TWI839974B - A heat dissipation module for heat exchange between two phase flow circulation vapor chamber and cold liquid fuild - Google Patents

Abstract

A heat dissipation module for heat exchange between two phase flow circulation vapor chamber and cold liquid fluid includes a heat exchanger and a vapor chamber with two-phase flow circulation. The heat exchanger includes a case, an inlet, an outlet and a heat exchanging chamber. The case has a below hole. The inlet and the outlet are respectively connected through the heat exchanging chamber. The vapor chamber includes a condenser end and an evaporator end. The condenser end is set inside the heat exchanging chamber that penetrate the case through the below hole. The evaporator end is set outside the heat exchanging chamber for contacting with a heat source. Compared with the prior art, the heat dissipation module using two phase flow circulation vapor chamber and cold liquid fluid for heat exchange of the invention provides an excellent heat-dissipating efficiency.

Description

A heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid

The present invention relates to a heat dissipation module using a water-cooled plate heat dissipation technology, and more particularly to a liquid-cooled heat dissipation module that efficiently utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange.

With the development of semiconductor chips for data center servers and in-vehicle autonomous driving artificial intelligence, chips are moving towards higher computing power and higher integration, which means that the heat dissipation of electronic chips per unit volume or area will increase sharply. Traditional air-cooled forced convection technology will find it difficult to meet the heat dissipation requirements of some IC electronic components, and water-cooled heat dissipation technology has become the mainstream solution for high heat flux density heat dissipation.

Please refer to FIG. 1, which is a schematic diagram of a conventional water-cooled plate heat dissipation device 9. The conventional water-cooled plate heat dissipation device 9 includes a water-cooled plate metal shell 90 having a heat exchange cavity 91. A heat-generating electronic component 94 contacts the water-cooled plate metal shell 90. A metal plate 93 is disposed in the water-cooled plate metal shell 90 to increase the heat dissipation area. The heat-generating electronic component 94 transfers heat to the metal plate 93 through the water-cooled plate metal shell 90 by heat conduction, and the metal plate 93 is designed with flow channels of different structures. The cooling liquid forms convection heat exchange between the flow channel in the heat exchange cavity 91 and the metal plate 93, thereby indirectly taking away the heat consumption of the electronic component 94.

It is known that the water-cooled plate heat sink 9 mainly conducts high energy density heat through the aluminum metal shell or copper metal shell to the metal plate 93 in the heat exchange cavity 91 by heat conduction, and then exchanges heat with the cooling liquid in the heat exchange cavity 91. As the power of high-intensity computing chips is getting higher and higher, the industry is in urgent need of water-cooled plate heat sinks 9 that reduce the thermal resistance of the heat conduction path. A more efficient water-cooled plate heat sink technology is needed to solve the problem of cooling and dissipating high-power and high-computing chips.

In view of this, the present invention provides a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange to solve the problems of the prior art.

The present invention provides a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, including a heat exchanger and a steam chamber element with a two-phase flow circulation. The heat exchanger includes a shell, an input pipe, an output pipe, and a heat exchange chamber. The shell has a lower opening hole, and the input pipe and the output pipe are connected to the heat exchange chamber. The steam chamber element corresponds to the lower opening hole of the shell of the heat exchanger and includes a condensation end and a heat absorption end. The condensation end penetrates the shell through the lower opening hole, so that the condensation end is arranged in the heat exchange chamber. The heat absorption end is arranged outside the heat exchange chamber and is used to contact a heat source.

Among them, cooling liquid is provided in the heat exchange cavity, the input pipe and the output pipe, and the cooling liquid is used to exchange heat with the condensation end of the steam cavity element.

The cooling liquid is one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants.

Wherein, the steam chamber element includes at least one heat sink fin coupled to the condensation end.

Furthermore, each heat sink fin has a plurality of microchannels, and the extension direction of the microchannels is parallel to the extension direction of the inlet pipe.

The steam chamber element is a three-dimensional steam chamber element, which further includes an upper cover, a lower cover, a capillary structure and a working fluid. The upper cover has a tube, an upper outer surface and an upper inner surface. The tube has a tube cavity and a tube inner surface. The lower cover matches the upper cover and has a lower outer surface and a lower inner surface. When the lower cover is sealed to the upper cover, the tube cavity forms a closed air cavity. The capillary structure is continuously arranged on the upper inner surface, the tube inner surface and the lower inner surface. The working fluid is arranged in the closed air cavity.

The tube body is integrally formed on the upper outer surface and protrudes outward from the upper outer surface, and the lower cover has a lower cover cavity. When the lower cover is sealed to the upper cover, the tube body cavity and the lower cover cavity form a closed air cavity.

The working fluid is one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants.

Wherein, the thickness of the capillary structure arranged on the lower inner surface relative to the tube body is greater than the thickness of the capillary structure arranged on the remaining lower inner surfaces.

Among them, the ratio of the length of the tube body to the thickness after the lower cover and the upper cover are sealed is greater than 10.

In summary, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can directly contact the cooling liquid in the heat exchange chamber through the condensation end of the steam chamber element with two-phase flow circulation, and no longer needs to pass through the layers of thermal resistance of heat conduction between the condensation end and the outer shell of the heat exchanger, thereby improving the heat dissipation efficiency. In addition, the steam chamber element of the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can increase the contact area between the condensation end and the cooling liquid through the heat dissipation fins and the microchannels arranged on the heat dissipation fins, thereby improving the heat dissipation efficiency. Furthermore, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can pass through the complete and continuous capillary structure of the three-dimensional steam chamber element, so that the liquid phase working fluid can smoothly and quickly flow back to the heat absorption end to absorb the heat energy generated by the heat source again, thereby improving the heat dissipation efficiency. In addition, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can also contact multiple heat sources through multiple steam chamber elements and dissipate heat in the same heat exchanger, and can also contact multiple heat sources through multiple steam chamber elements and dissipate heat in the same heat exchanger.

1, 3, 4, 4’, 4”: Heat dissipation module that uses two-phase flow circulation to exchange heat between the steam chamber and the cold liquid fluid

11, 31, 41, 41’: heat exchanger

110: Shell

1102, 3102: Bottom opening hole

111, 311, 91: input tube

112, 312, 92: output tube

121: Condensation end

122: Heat absorbing end

1231, 3231: Microchannel

221. Upper cover

2211, 2211’, 2211”, 4211: Tube body

2212, 2212’, 2212”: Tube cavity

2213: Inner surface of tube body

2214: Upper outer surface

1101, 3101, 4101’, 91: heat exchange chamber

12, 22, 22’, 22”, 32, 42, 42’, 42”: steam chamber components

123, 323, 423, 423’, 423”: heat sink fins

2215: Upper inner surface

222, 222”: Lower cover

2221: Lower outer surface

2222, 2222’, 2222”: lower inner surface

2223: Lower cover cavity

224, 224’, 224”: capillary structure

7: Heat source

8: Temperature balancing board

9: Water cooling plate heat dissipation device

90: Water cooling plate metal shell

93:Metal plate

94: Electronic components

FIG1 is a schematic diagram showing the structure of a liquid cooling device according to the prior art.

FIG2A is a schematic diagram showing the structure of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange in a specific embodiment of the present invention.

FIG2B is an exploded view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange based on FIG2A.

FIG3 is a cross-sectional view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange based on FIG2A.

FIG4A is a schematic cross-sectional view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange according to a specific embodiment of the present invention.

FIG. 4B is a schematic diagram showing the structure of the heat dissipation module of FIG. 4A that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid from another viewing angle.

FIG5A is a schematic diagram showing the cross-sectional structure of a two-phase flow circulation steam chamber element of a specific embodiment of the present invention.

FIG5B is a schematic diagram of the two-phase flow circulation steam chamber element in FIG5A during operation.

FIG6A is a schematic diagram showing the cross-sectional structure of a vapor chamber element of a specific embodiment of the present invention.

FIG6B is a schematic diagram showing the cross-sectional structure of a vapor chamber element of another specific embodiment of the present invention.

FIG. 7A is a disassembled diagram of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange according to a specific embodiment of the present invention.

FIG. 7B is a cross-sectional view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid according to FIG. 7A .

FIG. 7C is a cross-sectional view of the heat dissipation module of FIG. 7A that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid at another viewing angle.

FIG8A is a schematic diagram showing the structure of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange in a specific embodiment of the present invention.

FIG8B is an exploded view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange based on FIG8A.

FIG8C is a cross-sectional view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange based on FIG8A.

FIG8D is a schematic diagram showing the distribution of the steam chamber element and the heat source of a specific embodiment of the present invention.

FIG8E is a cross-sectional view of the heat dissipation module of FIG8A that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid at another viewing angle.

FIG9 is a schematic cross-sectional view of a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange according to a specific embodiment of the present invention.

FIG. 10 is a cross-sectional schematic diagram showing another specific embodiment of the present invention, which is a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange.

In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the attached drawings using specific embodiments. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. cited therein are not used to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, which should be explained first.

Please refer to Figures 2A, 2B and 3 together. Figure 2A is a structural schematic diagram of a heat dissipation module 1 that uses a two-phase flow circulation steam chamber to perform heat exchange with a cold liquid fluid according to a specific embodiment of the present invention. Figure 2B is an exploded view of the heat dissipation module 1 that uses a two-phase flow circulation steam chamber to perform heat exchange with a cold liquid fluid according to Figure 2A. Figure 3 is a cross-sectional view of the heat dissipation module 1 that uses a two-phase flow circulation steam chamber to perform heat exchange with a cold liquid fluid according to Figure 2A. As shown in Figures 2A, 2B and 3, in this specific embodiment, the heat dissipation module 1 that uses a two-phase flow circulation steam chamber to perform heat exchange with a cold liquid fluid includes a heat exchanger 11 and a steam chamber element 12 with a two-phase flow circulation. The heat exchanger 11 includes a housing 110, an input pipe 111, an output pipe 112, and a heat exchange chamber 1101 containing a cooling liquid. The housing 110 has a lower opening hole 1102, and the input pipe 111, the output pipe 112, and the lower opening hole 1102 are connected to the heat exchange chamber 1101. The steam chamber element 12 with two-phase flow circulation corresponds to the lower opening hole 1102 of the housing 110 of the heat exchanger 11 and includes a condensation end 121 and a heat absorption end 122. The condensation end 121 penetrates the housing 110 through the lower opening hole 1102, so that the condensation end 121 is arranged in the heat exchange chamber 1101, and the heat absorption end 122 is arranged outside the heat exchange chamber 1101 to trigger the heat source 7. The heat source 7 may be a chip or chip packaging shell of an electronic product.

In practice, the input pipe 111 and the output pipe 112 of the heat exchanger 11 are disposed at opposite ends of the heat exchanger 11. In a specific embodiment, the input pipe 111 and the output pipe 112 can also be disposed on the same surface of the shell 110 of the heat exchanger 11. In actual application, the heat exchange chamber 1101, the input pipe 111 and the output pipe 112 of the heat exchanger 11 are all provided with cooling liquid. When the heat exchanger 11 is in operation, the cooling liquid can flow from the input pipe 111 to the heat exchange chamber 1101, and from the heat exchange chamber 1101 to the output pipe 112 (as shown by the arrows in FIG. 3A ). In practice, the coolant can be water, acetone, ammonia, methanol, tetrachloroethane or hydrofluorocarbon chemical refrigerants, but is not limited thereto. The coolant can also be other fluids that absorb heat and carry away heat energy.

In this specific embodiment, the size of the condensation end 121 of the steam chamber element 12 with two-phase flow circulation can correspond to the size of the lower opening hole 1102 of the heat exchanger 11, and contains a two-phase flow working fluid. When the steam chamber element 12 with two-phase flow circulation is set on the heat exchanger 11, the condensation end 121 of the steam chamber element 12 with two-phase flow circulation can be embedded in or even tightly fitted in the shell 110 of the heat exchanger 11, so that the condensation end 121 is located in the heat exchange chamber 1101 of the shell 110 and contacts the coolant in the heat exchange chamber 1101. In practice, after the condensing end 121 is embedded in the shell 110 of the heat exchanger 11, the heat absorbing end 122 located outside the shell 110 can be fixedly connected to the shell 110 by bonding, welding, etc. to prevent the coolant in the heat exchanger 11 from flowing out from the lower opening hole 1102, but it is not limited thereto. A waterproof pad can also be provided between the shell 110 and the heat absorbing end 122 to prevent the coolant in the heat exchanger 11 from flowing out from the lower opening hole 1102.

