CN203537724U - heat sink - Google Patents

Abstract

A heat dissipation device comprises a shell and a heat pipe. The shell comprises a chamber containing working liquid, a plurality of supporting columns and a plurality of fixing elements, wherein the supporting columns and the fixing elements are arranged in the chamber. The heat pipe includes a heat absorbing region disposed in the cavity of the housing and fixed by the fixing elements, and a heat dissipating region extending from the heat absorbing region through the housing and disposed outside the cavity of the housing.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device of a uniform temperature plate and a heat pipe.

Background technique

As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry has proposed vapor chambers and heat pipes with better heat conduction performance to effectively solve the heat dissipation problem at the current stage.

The vapor chamber (Vapor chamber includes a rectangular shell and the capillary structure of the inner chamber wall of the shell, and the inside of the shell is filled with working liquid, and one side of the shell (that is, the evaporation area) is pasted Adsorb the heat generated by a heating element (such as a central processing unit, a north-south bridge chip, a transistor, etc.), so that the liquid working liquid evaporates in the evaporation area of the housing and converts it into a vapor state, and conducts heat To the condensation area of the shell, the vapor working liquid is condensed into a liquid state after being cooled in the condensation area, and the liquid working liquid flows back to the evaporation area through gravity or capillary structure to continue the vapor-liquid circulation, so as to effectively achieve uniform temperature and heat dissipation Effect.

The principle and theoretical structure of the heat pipe are the same as those of the vapor chamber. It is mainly to fill the hollow part of the heat pipe with a circular tube diameter with metal powder, and form a ring-shaped capillary structure on the inner wall of the heat pipe by sintering. , and then the heat pipe is evacuated and filled with working liquid, and finally closed to form a heat pipe structure. When the working liquid is heated and evaporated from the evaporating part, it diffuses to the condensing end, and the working liquid is in a vapor state in the evaporating part, and when it leaves the evaporating part and diffuses to the condensing end, it is gradually cooled and condensed into a liquid state, and then passes through The capillary structure flows back into the evaporation section.

Comparing the vapor chamber and the heat pipe, only the heat conduction method is different. The heat conduction method of the vapor chamber is two-dimensional, which is a surface heat conduction method, but the heat conduction method of the heat pipe is a one-dimensional heat conduction method.

Furthermore, although the existing vapor chamber can achieve the effect of uniform temperature, another problem has been extended, that is, the heat transfer method of the vapor chamber is that after one side of the vapor chamber absorbs heat, it is absorbed by the vapor of the working liquid in the chamber. The liquid phase change conducts to the other side, in other words, the vapor chamber only absorbs heat from one side and conducts it to the opposite side to achieve a uniform temperature effect, but it cannot have the same heat transfer method as a heat pipe. The absorbed heat is conducted to the remote end for heat dissipation. Therefore, the vapor chamber is only suitable for large-area uniform heat conduction, and is not suitable for remote heat conduction. If the heat cannot be dissipated in a timely manner, it is easy to accumulate heat near the heat source.

Therefore, the current industry still needs to improve the current heat dissipation technology in order to greatly increase the efficiency of heat conduction and effectively solve the heat dissipation problem of high-power electronic components.

Utility model content

Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present utility model is to provide a large-area conduction heat source and a heat dissipation device for remote heat dissipation.

Another object of the present invention is to provide a heat dissipation device that utilizes both one-dimensional heat conduction and two-dimensional heat conduction to dissipate heat.

Another object of the present invention is to provide a heat dissipation device combining a vapor chamber and a heat pipe so as to improve heat conduction and heat dissipation efficiency.

Another object of the present invention is that a heat pipe runs through the inside and outside of a chamber of a vapor chamber, and the heat pipe located in the housing is fixed by a plurality of fixing elements arranged in the housing, and does not directly contact the heat dissipation device of the housing.

