21134twf.doc/e 200806159 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱模組（Heat Dissipati〇n21134twf.doc/e 200806159 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipation module (Heat Dissipati〇n)
Module)，且特別是有關於一種具有熱傳介質保護蓋 (Thermal Medium Cap)之散熱模組。 【先前技術】 .在電子元件的散熱模組領域中，為減少散熱器㈤沾 Smk)與發熱電子元件間之接觸熱組（Thermal Resistance)，通常會在散熱器底面塗佈一熱傳導性質敍於 之熱傳介質（Thermal Medium)，並使散熱^透過熱傳介質 與發熱電子元件接觸。其中，散熱器與發熱電子元件間之 間隙會被熱傳介質填滿，使得發熱電子元件所產生之敎量 能有效地經由熱傳介質傳導至散熱器，進而對流至外;^環 ^ ’以達到散熱之效果。然而，在連輸或組裝散熱器之過 私中，塗佈於散熱器底面之熱傳介質容易受到其他元件之 到擦或是受到灰塵之汙染，造成散熱器組裝至發熱電子元 • 件後’散熱器與發熱電子元件間之熱傳導效果會因熱傳介 質受到刮擦或是汗染而大幅降低。 習知技術即提出-種散熱模組，其具有一散熱器與一 熱傳^質保護蓋。其中，熱傳介質保護蓋是藉由設置於其 部份蓋體之黏膠來貼附於散熱器之底面，進而覆蓋塗佈ς 散熱器底面之熱傳介質，以達到防止熱傳介質受到频或 是汗染之目的。 ' 然而’在將熱傳介質保護蓋組裝於散熱器之過程中， 21134twf.doc/e 200806159 由ί熱傳呆護蓋f先進行人卫黏膠才能貼附至散熱器 來蔣保例使用膠帶或雙面膠等方式 f將保於散熱器本體，目此雜費較多人力成 另黏^之材料成本也增加了散熱模組之產品成本。 運輪或組裝散熱器之過程中，埶傳介 蓋容易因_雜不足峨落，錢人;^丨貝保破 9P疋叫贶洛，使侍熱傳介質受到刮擦或 1汗*。目此，散熱驗敍發熱電子 盘 ，電子元件間之熱傳導效果將大幅降低，甚至 電子兀件因韻效果稀而發生難之航。 “、、 【發明内容】 中的H明之目的是提供—種散熱模組，以解決w知技術 為^上述目的，本發明提出一種散熱模組，其包括 =二2質、及熱傳介質保護蓋，其中散熱器適於配 置在U上，且具有多個開槽。熱傳 熱器與發熱源接觸之一表面。㈣_二：疋配置於政 ㈣,… 此外’熱傳介質保護蓋具有Module), and in particular, a heat dissipation module with a Thermal Medium Cap. [Prior Art] In the field of heat dissipation modules for electronic components, in order to reduce the thermal resistance between the heat sink (5) and the heat-generating electronic components, a heat transfer property is usually applied to the bottom surface of the heat sink. The Thermal Medium is placed in contact with the heat-generating electronic components through the heat transfer medium. Wherein, the gap between the heat sink and the heat-generating electronic component is filled by the heat transfer medium, so that the amount of heat generated by the heat-generating electronic component can be effectively transmitted to the heat sink via the heat transfer medium, and then convected to the outside; Achieve the effect of heat dissipation. However, in the case of continuous transmission or assembly of the heat sink, the heat transfer medium applied to the bottom surface of the heat sink is easily contaminated by other components or contaminated by dust, resulting in assembly of the heat sink to the heat-emitting electronic component. The heat transfer between the heat sink and the heat-generating electronic components is greatly reduced by scratching or sweating of the heat transfer medium. The prior art proposes a heat dissipation module having a heat sink and a heat transfer protection cover. The heat transfer medium protection cover is attached to the bottom surface of the heat sink by the adhesive disposed on a part of the cover body, and further covers the heat transfer medium of the heat sink bottom surface of the heat sink to prevent the heat transfer medium from being affected. Or the purpose of sweating. ' However, in the process of assembling the heat transfer medium protection cover to the radiator, 21134twf.doc/e 200806159 is carried out by the ί heat relay cover f first to carry the adhesive to the radiator. The surface glue and the like f will be preserved on the heat sink body, and the cost of the material is also increased by the cost of the material. In the process of transporting the wheel or assembling the radiator, the 埶 介 cover is easy to fall due to _ miscellaneous, money people; ^ 丨 保 保 9 9 9 9 9 9 9 9 9 9 9 , , , , , , , , , , , , , , , , , , , In