As shown in FIG3 , when the heat dissipation module 1 that utilizes the two-phase flow circulation steam chamber to exchange heat with the cold liquid fluid operates, the heat absorption end 122 that contacts the heat source 7 absorbs the heat energy generated by the heat source 7. At this time, the liquid phase working fluid in the capillary structure at the heat absorption end 122 absorbs the heat energy and changes into the gas phase working fluid, and the gas phase working fluid brings the heat energy to the condensation end 121, and then exchanges heat with the cooling liquid in the heat exchange chamber 1101, and the cooling liquid flowing in from the inlet pipe 111 of the heat exchanger 11 absorbs heat energy from the condensation end 121. At this time, the gas phase working fluid in the two-phase flow circulation steam chamber element 12 changes into the liquid phase working fluid at the condensation end 121, and the liquid phase working fluid flows back to the heat absorption end 122 through the capillary structure. Then, the cooling liquid that absorbs the heat energy flows out from the output pipe 112 of the heat exchanger 11 to take away the heat energy of the heat source 7 and achieve the function of heat dissipation. Therefore, the heat dissipation module of the present invention that uses a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange can directly contact the cooling liquid of the heat exchanger through the condensation end of the steam chamber element with a two-phase flow circulation, and no longer needs to pass through the layers of thermal resistance of heat conduction between the condensation end and the outer shell of the heat exchanger, thereby improving the heat dissipation efficiency.

Please refer to FIG. 4A and FIG. 4B together. FIG. 4A is a cross-sectional structural schematic diagram of a heat dissipation module 1 that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid in a specific embodiment of the present invention. FIG. 4B is a structural schematic diagram of the heat dissipation module 1 that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid in FIG. 4A from another viewing angle. As shown in FIG. 4A and FIG. 4B, in this specific embodiment, the steam chamber element 12 with two-phase flow circulation includes a heat dissipation fin 123 disposed at the condensation end 121. In practice, the heat sink 123 may include an opening (not shown) and may be sleeved on the condensation end 121 through the opening, so that the heat sink 123 is located in the heat exchange chamber 1101 of the heat exchanger 11 and contacts the cooling liquid. When the gas phase working fluid formed by absorbing heat energy at the heat absorption end 122 flows to the condensation end 121, the heat energy in the gas phase working fluid is not only transferred to the condensation end 121, but also transferred to the heat sink 123. Therefore, the cooling liquid of the heat exchanger 11 can absorb heat energy from the condensation end 121 and the heat sink 123 at the same time. In other words, the vapor chamber element 12 with two-phase flow circulation can increase the contact area between the condensation end 121 and the cooling liquid through the heat sink 123, thereby improving the heat dissipation efficiency. It is worth noting that the number of heat sink fins installed at the condensing end is not limited to 4 as shown in the figure. In practice, the number of heat sink fins can be 1, 2, 3 or more than 5, and can also be determined according to the design or requirements.

In this specific embodiment, the heat sink 123 may further include a plurality of microchannels 1231, and the extension direction of the microchannels 1231 is parallel to the extension direction of the input pipe 111. In practice, the plurality of microchannels 1231 are arranged in parallel with each other, and the extension direction of each microchannel 1231 is the same as the connection direction of the input pipe 111 and the output pipe 112, that is, the extension direction of the microchannel 1231 is the same as the flow direction of the coolant in the input pipe 111 and the output pipe 112. When the heat exchanger 11 takes away the heat energy at the condensation end 121, the cooling liquid input from the input pipe 111 can flow along the microchannel 1231 of the heat sink fin 123, and then smoothly flow to the output pipe 112, so that the cooling liquid will not generate turbulence in the heat exchange chamber 1101 of the heat exchanger 11, so as to reduce the time that the cooling liquid containing heat energy is in the heat exchange chamber 1101, thereby improving the heat dissipation efficiency. Furthermore, since the heat sink fin 123 includes a plurality of microchannels 1231, the contact area between the heat sink fin 123 and the cooling liquid can also be increased, and the heat dissipation efficiency can also be improved. In addition, the microchannel 1231 can also be disposed on the upper and lower planes of the heat sink fin 123 (as shown in FIG. 4B ) to improve the heat dissipation efficiency.

Please refer to FIG. 3, FIG. 5A and FIG. 5B together. FIG. 5A is a schematic diagram showing a cross-sectional structure of a two-phase flow circulation steam chamber element 22 of a specific embodiment of the present invention. FIG. 5B is a schematic diagram of the two-phase flow circulation steam chamber element 22 in operation according to FIG. 5A. As shown in FIG. 3 and FIG. 5A, in this specific embodiment, the two-phase flow circulation steam chamber element 22 with two-phase flow circulation is a three-dimensional steam chamber element. The three-dimensional steam chamber element includes an upper cover 221, a lower cover 222, a capillary structure 224 and a working fluid (not shown). The upper cover 221 has a tube 2211, an upper outer surface 2214 and an upper inner surface 2215. The tube body 2211 has a tube body cavity 2212 and a tube body inner surface 2213, and the tube body 2211 is integrally formed on the upper outer surface 2214 and protrudes outward from the upper outer surface 2214. In practice, the tube body 2211 is formed by stretching the upper cover 221 by stamping, and the height of the tube body 2211 is much greater than the thickness of the upper cover 221. The lower cover 222 matches the upper cover 221 and has a lower outer surface 2221, a lower inner surface 2222 and a lower cover cavity 2223. When the lower cover 222 is sealed to the upper cover 221, the tube body cavity 2212 and the lower cover cavity 2223 form a closed air cavity. It is worth noting that in this specific embodiment, the tube body 2211 of the upper cover 221 is the aforementioned condensation end 121, and the lower cover 222 is the aforementioned heat absorption end 122. The tube body 2211 is used to penetrate the lower opening hole 1102 of the shell 110 to be set in the heat exchange cavity 1101 of the heat exchanger 11, and the lower outer surface 2221 of the lower cover 222 is used to contact the heat source 7.

The capillary structure 224 is continuously disposed on the upper inner surface 2215, the inner surface 2213 of the tube body, and the lower inner surface 2222. In practice, the capillary structure 224 can be formed by laying copper powder and sintering, or by coating slurry on the upper inner surface 2215, the inner surface 2213 of the tube body, and the lower inner surface 2222, and then drying, cracking, and sintering. Since the upper cover 221 and the tube body 2211 are integrally formed, the upper inner surface 2215 and the inner surface 2213 of the tube body will form a continuous capillary structure 224. Furthermore, when the lower cover 222 is sealed to the upper cover 221 by welding or other methods, the capillary structures 224 of the upper inner surface 2215 and the lower inner surface 2222 will be fully in contact and connected, so that the three-dimensional vapor chamber element 22 has a complete and continuous capillary structure 224. The working fluid is used to be placed in the closed air cavity, and the working fluid can be water, acetone, ammonia, methanol, tetrachloroethane or hydrofluorocarbon chemical refrigerants.

As shown in FIG. 3 , FIG. 5A and FIG. 5B , when the heat dissipation module using the two-phase flow circulation steam cavity and the cold liquid fluid for heat exchange is in operation, the lower cover 222 of the three-dimensional steam cavity element 22 will absorb the heat energy generated by the heat source 7. At this time, the working fluid located in the capillary structure 224 of the lower cover cavity 2223 and the lower inner surface 2222 will also absorb heat energy and transform into a gas phase working fluid, and the gas phase working fluid flows to the tube cavity 2212 of the tube 2211 (as shown by the larger arrow in FIG. 5B ). Further, the heat energy in the gas phase working fluid will be transferred to the tube 2211, and the cooling liquid flowing into the heat exchange cavity 1101 from the input pipe 111 of the heat exchanger 11 will absorb heat energy from the tube 2211. At this time, the gas phase working fluid is transformed into the liquid phase working fluid, and the liquid phase working fluid sequentially flows from the capillary structure 224 on the inner surface 2213 of the tube body through the capillary structure 224 on the upper inner surface 2215, and then flows back to the capillary structure 224 on the lower inner surface 2222 of the lower cover 222 through the capillary structure of the support column (not shown) (as shown by the smaller arrow in FIG. 5B ). Finally, the cooling liquid containing heat energy flows out from the output pipe 112 of the heat exchanger 11 to take away the heat energy of the heat source 7 and achieve the function of efficient heat dissipation. Since the three-dimensional vapor chamber element 22 has a complete and continuous capillary structure 224, the liquid phase working fluid can smoothly and quickly flow back to the heat absorption end to absorb the heat energy generated by the heat source again, making the two-phase flow circulation smooth, thereby improving the heat dissipation efficiency.

In addition, in a preferred specific embodiment, the ratio of the length of the tube 2211 of the upper cover 221 of the three-dimensional vapor chamber element 22 to the thickness of the lower cover 222 after being sealed with the upper cover 221 is greater than 10. In other words, the volume of the tube cavity 2212 is greater than the volume of the lower cover cavity 2223. In practice, since the tube 2211 is disposed in the heat exchange cavity 1101 of the heat exchanger 11, that is, the tube cavity 2212 is located in the heat exchange cavity 1101 of the shell 110 of the heat exchanger 11, and the lower cover cavity 2223 is located outside the heat exchange cavity 1101. Therefore, when the working fluid in the capillary structure 224 of the lower cover cavity 2223 and the lower inner surface 2222 is converted into a gas phase working fluid due to absorbing heat energy, the gas phase working fluid can quickly enter the heat exchange cavity 1101 of the heat exchanger 11 to perform efficient heat exchange, thereby improving the heat dissipation efficiency.

The steam chamber element with two-phase flow circulation of the present invention can be in other forms in addition to the form of the aforementioned specific embodiment. Please refer to FIG. 6A. FIG. 6A is a schematic diagram showing the cross-sectional structure of a steam chamber element 22' of a specific embodiment of the present invention. As shown in FIG. 6A, the difference between the present specific embodiment and the aforementioned specific embodiment is that the thickness of the capillary structure 224' provided on the lower inner surface 2222' relative to the tube body 2211' is greater than the thickness of the capillary structure 224 provided on the remaining lower inner surface 2222'. As shown in the figure, the tube body 2211' and the capillary structure 224' with a larger thickness relative to the lower inner surface 2222' of the tube body 2211' can be located in the middle of the steam chamber element 22'. Generally speaking, the heat energy of the middle position of the heat source is the largest. Furthermore, since the capillary structure 224' on the lower inner surface 2222' located in the middle of the steam chamber element 22' is thicker, the capillary structure 224' there can store more liquid working fluid. When the steam chamber element 22' contacts the heat source 7, the liquid working fluid in the capillary structure 224' located in the middle of the steam chamber element 22' can absorb more heat through phase change, so as to be quickly converted into gaseous working fluid and flow into the tube cavity 2212' for heat exchange, thereby improving the heat dissipation efficiency.

Please refer to FIG. 6B. FIG. 6B is a schematic diagram of the cross-sectional structure of the steam chamber element 22" of another specific embodiment of the present invention. The difference between this specific embodiment and the aforementioned specific embodiment is that the lower cover 222" is a flat plate and does not include the aforementioned lower cover cavity. When the steam chamber element 22" contacts the heat source and the working fluid of the capillary structure 224" on the lower inner surface 2222" absorbs heat energy and is converted into a gas phase working fluid, the gas phase working fluid can quickly enter the tube cavity 2212" of the tube 2211" to exchange heat with the cooling liquid in the heat exchanger, thereby improving the heat dissipation efficiency.

The heat dissipation module of the present invention that utilizes a two-phase flow circulation steam cavity to exchange heat with a cold liquid fluid can be in other forms in addition to the aforementioned forms. Please refer to Figures 7A, 7B and 7C. Figure 7A is an exploded view of a heat dissipation module 3 that utilizes a two-phase flow circulation steam cavity to exchange heat with a cold liquid fluid in a specific embodiment of the present invention. Figure 7B is a cross-sectional view of the heat dissipation module 3 that utilizes a two-phase flow circulation steam cavity to exchange heat with a cold liquid fluid according to Figure 7A. Figure 7C is a cross-sectional view of the heat dissipation module 3 that utilizes a two-phase flow circulation steam cavity to exchange heat with a cold liquid fluid according to Figure 7A at another viewing angle. The heat dissipation module 3 of the present invention that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange can also contact multiple heat sources through multiple steam chamber elements and perform heat exchange in the same heat exchange chamber. Furthermore, since the location of the heat source is not always the same, the following will be described using Figures 7A to 7C as an example.

As shown in FIG. 7A , FIG. 7B and FIG. 7C , the heat exchanger 31 of the heat dissipation module 3 for heat exchange between the two-phase circulation steam chamber and the cold liquid fluid of the present specific embodiment comprises two input pipes 311 and two output pipes 312, the shell 310 has three lower opening holes 3102, and comprises three steam chamber elements 32. The two input pipes 311 and the two output pipes 312 are arranged in parallel and opposite to each other to form a first row and a second row. The cooling liquid can flow from the input pipe 311 of the first row to the output pipe 312 of the first row, and the cooling liquid can also flow from the input pipe 311 of the second row to the output pipe 312 of the second row. One lower opening hole 3102 is located in the first row, and two lower opening holes 3102 are located in the second row. One steam chamber element 32 is located in the first row, and two steam chamber elements 32 are located in the second row. The three steam chamber elements 32 can contact three heat sources 7 respectively.