In order to achieve the above object, the utility model provides a heat dissipation device, comprising: a housing, including a first chamber provided with a first capillary structure and containing a first working liquid, a plurality of support columns and a plurality of fixed A component is arranged in the first chamber; and a heat pipe is arranged in the first chamber and extends through the housing toward the outside of the housing, the heat pipe includes a second chamber and a heat absorption area extending to a heat dissipation area, wherein the The second chamber is provided with a second capillary structure and accommodates a second working liquid. The heat absorption area is located in the first chamber of the housing and is fixed by the plurality of fixing elements. The heat dissipation area is located in the housing. outside the first chamber and exposed to the environment outside the housing. The casing includes an upper casing and a lower casing. The upper casing includes a side wall ring arranged around the first chamber and defines an opening communicating with the first chamber. The lower casing corresponds to the lower casing. The casing is arranged at the opening to seal the first chamber; wherein the first chamber is located between the upper casing and the lower casing.

Preferably, the lower housing includes a first side and a second side opposite to the first side, wherein the first side of the lower housing is provided with the first capillary structure and contacts the working fluid in the first chamber , the second side of the lower casing is in contact with a surface of a heat generating element; the side wall is located on the first side.

Preferably, the upper casing includes a third side and a fourth side opposite to the third side, and the third side is located in the first chamber and provided with the first capillary structure.

Preferably, the plurality of supporting columns are disposed between the first side of the lower case and the third side of the upper case to support the upper case and the lower case.

Preferably, in one implementation, the plurality of support column systems are made of thermally conductive metal, and the thermally conductive metal includes any one of gold, silver, copper, and aluminum or a combination thereof.

Preferably, in another implementation, a third capillary structure layer is formed on the outer surfaces of the plurality of support columns to cover the support columns.

Preferably, the third capillary structure layer is integrated with the first capillary structure via diffusion bonding.

Preferably, in other implementations, the plurality of support columns are porous columns formed by capillary structures.

Preferably, the plurality of fixing elements are located on the first side of the lower housing.

Preferably, the plurality of fixing elements have a free end contacting the heat absorbing area of the heat pipe, so as to fix and support the heat absorbing area of the heat pipe in the first chamber.

Preferably, the heat absorption area of the heat pipe is located between the upper casing and the lower casing, and does not contact the first side of the lower casing and the third side of the upper casing.

Preferably, in an implementation, the heat absorption area of the heat pipe is formed along an axial meander of the heat pipe.

Preferably, the plurality of supporting columns and the plurality of fixing elements are alternately arranged in rows, wherein the supporting columns of each row are adjacent to the fixing elements of another row.

Preferably, the heat absorption area of the heat pipe is located around the support column.

Through the utility model, the heat dissipation device not only has a large-area heat transfer effect, but also has a remote heat transfer function, thereby greatly improving the overall heat transfer effect.

Description of drawings

Fig. 1 is the three-dimensional exploded schematic view of the utility model;

Fig. 2 is the three-dimensional combination schematic diagram of the present utility model;

Fig. 3 is the sectional view of the X-X line of Fig. 2 of the utility model;

Fig. 4 is the sectional view of the Y-Y line of Fig. 2 of the present utility model;

Fig. 5 is a schematic diagram of the practical application of the utility model.

Symbol Description

1 cooling device

10 shell

11 upper shell

111 third side

112 fourth side

12 lower shell

121 first side

122 second side

123 side wall

1231 opening

1232 perforated

13 first chamber

131 First capillary structure

132 first working liquid

133 supporting columns

1331 Tertiary capillary structure

134 fixing elements

1341 free end

20 heat pipes

23 second chamber

21 endothermic zone

22 cooling zones

24 Second capillary structure

25 second working fluid

26 second cooling fins

27 The first cooling fin

28 heat generating elements

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the utility model is described in further detail:

The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 to 4, Figure 1 is a three-dimensional exploded view of the utility model, Figure 2 is a three-dimensional combination schematic view of the present utility model, Figure 3 is a cross-sectional view of the line XX' in Figure 2 of the utility model, Figure 4 It is the sectional view of YY' line in Fig. 2 of the present utility model. As shown in FIGS. 1 to 4 , the heat dissipation device 1 includes a housing 10 (as shown in FIG. 2 ) and a heat pipe 20 . The housing 10 can be made of a material with good thermal conductivity, such as metal, but it is not limited thereto. The housing 10 includes an upper housing 11, a lower housing 12 and a first chamber 13. The upper housing 11 has a pair of Referring to the lower casing 12 , the first chamber 13 is located between the upper casing 11 and the lower casing 12 . A first capillary structure 131 is disposed in the first chamber 13 and stores a first working fluid 132 (as shown in FIGS. 3 and 4 ). A plurality of supporting pillars 133 and a plurality of fixing elements 134 are disposed in the first chamber 13 . The heat pipe 20 passes through the housing 10 from the first chamber 13 and then extends out of the housing 10 .

The lower housing 12 includes a first side 121 and a second side 122. Opposite the first side 121, the first side 121 is provided with the first capillary structure 131 and contacts the first working material in the first chamber 13. The liquid 132 , the second side 122 is implemented as a plane for contacting the surface of a heat generating element (as shown in FIG. 5 ). A side wall 123 is arranged on the first side 121 and is arranged around the first chamber 13, an upper end of the side wall 123 defines an opening 1231 communicating with the first chamber 13, and the side wall 123 is provided with two A through hole 1232 provides the heat pipe 20 in the first chamber 13 to pass through.

The upper casing 11 is disposed at the opening 1231 to seal the first chamber 13 . It includes a third side 111 and a fourth side 112 opposite to the third side 111 , the third side 111 is located in the first chamber 13 and is provided with the first capillary structure 131 . In one implementation, the fourth side 112 forms a plane for contacting a heat dissipation element (as shown in FIG. 5 ). In another implementation, the heat can be dissipated directly from the fourth side 112 without contacting the heat dissipation element.

The heat pipe 20 is, for example, a heat pipe with a circular diameter or a flat plate heat pipe, which is shown as a heat pipe with a circular diameter in this figure, but it is not limited thereto. The heat pipe 20 includes a second chamber 23 (as shown in Figures 3 and 4) and a heat-absorbing region 21 extending a heat-dissipating region 22, wherein a second capillary structure 24 is provided in the second chamber 23 and accommodates a The second working liquid 25 (as shown in Figures 3 and 4), the heat absorption area 21 is arranged in the first chamber 13 of the casing 10, and is fixed by the plurality of fixing elements 134, the heat dissipation area 22 is arranged in The first chamber 13 of the casing 10 is outside and exposed to the environment outside the casing 10 . It should be noted that, the heat absorbing region 21 of the heat pipe 20 is formed along an axial direction of the heat pipe 20 to meander, thereby increasing the heat-receiving length of the heat pipe 20 .

The plurality of support cylinders 133 are disposed between the first side 121 of the lower case 12 and the third side 111 of the upper case 11, and are used to support the upper case 11 and the lower case 12 to prevent the casing from The body 10 collapses during or after vacuuming, and when the casing 10 is filled with the first working liquid 132 and sealed, the overall strength of the casing 10 can be further enhanced. The plurality of supporting cylinders 133 are preferably solid cylinders made of heat-conducting metal, and the heat-conducting metal includes any one of gold, silver, copper, and aluminum or a combination thereof. In another implementation, except that the support cylinder 133 is a solid cylinder made of heat-conducting metal, a layer of third capillary structure 1331 is formed on the outer surface of the support cylinder 133 to cover the support cylinder 133. The third capillary structure 1331 can be integrated with the first capillary structure 131 through diffusion bonding. In other implementations, the plurality of supporting pillars 133 are porous pillars made of metal powder sintered capillary structure. It should be noted that the third capillary structure 1331 or the support column 133 formed by the capillary structure enhances the capillary return efficiency, so that the first working liquid 132 cooled and liquefied close to the upper case 11 quickly capillary returns to the lower case 12.

The plurality of fixing elements 134 are arranged on the first side 121 of the lower casing 12, and have a free end 1341 upright facing but not in contact with the upper casing 11, and the free end 1341 is used for contacting the suction of the heat pipe 20. The heat zone 21 and the shape of the free end 1341 match the shape of the heat pipe 20 so as to fix and support the heat absorption zone 21 of the heat pipe 20 in the first chamber 13 .

