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TW200603208A - Semiconductor device with crack prevention ring and method of manufacture thereof - Google Patents

Semiconductor device with crack prevention ring and method of manufacture thereof

Info

Publication number
TW200603208A
TW200603208A TW093139000A TW93139000A TW200603208A TW 200603208 A TW200603208 A TW 200603208A TW 093139000 A TW093139000 A TW 093139000A TW 93139000 A TW93139000 A TW 93139000A TW 200603208 A TW200603208 A TW 200603208A
Authority
TW
Taiwan
Prior art keywords
crack prevention
prevention ring
integrated circuit
crack
ring
Prior art date
Application number
TW093139000A
Other languages
English (en)
Other versions
TWI262537B (en
Inventor
Ping-Wei Wang
Chiiming-Morris Wu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200603208A publication Critical patent/TW200603208A/zh
Application granted granted Critical
Publication of TWI262537B publication Critical patent/TWI262537B/zh

Links

Classifications

    • H10W42/121—
    • H10W42/00—
    • H10W42/60—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW093139000A 2004-07-15 2004-12-15 Semiconductor device with crack prevention ring and method of manufacture thereof TWI262537B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/891,955 US7223673B2 (en) 2004-07-15 2004-07-15 Method of manufacturing semiconductor device with crack prevention ring

Publications (2)

Publication Number Publication Date
TW200603208A true TW200603208A (en) 2006-01-16
TWI262537B TWI262537B (en) 2006-09-21

Family

ID=35598589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139000A TWI262537B (en) 2004-07-15 2004-12-15 Semiconductor device with crack prevention ring and method of manufacture thereof

Country Status (4)

Country Link
US (3) US7223673B2 (zh)
CN (1) CN1734764A (zh)
SG (1) SG119257A1 (zh)
TW (1) TWI262537B (zh)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
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Also Published As

Publication number Publication date
SG119257A1 (en) 2006-02-28
US7586176B2 (en) 2009-09-08
TWI262537B (en) 2006-09-21
US8354734B2 (en) 2013-01-15
US20090289325A1 (en) 2009-11-26
US20060012012A1 (en) 2006-01-19
CN1734764A (zh) 2006-02-15
US20070194409A1 (en) 2007-08-23
US7223673B2 (en) 2007-05-29

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