1292301 0950157 21134twf.doc/e 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱模組（Heat Dissipation Module)，且特別是有關於一種具有熱傳介質保護蓋 (Thermal Medium Cap)之散熱模組。 【先前技術】 在電子元件的散熱模組領域中，為減少散熱器（Heat Sink)與發熱電子元件間之接觸熱組（Thermal Resistance)，通常會在散熱器底面塗佈一熱傳導性質較佳 之熱傳介質（Thermal Medium)，並使散熱器透過熱傳介質 與發熱電子元件接觸。其中，散熱器與發熱電子元件間之 間隙會被熱傳介質填滿，使得發熱電子元件所產生之熱量 能有效地經由熱傳介質傳導至散熱器，進而對流至外界環 i兄，以達到散熱之效果。然而，在運輸或組裝散熱器之過 程中，塗佈於散熱器底面之熱傳介質容易受到其他元件之 刮擦或是受到灰塵之汙染，造成散熱器組裝至發熱電子元 件後，散熱器與發熱·電子元件間之熱傳導效果會因熱傳介 質受到刮擦或是汙染而大幅降低。 是汙染之目的 然而 習知技術即提出-種散熱模組，其具有一散熱器與一 熱傳介質保護蓋。其巾’熱傳介魏護蓋是藉由設置於並 之黏膠來貼附於散熱器之底面’進而覆蓋塗佈ς 底面之熱傳介f，以達到防止熱傳介質麵刮擦或 程中 ’在將熱傳介質保護蓋組裝於散熱器之過 1292301 0950157 21134twf.doc/e 由於熱傳介^保護蓋需先進行人工黏膠才能貼附至散熱器 之底面以覆蓋熱傳介質，例如：使用膠帶或雙面膠等方^ 來將保護蓋固定於散熱器本體，因此需耗費較多人力成 本。此外，黏膠之材料成本也增加了散熱模組之產品成本。 方面，在運輸或組裝散熱!!之過程中，熱傳介質保護 蓋容易因黏膠黏性不足而脫落，使得熱傳介質受到刮擦或 是汙染。因此，散熱器組裝至發熱電子元件時，散熱器與 發熱電子元件間之熱傳導效果將大幅降低，甚至造成發熱 電子元件因散熱效果不佳而發生損壞之情況。 【發明内容】 本發明之目的是提供一種散熱模組，以解決習知技 中的問題。 n 為達上述目的，本發明提出一種散熱模組，其包括散 熱為、熱傳介質、及熱傳介質保護蓋，其中散熱器適於配 置在一發熱源上，且具有多個開槽。熱傳介質是配置於散 熱器與發熱源接觸之一表面。此外，熱傳介質保護蓋具有 一蓋體與多個固定部-，固定部延伸自蓋體，其中蓋體覆蓋 熱傳介質，而固定部穿設於開槽中。 在本發明之一實施例中，蓋體包括一頂壁與一側壁， 而頂壁與側壁構成一罩覆空間，以罩覆熱傳介質'。土 在本發明之一實施例中，蓋體與固定部一體成形。 在本發明之一實施例中，熱傳介質保護蓋之材質為塑 性材料。 在本發明之-實施例中，散熱器包括適於與發熱源接 1292301 0950157 21134twf.doc/e ，之二底座，而熱傳介質配置在 面’其中開槽是位於底座之側邊。·--源接觸之-表 編ΐ本發明之—實施例中，散熱器更包括—W細盘夕 個熱管，這些熱普夕一_、古& ^鰭片組與多 些熱管之另—端。 於底座，而則組S&設於這 在本發明之-實_中， 之鎖固支架，而熱管被㈣肖底座連接 開槽是位於鎖固支架之側邊。 <間具中 在本發狀散熱模財，熱傳介冑 與^個延伸自蓋體之固转，其中蓋體覆蓋熱傳^質盍^ 保遵，傳介㈣會受_擦或是汗染㈣定部可穿設於 散熱器之開槽，進而制賴傳介㈣護難定於散埶哭 之目的。藉此，可降低散熱模組之生產成本，並解決習、: 之熱傳介質保護蓋因黏膠黏性不足而脫落之問題。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 · ' 【實施方式】 圖1A繪示為本發明較佳實施例之一種散熱模組的級 合圖，圖1B繪示為圖1A之散熱模組的分解圖，而圖2冷 示為圖1A之散熱模組在拆除熱傳介質保護蓋後，組裝於 一電路板上之發熱源的示意圖。請同時參考圖1A、圖1B 與圖2，本實施例之散熱模組1〇〇主要包括散熱器no、熱 傳介質120、及熱傳介質保護蓋130(Grease Cover)。 12923獻57 21134twf.doc/e 上述散熱器110適於配置在電路板10上之發熱源 12，以對發熱源12進行散熱，而熱傳介質丨2〇配置於散熱' 器110與發熱源接觸之一表面ll〇a。舉例來說，電路板 例如是電腦之主機板（Mother Board)，而發熱源12例如B 中央處理單元（Center Processor Unit，CPU)。 值得一提的是，本實施例之散熱器110設有多個開槽 ll〇b，而熱傳介質保護蓋130則是藉由這些開槽110b^^ 定於散熱器110上，進而保護熱傳介質12〇不會受到人為 之刮擦或是受到灰塵汙染。 w 詳細地說，於本實施例中，熱傳介質保護蓋13〇具有 蓋體132與多個固定部134，上述蓋體132覆蓋熱傳介質 120,該些固定部134延伸自蓋體132而位於蓋體132之兩 側，且該些固定部134之位置與散熱器110之開槽u〇b 的位置相對應，俾供該些固定部134能穿設於開槽u〇b 中。此外，上述蓋體132更包括有頂壁132a與至少一個側 壁132b，頂壁132a與該些側壁132b構成一罩覆空間 132c，以罩覆熱傳介·質12〇。 於本實施例中，熱傳介質保護蓋13〇之材質為塑性材 料，且熱傳介貝保濩蓋130可經由一塑性材料薄片衝壓而 形成或透過射出成型來形成。換言之，蓋體132與固定部 =4是一體成形。當然，在其他實施例中，熱傳介質保護 蓋130之材質可以是其他具有形變回復力良好的材質，另 外，蓋體132與固定部134亦可透過其他折疊或接合方式 來形成。 1292301 21134twf.doc/e 0950157 另外，由於本實施例之熱傳介質保護蓋130其材質為 塑性材料，因此熱傳介質保護蓋13G容易因受力而產生暫 時ι±之塑性變㊉’進而讓in定部134可順利地穿設於開槽 110b中。在移除上述之受力條件後，熱傳介質保護蓋13〇 會回覆至原本之狀態，使得固定部134卡固於開槽110b 中’而蓋體132可覆蓋熱傳介質丨20。 如欲自散熱器110上拆卸熱傳介質保護蓋13〇時，僅 需對固定於散熱器11〇上之熱傳介質保護蓋13〇施力，使 得熱傳介質保護蓋130之外型產生暫時性之塑性變形，即 可使固定部134不再穿設於開槽1101)，熱傳介質保護蓋13〇 即可與散熱器110分離。具體地說，本實施例之熱傳介質 保護蓋130具有容易組裝於散熱器u〇以及容易自散熱器 Π0上拆卸下來的優點。 承上所述，散熱器110主要包括與發熱源12接觸之 底座112、一鰭片組114、多個熱管116以及一鎖固支架 118。其中，鎖固支架118是藉由多個鎖固元件118a來固 定於底座112上（請一併參考圖3)，而散熱器110是藉由 鎖固支架118與電路板10間之鎖固關係來固定於發熱源 U上。在本實施例中，熱傳介質丨2〇配置於底座112與發 熱源12接觸之一表面112a，熱管116之一端116a連接於 底座112,而鰭片組114則配設於熱管116之另一端116b。 此外，開槽ll〇b是設於鎖固支架118之侧邊，而上述固定 部134即可穿設於這些開槽110b，使得熱傳介質保護蓋130 能固定於散熱器110上。當然，本實施例在此並不對散熱 1292观 裔110之組成構件做任何限制。也就是說，在其他實施例 中，散熱恭110可以藉由另一種固定裝置來配設於發熱源 12上，而上述之開槽11〇b可設置於底座112或是散熱器 110之其他部位’以供熱傳介質保護蓋13〇之固定部ι34 穿設。 綜上所述，本發明較佳實施例所提供之散熱器具有多 個開槽，而熱傳介質保護蓋之固定部可穿設於散熱器之開 槽，進而讓蓋體可覆蓋熱傳介質，以保護熱傳介質不會受 到人為之刮擦或是受到灰塵汙染。相較於習知技術，本發 明較佳實施例所提供之散熱模組有下列優點·· (-）由於本發明較佳實施例所減之熱傳介質保護蓋 是藉由固定部與_間之卡合關係而直接固定於散熱器 上，而無須利用任何黏性材料，因此本發明較佳實施例所 提供之散熱模組有較低之材料成本。 ㈡本發賴佳實_所提供之熱傳介質倾蓋是藉 開槽間之卡合關係而直接固定於散熱器上。因 質保護蓋組裝至散熱器之過程中，無需額外 提供之料ί蹄之I作。換言之’本發賴佳實施例所 &仏之_政熱拉組有較低廉之人工成本。 