Moreover, the plurality of supporting columns 133 and the plurality of fixing elements 134 in the first chamber 13 are alternately arranged in rows, and the supporting columns 133 of each row are adjacent to the fixing elements 134 of another row. In such an arrangement, the heat absorbing region 21 formed in a meandering manner is wound around the support column 133 . In this way, the heat on the surface of the second side 122 of the lower case 12 can be evenly transferred to the heat absorption area 21 of the heat pipe 20 via the fixing element 134 of the first side 121 . But not only that, because the first working fluid 132 in the first chamber 13 changes from a liquid state to a vapor state after being heated in the lower casing 12, and then brings heat to the upper casing 11 to dissipate heat, the first working fluid 132 in the vapor state is Passing through the heat absorption region 21 of the heat pipe 20 on the way to the upper casing 11 , part of the heat will be absorbed by the heat absorption region 21 of the heat pipe 20 , and then dissipated through the heat pipe 20 . On the other hand, the heat pipe 20 avoids the support cylinder 133, so most of the cooled and liquefied first working liquid 132 will capillary flow back to the lower casing 12 along the third capillary structure 1331 outside the support cylinder 133, avoiding The water drops to the heat absorption area 21 of the heat pipe 20, so the heat absorption effect of the heat absorption area 21 will not be affected.

Furthermore, in one implementation, the heat absorption area 21 of the heat pipe 20 supported by the fixing element 134 is located between the upper casing 11 and the lower casing 12, and does not contact the first side 121 of the lower casing 12 and the upper casing. The third side 111 of the casing 11 (shown in FIGS. 3 and 4 ). This will reduce the heat absorption effect of the heat absorbing region 21 of the heat pipe 20 on the cooling of the liquefied first working fluid 132 in the upper housing 11 and/or the first working fluid 132 prepared to be liquefied and vaporized in the lower housing 12 .

Incidentally, the second working liquid 25 in the heat absorption area 21 of the heat pipe 20 changes into a vapor state after being heated, and then transfers heat to the heat dissipation area 22 for heat dissipation, and the second working liquid 25 cooled in the heat dissipation area 22 is vaporized It turns into liquefaction and then capillary flows back to the heat-absorbing area along the second capillary structure 24, so that the heat transfer is carried out in a cycle.

Finally, the first, second, and third capillary structures 131 , 24 , and 1331 described in this embodiment are specifically formed by, for example, metal powder sintering, but are not limited thereto, and may also be mesh or fiber.

Please continue to refer to FIG. 5 , which is a schematic diagram of a specific application of the present invention. As shown in FIG. 5, referring to FIGS. 1-4 together, the bottom surface of the housing 10, that is, the second side 122 of the lower housing 12 is disposed on the surface of a heat generating element 28, such as a CPU; The top surface of the casing 10, that is, the fourth side 112 of the upper casing 11 is provided with a heat dissipation element, such as a first heat dissipation fin 27, and the heat dissipation area 22 of the heat pipe 20, that is, the end far away from the heat absorption area 21 is provided with a Another heat dissipation element, such as a second heat dissipation fin 26 .

The heat generated by the heat generating element 28 is transferred from the second side 122 of the lower casing 12 to the first side 121, so that the liquid first working fluid 132 in the first chamber 13 is heated and converted into steam, and the heat is transferred to the upper casing 11. At the third side 111 , at the same time, the first working fluid 132 also transfers heat to the heat absorption area 21 of the heat pipe 20 . Meanwhile, the heat generated by the heat generating element 28 is transferred from the second side 122 to the first side 121 of the lower housing 12 , and then the heat is transferred to the heat absorbing region 21 of the heat pipe 20 through the fixing element 134 . Since the heat pipe 20 conducts rapidly in one direction, the heat in the heat absorbing area 21 is quickly transferred to the heat dissipating area 22 and dissipated by the second heat dissipating fins 26 . On the other hand, the heat from the heat generating element 25 can be quickly transferred to the fourth side 112 of the upper housing 11 , so that the heat is evenly spread on the effective area of the fourth side 112 , and then dissipated through the first cooling fins 27 .

