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TWI264268B - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TWI264268B
TWI264268B TW93138718A TW93138718A TWI264268B TW I264268 B TWI264268 B TW I264268B TW 93138718 A TW93138718 A TW 93138718A TW 93138718 A TW93138718 A TW 93138718A TW I264268 B TWI264268 B TW I264268B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation device
section
connection portion
sections
Prior art date
Application number
TW93138718A
Other languages
Chinese (zh)
Other versions
TW200621138A (en
Inventor
Hsiang-Chao Liu
Original Assignee
Quanta Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quanta Comp Inc filed Critical Quanta Comp Inc
Priority to TW93138718A priority Critical patent/TWI264268B/en
Publication of TW200621138A publication Critical patent/TW200621138A/en
Application granted granted Critical
Publication of TWI264268B publication Critical patent/TWI264268B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second with a second surface and a connection portion. The first surface is parallel to the second surface. The connection portion connects the first and second sections and extends along the normal direction thereof. An air passage is formed among the first and second sections and the connection portion, so that an air sequentially passes through the first section, the air passage and the second section.
TW93138718A 2004-12-14 2004-12-14 Heat dissipation device TWI264268B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93138718A TWI264268B (en) 2004-12-14 2004-12-14 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93138718A TWI264268B (en) 2004-12-14 2004-12-14 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200621138A TW200621138A (en) 2006-06-16
TWI264268B true TWI264268B (en) 2006-10-11

Family

ID=37967316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93138718A TWI264268B (en) 2004-12-14 2004-12-14 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI264268B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489077B (en) * 2010-04-23 2015-06-21 鴻準精密工業股份有限公司 Heat sink
TWI622752B (en) * 2017-06-22 2018-05-01 宏碁股份有限公司 Thermal module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489077B (en) * 2010-04-23 2015-06-21 鴻準精密工業股份有限公司 Heat sink
TWI622752B (en) * 2017-06-22 2018-05-01 宏碁股份有限公司 Thermal module
US10529649B2 (en) 2017-06-22 2020-01-07 Acer Incorporated Heat dissipation module

Also Published As

Publication number Publication date
TW200621138A (en) 2006-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees