TWI329320B - Memory module assembly and method for making the same - Google Patents

Description

1329320 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an industry-standard memory module of a personal computer (10) and other electronic money recorders, in particular, a memory including a heat sink structure. Module component related. [Prior Art] . The dispersion has been widely used in the heat of electronic components. Some microprocessors n have additional fins to allow for higher frequency operation. Other electronic components, such as memory modules, can also benefit from heat sinks. • Part A PCs include more than one memory module slot, so their owners can add additional memory modules to increase the PC's memory capacity. ^ Other non-PC devices can also use such memory modules designed for personal computers. High-volume production and product competition will drive down the cost of memory quilts and benefit consumers. The amount of memory can be _ afforestation _ industry fresh size and capacity, ¥ pick 3g chat mode •, the group has been replaced by 72 pins, 168 pins and other size modules. The pin was originally a "needle" foot that was extended from the edge of the module - but most of the modules are now "needle-free" foot modules, which can have metal contacts for communication. The size of the module is relatively small, for example, there is only about 5 · 25 长 and 1. 2 or 1. 7 吋. The conventional memory module includes a bottom plate of a small printed circuit board (PCBB) and a plurality of surface mount components (e.g., memory) mounted on one or both sides of the bottom plate. The base plate typically has a multi-layered alternating glass fiber insulation sheet layer and an aluminum foil or metal conductive sheet layer. The contact pads (or other contact structures) are typically discharged at the edge of the joint (bottom) of the bottom plate. The contiguous layer defines the route that provides the signal between the surface mount component and the 6 1329320 contact 塾. Surface mount components (such as memory) are soldered or attached to one or both sides of the backplane. Each component typically includes - or multiple packages of small ic, such as a small J-foot (S0J) package, plastic Low cost surface mount 1C such as pin wafer carrier (PLCC), thin small package (10) p) or small size (so) package. The number of memories embedded in the memory module substrate depends on the capacity of the memory 1C and the width of the data bits, and the size of the memory module. The thirteenth drawing is a schematic diagram showing a prior art conventional memory memory module including a dynamic random access memory (DRAM). The memory module 1, the bottom plate 11, & contains an I-position 12' (such as DRAM) mounted directly on its front side surface, and more devices (not shown) are typically mounted on its back side. surface. The metal contact 塾13 is placed along the front and back sides of the edge of the memory module connector (bottom). When the memory phantom assembly is embedded in the host system (such as a personal computer), the metal contact 塾 13 a is matched with the cymbal (not shown) of the module slot on the host, and the module and the host system of the host system are electronically f Sexual connection. The partition holes 14' and the recesses 4 can be used to ensure that the group has been correctly placed in the insertion. For example, the partition hole 14, the gamma plate u, the Caiyang wire, to ensure that the memory swapping cannot be reversed into the slot. The notch 15, in combination with the clamp of the module slot, ensures that the memory module is securely placed in the slot. As the processing H speed increases, it becomes more important for the faster scales (4). The memory will use the same user's interface. Coffee IG will also have a souther density than before, operate at a higher frequency, and generate more heat, which will hinder their operation. Therefore, there is a need to remove this heat from the memory module. Traditional memory module assemblies typically include three components: a printed circuit board 7 1329320 component (PCBA, PCB Assembly) and two metal heat sinks, and a fixture or fixtures that secure them together (eg Clamp or clip hook). The contact between the printed circuit board assembly and the two metal heat sinks is usually a thermal conductivity interface material (TIM, Then Interface MateHai) that is in the middle to assist in heat conduction. In order to manufacture such memory module assemblies, various different metal heat sinks have been previously designed. Some examples can be seen with reference to U.S. Patent Nos. 6,362,966, 6,424,532 and 6, 449,156 and other documents. Clip-on fixed heat sinks for memory modules are also known. For example, 〇cz Technology has created a copper heat sink with a flexible, wide metal band of fire hooks that clamps the memory module to the two heat sinks on its front and rear surfaces. These center clamps and clip-on designs add to the cost of manufacturing and the complexity of the associated memory modules because they are difficult to use on automated production lines. In addition, the use of a desaturated sputum or similar structure can easily allow the user to disassemble the heat sink, resulting in an unexpected condition. Another * Sleek and thermal guides The appearance of the enamel shell adds to the overall thickness of the memory module assembly and therefore takes up valuable board space.丨 Some memory module heatsinks provide a top-sealing design that prevents airflow from the gap between the memory and the memory module's backplane. Usually, the entire top edge of the heat sink is hermetic, and the sulphur portion depends on it. The light can be open or partially open by the bottom edge of the heat sink, but the side is higher than the top of the memory module. Or the bottom edge is much smaller, thus limiting the possible airflow dissipation. The need is to adhere (rather than clamp) the integrated circuit on the surface of the printed circuit board assembly of the memory module, and the squad is added to the printed circuit board assembly, which can also be distributed by the integrated circuit. The heat generated, and the uncompromising automatic 1329320 production method can be used. SUMMARY OF THE INVENTION The present invention is directed to a memory including one or two heat sinks that are directly attached to one or more integrated circuits (iC) of a printed circuit board assembly (PCBA) of a memory module using a bonding agent. The module assembly is developed 'where the heat sink can simultaneously protect the printed circuit board assembly of the memory module and dissipate the heat generated by the integrated circuit therein. By attaching the heat sink directly to the integrated circuit of the memory module, the present invention can facilitate a simplified automated manufacturing process to substantially reduce overall production costs. The memory module assembly of the present invention uses the same memory module as the industry standard, so that the present invention can be applied to existing electronic devices or products. That is to say, similar to the conventional memory swapping unit, the integrated circuit is mounted on the side or both side surfaces of the printed circuit board. The bottom plate includes a metal contact 塾' that is discharged along the edge of the joint (bottom) and has a plurality of wire traces providing a signal path between the integrated circuit and the contact pads. An important point of the present invention is that the touch circuit is embedded in the printed circuit board, so that the upper surface of the integrated circuit is defined as a surface of the flat printed circuit board on which it is tilted. Parallel planes, the height of each dragon circuit may vary. It should be particularly noted that the planar upper surface of these integrated circuits can be used to fix the memory module to the planar bottom surface of the heat sink by means of a bonding agent. In accordance with a particular embodiment of the invention, the bonding agent is a heterojunction thermally hardened bonding agent that can be applied to the upper surface of the or multiple integrated circuits or to the planar bottom surface of the heat sink. In the application, the bonding agent is secret and has a low turning force. The square 9 1329320 adjusts the alignment heat sink cover on the printed circuit board assembly of the memory module until the desired orientation is achieved. until. The closing jig is then caused to compress and hold the bonding agent between the heat sink and the integrated circuit in a compressed state. The fixture then carries the memory module assembly together to activate or harden the cement through a baked phase that is maintained at a particular temperature (e.g., equal or lower than the maximum safe heating temperature of the memory module). In one implementation, the use of a thermally activated cement exhibits a relatively low dryness compared to before heating when heated to a high temperature, and the heat activated bonding agent exhibits a high degree of saturation at the cold. In this case, if you want to remove the heat sink from the memory module printed circuit board assembly afterwards, you need to reheat it at a preset temperature to move it in a heavy weight. In another embodiment, the heating step is used to harden a relatively high thermal conductivity bonding agent, and the separation of the heat sink afterwards requires the use of a chemically soluble (tetra) thermally hardened bonding agent. In both cases, it is difficult for the user to make modifications to the secret authorization (such as removing the heat sink to contact the integrated circuit), and it is easier to detect k than the traditional use of the clamped memory module assembly. A modification of the domain rights. In addition, the thermally hardened bonding agent is relatively thin and can conduct heat to reduce thermal resistance between the integrated circuit and the heat sink, and thus can contribute to the relatively high heat flow rate of the integrated circuit to maintain a relatively low operating temperature. Therefore, the use of heat-activated or heat-hardened bonding agent can be used to know the thin film-bearing die-shaped die of the rut, and can simplify the assembly process to reduce the overall manufacturing cost, and the interest is not limited. Bribery (4) is based on the printed circuit board assembly (pCBA) of the memory module. "In accordance with another embodiment of the present invention, or two heat sinks are attached to the printed circuit board assembly of the memory module only by an adhesive attached between the heat sink guard and or the integrated circuit. Unlike the conventional inspection piece, the clamp is used to fix the cover on the bottom plate of the memory die 1329320 or fixed to each other. This embodiment only relies on the bonding agent to fix the heat sink cover on the memory module. Thus, the production process is greatly simplified. In another embodiment, one or more fixtures may be used in addition to the bonding agent to provide a stronger connection between the printed circuit board assembly of the memory module and the heat sink. In accordance with another embodiment of the present invention, one or more first ics may be attached to the corresponding heat sink using a bonding agent. One or more second ones (: and corresponding heat sinks are sandwiched) The traditional thermal conductivity & surface material (TIM) can provide greater (or less) thermal conductivity from the second ic to the relative. f can exhibit a higher 'high heat transfer than the bonding agent The ability to provide a greater heat dissipation effect to the second 1C. According to another embodiment of the invention, the scatter cover includes an open (or open) edge to provide 1C maximum heat dissipation. The edge of the heat sink cover is discharged along the top edge of the memory module bottom plate and the upper half of the side. In various embodiments, the side is an open printed circuit of the top edge and the memory module. There is a space (or opening) between the plate components, so that the air can be printed in the electrical component and recorded (such as through a small gap between the IG, seam), so it can be achieved during operation. The body module is used for maximum heat dissipation. [Embodiment] The tree is related to the improvement of the memory module component (such as the printed circuit board assembly of the memory module and one or more heat sinks). In order to enable a person having the general skill of the prior art to be able to make and use the present invention for a particular application and its needs. For those of ordinary skill in the art, it will be appreciated that various modifications to the specific embodiments presented are Very easy, The principle of generality defined here can also be applied to other specific examples. Because of the fact that 11 1329320 is the same, the present is _ secret, but it is based on the principles discussed here. The new functional concept is consistent with the widest range of inventions. Figures (4) to 5 are a simplified embodiment of the present invention, showing a simplified memory module assembly. The memory module assembly 1 typically includes a memory. Body module n and - or two heat sinks 12, 13. Figure - (A) and (8) are exploded view and assembly diagram of the basic tree of the memory pool component, respectively. The second figure shows the memory module u The top view of the related components, and the first view of the heat reading >j 12. The fourth and the eighth are respectively showing the scatter of the printed circuit board mounted on the memory module 11. 12 and 13 are schematic views and cross-sectional views of the assembly. The fifth figure is a cross-sectional view taken along the line (A)_age 5_5. Although the specific implementation described below defeats the two heat sinks 12, 13 mounted on the corresponding sides of the printed circuit board of the memory module 11, only one heat sink 12_hot film U can also be used according to the following The manner of description is attached to one side of the memory module n. Referring to FIG. 4(4) and FIG. 2, the memory module u includes a bottom plate in a printed circuit board having a first surface 112 and a second surface (1) on the other side. A plurality of 1Cs 114 (e.g., DRAMs) are mounted on at least one of the side surfaces of the first surface 112 and the second surface m. The bottom plate ni includes a circuit wire network ' on the surface (112 or 113) and extends through a thin layer of insulating material (e.g., FR4) in accordance with known manufacturing techniques. The selected wire traces are connected between the pins of the selected IC 114 and the corresponding metal contact pads 115 discharged along the first surface 1C of the bottom plate (1) and the joint edge 116 of the second surface 113. The metal contact pads 115 allow the memory module assembly i to be pluggably connected to a host system (e.g., eight pc or other computer system) and the IC 114 can be used to increase the memory capacity of the host. Please refer to 12 1329320. As shown in the fifth figure, when the memory module assembly 1 is mounted on the host system 2, the metal contact pad 115 is matched with the spacer 221 on the module slot 22 to align the memory module π. It is electrically connected to the motherboard 21 of the host system 2. Along the side edge 118 and the joint edge 116, the memory module 11 provides selective recesses 117, holes 11A and compartments ι1Β to ensure that the memory module 11 is correctly inserted into the module slot. 22 #中. The upper edge 119 is the opposite side of the joint edge 116.