view of this, the heat dissipation test heat-emitting electronic disk, the heat conduction effect between the electronic components will be greatly reduced, and even the electronic components will be difficult to navigate due to the rare effect of the rhyme. The purpose of the invention is to provide a heat dissipation module to solve the above-mentioned purpose. The present invention provides a heat dissipation module comprising: 2, 2, and heat transfer medium protection. a cover, wherein the heat sink is adapted to be disposed on the U and has a plurality of slots. The heat transfer device is in contact with one of the surfaces of the heat source. (4) _2: 疋 is disposed in the government (4), ... In addition, the 'heat transfer medium protection cover has
:盍體與多_轉，固定部延伸自蓋體，其中蓋體覆罢 熱傳介質，而固定部穿設於開槽中。 I 在本發明之-實施例中，蓋體包括一頂壁與一側壁， 而頂壁與側壁構成-罩覆空間，以罩覆熱傳介質。 在本發明之-實施例中，蓋體與固定部一體成形。 在本發明之-實施例巾，熱傳介質保護蓋之材質為塑 性材料。 在本毛月之I施例中，散熱器包括適於與發熱源接 21134twf.doc/e 200806159 觸之一底座，而熱傳介質配置在底座與發熱源接觸之一表 面’其中開槽是位於底座之侧邊。 在本發明之一實施例中，散熱器更包括一鰭片組與多 個熱管’這些齡之—端連接域座，而鰭版配設於這 些熱管之另一端。 在本發明之一實施例中，散熱器更包括一與底座連接 之鎖固支架，而熱管被挾持於鎖固支架與底座之間，其中 開槽是位於鎖固支架之侧邊。 在本發明之散熱模組中，熱傳介質保護蓋具有一蓋體 與多個延伸自蓋體之固定部，其中蓋體覆蓋熱傳介質，以 ，護熱傳介質不會受到刮擦或是汙染，而固定部可穿設於 政熱器之開槽，進而達到將熱傳介質保護蓋固定於散熱器 之目的。藉此/可降、低散熱模組之生產成本，並解決習知 之熱傳介質保護蓋因'黏膠黏性不足而脫落之問題。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 · 【實施方式】 圖1A繪示為本發明較佳實施例之一種散熱模組的組 =圖，圖1B繪示為圖1A之散熱模組的分解圖，而圖2繪 不為圖1A之散熱模組在拆除熱傳介質保護蓋後，組裝於 —電路板上之發熱源的示意圖。請同時參考圖1A、圖1B 與圖2 ’本貫施例之散熱模組1⑻主要包括散熱器ι1〇、熱 傳>1貝120、及熱傳介質保護蓋i3〇(Grease Cover)。 7 21134twf.doc/e 200806159 上述散熱器110適於配置在電路板l〇上之發熱源 12 ’以對發熱源12進行散熱，而熱傳介質120配置於散熱 器Π0與發熱源接觸之一表面ll〇a。舉例來說，電路板1〇 例如是電腦之主機板（Mother Board)，而發熱源12例如是 中央處理單元（Center Processor Unit, CPU) 〇: The body and the multi-turn, the fixing portion extends from the cover body, wherein the cover body covers the heat transfer medium, and the fixing portion is disposed in the slot. In an embodiment of the invention, the cover includes a top wall and a side wall, and the top wall and the side wall define a covering space to cover the heat transfer medium. In an embodiment of the invention, the cover is integrally formed with the fixed portion. In the towel of the present invention, the heat transfer medium protective cover is made of a plastic material. In the example of this month, the heat sink includes a base adapted to be connected to a heat source 21134twf.doc/e 200806159, and the heat transfer medium is disposed on a surface of the base in contact with the heat source 'where the slot is located The side of the base. In an embodiment of the invention, the heat sink further includes a fin set and a plurality of heat pipes 'the age-end connection domain seats, and the fin plates are disposed at the other ends of the heat pipes. In an embodiment of the invention, the heat sink further includes a locking bracket connected to the base, and the heat pipe is clamped between the locking bracket and the base, wherein the slot is located at a side of the locking bracket. In the heat dissipation module of the present invention, the heat transfer medium protection cover has a cover body and a plurality of fixing portions extending from the cover body, wherein the cover body covers the heat transfer medium, so that the heat transfer medium is not scratched or Contamination, and the fixed part can be inserted into the slot of the political heat device, thereby