201104201 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種適合於發熱電子元件散熱的散 熱裝置及其製造方法。 * 【先前技術】 隨著電腦產業的迅速發展’ CPU追求高速度 化，多功能化及小型化所衍生的散熱問題越來越嚴 重，因此，必須將熱量及時有效地散發出去，否則 會極大地影響電子元件的工作性能，同時還會縮減 電子元件的使用壽命。 業界通常採用散熱裝置為發熱電子元件散熱。 1知的散熱裝置大多採用吸熱底板與圓型熱管的組 合，該吸熱底板上開設有容置熱管的凹槽，該熱管 收谷於凹槽内並與吸熱底板籍由錫膏焊接相連，然 而，此類結構的散熱裝置存在以下幾點問題：其一二 成型該散熱裝置時，需在吸熱底板上開設凹槽，及 組合該熱管與吸熱底板的工序，其製造過程及组裝 過程繁瑣費時，造成成本的增加；其二、因制程公 差的問題，該熱管與吸熱底板結合不緊密，容易產 生較大的接觸熱阻，嚴重影響熱傳導效率；其三、 因錫貧焊接的工藝不易控制致使產品的品質差異較 大。 【發明内容】 201104201 鑒於此，有必要提供一種制程簡單且散熱效率 高的散熱裝置及其製造方法。 一種散熱裝置，包括一基座及結合於該基座内 的至少-熱管’該熱管包括一管體、設于該管體内 $毛細結構及容納于管體内的工作液體，該熱管的 官體籍由插入鑄造成型的方式埋設於基座内從而與 基座結合於一體，該熱管的至少一末端露置於座 外部。 種政熱裝置的製造方法，包括以下步驟：提 供内部設有毛細結構的一金屬管體，該金屬管體具 有相對的第一末端和第二末端，該第一末端開口； 將該管體置人模具内與㈣金屬結合形成包覆該管 體的-基座’同時使該管體的第一末端露置於基座 外部；從該管體的第—末端對該管體注人工作液體 並抽真空；密封該管體的第一末端。 與習知散熱裝置相比，上述散熱裝置省去了在 基座上開設凹槽及組裝並焊接熱管與基座的工序， 龍簡單錢，且歸與基鋪㈣造成型的方式 -體成型’該熱管與基座實現無間隙緊密結合，大 :::、了熱管與基座之間的接觸熱阻，提高散熱震 =政熱性能。同時提高産品質量的穩定性。 L貝施方式】 下面參照附圖結合實施例對本發明作進一步說 201104201 明。 請參閱圖1及圖2,該散熱裴置1〇〇包括一基座 12及埋設於基座12内的複數根熱管16。 該基座12大致呈方矩形，其由導熱性能良好的 金屬材料比如鋁製成。該基座12包括用於與發熱電 子元件（圖未示）接觸的一底面122及與該底面122 相對的一頂面124。 這些熱管16的形狀結構相同，每一熱管16呈 直線型延伸，包括一中空管體162、貼附于管體16^ 内壁的毛細結構164及容納于管體162内的工作液 體（圖未示）。該管體162由導熱良能良好的金屬材 料比如銅製成。該工作液體為低沸點液體，比如水、 酒精等。該工作液體受熱時易蒸發汽化，遇冷則易 液化凝結。該毛細結構164可為細微 钍 粉末、絲網或任意其中之二組合的複合型 構。本實施财’該毛細結構164為燒結粉末。該 毛細結構164内具有複數細小孔隙，可為液化凝結 後的工作液體提供回流的動力。 這些熱管16相互平行，且均勻間隔設置。這些 熱管^從基座12的—側邊延伸至相對的另一側 邊。母一熱管16的兩末端分別突出於該基座12的 兩側而露置於外界。這些熱管16呈扁平狀，從而每 一熱管16具有一平坦的吸熱面161。該熱管16的 201104201 吸熱面161暴露出基座12並與基座12的底面122 平齊，因此，該熱管16的吸熱面161可直接與發熱 電子元件接觸吸熱。 請參閱圖3及圖4，成型該散熱裝置100時，首 先提供内部設有毛細結構164a的扁平狀金屬管體 162a，該管體162a的一端開口，另一端密封；將管 體162a置入一成型所述基座12的鑄造模具18内， 並向該模具18注入熔融金屬，使管體162a與熔融 的金屬結合在一起形成包覆該管體162a的基座 12，同時使該管體162a的兩末端露置於基座外部； 從該管體162a的開口端對該管體162a注入工作液 體並抽真空；密封該管體162a的開口端，得到所述 散熱裝置100。 該熱管16籍由插入鑄造成型（InsertMolding)的 方式嵌設於該基座12内與該基座12結合於一體， 在將管體162a置入模具18中之前，對該管體162a 進行塵扁使其具有平坦的吸熱面161。在將管體162a 置入模具18中時，使該管體162a的至少一末端即 開口端露置於基座12外部，以便於成型完成之後對 管體162a進行注液、抽真空及封口等操作。 與習知散熱裝置相比，該散熱裝置100省去了 在基座12内開設凹槽的工序，且無需組裝熱管16 與基座12，省去焊接工藝，制程簡單方便。此外， 201104201 該熱管16與基座12之間實現無間隙的緊密結合， 大大減少了熱管16與基座12間的接觸熱阻，且提 尚了產品品質。本實施例中，該基座12由鋁製成， 該熱官16的管體162由銅製成，為避免該鋁質的基 座12與銅質的熱管16發生電化學腐蝕，可預先在 熱官16的管體162的外表面喷塗或鍍覆一層介面材 料比如錦層。 ❿ 該散熱裝置工作時，該基座12的底面122 與熱管16的吸熱面161貼設於發熱電子元件上，該 基座12的底面122與熱管16的吸熱面161同時從 發熱電子疋件吸熱。該基座12將吸收的熱量直接傳 導至其頂面124散發出去；熱管16吸收熱量後，其 内的工作液體蒸發&化，將熱量迅速傳導至整個熱 官16的内部，然後迅速傳導至熱管16外圍的基座 12，使基座12各部分均勻受熱。因熱管16與基座 • 12成型為一體的結構，熱管16與基座^之間的熱 阻達到最小’因而熱量可迅速從熱管16傳遞至基座 12，從而提升該散熱裝置1〇〇的散熱性能。 圖5所示為本發明散熱裝置第二實施例，該散 熱裝置200與上述實施例的散熱裝置ι〇〇相似，包 括一方矩狀的基座22及籍由鑄造成型的方式嵌設 於基座22底部的熱管26、27。該散熱裝置遞與 上边實施例的散熱裝置100的不同之處在於：該散 201104201 、，置200包括一呈直線型的第一熱管26及彎折的 ，兩第一熱官27。該第一熱管26位於中間，從基座 Y2的一側邊的中央延伸至相對的另一側邊的中央， 第一熱管26的兩末端分別突出於基座22兩側。 ,該兩第二熱管27分別位於該第一熱管26的兩 該兩第二熱管27包括位於中間的直管部272及 刀另]位於直管部272兩端的兩折管部271、273，該 • 兩第二熱管27的直管部272與第一熱管26相平 行，=管部27丄、273分別呈放射狀向基座22的四 個角落延伸並突出於基座22外側，因第二熱管π 的折管部271、273向基座22的角落延伸，可使基 座22叉熱更均勻，從而提高基座22的利用率。成 型該散熱裝置2GG的方法與成型上述實施例中的散 熱裝置100的方法相同，在此不贅述。 φ 圖6所示為本發明散熱裝置的第三實施例。該 U置300與上述第—實施例中的散熱裝置個 相似，也包括一基座32及設於該基座Μ内的熱管 36。該基座32具有與發熱電子元件接觸的底面 及與底面322相對的—頂面似。該散熱裝置綱 與上述第一實施例中的散熱裝置100的區別在於·· 成型該基座32時，於該基座％的頂面324 一體延 伸出複數散熱鰭片34 ’該熱管36的形狀也與上述 實施例中的熱管16的形狀有所不同，該熱管％呈 201104201 U型°沿其延伸方向包括一蒸發段362及一冷凝段 364 °該熱管36的蒸發段362埋設於基座32内，冷 凝段364穿設於散熱鰭片34中。該熱管36也呈扁 平狀’從而其蒸發段362也具有一平坦的接觸面用 於與發熱電子元件接觸。該熱管36籍由插入鑄造成 型的方式與該基座32、散熱鰭片34結合於一體， 如此可使該熱管36與基座32及散熱鰭片34間實現 鲁 無間隙的緊密結合，使熱管36與基座32、散熱鰭 片34間的接觸熱阻降至最小，從而提升該散熱裝置 3〇〇的散熱效率。 成型該散熱裝置300的方法與成型上述第一實 %例的散熱震置1〇〇的方法相似。首先提供内部設 有毛細結構的金屬管體，該管體的一端開口，另一 ‘雀封，該管體呈扁平狀，且彎折成U型；將管體 置入一成型所述基座32及散熱鰭片34的模具内， ♦ 使管體用於形成蒸發段362的部分與縣的金屬結 合在一起形成包覆該蒸發段部分的基座32，該管體 用於形成冷凝段364的部分與熔融的金屬結合在一 起形成包覆該冷凝段部分外圍的散熱鰭片34，同時 使該管體的兩末端露置於基座32或散熱鰭片34的 外部；從該管體的開口端對該管體注入工作液體並 抽真空；密封管體的該開口端，得到該散熱裝置3〇〇。 “上所述，本發明符合發明專利之要件，爰依 201104201 =出專射請。