Although reference will be made herein to a memory IC, IC 114 may include one or more additional controllers 1C, such as processing ||, specific IG (ASIG), or electron-reducible elements 110 (eg, Figure-(4) Shown), such as capacitors, resistors and inductors. In accordance with an embodiment of the present invention, each ICU 4 is packaged such that its upper surface is a flat crane (e.g., a small package (lion)) and the upper surface of each of the flat surfaces is parallel to the bottom plate (1). For example, as shown in the first figure (4), each IC 114 is mounted on the first surface ι 2 so that its flat upper surface can be maintained in parallel with the first surface ι 2 . With this, each of the singularities 4 is mounted on the second surface 113 so that its flat upper surface can be maintained parallel to the second surface n3. Referring to Figures -1 and 3, the heat sink 12'13 is made of a gold eyebrow structure, for example, of a suitable sheet metal (e.g., copper or inscription). As shown in the first figure (4), in one embodiment, the heat sink 12 includes a flat peripheral region (2) surrounding the recessed region 122, and a flat bottom surface formed on the outer side of the recessed region 122. 123. By analogy, the heat sheet 13 includes a flat peripheral region (3) surrounding a concave region 132 (not labeled;) and a flat bottom surface (3) formed on the outer side of the recessed region 132. Heat Dissipation 13 The bottom surface 123, 133 of the 120 piece of 12 丨 3 will be set in the following method - or a plurality of relative " Note that the recessed areas 122, 132 of the fins 12, 13 in the fourth figure (8) will surround the cover 1C 114 (if the flat bottom surfaces 123, 133 will contact the upper surface of the 1C 114)

As shown in the third figure, one or two heat sinks (e.g., heat sink 12) may include - one slit 124' for heat dissipation applications. Each of the fins 12, 13 has a bottom edge 125, both side edges 126, 136 and - an upper edge 12?, 13?. As shown in the third figure, the [1 edge 126 136 of each of the heat sinks ΐ 2, η is modified to expose the notch m formed by the bottom plate (1) (as shown in the fourth figure (4), the heat sinks 12, 13 Including the concave side edges 128, 138 to expose the notch (10). As shown in the i (8), fourth (4), (8) and fifth figures, when the heat sinks i2, 13 are enemies in the hidden plate, and 11 The heat sinks 12, 13 will substantially overlap the surface of the printed circuit board in a manner that protects the K 114. However, the metal contact pads 115 are used to allow the metal contact pads 115 to be inserted into the host of the master system 2 in a pluggable manner. In the plate 2_group slot 22 (eg, the fifth jin), as shown in the fourth (A) and fifth figures, for example, the bottom edge n 135 of the fins 12, 13 is discharged above the joint edge 116 of the bottom plate U1. Therefore, the metal contact pad ιι5 will extend below the bottom edges 125, 135 of the heat sinks 2, 13, and the upper edges _, 137 of the heat sink i2 i3 will protrude above the upper edge 119 of the bottom plate lu. Please refer to As shown in the fifth figure, a side port g is provided between the fins 12, 13 and the bottom plate m adjacent the upper edges 127, 137 so that the side edges 126 of the 12, 13 are 136 The air heated by 1C 114 can escape. Please note that the heat sink makes the space (such as opening G) narrow, and the upper edges 127, 137 can be bent inward and downward to provide the electronic side hybrid, but This is also a healthy meal. * The upward air circulation caused by free convection (as shown in the fifth financial _) will add (4) heat dissipation, because 1329320 reduces the operating temperature of the memory module assembly i. In addition to the heat dissipation of the air circulation, the heat can also be surrounded by the air.