曰葬本㈣較佳實施_提供之熱傳介質保護蓋 =僂與開_之卡合關係而固定於散熱器上，因 (四）由於本發明較佳實施例所提供之熱傳介質保護蓋 1292¾¾^ 21134twf.doc/e 是藉由HI定部與開翻之卡合_而固定於散熱器上，因 此熱傳介$保護蓋可穩IS地配置於散熱H上，以保護熱傳 介質不會_人為之觸或是灰塵汙染，而不會有習知所 述之熱傳介質保護蓋gj故脫落之問題。 —雖然本發明已以較佳實施例揭露如上，然其並非用以 限^本發明，任何熟f此技#者，在不麟本發明之精神 ^範圍内’當可作些許之更動與潤飾，因此本發明之保 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A緣示為本發明較佳實施例之一種散熱模組的叙 圖1B繪示為圖1A之散熱模組的分解圖。 圖2綠示為圖1A之散熱模組在拆除熱傳介質保護蓄 後，並組裝於一電路板上之發熱源的示意圖。 圖3繪示為圖1B之鎖固支架與底座之連接示意圖。 【主要元件符號說明】 10 :電路板 12 :發熱源 100 :散熱模組 110 :散熱器 110a :表面 ll〇b :開槽 112 :底座 112a :表面 11 12923^ 21134twf.doc/e 114 :鰭片組 116 :熱管 116a、116b :熱管之端部 118 :鎖固支架 118a :鎖固元件 120 :熱傳介質 130 :熱傳介質保護蓋 132 :蓋體 132a :頂壁 132b :側壁 132c :罩覆空間 134 :固定部1292301 0950157 21134twf.doc/e IX. Description of the Invention: [Technical Field] The present invention relates to a Heat Dissipation Module, and in particular to a Thermal Medium Cap (with Thermal Medium Cap) ) The thermal module. [Prior Art] In the field of heat dissipation modules for electronic components, in order to reduce the thermal resistance between the heat sink and the heat-generating electronic components, a heat transfer property is preferably applied to the bottom surface of the heat sink. Thermal Medium and the heat sink is in contact with the heat-generating electronic components through the heat transfer medium. Wherein, the gap between the heat sink and the heat-generating electronic component is filled by the heat transfer medium, so that the heat generated by the heat-generating electronic component can be effectively transmitted to the heat sink via the heat transfer medium, and then convected to the external ring to achieve heat dissipation. The effect. However, in the process of transporting or assembling the heat sink, the heat transfer medium applied to the bottom surface of the heat sink is easily scratched by other components or contaminated by dust, and the heat sink is assembled after the heat sink is assembled to the heat generating electronic component. • The heat transfer effect between electronic components is greatly reduced by scratching or contamination of the heat transfer medium. It is the purpose of pollution. However, the prior art proposes a heat dissipation module having a heat sink and a heat transfer medium protection cover. The towel 'heat transfer Wei cover is attached to the bottom surface of the heat sink by the adhesive disposed on the bottom of the heat sink, and then covers the heat transfer medium f of the bottom surface of the coated crucible to prevent the heat transfer medium surface from scratching or In the case of assembling the heat transfer medium protection cover to the heat sink 1292201 0950157 21134twf.doc/e, the heat transfer medium must be manually glued to the bottom surface of the heat sink to cover the heat transfer medium, for example : Use the tape or double-sided tape to fix the cover to the heat sink body, so it costs a lot of labor. In addition, the material cost of the adhesive also increases the product cost of the thermal module. On the other hand, in the process of transporting or assembling heat dissipation!!, the heat transfer medium protection cover is easily peeled off due to insufficient adhesiveness, so that the heat transfer medium is scratched or contaminated. Therefore, when the heat sink is assembled to the heat-generating electronic component, the heat conduction effect between the heat sink and the heat-generating electronic component is greatly reduced, and even the heat-generating electronic component is damaged due to poor heat dissipation effect. SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipation module that solves the problems of the prior art. To achieve the above object, the present invention provides a heat dissipation module including a heat dissipation, heat transfer medium, and heat transfer medium protection cover, wherein the heat sink is adapted to be disposed on a heat source and has a plurality of slots. The heat transfer medium is disposed on one surface of the heat sink in contact with the heat source. Further, the heat transfer medium protective cover has a cover body and a plurality of fixing portions - the fixing portion extends from the cover body, wherein the cover body covers the heat transfer medium, and the fixed portion penetrates through the groove. In an embodiment of the invention, the cover body includes a top wall and a side wall, and the top wall and the side wall form a cover space to cover the heat transfer medium. Soil In one embodiment of the invention, the cover is integrally formed with the fixed portion. In one embodiment of the invention, the material of the heat transfer medium protective cover is a plastic material. In an embodiment of the invention, the heat sink includes a base adapted to be coupled to a heat source 1292301 0950157 21134 twf.doc/e, and the heat transfer medium is disposed on the face where the slot is located on the side of the base. - - Source Contact - Table Compilation - In the embodiment, the heat sink further includes a -W thin plate and a heat pipe, and these heat pu _, ancient & ^ fin sets and more heat pipes -end. In the base, the set S& is provided in the present invention, the locking bracket, and the heat pipe is connected to the side of the locking bracket by the (four) sill base connection slot. <In the middle of the hair, the heat transfer mode, the heat transfer and the extension of the self-covering body, wherein the cover covers the heat transfer 盍 ^ 遵 遵, the biography (4) will be _ rubbed or Sweat dye (4) The fixed part can be worn in the slot of the radiator, and then the reliance on the biography (4) is difficult to set up in the purpose of crying. Thereby, the production cost of the heat dissipation module can be reduced, and the problem that the heat transfer medium protective cover of the heat transfer medium is peeled off due to insufficient adhesiveness can be solved. The above and other objects, features and advantages of the present invention will become more <RTIgt; 1A is a cascading diagram of a heat dissipation module according to a preferred embodiment of the present invention. FIG. 1B is an exploded view of the heat dissipation module of FIG. 1A, and FIG. 2 is a cold diagram of FIG. 1A. The heat dissipation module is a schematic diagram of a heat source assembled on a circuit board after the heat transfer medium protection cover is removed. Referring to FIG. 1A, FIG. 1B and FIG. 2, the heat dissipation module 1 of the present embodiment mainly includes a heat sink no, a heat transfer medium 120, and a heat transfer medium cover 130 (Grease Cover). The heat sink 110 is adapted to be disposed on the heat source 12 of the circuit board 10 to dissipate heat from the heat source 12, and the heat transfer medium 〇2 is disposed in the heat sink 110 to be in contact with the heat source 12238. One of the surfaces is ll〇a. For example, the circuit board is, for example, a motherboard of a computer, and the heat source 12 is, for example, a central processing unit (CPU). It is worth mentioning that the heat sink 110 of the embodiment is provided with a