achieving the purpose of fixing the heat transfer medium protection cover to the heat sink. This can reduce the production cost of the low heat dissipation module and solve the problem that the conventional heat transfer medium protection cover is detached due to insufficient adhesiveness. The above and other objects, features and advantages of the present invention will become more <RTIgt; 1A is a group diagram of a heat dissipation module according to a preferred embodiment of the present invention. FIG. 1B is an exploded view of the heat dissipation module of FIG. 1A, and FIG. 2 is not a diagram of FIG. 1A. After disassembling the heat transfer medium protection cover, the heat dissipation module is assembled to a schematic diagram of the heat source on the circuit board. Referring to FIG. 1A, FIG. 1B and FIG. 2 respectively, the heat dissipation module 1 (8) of the present embodiment mainly includes a heat sink ι1 〇, a heat transfer 1-3, and a heat transfer medium protective cover i3 〇 (Grease Cover). 7 21134twf.doc/e 200806159 The heat sink 110 is adapted to be disposed on the heat source 12' of the circuit board 10 to dissipate the heat source 12, and the heat transfer medium 120 is disposed on the surface of the heat sink Π0 and the heat source. Ll〇a. For example, the circuit board 1 is, for example, a motherboard of a computer, and the heat source 12 is, for example, a central processing unit (CPU).
值得一提的是，本實施例之散熱器n〇設有多個開槽 ll〇b，而熱傳介質保護蓋130則是藉由這些開槽11%來^ 定於散熱器110上，進而保護熱傳介質120不會受到人為 之刮擦或是受到灰塵汙染。 詳細地說，於本實施例中，熱傳介質保護蓋13〇具有 盍體132與多個固定部134，上述蓋體132覆蓋熱傳介質 120,該些固定部134延伸自蓋體132而位於蓋體” 132之兩 侧，且該些固定部134之位置與散熱器11〇之開槽u〇b 的位置相對應，俾供該些固定部134能穿設於開槽Η此 中。此外，上述盍體132更包括有頂壁〗32a與至少一個側 壁132b，頂壁132a與該些侧壁132b構成—罩覆空間 132c，以罩覆熱傳介·質12〇。 於本實施例中，熱傳介質保護蓋13〇之材質為塑性; 料，且熱傳介質保護蓋13()可經由—塑性材料薄片衝壓 形成，透過射出成型來形成。換言之，蓋體132與固定 1—34是一體成形。當然，在其他實施例中，熱傳介質保 蓋13二之材質可以是其他具有形變回復力良好的材質，、 外，/蓋體132與固定部134亦可透過其他折疊或接合方 來形成。 〇 21134twf.doc/e 200806159 另外，由於本實施例之熱傳介質保護蓋m其 f生材料’因此熱傳介f保護蓋130容易因受力而產生暫 日推之塑性變形，進而讓固定部134可順利地穿設於開槽 =〇b中。在移除上述之受力條件後，熱傳介質保護蓋請 έ回覆f原本之狀態，使得固定部m卡固於開槽議 中，而蓋體132可覆蓋熱傳介質12〇。 如欲自散熱器110上拆卸熱傳介質保護蓋13〇時，僅 =對固疋於散熱态11〇上之熱傳介質保護蓋施力，使 得熱傳介質保護蓋130之外型產生暫時性之塑性變形，即 可使固定部134不再穿設於開槽11〇b，熱傳介質保護蓋13〇 即可與政熱斋Π0分離。具體地說，本實施例之熱傳介質 保濩盍130具有容易組裝於散熱器11〇以及容易自散熱器 Π0上拆卸下來的優點。 承上所述，散熱器Π0主要包括與發熱源12接觸之 底座112、——鰭片組114、多個熱管116以及一鎖固支架 118。其中，鎖固支架us是藉由多個鎖固元件i18a來固 定於底座112上（請一併參考圖3)，而散熱器110是藉由 鎖固支架118與電路板10間之鎖固關係來固定於發熱源 12上。在本實施例中，熱傳介質〗2〇配置於底座1丨2與發 熱源12接觸之一表面U2a，熱管116之一端116a連接於 底座112,而鰭片組114則配設於熱管116之另一端U6b。 此外，開槽110b是設於鎖固支架118之侧邊，而上述固定 部134即可穿設於這些開槽ii〇b，使得熱傳介質保護蓋13〇 能固定於散熱器110上。當然，本實施例在此並不對散熱 21134twf.doc/e 200806159 裔110之組成構件做任何限制。也就是說，在其他實施例 中，散熱器110可以藉由另一種固定裝置來配設於發熱源 12上’而上述之開槽11〇b可設置於底座112或是散熱器 110之其他部位，以供熱傳介質保護蓋13〇之固定部134 穿設。It is to be noted that the heat sink n〇 of the embodiment is provided with a plurality of slots 〇b, and the heat transfer medium protection cover 130 is fixed to the heat sink 110 by 11% of the slots. The heat transfer medium 120 is protected from being scratched by humans or contaminated with dust. In detail, in the present embodiment, the heat transfer medium protection cover 13 has a body 132 and a plurality of fixing portions 134. The cover 132 covers the heat transfer medium 120, and the fixed portions 134 extend from the cover 132. The two sides of the cover body 132, and the positions of the fixing portions 134 correspond to the positions of