Of course 'except for this free convection upward space · X · gas 'hunting by free convection and light shot by the dispersion y and the fifth figure, the joint part A) flatten the upper surface 'or the flat bottom surface of the fins 12, 13 123. The manner in which the pieces 12 and 13 are fixed to the memory module 11 is as shown in the first figure (B), and a joint portion 8 (shown by a broken line) is sandwiched on the flat bottom surface of the heat sink 12. 123 and the corresponding I (: m (also indicated by the dashed line) between the upper surface of the 'the heat sink 12 can be fixed to the memory module I by the joint portion A." Part A is sandwiched between the top surface 133 of the fin 13 and the corresponding upper surface (also indicated by the dashed line). Therefore, the heat sink can be joined by the joint portion.

-In order to prevent unauthorized modification (for example, remove the heat-dissipation month 12 '13 to contact the IC 114). In accordance with an embodiment of the present invention, the joint portion A is provided by a thermally activated bonding agent applied to the upper surface of one or more of the ICs 114 or the flat bottom surfaces 123, 133 of the fins 12, 3 In this embodiment, the #activated cement will soften (e.g., exhibit relatively low adhesion) upon heating to elevated temperatures (e.g., equal or lower than the maximum safe heating temperature of the memory module assembly 1). The heat-activated cement will show a high degree of professionalism after subsequent cooling. The advantages of such thermally activated interface agents are that they can be removed by heating' so that they can be reworked. In the case of this 15 1329320, if the heat sinks 12, 13 are to be removed from the memory module 11 afterwards, it is necessary to reheat at a predetermined temperature to resoften the bonding agent. This type of heat activated cement is typically fabricated in the form of a film or tape that can be used to produce less heat in the ICU 4, while the primary purpose of the heat sinks 2, 13 is to classify the protection IC 114. This thermally activated cement material forms a thin, continuous interface layer between the upper surfaces of the fins 12, 13 and 1C 114. Since the newly formed interface layer is very thin and is substantially caused by a hollow form (e.g., very few air bubbles), the thermal impedance of the penetration bonding layer is relatively small. In addition, the ability to rework through, for example, heating, is also an important consideration. A thermoplastic-based cement material, such as a thermal bonding film manufactured by 3M in St. Paul, Minnesota (eg, product number TBF668) or by Henkel L〇ctite, R0Cky Hill, Connecticut, USA

A hot melt film manufactured by Corporation (for example, product number 78〇2) can be used as a bonding agent in this application. While thermally activated cements offer the advantage of being reheated to achieve rework, such cements typically exhibit only relatively low thermal conductivity, so they are less desirable in applications that require high heat dissipation through the heat sink. welcome. In another embodiment, the joint portion eight is comprised of a cement material that can be "hardened" during heating (e.g., exhibiting an initial relatively low adhesion when applicable, and exhibiting after heat hardening) Relatively sticky.) Such thermally hardened cements generally have a relatively higher thermal conductivity than thermally activated cements and are therefore preferred in applications where high heat dissipation through the fins 12, 13 is required. The material of the heat-hardening adhesive is applied in a paste form, and can be re-dispersed under pressure, and [C H4 and heat sinks a and a are tied up to 16 1329320 by heat hardening. The hardening process can be carried out at elevated temperatures and catalysts can be used to speed up. The process of re-dispersing causes the cement material to flow and fill the voids on the surfaces of the fins 12, 13 and 1C 114, resulting in a thin and good contact therein, reducing the heat source (1C 114) between the fins 12, 13 Thermal impedance. A dispenser can be used to ensure an even spread of the cement material. In another embodiment, the heat hardening bonding agent is composed of a resin mainly composed of a silicone resin to maintain reworkability and survivability at high temperatures that electronic components may encounter. Metal fillers can also be added to improve thermal conductivity. DowCorning offers a suitable thermosetting interface (eg product number 3-6752). This view of the hardened cement requires the use of a chemical solvent to dissolve the removal' to facilitate rework. Although the thermally activated and thermally hardened cement material provides excellent bonding between the heat sink and the memory module 11 'other' adhesives can also provide suitable connections in the manner described herein unless otherwise attached There are particularly different indications in the scope of the patent application, and the term "joining portion" - the term refers to any non-corruptive bonding agent that can reliably connect the scatters 12, 13 and the memory module 11 as herein described. In addition, although the present invention has been described as described above, some of the advantages of attaching only the heat-dissipating portion 12 to the body-changing group u are only used in the joint portion A, but in some embodiments, the selection of the fine object ( Screws S, rivets or clamps or clips as indicated by the dashed lines in Figure (8) to further strengthen the component connections. The sixth figure is a display - the implementation steps are as follows: A flow chart based on the manufacturing method of the present invention. Step 601 is to fabricate a memory module, and the memory is mounted on the printed circuit board ill by mounting the memory 1C and other 1C and other elements 1329320 on the printed circuit board ill. Memory Module (DIMM). Step 602 - Coating Bonding The bonding agent is applied to the upper surface of the memory Ic ΐ 4 or to the flat bottom surfaces 123, 133 of the heat sink, 13. When turning over, the bonding agent is secret and has a relatively low bonding force, or a film or material having a small amount of secret, which can facilitate the alignment adjustment of the heat sinks 2, 13 and the memory module U until Achieve the desired position.