When the heat dissipation module 3 that utilizes two-phase flow circulation to exchange heat between the steam chamber and the cold liquid fluid operates, the cooling liquid flowing in from the first row of input pipes 311 of the heat exchanger 31 mainly absorbs the heat energy of the first row of steam chamber components 32, and then the cooling liquid containing the heat energy flows out from the first row of output pipes 312 of the heat exchanger 31; similarly, the cooling liquid flowing in from the second row of input pipes 311 of the heat exchanger 31 simultaneously absorbs the heat energy of the two steam chamber components 32 in the second row, and then the cooling liquid containing the heat energy flows out from the second row of output pipes 312 of the heat exchanger 31.

In addition, the three vapor chamber elements 32 may respectively include at least one heat sink fin 323, and the heat sink fin 323 may also include a plurality of microchannels 3231. The extension direction of the microchannels 3231 of the heat sink fin 323 of the vapor chamber element 32 in the first row is the same as the flow direction of the cooling liquid in the first row of input pipes 311 and output pipes 312, and the extension direction of the microchannels 3231 of the heat sink fin 323 of the vapor chamber element 32 in the second row is the same as the flow direction of the cooling liquid in the second row of input pipes 311 and output pipes 312. Therefore, the cooling liquid input from the first and second rows of input pipes 311 can flow along the microchannels 3231 of the heat sink fins 323, and then smoothly flow to the first and second rows of output pipes 312, respectively, to reduce the turbulence of the cooling liquid in the heat exchange chamber 3101 of the heat exchanger 31, thereby reducing the time that the cooling liquid containing heat energy is in the heat exchange chamber 3101, thereby improving the heat dissipation efficiency. It is worth noting that the size of the heat sink fins of each vapor chamber element can be different, and can also be determined according to the heat power of the heat source.

Please refer to Figures 8A to 8E together. Figure 8A is a structural schematic diagram of a heat dissipation module 4 that uses a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid according to a specific embodiment of the present invention. Figure 8B is an exploded view of the heat dissipation module 4 that uses a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid according to Figure 8A. Figure 8C is a cross-sectional view of the heat dissipation module 4 that uses a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid according to Figure 8A. Figure 8D is a distribution schematic diagram of a steam chamber element 42 and a heat source 7 according to a specific embodiment of the present invention. Figure 8E is a cross-sectional view of the heat dissipation module 4 that uses a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid according to Figure 8A at another viewing angle. The heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange can also contact multiple heat sources through multiple steam chamber elements and dissipate heat in the same heat exchanger.

As shown in FIGS. 8A to 8E , the heat dissipation module 4 of the present embodiment that utilizes a two-phase flow circulation vapor chamber to exchange heat with a cold liquid fluid comprises five vapor chamber elements 42 and is applied to twenty-five heat sources 7 for heat dissipation. In practice, when the electronic product comprises closely arranged heat sources 7 (chips), each vapor chamber element 42 can contact multiple heat sources 7, so that multiple heat sources 7 can simultaneously share one vapor chamber element 42 in the heat exchange chamber of the heat exchanger 41 for heat dissipation. In the present embodiment, the vapor chamber elements 42 are arranged in a field-shaped manner (as shown in FIG. 8D ) to ensure that all vapor chamber elements 42 can contact the heat source 7 for heat dissipation. In practice, the shape of the steam chamber element 42 is not limited to that shown in the figure, and the shape of the steam chamber element 42 can also be designed according to the design or demand. Furthermore, since the heat source 7 located in the middle position will be affected by the surrounding heat sources, and the heat energy generated by the heat source 7 located in the middle position is the largest. Therefore, as shown in the figure, the size of the tube 4211 of the steam chamber element 42 located in the middle position can be larger than the size of the tube 4211 of other steam chamber elements 42 to improve the heat dissipation efficiency. In addition, the shape of the heat dissipation fin 423 provided on the steam chamber element 42 can also correspond to the shape of the steam chamber element 42. And, the heat dissipation fin 423 can also include the aforementioned microchannel.

The heat dissipation fins of the steam chamber element of the present invention can be in other forms in addition to the above-mentioned forms. Please refer to Figures 9 and 10. Figure 9 is a cross-sectional schematic diagram of a heat dissipation module 4' that uses a two-phase flow circulation steam chamber and a cold liquid fluid to perform heat exchange in a specific embodiment of the present invention. FIG10 is a cross-sectional schematic diagram of a heat dissipation module 4" for heat exchange between a two-phase circulating steam chamber and a cold liquid fluid according to another specific embodiment of the present invention. As shown in FIG9, the shape of the heat dissipation fins 423' on all steam chamber elements 42' may also correspond to the shape of the heat exchange chamber 4101' of the heat exchanger 41'. As shown in FIG10, the heat dissipation module 4" for heat exchange between a two-phase circulating steam chamber and a cold liquid fluid may also include a plurality of heat dissipation fins 423", and each heat dissipation fin 423" is disposed on a plurality of steam chamber elements 42".