惟以上所述者僅為轉明 2例，料熟悉本案技藝之人士，在爰依本發明 、砷所作之等效修飾或變化，皆應涵蓋於以下 請專利範圍内。 【圖式簡單說明】 圖1為本發明散熱裝置第一實施例的立體圖。 圖2為圖1所示散熱裝置沿II-II線的剖面圖。 圖3為圖1所示散熱裝置的一製造方法的流程 圖。 圖4為運用圖3所示製造方法成型圖工所示散 熱裝置的成型過程示意圖。 圖5為本發明散熱裝置第二實施例的仰視圖。 圖6為本發明散熱裝置第三實施例的立體圖。 【主要元件符號說明】 散熱裝置 100 ' 200 、 300 基座 12 、 22 、 32 底面 122 ' 322 頂面 124 > 324 敎管 *、、、 9 16、36 吸熱面 161 ' 361 管體 162 ' 162a 毛細結構 164、164a 模具 18 第一熱管 26 第二熱管 27 折管部 271 、 273 直管部 272 散熱鰭片 34 蒸發段 362 冷凝段 364 11201104201 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink device suitable for heat dissipation of a heat-generating electronic component and a method of manufacturing the same. * [Prior Art] With the rapid development of the computer industry, the CPU is pursuing high speed, and the heat dissipation problem caused by multi-function and miniaturization is becoming more and more serious. Therefore, heat must be dissipated in a timely and effective manner, otherwise it will greatly Affect the performance of electronic components, while also reducing the life of electronic components. The heat sink is usually used in the industry to dissipate heat from electronic components. 1 The heat dissipating device mostly adopts a combination of an endothermic bottom plate and a round heat pipe. The heat absorbing bottom plate is provided with a groove for accommodating the heat pipe, and the heat pipe is valleyd in the groove and connected to the heat absorbing base plate by solder paste. The heat dissipating device of the structure has the following problems: when the heat dissipating device is formed, the groove is formed on the heat absorbing substrate, and the heat pipe and the heat absorbing substrate are combined, and the manufacturing process and the assembly process are cumbersome and time consuming. The cost is increased. Second, due to the problem of process tolerance, the heat pipe and the heat absorption base plate are not tightly combined, and it is easy to generate a large contact thermal resistance, which seriously affects the heat transfer efficiency. Third, the process of tin-poor welding is difficult to control and the product is caused. The quality of the difference is large. SUMMARY OF THE INVENTION 201104201 In view of this, it is necessary to provide a heat sink having a simple process and high heat dissipation efficiency and a method of manufacturing the same. A heat dissipating device includes a base and at least a heat pipe coupled to the base. The heat pipe includes a pipe body, a capillary structure disposed in the pipe body, and a working liquid accommodated in the pipe body. The body is embedded in the base by insert molding to be integrated with the base, and at least one end of the heat pipe is exposed outside the seat. The method for manufacturing a political thermal device includes the steps of: providing a metal pipe body having a capillary structure therein, the metal pipe body having opposite first ends and second ends, the first end opening; The human mold is combined with the (4) metal to form a pedestal covering the tube body while the first end of the tube body is exposed to the outside of the pedestal; the working fluid is injected into the tube body from the first end of the tube body And evacuating; sealing the first end of the tube. Compared with the conventional heat dissipating device, the above-mentioned heat dissipating device eliminates the process of forming a groove on the pedestal and assembling and welding the heat pipe and the pedestal, and the dragon is simple and money, and is returned to the base shop (four) to form a type-body molding' The heat pipe and the susceptor are tightly combined without gaps, and the