"Step-heat sink row inspection, the heat sinks 12, 13 are arranged and mounted on the memory module 11 to form the memory module assembly 1. Step _- remember (four) mold her The heating program is to check the installed model (4) and the piece! The solid core mosquito fixture 3, and then apply a heating program to activate or harden the cement. As shown in the seventh figure, the fixture 3 includes a definition. A suitably sized component that can hold a cavity on a memory module assembly (such as metal or ceramic), and also includes a securing mechanism (such as a screw or other fixed fitting 32 for recording, with spring assisted 33) Firmly maintain the memory module assembly 1 (such as scatter 12, 13 _ on the opposite side of the memory module 作 on the corresponding 1C 114) 'heating program to activate or harden the bonding agent system will fix the memory The overall structure of the mold and the member 1 and the solid mold 3 are heated, for example, by maintaining the structure of the mosquito fixture 3 in the oven of the crucible/span (for example, equal to or lower than the memory module assembly). Safety plus degree (for example, temperature at which 1C 114 can be undamaged) to activate or harden the joint Please note that the L body parts 1疋 are carried by the fixed fixture 3_, they will be carried by the conveyor belt device to b roast the phase 0 (4) to ensure the temperature of the city to the collar, in order to promote the "joining"孰18 1329320 Process. Most _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ After the agent, the solids are removed from the baking phase for cooling, and then the memory module assembly 1 can be removed from the fixed jig 3 to (4) the memory component of the gamma The specific embodiment shown in the above-mentioned FIGS. (4) to 5 includes the flow of g fluorine which can be prevented by the heat sink 12 13 , and the heat dissipation efficiency is increased to the maximum heat sink η, Μ Edge design features (eg, openings between the heat sinks 12, 13 and the bottom plate U1). Even if the area between the heat sinks 12, 13 and the bottom plate ill is very narrow, and most of the buckles 114 (such as memory and control) Occupied by 'but a small gap between adjacent 1C 114 can allow air to circulate, directly cooling 1C 114 And simultaneously cooling the fins 12, 13 from the bottom surface and the larger and exposed top surface. The present invention promotes air by maintaining an opening G (as shown in FIG. 5) at the upper edge of the memory module assembly 1. Between the 1C 114 narrow passages, these openings g allow air to escape between the bottom plate 111 and the fins 12, 13. The air enters between the fins 12, 13 and the bottom plate 111 by the open bottom edge near the lower joint edge 116. The gap, which circulates between the ic 114, flows out of the opening G at the top edge. Therefore, the effect of heat dissipation can be enhanced. The eighth to tenth figures show the shape of the edge of the heat sink 丨2, 丨3 in other specific embodiments. It has been modified to include a rib cage or support arm that is bent toward the memory module 11, thus sacrificing the maximum air circulation on the 1C 114, in order to improve the protection of the 1C 114 mounted on the memory module 11. . The eighth figure shows another memory module assembly 1 as seen from the top, wherein 19 1329320 contains heat sinks 12, 13 ' and several rib cage-like structures are provided by the upper edges of the heat sinks 12, 13 127. 137k extends to the bottom of the printed circuit board, and each pair of adjacent ribs 4 is separated by an open area that promotes air circulation. The rib cage ί4 can also be made so that the trailing ends of the reverse rib cages can be contacted as shown in the eighth figure or separated by small gaps. In addition, the fins a, Μ also include side walls 129 that extend from the side edges 126' 136 to the bottom plate ΐ. The ninth drawing is a schematic cross-sectional view showing another type of δ-remembrance module assembly j. The heat sink η, the upper edges 127, 137 are generally aligned in the upper edge 119 of the bottom plate (1), and the branch arm 15 is scattered. The upper edges 127, 137 of the 12' 13 are extended with respect to the sharpness of the flat bottom surfaces 123, 133, such as milk, thereby providing both air circulation and some protection of the 1C 114 of the memory module 11. . Although the specific embodiment described above includes heat sinks 12, 13 extending beyond the upper edge 119 of the corresponding memory module, other embodiments may be used. As shown in the tenth figure, another memory model is shown. A schematic cross-sectional view of the assembly of the components, the upper edges 127, 137 of the fins 12, 13 are aligned on the upper edge (10) of the bottom plate (1). The support arms are extended and contact by the upper edges 127, 137 of the fins 12, 13 The first surface 112 and the