plurality of slots 〇b, and the heat transfer medium protection cover 130 is fixed on the heat sink 110 by the slots 110b, thereby protecting the heat. The medium 12 will not be scratched by people or contaminated by dust. In detail, in the present embodiment, the heat transfer medium protection cover 13 has a cover 132 and a plurality of fixing portions 134, and the cover 132 covers the heat transfer medium 120, and the fixed portions 134 extend from the cover 132. The positions of the fixing portions 134 are located on the two sides of the cover 132, and the positions of the fixing portions 134 correspond to the positions of the slots u〇b of the heat sink 110, so that the fixing portions 134 can pass through the slots u〇b. In addition, the cover 132 further includes a top wall 132a and at least one side wall 132b. The top wall 132a and the side walls 132b form a cover space 132c to cover the heat transfer medium. In the present embodiment, the heat transfer medium protective cover 13 is made of a plastic material, and the heat transfer medium cover 130 can be formed by stamping a plastic material sheet or by injection molding. In other words, the lid body 132 and the fixing portion = 4 are integrally formed. Of course, in other embodiments, the material of the heat transfer medium protection cover 130 may be other materials having good deformation restoring force. Further, the cover body 132 and the fixing portion 134 may be formed by other folding or joining methods. 1292301 21134twf.doc/e 0950157 In addition, since the heat transfer medium protection cover 130 of the present embodiment is made of a plastic material, the heat transfer medium protection cover 13G is easily subjected to a force to temporarily change the plasticity of the ι± and then The fixed portion 134 can be smoothly passed through the slot 110b. After the above-mentioned stress conditions are removed, the heat transfer medium protective cover 13 回 is returned to the original state, so that the fixing portion 134 is stuck in the slit 110b' and the cover 132 can cover the heat transfer medium 丨20. If the heat transfer medium protection cover 13 is to be removed from the heat sink 110, only the heat transfer medium protection cover 13 fixed to the heat sink 11 is required to be applied, so that the heat transfer medium protection cover 130 is temporarily formed. The plastic deformation of the material can make the fixing portion 134 no longer pass through the slot 1101), and the heat transfer medium protection cover 13 can be separated from the heat sink 110. Specifically, the heat transfer medium protective cover 130 of the present embodiment has an advantage that it can be easily assembled to the heat sink and easily detached from the heat sink Π0. As described above, the heat sink 110 mainly includes a base 112 that contacts the heat source 12, a fin set 114, a plurality of heat pipes 116, and a lock bracket 118. The locking bracket 118 is fixed to the base 112 by a plurality of locking components 118a (please refer to FIG. 3 together), and the heat sink 110 is locked with the circuit board 10 by the locking bracket 118. It is fixed on the heat source U. In this embodiment, the heat transfer medium 丨2〇 is disposed on one surface 112a of the base 112 in contact with the heat source 12, one end 116a of the heat pipe 116 is connected to the base 112, and the fin set 114 is disposed at the other end of the heat pipe 116. 116b. In addition, the slots llb are disposed on the side of the locking bracket 118, and the fixing portion 134 can be disposed through the slots 110b, so that the heat transfer medium protection cover 130 can be fixed to the heat sink 110. Of course, this embodiment does not impose any limitation on the components of the heat sink 1292. That is to say, in other embodiments, the heat dissipation 110 can be disposed on the heat source 12 by another fixing device, and the above-mentioned slot 11b can be disposed on the base 112 or other parts of the heat sink 110. 'Through the fixing part ι34 of the heat transfer medium protection cover 13〇. In summary, the heat sink provided by the preferred embodiment of the present invention has a plurality of slots, and the fixing portion of the heat transfer medium protection cover can be inserted into the slot of the heat sink, so that the cover body can cover the heat transfer medium. To protect the heat transfer medium from being scratched or contaminated by dust. Compared with the prior art, the heat dissipation module provided by the preferred embodiment of the present invention has the following advantages: (-) The heat transfer medium protection cover which is reduced by the preferred embodiment of the present invention is provided by the fixing portion and the The snap-fit relationship is directly fixed to the heat sink without using any adhesive material, so the heat dissipation module provided by the preferred embodiment of the present invention has a lower material cost. (2) The heat transfer media cover provided by the company is directly fixed to the heat sink by the snap-fit relationship between the slots. Due to the assembly of the protective cover to the heat sink, no additional material is required. In other words, the 'China's Laijia's embodiment has a lower labor cost. Funeral book (4) preferred implementation _ provided heat transfer medium protective cover = 偻 and open _ in the snap relationship fixed to the heat sink, because (d) due to the preferred embodiment of the present invention provides a heat transfer medium protective cover 12923⁄43⁄4^ 21134twf.doc/e is fixed on the heat sink by the HI fixed part and the opening and closing _, so the heat transfer $ protective cover can be stably placed on the heat sink H to protect the heat transfer medium. It will be caused by human touch or dust pollution, and there will be no problem of the heat transfer medium protection cover gj falling off as described. </ RTI> Although the invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any of the skilled inventions may be modified and retouched within the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a perspective view of a heat dissipation module according to a preferred embodiment of the present invention. FIG. 1B is an exploded view of the heat dissipation module of FIG. 1A. 2 is a schematic view showing the heat source of the heat dissipation module of FIG. 1A after the heat transfer medium is removed and assembled on a circuit board. 3 is a schematic view showing the connection of the locking bracket of FIG. 1B and the base. [Main component symbol description] 10: Circuit board 12: Heat source 100: Heat dissipation module 110: Heat sink 110a: Surface ll〇b: Slot 112: Base 112a: Surface 11 12923^21134twf.doc/e 114: Fin Group 116: heat pipes 116a, 116b: heat pipe end 118: locking bracket 118a: locking element 120: heat transfer medium 130: heat transfer medium protection cover 132: cover 132a: top wall 132b: side wall 132c: cover space 134: Fixed part
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