large:::, the contact thermal resistance between the heat pipe and the pedestal, and the heat dissipation vibration = thermal performance. At the same time improve the stability of product quality. L Besch Mode The following is a further description of the present invention with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipation device 1 includes a base 12 and a plurality of heat pipes 16 embedded in the base 12. The susceptor 12 has a substantially square rectangular shape and is made of a metal material such as aluminum which is excellent in thermal conductivity. The susceptor 12 includes a bottom surface 122 for contacting a heat generating electronic component (not shown) and a top surface 124 opposite the bottom surface 122. The heat pipes 16 have the same shape and structure, and each heat pipe 16 extends linearly, and includes a hollow pipe body 162, a capillary structure 164 attached to the inner wall of the pipe body 16 and a working liquid accommodated in the pipe body 162 (not shown). Show). The tube body 162 is made of a metal material such as copper which is excellent in heat conduction. The working fluid is a low boiling liquid such as water, alcohol, or the like. The working liquid is easily vaporized and vaporized when heated, and liquefied and condensed when it is cold. The capillary structure 164 can be a fine tantalum powder, a mesh or a composite of any two of them. In the present embodiment, the capillary structure 164 is a sintered powder. The capillary structure 164 has a plurality of fine pores therein to provide recirculation power for the liquefied coagulated working fluid. These heat pipes 16 are parallel to each other and are evenly spaced. These heat pipes extend from the side of the base 12 to the opposite side. Both ends of the mother-heat pipe 16 protrude from the two sides of the base 12 to be exposed to the outside. These heat pipes 16 are flat, so that each heat pipe 16 has a flat heat absorbing surface 161. The 201104201 heat absorbing surface 161 of the heat pipe 16 exposes the susceptor 12 and is flush with the bottom surface 122 of the susceptor 12. Therefore, the heat absorbing surface 161 of the heat pipe 16 can directly absorb heat from the heat generating electronic component. Referring to FIG. 3 and FIG. 4, when the heat dissipating device 100 is molded, firstly, a flat metal pipe body 162a having a capillary structure 164a therein is provided, and one end of the pipe body 162a is open and the other end is sealed; the pipe body 162a is placed in a The casting mold 18 of the susceptor 12 is molded, and molten metal is injected into the mold 18, and the tube body 162a is bonded to the molten metal to form a susceptor 12 covering the tube body 162a, while the tube body 162a is formed. The two ends are exposed to the outside of the base; the working fluid is injected into the tubular body 162a from the open end of the tubular body 162a and evacuated; and the open end of the tubular body 162a is sealed to obtain the heat sink 100. The heat pipe 16 is embedded in the base 12 and integrated with the base 12 by means of insert molding, and the pipe body 162a is dust-flated before the pipe body 162a is placed in the mold 18. It has a flat heat absorbing surface 161. When the tube body 162a is placed in the mold 18, at least one end, that is, the open end of the tube body 162a is exposed to the outside of the base 12, so as to inject, vacuum and seal the tube body 162a after the molding is completed. operating. Compared with the conventional heat dissipating device, the heat dissipating device 100 eliminates the process of forming a groove in the