second surface 113 adjacent to the upper edge 119 of the memory module. The contact between the arm (4) first surface (1) and the second surface 113 increases the memory module η and the heat sink The connection between the turns 2, 13 is stable. In a particular embodiment, the support 15 is dense, for example, without a gap between the heat sink 13 and the upper edge Π 9 of the bottom plate ill, to achieve maximum protection of π Hi This particular embodiment can be used, for example, to memory modules that generate less heat, and the external surfaces of the heat sinks 12, 13 are free to convect and _ can already provide sufficient dispersion 丄 329320 ... In a specific embodiment, the lower side of the support arm 15 The edge can be sized so that we do not contact the first surface 112 and the second surface 113, so that a narrow gap is left for the air to dissipate heat. (4) - a specific embodiment can be supported An opening similar to that shown in the eighth figure is made in the arm 15 to provide a high airflow heat dissipation. Tenth® memory module assembly according to another embodiment of the present invention. Memory module assembly 1 can be, for example, when the heat generated by each -ic m of the memory module 11 is not equal (for example, when the heat generated by the first Ic 114 is greater or smaller than the second 1C 114). The brother recalls the body module (10), and the sputum with the (four) face is an example of the body module assembly 1, wherein the first ic m is the memory and the second IC 114 is the control. 'Please refer to the tenth In the figure, similar to the specific embodiment described above, the memory module assembly package includes a memory module η and heat sinks 12, 13, and a plurality of first ic ΐ 4, both in the manner of the joint portion 2 On the first surface U2 of the bottom plate ln and the flat bottom surface of the heat sink 12 (2) • β (phase The same way is also provided between the second surface not shown on the other side, which is called a flat bottom surface 133 of 3, according to the other side of the present invention. At least one of the guide surface material portions β (for example, a heat conductive paste, a heat conductive paste, a heat conductive film) is sandwiched between at least one of: an upper surface of the IC m and a flat bottom surface 123 of the heat sink 12 (corresponding to another The upper surface of the second iC 114 and the flat bottom surface of the heat sink 13 which are not shown on the side also provide a phase-scale interface doping β). The part of the crucible is a bonding agent coated on the joint portion. Different, body: application, thermal conductivity interface material, we have a relatively high heat 21 1329320 γ and does not provide the dry force between the second 1c 114 and the heat sink 12 '13. Therefore, the thermal conductivity interface material portion b is used on the second 1 (: 114, which generates higher heat, and the bonding agent A is used on the first IC 114 which generates the relative enthalpy low heat s. The thermal conductivity interface material B can A form of thermal grease (Vamec hot paste) or a thermally conductive bonding agent (-c(10)-3-gamma-conductive compound) is provided to be sandwiched between the second layer and the heat sink in a manner similar to the coating of the bonding agent on the bonding portion A described above. Between the sheets 12 and 13. The thermal conductivity interface material B needs to be replaced with a new one every time the memory module assembly is reworked. The twelfth figure-serving (10) is very interesting. The other part of the present embodiment is the phantom that is depicted in the specific embodiment. The memory of the previous description is "1", and contains a small-sized double-row in-line memory model, group (S〇mMM). Type memory model, group u. This type of face-leg type memory module u includes a small-sized package (TS0P) memory IC, and is applied to a notebook computer. The number of Ic 114 is usually Will be halved, each side of the memory module component i can only include up to four memory ICs The bonding agent is applied to the upper surface of the IC 114 or the bottom surface 123 of the heat sink 12 before the heat sink 12 is bonded to the memory module U in accordance with the specific embodiment described above. All other functions of the memory module assembly Both are similar to the previously described memory module assembly 1. In addition to the small size dual in-line memory module (S0DIMM) of the twelfth figure, the present invention can also be applied to any single inline memory. Body module (s brain), dual in-line memory module (round), and fully buffered dual in-line memory module (FBDIMM) device. The inventors have considered several other implementations. For example, the heat sink can be made of various heat-conducting materials such as Ming, Ming alloy, copper, brass, bronze, stainless steel, etc.