To sum up, the utility model can make the cooling device not only have a large-area heat transfer effect, but also have the function of remote conduction and heat dissipation, thereby greatly improving the overall heat transfer effect.

Although the utility model is disclosed as above in terms of implementation, it does not limit the utility model. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore The scope of protection of the utility model should be defined by the claims.

Claims (15)

1. a heat abstractor, is characterized in that, comprising:

One housing, comprises one first chamber and is provided with one first capillary structure and has been installed with the first hydraulic fluid, and a plurality of support cylinders and a plurality of retaining element are arranged in this first chamber; And

One heat pipe, be arranged in this first chamber and run through this housing towards housing extension, this heat pipe comprises one second chamber and a radiating area is extended in a heat absorption district, wherein in this second chamber, be provided with one second capillary structure and be installed with one second hydraulic fluid, this heat absorption district is positioned at first chamber of this housing, and by the plurality of retaining element, fixed, this radiating area is positioned at outside first chamber of this housing, and is exposed in the environment outside this housing.

2. heat abstractor as claimed in claim 1, it is characterized in that, wherein this housing comprises a upper shell and a lower house, this upper shell comprises that a side wall ring is located at this first chamber around, and define this first chamber of an open communication, this lower house is to should lower house and be arranged on this opening part and seal this first chamber; Wherein this first chamber is between this upper shell and lower house.

3. heat abstractor as claimed in claim 2, it is characterized in that, wherein this lower house comprises one first side and contrary this first side of one second side, wherein the first side of this lower house is provided with this first capillary structure and contacts the hydraulic fluid in this first chamber, the surface of the second side contacts one hot producing component of this lower house; This sidewall is positioned at this first side.

4. heat abstractor as claimed in claim 3, is characterized in that, wherein upper shell comprises one the 3rd side and contrary the 3rd side of one the 4th side, and the 3rd side is positioned at this first chamber and is provided with this first capillary structure.

5. heat abstractor as claimed in claim 4, is characterized in that, wherein the plurality of support cylinder is arranged between the first side of this lower house and the 3rd side of this upper shell, to support this upper shell and this lower house.

6. heat abstractor as claimed in claim 5, is characterized in that, wherein the plurality of support cylinder is that heat-conducting metal forms, and this heat-conducting metal comprises wherein arbitrary or its combination of gold, silver, copper and aluminium.

7. heat abstractor as claimed in claim 6, is characterized in that, wherein the outer surface of the plurality of support cylinder forms coated this support cylinder of one the 3rd capillary structure layer.

8. heat abstractor as claimed in claim 7, is characterized in that, wherein the 3rd capillary structure layer is combined into one via diffusion bond and this first capillary structure.

9. heat abstractor as claimed in claim 6, is characterized in that, wherein the plurality of support cylinder is the concrete dynamic modulus cylinder that capillary structure forms.

10. heat abstractor as claimed in claim 6, is characterized in that, wherein the plurality of retaining element is positioned at the first side of this lower house.

11. heat abstractors as claimed in claim 2, is characterized in that, wherein the plurality of retaining element has the heat absorption district that a free end contacts this heat pipe, with the heat absorption district of this heat pipe of fixed support in this first chamber.

12. heat abstractors as claimed in claim 11, is characterized in that, wherein the heat absorption district of this heat pipe is positioned between this upper shell and lower house, and do not contact the first side of this lower house and the 3rd side of this upper shell.

13. heat abstractors as claimed in claim 12, is characterized in that, wherein the heat absorption district of this heat pipe is extending to form of axially wriggling along one of this heat pipe.

14. heat abstractors as claimed in claim 13, is characterized in that, wherein the plurality of support cylinder and a plurality of retaining element are the mutual spread configuration of mode with row, the wherein retaining element of adjacent another row of support cylinder of every a line.

15. heat abstractors as claimed in claim 14, is characterized in that, wherein the heat absorption position of this heat pipe at this support cylinder around.

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