susceptor 12, and does not need to assemble the heat pipe 16 and the susceptor 12, thereby eliminating the welding process and making the process simple and convenient. In addition, 201104201, the heat pipe 16 and the susceptor 12 realize a tight joint without gaps, which greatly reduces the thermal resistance between the heat pipe 16 and the susceptor 12, and improves the product quality. In this embodiment, the base 12 is made of aluminum, and the tube body 162 of the heat official 16 is made of copper. In order to avoid electrochemical corrosion of the aluminum base 12 and the copper heat pipe 16, it may be preheated. The outer surface of the body 162 of the officer 16 is sprayed or plated with a layer of interface material such as a layer of gold.底面 When the heat sink is in operation, the bottom surface 122 of the susceptor 12 and the heat absorbing surface 161 of the heat pipe 16 are attached to the heat-generating electronic component, and the bottom surface 122 of the susceptor 12 and the heat absorbing surface 161 of the heat pipe 16 absorb heat from the heat-generating electronic component simultaneously. . The susceptor 12 directly conducts the absorbed heat to the top surface 124 thereof; after the heat pipe 16 absorbs the heat, the working liquid therein evaporates & the heat is quickly transmitted to the entire interior of the heat officer 16, and then rapidly transmitted to The susceptor 12 on the periphery of the heat pipe 16 allows the portions of the susceptor 12 to be uniformly heated. Because the heat pipe 16 and the base 12 are integrally formed, the thermal resistance between the heat pipe 16 and the base ^ is minimized', so heat can be quickly transferred from the heat pipe 16 to the base 12, thereby lifting the heat sink 1 Thermal performance. FIG. 5 is a second embodiment of a heat sink according to the present invention. The heat sink 200 is similar to the heat sink of the above embodiment, and includes a rectangular base 22 and is embedded in the base by casting. 22 heat pipes 26, 27 at the bottom. The heat dissipating device is different from the heat dissipating device 100 of the above embodiment in that the dispersing 201104201, the set 200 includes a first heat pipe 26 in a straight line shape and two first heat members 27 which are bent. The first heat pipe 26 is located in the middle, extending from the center of one side of the base Y2 to the center of the opposite other side, and both ends of the first heat pipe 26 protrude from both sides of the base 22, respectively. The two second heat pipes 27 are respectively located on the two heat pipes 26, and the two second heat pipes 27 include a straight pipe portion 272 located in the middle and two folded pipe portions 271, 273 located at opposite ends of the straight pipe portion 272. • The straight tube portion 272 of the two second heat pipes 27 is parallel to the first heat pipe 26, and the tube portions 27丄, 273 extend radially toward the four corners of the base 22 and protrude outside the base 22, because of the second The folded portions 271 and 273 of the heat pipe π extend toward the corners of the susceptor 22, so that the susceptor 22 can be more uniformly heated, thereby improving the utilization of the susceptor 22. The method of forming the heat sink 2GG is the same as the method of forming the heat sink 100 in the above embodiment, and will not be described herein. φ Figure 6 shows a third embodiment of the heat sink of the present invention. The U-set 300 is similar to the heat sink of the above-described first embodiment, and includes a base 32 and a heat pipe 36 disposed in the base. The