UZbfJZU replaces β with heat sinks of different geometries. In addition to the agent, rivets or other objects can also be used to connect the heat sink cover disk 4 to the bottom plate of the body module. For example, small bolts and bolt caps, or screw pins and caps can also be used. These losses provide additional holes for temporary, rather than permanent, additional holes to be added to the base of the alpha-hidden die for use by these fixtures. These fixtures' holes are usually ordered in standard memory modules. Two, two or four ICs can be stacked on each memory location on the memory module backplane. Some _ 1C can have more than one wafer selection) input. In the case of '5 忆 体 换 换 组合 组合 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' . One, three, four, eight or more data bits wide or narrow dram 1C can also be substituted for each other. Other facets (10) or W can also be embedded in the rest, such as a health or address decoder, a parity bit generator, an error detector, or a serial sequence for identifying a memory module. Programmable device (SPD). The memory module assembly fabricated in accordance with the present invention may utilize an improved DRAM Ic such as Synchronous DRAM (SDRAM), Double Data Rate (DDR) SDRAM, Second Generation Dual Data Rate (10) R2) SDRAM, and Rambus DRAM (RDRAM). The memory module assembly fabricated in accordance with the present invention may also include a memory module of the SIMM and FBDIMM type. Other memory types (such as SRAM, ROM, EPROM) can also be used instead of DRAM. The _ domain can also be used by the memory module using electronic erase and write-only read-only memory (EEPR0M) technology, 23 1329320 or other technologies (such as iron m F_, although _, etc.). The present invention can be used to stack other memory ICs other than _, such as flash memory or surface. The invention can be used in other types of quilts other than the ship's amount, or it can be used to stack other _ κ: such as buffers [scratchpad _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The assignment of functional or electronic signals to metal contact pads (or pins) located at the bottom edge of the module is usually determined by industry standard setting committees (eg JEDEC). Jedec will specify the order of the pins and the module; the M, ‘rejoy group has a substitute so that the pool can still be operated with the slot. The DRAM IC is typically connected to its nearest data signal pin to minimize the length of the data line and reduce signal delay. The older 72-pin module has been replaced by a 168-pin and a larger module. Multilayer printed circuit boards can also share signal traces with power and ground planes, reducing the number of laminates used from eight to six, or even to four. Further, the memory module assembly of the present invention can have many other settings. The above description of specific embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive from the discussion or to limit the scope of the invention. There are many modifications and variations that can be made in accordance with the above description. As such, the present invention is not limited by this description, but rather refers to the broadest scope of the invention in accordance with the principles and novel concepts discussed herein. BRIEF DESCRIPTION OF THE DRAWINGS The first figure (A) shows an exploded view of the relevant components of the memory module assembly of the present invention. The first figure (B) shows the assembled memory module assembly of the present invention. A schematic view of the three-dimensional appearance. 24 1329320 The second diagram shows a top view of the memory module of the memory module assembly. The third figure is a top view of the heat sink of the memory module assembly of the present invention. The picture shown in Figure 4 (4) is a schematic diagram of the upper part of the gift group. The fourth figure (8) is a schematic cross-sectional view taken from the fourth figure (4) (4) to the upper line. The figure shown in the fifth figure is based on the figure (4) t5_5· line _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ u The sixth figure shows a flow chart of the method for manufacturing the memory module of the present invention. The seventh figure is read as an example of the embodiment of the invention. The eighth drawing is not a schematic top view of the second preferred memory module assembly embodiment of the present invention. FIG. 9 is a cross-sectional view showing an embodiment of a third preferred memory module assembly of the present invention. The seventh embodiment of the seventh embodiment is a detailed schematic diagram of the module of the present invention. The tenth-figure is a schematic diagram of the decomposition of the fine components of the five best phantoms. 10 is not a schematic view of an embodiment of a sixth preferred memory module assembly of the present invention. The twelfth figure is not a schematic view of a memory module of the prior art. [Main component symbol description] Memory module........................y .................. .............. if Mounting device.............................. 25 1329320 Metal contact pad .....................13' compartment hole........................ ... 14' Notch.............................. 15' Memory Module Assembly... .........1 Memory Module........................11 'Backplane............ .................. 111 'First surface........................ 112 _ Two surfaces........................113, 1C device........................ .......114, metal contact pads........................115 Connector Edges.............. ..........116 Notch.............................. 117 Side edge.... ....................... 118 Upper edge........................ ... 119 • Electronic components........................110

Hole.............................. 11A

Zone hole.............................. 11B Heat sink................. ..........12 Peripheral area........................ 121 Concave area......... ............... 122 Bottom surface.................. 123 26 1329320 Slit............ .................. 124 bottom edge........................... 125 side Edge........................... 126 Upper edge.................. ........ 127 concave side........................... 128 - Side wall........ ...................... 129 ' Heat sinks........................ ...13 • Surrounding area........................131 Recessed area............... ......... 132 bottom surface.............................. 133 bottom edge........ ................... 135 Side edge..............................136 Upper edge.............................. 137 concave side................ .........· 138 _ Ribs..............................14 • Support arm... .......................15 Host System........................ 2 Motherboard.............................. 21 Module slot............... .........22 slot gasket.... ....................221 Fixing Fixture........................3 27 1329320 Holes.............................. 31 Fixed parts.............. ..........32 clamps..............................33

Joint location........................ A

Thermal interface material part............B

Screw..............................S

Open d.............................. G 28

Claims (1)

曰Si Patent Application Range: i. A memory module assembly comprising: a memory group comprising: a bottom plate having a surface and a second surface, most of which are embedded in the first surface of the bottom plate a first IC device and a plurality of circuit traces on the first surface and the surface: wherein the upper surface of the first IC device is flat with the first surface of the substrate and to > some of the circuit traces along a metal contact rim on the edge of the bottom plate joint and a first 1C device on the first surface of the bottom plate; a first heat sink having a flat bottom surface, the first heat sink including a peripheral area surrounding a concave area 'And the recessed area has __ flat bottom surface, and the upper edge of the first heat sink extends to the edge of the memory group, and at least one of the surface of the bottom plate and the bottom surface of the bottom plate is made at least one Air venting opening; and ▲ a plurality of first bonding portions of the bonding agent, wherein each of the first bonding portions is centered on the flat bottom surface of the first heat sink and the upper surface of the first IC device Between the first one The sheet can be firmly adhered to the memory module by the plurality of first-joining portions of the bonding agent. 0) 2. The memory surface group assembly of the patent application scope, which makes the - the joint-coated juncell heat-activated cement will exhibit a relatively low temper when heated to the temperature of the first tree height and will be southerly when subsequently cooled to a second relatively low temperature. Withered. 3. The memory module assembly of claim </ RTI> wherein the bonding agent for each of the first partial portions is a heat hardening bonding agent which exhibits an initial low point = force when applied. And exhibits a relatively high adhesion after heating. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 5. The memory module assembly of claim 1, wherein the first heat sink is mounted on the memory module, and the plurality of first IC devices overlap the first surface and the memory module is The connector edges and metal contacts are exposed to facilitate insertion into the module slot of the host system. Lu 6. The § memory module assembly of the first paragraph of the patent scope of the application of the invention includes at least one 帛2 (: device and clipped on the 帛-surface of the memory surface group) a thermally conductive interface material between the flat bottom surface of the heat sink and the upper surface of the second 1C device, wherein the thermal conductive interface material has a relatively higher thermal conductivity than the bonding agent applied by the first bonding portion. The memory module assembly of claim 1, further comprising at least one second 1 mounted on the first surface of the bottom plate of the memory module (the device and the moxibustion on the flat bottom surface of the first heat sink) And a thermal conductive interface material between the upper surface of the second IC device, wherein the thermal conductive interface material has a relatively lower bonding force than the bonding agent coated by the first bonding portion. A memory module assembly, wherein the memory module can include a single in-line memory module (SIMM), a dual in-line memory module (_M), and a small size double inline type Memory Module (SODIMM), Tiny Size Inline Memory Module (Micro DIMM) 9. The memory module assembly of claim 8, wherein the memory module can include a single data rate (SDR) device, a dual data rate (DDR) device, and a second generation dual data rate. 30 1329320 (10) 2) One of the skirting, third-generation double data rate (10) R3) devices, Fully Buffered devices, and the like. The memory module assembly of claim 1, wherein the flat bottom surface of the recessed portion of the first heat sink contacts the upper surface of the first IC device. 11. The memory module assembly of claim 1, wherein the first heat sink further comprises a plurality of ribs extending from the upper edge of the first heat sink to the bottom plate. • I2. The memory module assembly of claim 1, wherein the first heat sink further comprises a plurality of branch arms “from the upper edge of the first heat sink to be flat with respect to the first heat sink The acute angle of the surface extends. 13. The memory module assembly of claim 10, wherein an upper edge of the first heat sink is disposed along an upper edge of the memory If module, and the first heat sink further includes at least one The support extending from the upper edge and at least one of the support arms extending from the side edges extend in a vertical angle relative to the flat bottom surface of the first heat sink. 14. The memory module assembly of claim 13 wherein at least one of the support arms contacts the first surface of the bottom plate. 15. A memory module assembly comprising: - a memory module 'which includes a bottom plate having a first surface and a second surface opposite to each other, most of which are mounted on the bottom plate - Table _ a first _Ic device, and a plurality of first 1C devices mounted on a second surface of the memory module bottom plate, 1 being extended, wherein each of the first ones (the upper surface of the device is The first surface and the second surface of the bottom plate are parallel, and at least some of the circuit traces are connected to the metal contact pads of the edge of the bottom plate joint of the 31 1329320 and the first ic device on the first surface and the second surface of the bottom plate; a first-bulk material having a flat bottom surface, the first heat-dissipating portion {including a peripheral region-recessed-recessed region, and the recessed region has a flat wire surface, and the upper edge of the first heat sink extends Up to beyond the bottom edge of the memory module to make at least one air flow dissipation opening between the first heat sink and the first surface of the bottom plate; • a second heat sink having a flat bottom surface, the first Two fins include - peripheral area surrounding - recessed area a region, wherein the recessed region has a flat wire surface, and an upper edge of the second heat sink extends to an edge of the super (four) memory substrate to make at least between the second heat sink and the second surface of the bottom plate An air venting opening; and a plurality of first engaging portions of the bonding agent, wherein each of the first engaging portions is lost on the flat bottom surface of the first heat sink and the upper surface of the first IC device Between the flat surface of the second heat sink and the upper surface of the -1C device, the first heat sink and the second heat sink can be firmly coated by the plurality of first joint portions The bonding agent is disposed on the memory module. 16. The memory module assembly of claim 15 further comprising at least one in the first heat dissipation &gt; 第二, second heat dissipation&gt;; and the memory The fixture of the connection between the body modules. 17. The memory module assembly of claim 15 further comprising at least one second 1 mounted on the second surface of the bottom plate of the cryptographic module module: a device and an inflammation on the second heat sink flat bottom surface and the Two 1 (: _ surface of the thermal conductivity of the interface material f means that the towel has a thermal conductivity than the material of the interface section - engaging portion of the adhesive coated relatively high thermal conductivity 321,329,320. 18. The memory module assembly of claim 15 further comprising at least one second 1C device mounted on the second surface of the memory module bottom plate and sandwiched on the flat bottom surface of the second heat sink And a thermal conductive interface material between the upper surface of the second 1C device, wherein the thermal conductive interface material has a relatively lower bonding force than the bonding agent coated by the first bonding portion. 33