In summary, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can directly contact the cooling liquid in the heat exchange chamber through the condensation end of the steam chamber element with two-phase flow circulation, and no longer needs to conduct heat between the condensation end and the outer shell of the heat exchanger to reduce thermal resistance, thereby improving the heat dissipation efficiency. In addition, the steam chamber element of the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can increase the contact area between the condensation end and the cooling liquid through the heat dissipation fins and the microchannels disposed on the heat dissipation fins, thereby improving the heat dissipation efficiency. Furthermore, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can pass through the complete and continuous capillary structure of the three-dimensional steam chamber element, so that the liquid phase working fluid can smoothly and quickly flow back to the heat absorption end to absorb the heat energy generated by the heat source again, thereby improving the heat dissipation efficiency. In addition, the heat dissipation module of the present invention that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid can also contact multiple heat sources through multiple steam chamber elements and dissipate heat in the same heat exchanger, and can also contact multiple heat sources through multiple steam chamber elements and dissipate heat in the same heat exchanger.

The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

1: A heat dissipation module that uses a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid

11: Heat exchanger

110: Shell

1101: Heat exchange chamber

111: Input pipe

112: Output tube

12: Steam chamber components

121: Condensation end

122: Heat absorbing end

7: Heat source

Claims (10)

A heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange, comprising: A heat exchanger, comprising a shell, N input tubes and M output tubes, the shell having a heat exchange cavity and P lower opening holes, the N input tubes and the M output tubes being connected to the heat exchange cavity; and P steam chamber elements with two-phase flow circulation correspond to the P lower opening holes respectively, and each steam chamber element includes a condensation end and a heat absorption end. The condensation end passes through the shell through the corresponding lower opening hole, so that the condensation end is arranged in the heat exchange cavity, and the heat absorption end is arranged outside the heat exchange cavity and is used to contact a heat source; Among them, N, M and P are all natural numbers greater than or equal to 1. As described in item 1 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein a cooling liquid is disposed in the heat exchange chamber, the N input pipes, and the M output pipes, and the cooling liquid is used to exchange heat with the condensation end of the steam chamber element. As described in item 2 of the patent application scope, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein the cooling liquid is one of water, acetone, ammonia, methanol, tetrachloroethane, and hydrofluorocarbon chemical refrigerants. As described in Item 1 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein each of the steam chamber elements includes Q heat dissipation fins coupled to the condensation end, and Q is a natural number greater than or equal to 1. As described in Item 4 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange, wherein each heat dissipation fin has a plurality of microchannels, and the extension direction of the microchannels is parallel to the extension direction of the inlet pipe. As described in Item 1 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber and a cold liquid fluid for heat exchange, wherein each steam chamber element is a three-dimensional steam chamber element, which further includes: A top cover having a tube body, an upper outer surface and an upper inner surface, wherein the tube body has a tube body cavity and a tube body inner surface; A lower cover matches the upper cover and has a lower outer surface and a lower inner surface. When the lower cover is sealed to the upper cover, the tube cavity forms a closed air cavity; A capillary structure is continuously disposed on the upper inner surface, the inner surface of the tube body and the lower inner surface; and A working fluid is disposed in the closed air cavity. As described in item 6 of the patent application scope, a heat dissipation module that utilizes a two-phase flow circulation steam cavity to exchange heat with a cold liquid fluid, wherein the tube body is integrally formed on the upper outer surface and protrudes outward from the upper outer surface, and the lower cover has a lower cover cavity, and when the lower cover is sealed to the upper cover, the tube body cavity and the lower cover cavity form the closed air cavity. As described in Item 6 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein the working fluid is one of water, acetone, ammonia, methanol, tetrachloroethane, and hydrofluorocarbon chemical refrigerants. As described in Item 7 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein the thickness of the capillary structure disposed on the lower inner surface relative to the tube body is greater than the thickness of the capillary structure disposed on the remaining lower inner surfaces. As described in Item 7 of the patent application, a heat dissipation module that utilizes a two-phase flow circulation steam chamber to exchange heat with a cold liquid fluid, wherein the ratio of the length of the tube body to the thickness of the lower cover and the upper cover after sealing is greater than 10.

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