the slots u〇b of the heat sink 11〇, so that the fixing portions 134 can be penetrated into the slot. The body 132 further includes a top wall 32a and at least one side wall 132b. The top wall 132a and the side walls 132b constitute a covering space 132c to cover the heat transfer medium 12 〇. In this embodiment The heat transfer medium protection cover 13 is made of plastic material; and the heat transfer medium protection cover 13 () can be formed by stamping a plastic material sheet and formed by injection molding. In other words, the cover 132 and the fixed 1 - 34 are In other embodiments, the material of the heat transfer medium cover 13 may be other materials having good deformation restoring force, and the cover body 132 and the fixing portion 134 may also pass through other folding or joining parties. To form. 〇21134twf.doc/e 200806159 In addition, due to this The heat transfer medium protection cover of the embodiment is such that the heat transfer material f is easy to be plastically deformed by the force, so that the fixing portion 134 can be smoothly passed through the slot = 〇 After removing the above-mentioned stress conditions, the heat transfer medium protection cover should be returned to the original state, so that the fixing portion m is stuck in the slotted portion, and the cover 132 can cover the heat transfer medium 12〇. If the heat transfer medium protection cover 13 is to be detached from the heat sink 110, only the heat transfer medium protection cover that is fixed on the heat dissipation state 11 施 is applied, so that the heat transfer medium protection cover 130 has a temporary appearance. The plastic deformation can make the fixing portion 134 no longer pass through the slot 11b, and the heat transfer medium protection cover 13 can be separated from the political heat sink 0. Specifically, the heat transfer medium of the embodiment is protected. The crucible 130 has the advantage of being easily assembled to the heat sink 11 and easily detached from the heat sink 。0. As described above, the heat sink Π0 mainly includes a base 112 that contacts the heat source 12, the fin group 114, and a plurality of The heat pipe 116 and a locking bracket 118. Among them, the locking bracket us is by a plurality of locks The component i18a is fixed to the base 112 (please refer to FIG. 3 together), and the heat sink 110 is fixed to the heat source 12 by the locking relationship between the locking bracket 118 and the circuit board 10. In this embodiment The heat transfer medium is disposed on the surface U2a of the base 1丨2 and the heat source 12, one end 116a of the heat pipe 116 is connected to the base 112, and the fin set 114 is disposed at the other end U6b of the heat pipe 116. The slot 110b is disposed on the side of the locking bracket 118, and the fixing portion 134 can be disposed through the slots ii〇b so that the heat transfer medium protection cover 13 can be fixed to the heat sink 110. Of course, this embodiment does not impose any restrictions on the components of the heat sink 21110 twf. That is, in other embodiments, the heat sink 110 can be disposed on the heat source 12 by another fixing device, and the above-mentioned slot 11b can be disposed on the base 112 or other parts of the heat sink 110. The fixing portion 134 of the heat transfer medium protection cover 13 is pierced.