susceptor 32 has a bottom surface that is in contact with the heat-generating electronic component and a top surface that faces the bottom surface 322. The heat dissipating device is different from the heat dissipating device 100 in the first embodiment in that: when the pedestal 32 is formed, a plurality of heat dissipating fins 34 ′ are integrally formed on the top surface 324 of the susceptor %. The heat pipe 16 is different from the shape of the heat pipe 16 in the above embodiment. The heat pipe % is 201104201 U-shaped. The heat pipe 16 includes an evaporation section 362 and a condensation section 364. The evaporation section 362 of the heat pipe 36 is embedded in the base 32. The condensation section 364 is disposed in the heat dissipation fins 34. The heat pipe 36 is also flattened so that its evaporation section 362 also has a flat contact surface for contact with the heat generating electronic components. The heat pipe 36 is integrated with the base 32 and the heat dissipation fins 34 by insert molding, so that the heat pipe 36 and the base 32 and the heat dissipation fins 34 can be tightly coupled without gaps, so that the heat pipe The contact thermal resistance between the base 36 and the heat sink fins 34 is minimized, thereby improving the heat dissipation efficiency of the heat sink 3. The method of molding the heat sink 300 is similar to the method of forming the heat sink of the first embodiment. Firstly, a metal pipe body having a capillary structure is provided, the pipe body is open at one end, and the other pipe is sealed, and the pipe body is flat and bent into a U shape; the pipe body is placed into the base plate. 32 and the mold of the heat sink fin 34, ♦ the portion of the tube body used to form the evaporation section 362 is combined with the metal of the county to form a susceptor 32 covering the evaporation section, the tube body being used to form the condensation section 364. The portion is combined with the molten metal to form a heat dissipating fin 34 covering a periphery of the condensation portion, and both ends of the tube are exposed to the outside of the base 32 or the heat dissipating fin 34; The open end injects a working liquid into the tube body and evacuates the liquid; and the open end of the tube body is sealed to obtain the heat sink 3〇〇. "The above description, the invention meets the requirements of the invention patent, according to 201104201 = special shot please. However, the above mentioned only for the transfer of 2 cases, those who are familiar with the skill of the case, in the conversion of the invention, arsenic Equivalent modifications or variations are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a first embodiment of a heat sink according to the present invention. Fig. 2 is a line along the line II-II of the heat sink shown in Fig. 1. Figure 3 is a flow chart of a manufacturing method of the heat dissipating device shown in Figure 1. Figure 4 is a schematic view showing a molding process of the heat dissipating device shown in Figure 3 by using the manufacturing method shown in Figure 3. Figure 5 is a heat dissipating device of the present invention. Fig. 6 is a perspective view of a third embodiment of a heat sink according to the present invention. [Description of main components] Heat sink 100' 200, 300 Base 12, 22, 32 Base 122' 322 Top surface 124 > 324 敎管*,,, 9 16、36 Heat absorbing surface 161 ' 361 Tube 162 ' 162a Capillary structure 164, 164a Mold 18 First heat pipe 26 Second heat pipe 27 Folding pipe portion 271, 273 Straight pipe portion 272 Heat sink fin 34 evaporation Section 362 Condensation section 364 11