綜上所述，本發明較佳實施例所提供之散熱器具有多 個開槽’而熱傳介質保護蓋之蚊部可穿設於散熱器之開 槽，進而讓盍體可覆蓋熱傳介質，以保護熱傳介質不會受 到人為之刮擦或是受到灰塵汙染。相較於習知技術，本發 明較佳實施例所提供之散熱模組有下列優點： η —(—)由於本發明較佳實施例所提供之熱傳介質保護蓋 疋藉由固定部與開槽間之卡合關係而直接固定於散熱器 2而無須任何雜·，因此本發雜佳實施例所 提供之散熱模組有較低之材料成本： ㈡本發明較佳實施例所提供之熱傳介 ΓΓ:糊之卡合關係而直接固定於散熱器上： ’將”，、傳介質保護蓋組裝至散熱器之過程中，無 提供之本本發明較佳實_ 是藉:護㊁ :上熱拆傳:=有容易組裝一及 (四）由於本發明較佳實施例所提供之熱傳介質保護蓋 200806159 21134twf.doc/e 疋藉與開槽間之卡合聽而 =質保護蓋可穩固地配置於散熱器上：以 二貝人為之顺歧灰塵㈣，科會有習= 述之”、、傳介質賴蓋目故脫叙問題。 —f然本發明已喻佳實麵揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，明牲 和範圍内，當可作此，之脫縣W之精神 F二汗之更動與潤飾，因此本發明之伴譜 範圍當視後附之申請專利範圍所界定者為準。之保屢 【圖式簡單說明】 圖1A繪福本發雜佳實補之—錄熱模組的敏 合圖。 、 圖1B繪示為圖lAi散熱模組的分解圖。 圖2繪示為圖1A之散熱模組在拆除熱傳介質保護蓋 ^ ，並組裝於一電路板上之發熱源的示意圖。 圖3繪示為目1B之鎖固支架與底座之連接示意圖。 【主要元件符號說明】 W:電路板· U =發熱源 100 I散熱模組 u〇 :散熱器 U〇a :表面 110b :開槽 112 ·底座 112a :表面 11 200806159 21134twf.doc/e 114 :鰭片組 116 :熱管 116a、116b :熱管之端部 118 :鎖固支架 118a :鎖固元件 120 :熱傳介質 130 :熱傳介質保護蓋 132 :蓋體 • 132a:頂壁 132b :侧壁 132c :罩覆空間 134 :固定部 12In summary, the heat sink provided by the preferred embodiment of the present invention has a plurality of slots, and the mosquito portion of the heat transfer medium protection cover can be inserted into the slot of the heat sink, so that the body can cover the heat transfer medium. To protect the heat transfer medium from being scratched or contaminated by dust. Compared with the prior art, the heat dissipation module provided by the preferred embodiment of the present invention has the following advantages: η - (-) The heat transfer medium protection cover provided by the preferred embodiment of the present invention is fixed by the fixing portion and the opening The heat dissipation module provided by the present invention has a lower material cost because of the snap-fit relationship between the slots and is directly fixed to the heat sink 2: (b) the heat provided by the preferred embodiment of the present invention The ΓΓ: 糊 卡 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊 糊Thermal teardown: = easy to assemble one and (4) heat transfer medium protection cover provided by the preferred embodiment of the present invention 200806159 21134twf.doc / e 疋 by the snap between the slotted and the quality protection cover Stablely placed on the radiator: the two people are the same as the dust (four), the branch will learn to describe it, and the media will be removed from the cover. The present invention has been described above, but it is not intended to limit the present invention, and any person skilled in the art, within the scope and scope of the invention, can do this, and the spirit of F. Therefore, the scope of the present invention is defined by the scope of the appended claims. The protection of the pattern [Simple description of the diagram] Figure 1A depicts the fascinating picture of the recording module. FIG. 1B is an exploded view of the heat dissipation module of FIG. 2 is a schematic view showing the heat source of the heat dissipation module of FIG. 1A with the heat transfer medium protective cover removed and assembled on a circuit board. FIG. 3 is a schematic view showing the connection of the locking bracket of the item 1B and the base. [Description of main component symbols] W: Circuit board · U = Heat source 100 I Heat dissipation module u〇: Heat sink U〇a: Surface 110b: Slot 112 • Base 112a: Surface 11 200806159 21134twf.doc/e 114 : Fin Chip set 116: heat pipes 116a, 116b: heat pipe end 118: locking bracket 118a: locking element 120: heat transfer medium 130: heat transfer medium protection cover 132: cover body • 132a: top wall 132b: side wall 132c: Covering space 134: fixing portion 12