TW200403014A - Method and device for treating flat and flexible work pieces - Google Patents
Method and device for treating flat and flexible work pieces Download PDFInfo
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- TW200403014A TW200403014A TW092115247A TW92115247A TW200403014A TW 200403014 A TW200403014 A TW 200403014A TW 092115247 A TW092115247 A TW 092115247A TW 92115247 A TW92115247 A TW 92115247A TW 200403014 A TW200403014 A TW 200403014A
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- Prior art keywords
- protective carrier
- carrier
- fluid
- processing
- protective
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000012545 processing Methods 0.000 claims abstract description 161
- 230000001681 protective effect Effects 0.000 claims abstract description 146
- 239000012530 fluid Substances 0.000 claims abstract description 116
- 239000000126 substance Substances 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims description 16
- 230000003068 static effect Effects 0.000 claims description 11
- 230000000903 blocking effect Effects 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 4
- 230000032258 transport Effects 0.000 description 36
- 239000011888 foil Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 241000196324 Embryophyta Species 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
Abstract
Description
200403014 玖、發明說明·· 發明所屬之技術領域 本裝置及方法係用於較佳地在電鍍線及蝕刻設施中處 理平板及彈性工件,更具體言之,其在濕化學或電化加工 期間將箔型工件垂直地浸入一處理池中。 先前技術 特別是在濕化學加工線、電鍍線及蝕刻設施中處理諸如 印刷電路箔等薄工件之方法係包括但不限於清理、活化、 電鍍及後處理該印刷電路箔之方法步驟。在一種内部由不 導電材料製成之工件中,以數項處理步驟製成一印刷電路 圖案及通鍍孔。對於特定應用而言,箔厚度總計不超過3〇 至50微米而使得這些箔對於機械應力高度敏感。工件表面 時常為軟性,所以工件不可在滾子之間傳送。在此例中, 使用諸如電鍍線等垂直加工線。在這些線中,印刷電路箔 的外邊緣係藉由夾件、夾扣或螺絲加以緊固以供運送至一 样板(flight bar)。一般而言,將複數個箔以併排的列狀方 式且有時亦以逐一位於彼此底下的方式配置於一梯板上。 =為了電解沉積-傳導層,經由夹扣及—梯板將工件連接 至-電流源的負極。為此,將一相對電極(在此例中為一陽 極)導電式連接至正極。在電解蝕刻期間使極性互換。工件 隨後受到陽極性極化。 一傳送器滑架上,使得工 中工件可降入各別的浸池 可緊固住工件之梯板係固持在 件從一浸池運送至另一浸池,其 中及在處理之後再度升出浸池外200403014 发明 、 Explanation of the invention ... The technical field to which the invention belongs The present device and method are used for processing flat plates and elastic workpieces in electroplating lines and etching facilities, and more specifically, during the wet chemical or electrochemical processing, The workpiece is immersed vertically in a processing tank. Prior art methods, particularly for processing thin workpieces such as printed circuit foils in wet chemical processing lines, plating lines and etching facilities, include, but are not limited to, method steps for cleaning, activating, electroplating, and post-processing the printed circuit foil. In a workpiece made of a non-conductive material inside, a printed circuit pattern and a through-plated hole are made in several processing steps. For specific applications, the foil thickness totals no more than 30 to 50 microns making these foils highly sensitive to mechanical stress. The surface of the workpiece is often soft, so the workpiece cannot be transferred between rollers. In this example, a vertical processing line such as a plating line is used. In these wires, the outer edge of the printed circuit foil is secured by clips, clips or screws for transport to a flight bar. Generally speaking, a plurality of foils are arranged on a step board in a side-by-side manner and sometimes also under each other. = For electrolytic deposition of the -conducting layer, connect the workpiece to the negative terminal of the -current source via the clip and the -ladder. To this end, a counter electrode (an anode in this example) is conductively connected to the positive electrode. The polarity is reversed during electrolytic etching. The workpiece is then subjected to anodic polarization. A conveyor slide, so that the workpieces in the work can be lowered into the respective immersion tanks, and the ladder plate which can fasten the workpieces is held and transported from one immersion tank to another immersion tank, and it is raised again after processing. Outside the dip tank
85747.DOC 200403014 可供不同加工使用之處理池係以水性流體運作。該流體 係依據組成物而具有不同的表面張力。為了將諸如箔等薄 工件降入處理池中,其需要具有最小的剛性及一盡可能平 放的表面。若非如此,箔降入流體中時譬如在水平方向將 會因為流體的表面張力而產生偏離,且會碰撞到槽的外緣 或附近的組成元件,諸如陽極、加熱裝置、冷卻裝置、感 應器及類似物。 過大的偏離可能引發使這些敏感的箔產生變形或彎曲 之危險〜甚至疋當偏離的箔碰觸到一電反極(eiectric antipole)時在電解池中產生短路之危險。因此,其原因係 為夾扣或齒條對於工件之不良的引導作用,或是材料缺乏 剛性所致。池中流體藉由環流泵、空氣噴射及類似方式( 對机)引發之/荒動亦會使箔偏離。由於不斷地需要降低工件 厚度’其不再浸入例如傳統上較厚的工件。 發明内容 本發明之一種目的係避免習知方法之缺點,更具體言之 ,本發明提供一種可以極少費用確保工件降入一加工流體 中而不造成損害之用於處理平板及彈性工件之裝置及方法。 、本發明提供了根據申請專利範圍第丨項之裝置及根據申 α專利範圍第14項(方法。本發明的較佳實施例描述於依 附項的申請專利範圍中。 在揭露及描述在一加工流體中處理平板及彈性工件而 不造成損害之本發明之前,請了解本發明並不限於本文揭 露之特定裝置、加工步騾及材料,這些裝置、加工步驟及85747.DOC 200403014 The treatment tanks available for different processing operations are based on aqueous fluids. The fluid has a different surface tension depending on the composition. In order to lower a thin workpiece such as a foil into a processing tank, it needs to have the least rigidity and a surface that is as flat as possible. If this is not the case, when the foil is dropped into the fluid, for example in the horizontal direction, it will deviate due to the surface tension of the fluid, and it will collide with the outer edge of the tank or nearby components, such as anodes, heating devices, cooling devices, sensors and analog. Excessive deviation may cause the sensitive foil to deform or warp. Even the risk of short circuit in the electrolytic cell when the deviated foil touches an eiectric antipole. Therefore, the reason is the poor guiding effect of the clip or rack on the workpiece, or the lack of rigidity of the material. The foil's deviation can also be caused by the fluid in the tank caused by circulation pumps, air jets, and the like (opposite to the machine). Due to the constant need to reduce the thickness of the workpiece ', it is no longer immersed in, for example, a traditionally thicker workpiece. SUMMARY OF THE INVENTION An object of the present invention is to avoid the disadvantages of the conventional method. More specifically, the present invention provides a device for processing flat plates and elastic workpieces, which can ensure that the workpiece is lowered into a processing fluid without causing damage and without causing damage. method. The present invention provides a device according to the scope of the patent application and a method according to the scope of the patent application. It describes the preferred embodiment of the invention in the scope of the patent application according to the attached items. The disclosure and description of a process Before the present invention processes flat plates and elastic workpieces in a fluid without causing damage, please understand that the present invention is not limited to the specific devices, processing steps, and materials disclosed herein. These devices, processing steps, and
85747.DOC 200403014 材料可μ略作改變。亦了解因為本發明的範圍只受到申社 :利範圍所限定,本文的術語僅用來描述特定實施例而: 忍欠加以限制。因此可了_,利用技術裝置所作之各種不同 知改及替代方式皆適㈣下文範例及圖式的描述,而不脫 離由申請專利範圍所界定之本發明的範圍。 =據本發明之裝置及方㈣祕特別是在電鑛線及姓 刻叹她中以-流體來處理大致垂直定位的平板及彈性工件 。此裝置及方法可將型工件放人流體中,亦即—加工流 體(處理池),而特別不使其變形及/或顯著地移位,故可3 止其碰撞到加工槽(槽)的侧壁或其他内建組件。 根據本發明的裝置係包含至少一個用於固持工件之保 護載體,該載體可由—含有流體之槽予以接收,以及包含 至少-能使流體流人保護載體中之裝置,藉以至少在流體 机入及充填加工期間不使保護載體内的工件變形及/或顯 著地移u w體最#係為一可供濕蚀刻$電化I理使用之 加工流體。所用的流體亦可為-氣體,譬如乾燥用之加熱 2机。為了簡單起見’下文描述中將使用”加工流體"名稱 來代表任何流體。 為了進行根據本發明的方法,譬如將工件緊固至一梯板 ,該梯板藉由一運送系統將工件傳送到各不同加工槽。根 據本發明,因此工件不降入流體中而是首先被接收在一譬 如已經大體排空加工流體之保護載體中。保護載體係傳送 至可供配置其中之加工槽。然後,保護載體充填加工流體 的方式大致不會使工件變形及/或移位。只有此時才使工件85747.DOC 200403014 Materials may vary slightly. It is also understood that because the scope of the present invention is limited only by the scope of the application, the terms herein are used to describe specific embodiments and: Limitation of tolerance. Therefore, it is possible to use various technical modifications and alternatives made by the technical device to fit the description of the following examples and drawings without departing from the scope of the present invention as defined by the scope of the patent application. = The device and the recipe according to the present invention, especially in the electric mine line and surname, sighed her with -fluid to process approximately vertically positioned flat plates and elastic workpieces. This device and method can put the shaped workpiece into the fluid, that is, the processing fluid (processing tank) without particularly deforming and / or significantly displacing it, so that it can be prevented from colliding with the processing groove (slot). Side walls or other built-in components. The device according to the invention comprises at least one protective carrier for holding a workpiece, which carrier can be received by a tank containing a fluid, and at least a device capable of flowing fluid into the protective carrier, so that at least During the filling process, the workpiece in the protective carrier is not deformed and / or significantly moved. The processing system is a processing fluid that can be used for wet etching and electrochemical processes. The fluid used can also be a gas, such as a heating machine for drying. For the sake of simplicity, the name "processing fluid" will be used in the following description to represent any fluid. To carry out the method according to the invention, for example, the workpiece is fastened to a ladder plate, which conveys the workpiece by a transport system To different processing tanks. According to the invention, the workpiece is therefore not lowered into the fluid but is first received in a protective carrier, such as the processing fluid that has been substantially evacuated. The protective carrier is transferred to the processing tank where it can be configured. Then , The method of protecting the carrier from filling the processing fluid will not substantially deform and / or shift the workpiece. Only then will the workpiece
85747.DOC 200403014 接觸到加工流體加以處理。 保護載體係由一種適合所使用的化學物及預定池溫之 材料所組成,諸如塑膠材料或金屬。利用重力在保護載體 中接納加工流體之裝置係為位於保護載體中之至少一個開 孔。保護載體最好包含側壁及一底壁,開孔平均地分隔及 分佈於該等壁中。開孔的尺寸可使得加工流體以受控制方 式緩慢地流入該載體中而不彎折或推離敏感的工件。各開 孔的尺寸(流動通道面積)最好位於1至500平方公厘的範圍 。為了將諸如所使用加工流體之不同表面張力或者工件的 敏感度等特定需求列入考慮,且其中表面張力可能依據加 工流體的組成物而改變,可將保護載體中的開孔製成不同 或可加以調整。譬如可藉由可位移式擋板或孔口板來改變 或調整開孔的流動通道面積。藉由擋板或孔口板相對於開 孔之位移,亦可以改變相對於保護載體壁中開孔位置之孔 口板中的開孔位置,使保護載體中的開口被部份地覆蓋或 關閉。結果,可以改變進入保護載體中的流體以及此流體 的容積流速。藉由擋板及孔口板的位移來部份地關閉保護 載體中的開孔,降低了每單位時間的入流率。 擾流譬如係為流速的一項函數,且擾流係在加工流體進 入載體的入流期間發生於保護載體的開孔後方之加工流體 中。此外,從開口出發的分離流係朝向保護載體内部且亦 在其相遇時產生擾流。這些擾流會使得敏感的工件發生變 形。擾流在工件上造成之影響程度譬如係取決於工件相對 於發生的擾流或流向之定向及距離而定。在保護載體的一 85747.DOC -9- 200403014 :::施例中’加工流體只穿過保護載體的側壁中對於工 :平仃疋向〈開孔,其他側壁中可能存在的開孔 、 係為了防止特別容易變形的工件產生彎曲, 因:此例中幾乎正面衝擊在工件上之流將會彼此抵銷所以 工不會顯著地偏離其位置。 為了。如在載體升高期間處理之後從保護載體快速地 p加工㈣’保護載體的底壁最好可設有排放阻板或大 面排放閘且其譬如藉由槓桿的升高動作或藉由浮體在保 -載祖升向時自動地開啟且當降入槽中時再度自動地關閉。 口在件進仃電化處理(藉由電鍍或電化蝕刻加工)期間, 可將電鍍形成電解電池所需要的陽極或者姓刻用的陰極緊 固至保^載壁,更具體言之,此時該等陽極譬如係不可 ’令化。右保護載體材料具有適當的抗化學物能力及電化加 工,壁本身即可執行陽極或陰極的功能。 右以此技#熟知的方式將陽極(相對電極)緊鄰於槽外緣 緊固在们壬側上,保護載體除了保護工件不受保護載 也中的對机動外亦可執行遮蔽_相對電極不受到電場線 之力把基於此目的,保護載體中用於接納加工流體之譬 々鑽孔等開孔譬如最好係未設置在保護載體壁的周邊區域 中’或者其可在這些區域中比起壁的中⑽域具有較小的 直徑及/或減少數量。如此可在工件周邊區域中避免不良之 南场線集中現象。在此例中,由於電場線原本不能穿透入 載體及抵達工件,載體材料至少在其表面上不具有導電的 特性。85747.DOC 200403014 Exposure to processing fluid for processing. The protective carrier is composed of a material suitable for the chemical used and a predetermined cell temperature, such as a plastic material or a metal. The means for receiving the processing fluid in the protective carrier using gravity is at least one opening in the protective carrier. The protective carrier preferably includes side walls and a bottom wall, and the openings are evenly separated and distributed in these walls. The size of the openings allows the processing fluid to flow slowly into the carrier in a controlled manner without bending or pushing away from sensitive workpieces. The size of each opening (flow channel area) is preferably in the range of 1 to 500 square millimeters. In order to take into account specific requirements such as the different surface tension of the processing fluid used or the sensitivity of the workpiece, and where the surface tension may vary depending on the composition of the processing fluid, the openings in the protective carrier can be made different or accessible Be adjusted. For example, the flow channel area of the opening can be changed or adjusted by the displaceable baffle or orifice plate. Through the displacement of the baffle or the orifice plate relative to the opening, the position of the opening in the orifice plate relative to the opening position in the protective carrier wall can also be changed, so that the opening in the protective carrier is partially covered or closed. . As a result, the fluid entering the protective carrier and the volume flow rate of this fluid can be changed. The displacement of the baffle and orifice plate partially closes the openings in the protective carrier, reducing the inflow rate per unit time. The turbulence is, for example, a function of the flow velocity, and the turbulence occurs during the inflow of the processing fluid into the carrier in the processing fluid behind the openings protecting the carrier. In addition, the separated flow from the opening is directed towards the inside of the protective carrier and also creates turbulence when it meets. These turbulences can deform sensitive workpieces. The degree of influence of the turbulence on the workpiece depends, for example, on the orientation and distance of the workpiece relative to the turbulence or flow direction that occurs. In the case of the protective carrier, 85747.DOC -9- 200403014 ::: In the examples, the 'processing fluid only passes through the side walls of the protective carrier. In order to prevent bending of the workpiece which is particularly easy to deform, in this case, the flow of almost frontal impact on the workpiece will offset each other, so the worker will not deviate significantly from its position. in order to. For example, if the processing of the carrier during the raising process is quickly performed from the protective carrier, the bottom wall of the protective carrier may preferably be provided with a discharge blocking plate or a large-surface discharge gate and it may be raised by a lever or by a floating body, for example. It is automatically opened when the Bao-Zaizu is ascended and closed again when lowered into the tank. During the electrification process (by electroplating or electrochemical etching), the anode or cathode used for electroplating to form an electrolytic cell can be fastened to the carrier wall. More specifically, at this time, the Wait for the anode, for example, can't be ordered. The right protective carrier material has appropriate chemical resistance and electrochemical processing, and the wall itself can perform the function of an anode or a cathode. RIGHT This technique # Anode (opposite electrode) is fastened on the side of the groove next to the outer edge of the groove in a well-known manner. The protection carrier can also perform shielding in addition to protecting the workpiece from the manoeuvre. Due to the force of the electric field line, for this purpose, openings such as drill holes and the like in the protective carrier for receiving the processing fluid are preferably not provided in the peripheral regions of the protective carrier wall, or they can be compared in these regions. The medial ridge region of the wall has a smaller diameter and / or reduced number. In this way, the undesired concentration of the southern field line can be avoided in the peripheral area of the workpiece. In this example, since the electric field lines could not have penetrated into the carrier and reached the workpiece, the carrier material did not have conductive properties at least on its surface.
85747.DOC -10- 200403014 為了在工件已經接收於保護載體中之後或者導入保護 載體中時充填此保護載體,經由保護載體内部與外部的不 同池位準生成之一靜水壓梯度將加工流體輸送至保護載體 。具有各種不同可能性可藉由保護載體内部與外部的流體 位準來生成此梯度,加工槽中的流體譬如可在保護載體降 入槽中時產生位移。 一加工槽譬如可包含一靜態的亦即穩固安裝的保護 載體。在此例中,利用一運送系統將固持在梯板上的工件 傳送至位於空槽中之空保護載體内。在此例中,加工流體 在梯板降入空槽中之前譬如係包含於一分離的貯器中,且 在梯板已經完全地降入加工槽中且工件已經沉積在保護載 體中之後利用一輸送系統(一泵系統或重力)及導管將加工 流體輸送至一位於保護載體外之槽空間。濕化學或電化處 理完成時,藉由運送系統將工件從槽升高及運送到下個加 工槽。加工流體再循環至貯器。然後,保護載體已經就緒 可接收後續的工件。 另一實施例中,可將容納工件的保護載體降入槽中藉以 獲得槽中之流體位準差,其中只在載體降低期間或之後加 工流體才會輸送至槽。在此例中,加工流體譬如容納在一 分離的貯器中且在包含工件的梯板已經完全地降入槽中或 其降低期間利用一輸送系統(一泵系統或重力)及導管將加 工流體輸送至一位於保護載體外之槽空間。貯器可放置在 加工槽旁邊作為一分離單元或者可藉由一分離的側隔室形 成於加工槽中或加工槽上。可將諸如攪拌器、加熱器、冷 85747.DOC -11 - 200403014 卻益或類似物等用於加工此加工流體之裝置安裝在貯器中 。化學或電化處理完成時,具有工件的梯板係升出槽外且 加工流體可同時地再循環至貯器。 另一貫施例中,可將保護載體降入已經容納有工件的加 工槽中’藉以獲得已經充填加工流體之槽中的流體位準差。 關於用以將保護載體傳送至一已經或尚未充填加工流 體之槽中的替代方式之上述方法及裝置變化例係可無限制 地合併下文描述之實施例,該等實施例係有關將保護載體 送入及移出加工槽之方式。 可利用各種不同裝置將保護載體降入譬如經充填的加 工槽中。此裝置最好包含一與槽相聯的靜態保護載體吊具 ,藉以將保護載體傳送至槽中。另一較佳示範性實施例中 ’ 一保護載體吊具可將保護載體傳送至槽中,且此保護載 體吊具係安裝至用於傳送工件之運送系統的一運送滑架。 在一靜態保護載體吊具的案例中,在梯板降入加工槽中 之珂吊具係將保護載體升高至一較高位置中。在此位置中 ,保護載體此時已經取出加工槽外,且已使加工流體流出 到工件在降入保護載體時不會浸入加工流體中之程度。為 了使彳于加工流體在處理之後快速地流出,設置於保護載體 底部之排放阻板或大表面排放閘譬如可在保護載體升高時 開啟,孩排放阻板或排放閘係經由槓桿的揚升動作或經由 浮體而自動㈣,且經由降低動作而再度自動關閉。當然 ,排放阻板及排放閘亦可藉由馬達或諸如用手等任何^他 致動作用使其開啟及關閉。 85747.DOC -12- 200403014 處理時,保護載體及工件最好同步地降入加工槽中。因 此,容納在加工流體中的流體之位移程度係可提高槽中的 流體位準,導致保護載體内部與外部之流體位準差。結果 ,可使加工流體均句地流過位於保護載體内之開孔而不使 工件因而受損。因此,譬如可在保護載體側壁中利用擋板 來改變開孔的流動通道面積以使流動通道面積配合於吊具 降低工件之速度,藉此譬如可符合工件性質而使入流的加 工流體受控制地流入。在處理之後,如同此類設施的慣例 ,利用運送系統的一運送滑架吊具將工件直接地移除。然 後,經命運送滑架的移行動作將工件傳送至下個加工槽。 保護載體留在加工槽内的較低位置中,直到後續工件已經 就緒在加工槽上方等待而不妨礙運送滑架的移行動作為止。 在本發明的此變化例之一特定實施例中,可以免除了通 常安裝在運送滑架之工件吊具,在此例中可將一用於保護 載體及工件的吊具安裝在各加工槽。當吊具已經將工件升 高至站外且將其帶到較高位置中之後,抵達的運送滑架係 接收被放在梯板上之工件。亦升高的保護載體藉由此吊具 再度下降,此時呈自由懸置之梯板譬如可移行至下個加工 槽。在此處,屬於該槽的保護載體係被升高、接收梯板並 將其降入加工池内。然後,運送滑架可移行至下個工作站。 若一保護載體吊具安裝至運送滑架,可利用該吊具將保 護載體降入及升出加工槽。基於此目的,運送滑架將受處 理的工件傳送到加工槽。在裝載至濕化學池之前,保護載 體存放在各別的加工槽中。如同此型浸鍍廒(dip plant)常見 85747.DOC -13- 200403014 的情形,運送滑架係以受處理工件位於升高狀態的方式抵 達加工池。不同於將梯板立即降入加工槽中之先前技術的 方法,本發明建議首先以保護載體吊具將保護載體升出加 工槽外達到工件被大體清空的保護載體所接收之程度。然 後,梯板及保護载體係以與進入加工站的加工流體大致相 同之速度緩慢地降低。因此,加工流體係在降入槽期間均 勻地輸送至容納有敏感的工件之保護載體,而不造成偏離 或變形之工件。將其移除時,只使梯板隨著工件吊具升高 。運送滑架上的保護載體吊具及槽中的保護載體係仍留在 較低位置中且運送滑架移行至下個加工站。此實施例二加 工站上可以免用靜態吊具,所需要的整體高度係幾乎對應 於先前技術浸鍍廠的需求。 在本發明的此變化例之一特定實施例中,將保護載體緊 固至運运滑架而可連同工件一起垂直地移動及移行至各別 的加工站。保護載體的構造具有至少兩個部分,且在底部 上及兩相對側壁上係具有能夠視需要在底部及側邊打開保 護載體之自動致動式阻板。一旦阻板開啟時,保護載體係 分離成兩半部且其彼此平行懸置、緊固在運送滑架上且不 再%全地圍繞具有工件的梯板。最好將工件及兩半部定向 成為大致彼此平行。為了接收工件,額外設置於運送滑架 上足工件吊具或梯板吊具係在該梯板升高時將固持住工件 的梯板拉入開啟的保護載體中。一旦固持住工件的梯板已 抵達較高位置之後,底及側阻板係關閉且兩載體半部合併 形成一關閉的載體。在此狀況中,運送滑架移行至下個加85747.DOC -10- 200403014 In order to fill the protective carrier after the workpiece has been received in the protective carrier or when it is introduced into the protective carrier, a hydrostatic gradient is generated to transport the processing fluid through different pool levels inside and outside the protective carrier To the protection carrier. There are various possibilities to generate this gradient by protecting the fluid levels inside and outside the carrier. The fluid in the processing tank, for example, can be displaced when the protective carrier is lowered into the tank. A processing slot may, for example, contain a static, i.e., securely mounted, protective carrier. In this example, a transport system is used to transfer the workpieces held on the pallets to the empty protective carriers in the empty slots. In this example, the process fluid is contained in a separate receptacle, for example, before the step is lowered into the empty slot, and after the step has been completely lowered into the processing slot and the workpiece has been deposited in the protective carrier, a A conveying system (a pump system or gravity) and a conduit convey the processing fluid to a slot space outside the protective carrier. When the wet chemical or electrochemical treatment is completed, the workpiece is lifted and transported from the tank to the next processing tank by a transport system. The process fluid is recirculated to the reservoir. The protective carrier is then ready to accept subsequent workpieces. In another embodiment, the protective carrier containing the workpiece can be lowered into the tank to obtain the fluid level difference in the tank, wherein the processing fluid is delivered to the tank only during or after the carrier is lowered. In this example, the process fluid is, for example, contained in a separate receptacle and the process fluid is pumped using a conveying system (a pump system or gravity) and a duct while the step containing the workpiece has been fully lowered into the tank or during its lowering. Conveyed to a trough space outside the protective carrier. The receptacle may be placed next to the processing tank as a separate unit or may be formed in or on the processing tank by a separate side compartment. A device such as a stirrer, heater, cold 85747.DOC -11-200403014 Cheryl or the like for processing this processing fluid may be installed in the receptacle. When the chemical or electrochemical treatment is completed, the pallets with workpieces are lifted out of the tank and the processing fluid can be recycled to the reservoir simultaneously. In another embodiment, the protective carrier may be lowered into a processing tank that already contains a workpiece to obtain a fluid level difference in the tank that has been filled with the processing fluid. The above method and device variants regarding alternative ways of delivering a protective carrier to a tank that has been or has not been filled with a processing fluid can be combined without limitation with the embodiments described below, which relate to the delivery of the protective carrier Way of entering and removing the processing tank. Various devices can be used to lower the protective carrier into, for example, a filled processing tank. The device preferably includes a static protective carrier sling associated with the trough to convey the protective carrier into the trough. In another preferred exemplary embodiment, a protection carrier spreader can transfer the protection carrier into the trough, and the protection carrier spreader is mounted to a transport carriage of a transport system for transporting a workpiece. In the case of a static protective carrier spreader, the K-Lift lifter lowers the protective carrier into a higher position when the ladder is lowered into the processing tank. In this position, the protective carrier has now been taken out of the processing tank and the processing fluid has been allowed to flow out to the extent that the workpiece will not be immersed in the processing fluid when lowered into the protective carrier. In order to allow the processing fluid to flow out quickly after processing, the discharge barrier or large surface discharge gate provided at the bottom of the protection carrier can be opened when the protection carrier is raised, for example, the discharge barrier or discharge gate is lifted by the lever. The movement may be automatically carried out through the floating body, and the movement may be automatically closed again through the lowering movement. Of course, the discharge blocking plate and the discharge gate can also be opened and closed by a motor or any other action such as a hand. 85747.DOC -12- 200403014 During processing, the protective carrier and the workpiece are preferably lowered into the processing tank simultaneously. Therefore, the degree of displacement of the fluid contained in the processing fluid can increase the fluid level in the tank, resulting in a difference in fluid level between the inside and outside of the protection carrier. As a result, it is possible to flow the processing fluid uniformly through the openings in the protective carrier without damaging the workpiece. Therefore, for example, a baffle can be used in the side wall of the protection carrier to change the area of the flow channel of the opening so that the area of the flow channel is matched with the spreader to reduce the speed of the workpiece, thereby controlling the inflow of the processing fluid in accordance with the nature of the workpiece Inflow. After processing, as is customary in such facilities, the workpiece is directly removed using a transport carriage spreader of the transport system. Then, the workpiece is transferred to the next processing tank by the movement of the destiny carriage. The protective carrier remains in the lower position in the processing tank until subsequent workpieces are ready to wait above the processing tank without hindering the movement of the transport carriage. In a specific embodiment of this variation of the present invention, a workpiece spreader that is usually mounted on a transport carriage can be eliminated. In this example, a spreader for protecting the carrier and the workpiece can be installed in each processing slot. After the spreader has raised the work piece outside the station and brought it to a higher position, the arriving transport carriage receives the work piece placed on the ladder. The raised protective carrier is lowered again by the spreader. At this time, the freely suspended ladder plate can be moved to the next processing slot, for example. Here, the protective carrier belonging to the tank is raised, receives the steps and lowers them into the processing tank. The transport carriage can then be moved to the next workstation. If a protective carrier sling is installed on the transport carriage, the protective carrier can be used to lower the protective carrier into and out of the processing tank. For this purpose, the transport carriage transports the processed workpieces to the processing tank. The protective carriers are stored in separate processing tanks before being loaded into the wet chemical bath. As is the case with this type of dip plant (85747.DOC -13- 200403014), the transport carriage arrives at the processing pond with the workpiece being raised. Unlike the prior art method of immediately lowering the ladder plate into the processing tank, the present invention proposes to first lift the protection carrier out of the processing tank with a protection carrier spreader to the extent that the workpiece is received by the protection carrier that is substantially emptied. Then, the steps and the protective carrier are slowly lowered at about the same speed as the processing fluid entering the processing station. Therefore, the processing flow system is uniformly transported to the protective carrier containing sensitive workpieces during the lowering into the groove without causing deviation or deformation of the workpieces. When removing it, only raise the ladder plate with the workpiece spreader. The protective carrier sling on the transport carriage and the protective carrier in the slot remain in the lower position and the transport carriage moves to the next processing station. In this second embodiment, a static spreader can be omitted on the processing station, and the overall height required almost corresponds to the requirements of the prior art dip plating plant. In a specific embodiment of this variation of the present invention, the protective carrier is fastened to the transport carriage so as to be vertically moved and moved along with the workpiece to respective processing stations. The structure of the protection carrier has at least two parts, and on the bottom and on two opposite side walls are provided with an automatically actuated blocking plate capable of opening the protection carrier at the bottom and sides as needed. Once the blocking plate is opened, the protective carrier is separated into two halves and it is suspended parallel to each other, fastened on the transport carriage and no longer completely surrounds the step plate with the workpiece. Preferably, the workpiece and the two halves are oriented approximately parallel to each other. In order to receive the workpiece, a foot lifting device or a ladder lifting device which is additionally arranged on the conveying carriage is used to pull the ladder holding the workpiece into the opened protection carrier when the ladder is raised. Once the ladder plate holding the workpiece has reached the higher position, the bottom and side barrier plates are closed and the two carrier halves merge to form a closed carrier. In this situation, the transport carriage moves to the next Canada
85747.DOC •14- 200403014 工站且其中使關閉的保護載體連同梯板及工件降入加工站 中。一旦加工流體已完全進入保護載體之後,代表池位準 在保護載體内部與外部幾乎相同時,底及側阻板係開啟且 保護載體再度被保護載體吊具升高直到較高位置為止,而 抵達了保護載體的運送位置。工件受到處理且運送滑架連 同保護載體-起恢復移行藉以執行下個運送任務。為了使 池流體中的較大擾流不會在保護載體的升高程序期間造成 敏感的工件強烈地偏離,必須將側壁及阻板構成為譬如具 2圓滑邊緣、平滑表面且無突起部分藉以便於流動。此實 施例中,-各加工站不需配備有保護載體,但此特性係具有 分另1將黏附至保護載體之加工流體帶到下站之缺點。可譬 如精由一位於運送滑架上的掃掠或喷除裝置來減輕此缺陷 ,該裝置能夠移除或至少顯著地降低了在升高程序期間黏 附之流體量。此實施例特別適合使用在所挾帶的池流體不 含有重大缺點之案例’且其譬如為從一沖洗池運送至下個 池,將工件傳送至譬如多階段清洗池等具有很類似組成物 之加工池,或者此實施例適合使用在甚至需要連續地拖出 加工流體《案例’且其譬如為將池組成物予以再生。在保 護載體底部之關閉的阻板可在運送滑架移行期間同時作為 -滴盆。最好已被移行動作抖落的加工流體係由關閉的阻 板加以收集。由相板在後續加工站打開, 的流體。基於此目的,可提 匕殘田 ^供收集^來防止任何殘留流 ⑽加工站中而非譬如直接地導往-廢水處理系統。 本發明的另-實施例中,保護載體處理之後不會留在處85747.DOC • 14- 200403014 The station and in which the closed protective carrier is lowered into the processing station along with the ladder and the workpiece. Once the processing fluid has completely entered the protective carrier, representing that the cell level is almost the same inside and outside the protective carrier, the bottom and side barriers are opened and the protective carrier is again raised by the protective carrier sling to a higher position and arrives. Protects the transport position of the carrier. The workpiece is processed and the transport carriage, together with the protective carrier, resumes movement to perform the next transport task. In order that the large turbulence in the pool fluid will not cause the sensitive workpiece to strongly deviate during the lifting process of the protection carrier, the side wall and the blocking plate must be constructed, for example, with 2 smooth edges, smooth surfaces and no protrusions to facilitate flow. In this embodiment, each processing station does not need to be provided with a protective carrier, but this characteristic has the disadvantage of bringing the processing fluid adhered to the protective carrier to the lower station separately. This defect can be mitigated, for example, by a sweeping or spraying device located on the transport carriage, which can remove or at least significantly reduce the amount of fluid that is stuck during the raising procedure. This embodiment is particularly suitable for cases where the pool fluid contained does not contain significant disadvantages, and it is, for example, transported from a flushing tank to the next tank, and transferring the workpiece to a multi-stage cleaning tank, for example, which has a very similar composition. The processing tank, or this embodiment is suitable for use even when the processing fluid "case" needs to be continuously withdrawn and it is, for example, to regenerate the tank composition. The closed baffle at the bottom of the protective carrier can be used as a drip tray during the carriage carriage movement. It is preferred that the processing flow system that has been shaken off by the movement action is collected by a closed baffle. The fluid is opened by the phase plate at the subsequent processing station. For this purpose, dregs can be provided for collection to prevent any residual flow in the processing station instead of, for example, directing to a wastewater treatment system. In another embodiment of the present invention, the protection carrier does not stay in place after processing
85747.DOC -15· 200403014 理池中。保護載體譬如可安裝至亦 了奘哉爲土人 了π工件<梯板。為 p除工件,保護載體係在 側I- μ 士 叫町装戟及卸除站之一 州上汉有門。此實施例中,將梯板連 各別的加工站且在其中緩,_入池中起帶到 間,加工流體均句地流入保護載體中而不/低私序的期 膏祐㈣ 木㈣把甲而不使工件變形。此 男施例中,設備費用極低,但另一 缚齑触叫, 万面/原自於黏附在保 濩载植開孔及壁的殘留流 的加工流體量則遠為較大。 池之挾帶 廠^實上’可將本發明的各不同實施例一起合併在一電鍵 實施方式 圖二顯示各不同的加工站10’且其各包含槽3,3,或24β槽 3 !由一導管9及一聚8 含,、e 逆妖王,、了态7。一具有開孔6之靜 Μ即穩固安裝的賴載體5係與槽3,相聯。相對地,—具 有開孔6之可升降的保護載體5係與槽3相聯。將一用於運送 工们之運送系統分派給各加工站,且此運送系統大致係由 承載臂23 ' -梯板2及一固持裝置4所組成。在此例中身 為薄印刷電路落之工件對於圖面呈垂直延伸。譬如為長 万形銅齒條之梯板2在圖中以相同方式顯示其具有一承載 臂23、-用以接收梯板2及送到電鍵戚的分離加工站1〇之運 运'月木(未圖不)。工件1藉由固持裝置4緊固至梯板2。此配 置中,並無保護載體5與槽24相聯,此處預定進行的處理链 如可在—氣態環境中施行,所以通常不需要保護載體5。若 在此處理中產生強烈流動,譬如強力風扇造成的空氣環流85747.DOC -15 · 200403014 in the pool. The protective carrier can be mounted to, for example, the π workpiece < ladder plate. To remove the workpiece for p, the protection carrier is on the side of I-μ, called one of the town-mounted halberds and the removal station. In this embodiment, the ladder plate is connected to the respective processing stations and is slowly moved into the pool, and the processing fluid flows into the protective carrier in a steadily manner. Put nails without deforming the workpiece. In this male example, the equipment cost is extremely low, but the other binding is called, and the amount of processing fluid from the residual flow that originally adhered to the openings and walls of the container was much larger. The Chinosaki belt factory can actually combine the different embodiments of the present invention together in a single key implementation. Figure 2 shows different processing stations 10 'and each of them contains a slot 3, 3, or 24β slot 3! Conduit 9 and one poly 8 contain,, e inverse demon king, and state 7. A static carrier 5 with an opening 6 that is firmly installed is connected to the groove 3. In contrast, a liftable protective carrier 5 having an opening 6 is connected to the groove 3. A processing system for the transportation workers is assigned to each processing station, and the transportation system is roughly composed of a carrying arm 23'-stair plate 2 and a holding device 4. In this example, the workpiece, which is a thin printed circuit, extends perpendicular to the drawing surface. For example, the ladder plate 2 which is a long-shaped copper rack is shown in the same way in the figure. It has a load arm 23, a transport processing station 10 for receiving the ladder plate 2 and sending it to the keypad. (Not pictured). The work 1 is fastened to the step plate 2 by the holding device 4. In this configuration, there is no protection carrier 5 connected to the tank 24, and the processing chain scheduled here may be performed in a gaseous environment, so the protection carrier 5 is generally not required. If there is a strong flow during this process, such as air circulation caused by a powerful fan
85747.DOC -16- 200403014 ’則此處亦可使用保護載麫 又我5,且依此碉整其開孔6。 經由保護載體5側壁中的開 、 、 丁 0開口 6,加工流體以受控制的速 度流通至保護載體5。名如τ i 、 在加工狀況中,槽3及3’最高係將加 工流體充填至池位準21。 槽3」在處理時係裝載有受處理工w,加王流體首先容納 在τ的7中裝載時,工件1被一運送滑架傳送至加工槽3, 且降入此時均為清空之保護載體5中及槽。然《灸,以泵8 將加工流體從貯器7泵送通過導管9進入槽3,中。槽3,充填有 加工泥體。這同時地導致保護載體5内部與外部之一流體位 卞差迨成加工泥體受控制地經由開孔(5流入保護載體5内 部’心入保遵載體5之流體速度係為泵§的輸出能量之一項 函數且藉由開孔6尺寸加以決定。實際上,其具有(^⑹至} 公尺/秒的最大值。.處理期間,保護載體5亦必須執行使強 流保持遠離工件1之功能,且強流譬如係由用於均勾地分佈 溫度或用於補充溶液之過濾線路或攪拌裝置所產生。 處理之後’利用一吊具(未圖示)將固持有工件1的梯板2 升出加工流體外,且此吊具係安裝至運送滑架且帶入一沖 洗站中譬如進行後續處理。同時地,藉由泵8將閥(未圖示) 加以切換或利用槽3,與貯器7之間的高度差而使得加工溶 液再循環至貯器7。 為了處理槽3中的工件1,必須藉由一尚未圖示且呈靜態 或安裝至運送滑架之保護載體吊具首先將保護載體5升出 槽3外’加工流體仍留在槽3中。升高且大體清空的保護載 體5已經接收工件丨之後,保護載體5與工件1一起降入槽385747.DOC -16- 200403014 ’The protective load can also be used here, and I am 5 and the opening 6 is adjusted accordingly. Through the openings 6 and 6 in the side wall of the protective carrier 5, the processing fluid circulates to the protective carrier 5 at a controlled speed. The name is τ i. In the processing state, the grooves 3 and 3 'are filled with the processing fluid to the tank level 21 at the highest. Slot 3 "is loaded with the worker w during processing. When King King fluid is first contained in τ 7 for loading, the workpiece 1 is transferred to the processing tank 3 by a transport carriage, and the lowering is protected by emptying The carrier 5 neutralizes the groove. However, "moxibustion, pump 8 is used to pump the processing fluid from the reservoir 7 through the conduit 9 into the tank 3 ,. Tank 3 is filled with processing mud. At the same time, one of the internal and external fluids of the protective carrier 5 differs from each other to form a processed mud through the openings (5 into the protective carrier 5's heart. The speed of the fluid flowing into the protective carrier 5 is the output energy of the pump § It is a function and is determined by the size of the opening 6. In fact, it has a maximum value of (^ ⑹ to} meters / second. During the processing, the protection carrier 5 must also perform a strong current to keep away from the workpiece 1 Functional and strong currents are, for example, generated by filtering lines or stirring devices for uniformly distributing the temperature or for replenishing the solution. After processing, 'a spreader (not shown) will be used to hold the ladder plate holding the workpiece 1 firmly. 2 Lift out of the processing fluid, and the spreader is installed on the transport carriage and brought into a washing station, for example for subsequent processing. At the same time, the valve (not shown) is switched by the pump 8 or the tank 3 is used The height difference from the receptacle 7 causes the processing solution to be recirculated to the receptacle 7. In order to process the workpiece 1 in the tank 3, it is necessary to use a protective carrier hanger that is not shown and is static or mounted to a transport carriage First lift the protective carrier 5 out of the slot 3 and add After the fluid remaining in the tank 3. Increased protection and generally empty workpiece carrier 5 Shu has been received, the protection of the workpiece carrier 5 is lowered into a tank 3 with
85747.DOC -17- 200403014 中。依據S護載體5的降低速度而定,加工流體係藉由保護 載體5内部及外部產生之流體位準的差距以較高的降低速 度在降低程序期間受控制地流通至保護載體5中。 圖2以類似圖丨(槽3,)的方式顯示一具有—包含—靜賤保 護載體5的槽之加工站1〇,加工站1〇具有—直接地安裝至槽 <貯器25。因為槽的整體内容物未必以泵送方式傳送,貯 器25容納的最小流體量係可小於實際容納量。根據=發明丁 為了將工件1降入槽中,只使加工流體泵送離開直心^ 殘留的池位準為止,且該位準恰抵達進人保護載體5二工件 1的下緣底下。 、圖3顯示一空槽24及一包含一槽3之加工站^,其中槽3 无填有加工流體且分派有一保護載體5。加工站⑺係配備有 —保護載體吊具(未圖示),此保護載體吊具係分派給槽3且 能夠使保護載體5以箭頭26方向上下地垂直移動。上下詩 係近似對應於固持有工件i之梯板2的上下運動。梯板2在該 處以其較高位置由運送滑架加以接取。然後,保護載體5 在較高位置升高藉此接收其内部之工件i。在此時,保護載 月豆5中幾乎無任何加工流體。然後,保護載體$及工件1緩慢 且幾乎同步地降人槽3中直到抵達—預定位置為止。為了在 處理 < 後移除工件1,保護載體5留在較低位置互只有固持 住工件1的梯板2藉由運送滑架的吊具離開此站。 似圖4的加工站在圖中相較於前圖水平旋轉⑼度,所以可 從電鍵廒的裝載侧看見加工站。保護裁體吊具係與一以片 段顯示的運送滑架相聯。此實施例中,保護載體5在兩側配85747.DOC -17- 200403014. Depending on the lowering speed of the S protection carrier 5, the processing flow system circulates to the protection carrier 5 in a controlled manner during the lowering process at a higher reduction speed by protecting the difference in fluid levels generated inside and outside the carrier 5. Fig. 2 shows a processing station 10 having a slot including-a static protection carrier 5 in a manner similar to Figure 1 (slot 3,), and the processing station 10 has-directly mounted to the slot < reservoir 25. Because the entire contents of the tank may not necessarily be pumped, the minimum amount of fluid contained in the reservoir 25 may be less than the actual capacity. According to the invention, in order to lower the workpiece 1 into the groove, only the processing fluid is pumped away from the center level of the remaining pool, and the level just reaches the lower edge of the workpiece 1 in the protection carrier 5. 3 shows an empty tank 24 and a processing station including a tank 3, wherein the tank 3 is not filled with processing fluid and is assigned a protective carrier 5. The processing station ⑺ is equipped with a protective carrier spreader (not shown), which is assigned to the slot 3 and can move the protective carrier 5 vertically up and down in the direction of arrow 26. The up and down poetry system approximately corresponds to the up and down movement of the ladder plate 2 holding the workpiece i. At this point, the ladder plate 2 is picked up by the transport carriage at its higher position. Then, the protective carrier 5 is raised at a higher position to receive the workpiece i inside it. At this time, there was almost no processing fluid in Protected Moon Bean 5. Then, the protective carrier $ and the workpiece 1 are lowered into the trough 3 slowly and almost simultaneously until they reach the predetermined position. In order to remove the work piece 1 after processing <, the protective carrier 5 is left in a lower position, and only the pallets 2 holding the work piece 1 leave the station by a spreader that transports the carriage. The processing station shown in Fig. 4 is rotated horizontally by ⑼ degrees compared to the previous figure, so the processing station can be seen from the loading side of the key 廒. The protective sling spreader is linked to a transport carriage shown in sections. In this embodiment, the protection carrier 5 is provided on both sides.
85747.DOC -18· 200403014 備有引導支撐件11’且引導支撐件u係在槽3外緣上於降低 位置中倚靠在支承表面12上,藉以承載保護載體5。承載臂 17進一步安裝至保護載體5,因此使得只顯示片段的運送= 架藉由接收臂18及牽引系統2()來垂直地升高保護載體5 = 此實施例中,運送滑架具有兩個吊具、一工件吊具及一保 護載體吊具。本文並未示範說明在本發明的運作中未詳細 描述之吊具的-般元件,諸如—捲繞心軸、—揚升齒輪馬田 達、用於保護載體的導件等等。工们藉由固持裝置4緊固 至梯板2。梯板2具有承載臂23,因此使得工件吊且或梯板 吊具藉由接收臂22來掌握住梯板2且予以升高或降低。將其 放置在位於梯板上之料支撐件13上及位於—用於保護載 體的承載裝置上之支承表面14上。運送滑架在升高位置中 將工件1傳送到包含槽3之加工站。然後,保護載體吊具藉 由一牽引系統20升高保護載體5直到工件丨完全地位於其中 為止,且已經將保護載體吊具的接收臂18放在承載臂丨了下 万。工件吊具具有揚升梁15,且保護載體吊具設有一揚升 梁16。箭頭26代表對於工件的拉動方向。 當保護載體5升高時,其中包含的加工流體係經由開孔6 離開保護載體5且流回到槽3中。為了從保護載體5快速地排 空流體’排放阻板27係設置於保護載體的底部且在升高程 序期間譬如藉由槓桿(未圖示)經由升高動作或藉由浮體自 動地開啟並藉由降低動作再度自動地關閉。圖中未顯示排 放阻板的移動方式。 、 在保護載體5已經清空及抵達較高位置之後,運送滑架85747.DOC -18 · 200403014 A guide support 11 'is provided and the guide support u is leaned on the support surface 12 in a lowered position on the outer edge of the groove 3, thereby carrying the protective carrier 5. The carrying arm 17 is further mounted to the protective carrier 5 so that only the transport of the segments is shown = the protective carrier 5 is raised vertically by the receiving arm 18 and the traction system 2 (). In this embodiment, the carrying carriage has two A spreader, a workpiece spreader and a protective carrier spreader. This document does not exemplify general components of the spreader that are not described in detail in the operation of the present invention, such as a winding mandrel, a lifting gear Matanda, a guide for protecting the carrier, and the like. The workers are fastened to the ladder plate 2 by the holding device 4. The ladder board 2 has a load arm 23, so that the work piece and / or the ladder hanger can hold the ladder board 2 by the receiving arm 22 and raise or lower it. It is placed on the material support 13 on the ladder board and on the support surface 14 on the load-bearing device for protecting the carrier. The transport carriage is in a raised position to transport the workpiece 1 to a processing station containing a tank 3. Then, the protective carrier spreader raises the protective carrier 5 by a traction system 20 until the work piece is completely positioned therein, and the receiving arm 18 of the protective carrier spreader has been placed on the load bearing arm 10,000. The workpiece spreader has a lifting beam 15, and the protection carrier spreader is provided with a lifting beam 16. Arrow 26 represents the direction of pulling on the workpiece. When the protective carrier 5 is raised, the process flow system contained therein leaves the protective carrier 5 via the opening 6 and flows back into the tank 3. In order to quickly drain the fluid from the protective carrier 5, a 'discharge stopper plate 27 is provided at the bottom of the protective carrier and is automatically opened and raised during the lifting procedure, for example, by a lever (not shown) through a lifting action or by a floating body and Automatically closed again by lowering. The figure does not show how the discharge barrier is moved. After the protective carrier 5 has been emptied and reached a higher position, the carriage is transported
85747.DOC -19- 200403014 利用工件吊具及保護載體吊具緩慢地且同步地(亦即幾乎 以相同速度)將保護載體及梯板同時降低至槽3中。當容納 在槽3中的加工流體產生位移時,池位準21在保護載體$外 升向且流體依據開孔6組悲以受控制的速度流入保護載體5。 圖式簡單說明 參照圖式進一步描述根據本發明之裝置及方法,圖中以 切開的側視圖顯示分離的加工站(槽),圖中: 圖1為一電鍍廠中包含及不含保護載體且包含一貯器之 一列的槽之側視圖; 圖2為-包含一靜態保護載體且其上直接安裝一貯器之一 槽的放大側視圖; 一電鍍廠中的—槽睁 圖3為包含一靜態保護載體吊具之 列之示意圖;85747.DOC -19- 200403014 Use the workpiece spreader and the protective carrier spreader to slowly and simultaneously (that is, at almost the same speed) lower the protection carrier and the ladder plate into the groove 3 at the same time. When the processing fluid contained in the groove 3 is displaced, the pool level 21 rises out of the protection carrier $ and the fluid flows into the protection carrier 5 at a controlled speed according to the 6 groups of openings. Brief Description of the Drawings The device and method according to the present invention will be further described with reference to the drawings. The figure shows a separated processing station (slot) in a cut side view. In the figure: Figure 1 is a plating plant with and without a protective carrier and Side view of a slot containing a row of receptacles; Figure 2 is an enlarged side view of a slot containing a static protective carrier and a receptacle is directly mounted thereon; in a plating plant-slot opening Figure 3 contains a Schematic diagram of the static protection carrier spreader;
保護載體吊 八足一電鍍廠中的一加工站之示意圖。 圖式代表符號說明 1 工件 2 梯板 3 用於在一流體中處理之槽(加工槽) 4 用於將工件固持在梯板上之固持装置 工槽) 保護載體 供加工流體進出之開孔 7 貯器Protective carrier crane Schematic of a processing station in an eight-foot-one electroplating plant. Description of the representative symbols of the drawings 1 Work piece 2 Ladder plate 3 Slot for processing in a fluid (processing slot) 4 Slot for holding device for holding the workpiece on the step plate Receptacle
85747.DOC -20· 200403014 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 導管 加工站 保護載體上的引導支撐件 加工站上的支承表面 梯板上的引導支撐件 保護載體的承載裝置上之支承表面 運送滑架的工件吊具上之揚升梁 運送滑架的保護載體吊具上之揚升梁 保護載體的承載裝置上之承載臂 -保護載體的揚升梁之接收臂 工件吊具的牽引系統 保護載體吊具的牽引系統 池位準 工件揚升梁的接收臂 梯板上的承載臂 用於乾處理的槽 貯器 保護載體及梯板的移動方向 排放阻板85747.DOC -20 · 200403014 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Guide support on the carrier processing station support on the support surface on the processing station Guide support protection on the step board Lifting beam on the work surface of the carrier on the supporting device of the carrier. The lifting beam on the carrier of the carrier is protected by the lifting beam on the carrier. Protecting the load arm on the supporting device of the carrier-protecting the lifting beam of the carrier. Traction system for receiving the work piece spreader of the protection arm Traction system of the carrier spreader Pond position of the receiving arm of the lifting beam of the workpiece lifting beam The load bearing arm on the ladder plate for dry processing Slot container protection carrier and the movement direction of the ladder plate Emission blocking plate
85747.DOC -21 -85747.DOC -21-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10224817A DE10224817B4 (en) | 2002-06-05 | 2002-06-05 | Method and device for vertical dipping of film-like material to be treated in baths of electroplating and etching plants |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200403014A true TW200403014A (en) | 2004-02-16 |
Family
ID=29594258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092115247A TW200403014A (en) | 2002-06-05 | 2003-06-05 | Method and device for treating flat and flexible work pieces |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20050224357A1 (en) |
| EP (1) | EP1510111A1 (en) |
| JP (1) | JP2005529243A (en) |
| KR (1) | KR20050008772A (en) |
| CN (1) | CN1650679A (en) |
| AU (1) | AU2003240725A1 (en) |
| BR (1) | BR0308809A (en) |
| DE (1) | DE10224817B4 (en) |
| TW (1) | TW200403014A (en) |
| WO (1) | WO2003105546A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004039632A1 (en) * | 2004-08-11 | 2006-02-23 | Atotech Deutschland Gmbh | Container for a galvanic vertical treatment plant and its manufacturing process |
| KR100728889B1 (en) * | 2006-06-07 | 2007-06-20 | (주)에스엠씨 | Flexible film etching equipment |
| KR100728890B1 (en) * | 2006-06-07 | 2007-06-20 | (주)에스엠씨 | Flexible film etching equipment |
| JP5481785B2 (en) * | 2007-12-19 | 2014-04-23 | 日立化成株式会社 | Etching method |
| CN103374744A (en) * | 2013-07-11 | 2013-10-30 | 皆利士多层线路版(中山)有限公司 | PCB electroplating copper with groove |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1374370A (en) * | 1918-11-07 | 1921-04-12 | Herbert P Ewell | Electrochemical gold-separator |
| US1792998A (en) * | 1928-07-05 | 1931-02-17 | Thomas G Melish | Anode container |
| US2365202A (en) * | 1941-06-14 | 1944-12-19 | Connelly Iron Sponge & Governo | Process of making ferric hydrate |
| US2431949A (en) * | 1943-11-24 | 1947-12-02 | Gen Motors Corp | Apparatus for electroplating the inside of bearing shells and the like |
| US2461113A (en) * | 1946-10-14 | 1949-02-08 | Hanson Van Winkle Munning Co | Fluid treatment equipment |
| US3607712A (en) * | 1969-01-21 | 1971-09-21 | Ionic International Inc | Barrel-type processing apparatus |
| US3663406A (en) * | 1971-03-11 | 1972-05-16 | Ppg Industries Inc | Combined electrodialysis and ultrafiltration of an electrodeposition bath |
| US4059493A (en) * | 1976-04-29 | 1977-11-22 | Cities Service Company | Anode, anode basket and method of packaging anodes |
| US4680100A (en) * | 1982-03-16 | 1987-07-14 | American Cyanamid Company | Electrochemical cells and electrodes therefor |
| JPS62222081A (en) * | 1986-03-25 | 1987-09-30 | Toyo Giken Kogyo Kk | Jig for thin sheet |
| DE3612220A1 (en) * | 1986-04-11 | 1987-10-15 | Schering Ag | HOLDING PLIERS |
| JPH0657879B2 (en) * | 1987-10-31 | 1994-08-03 | 日大工業株式会社 | Basket type electrodeposition coating equipment |
| US4817650A (en) * | 1988-01-04 | 1989-04-04 | Herbert Tilton | Self-contained tiltable basket for plating, washing or otherwise treating hollow articles |
| JPH01194497A (en) * | 1988-01-29 | 1989-08-04 | Tanaka Kikinzoku Kogyo Kk | Jig for plating printed wiring board |
| US4966672A (en) * | 1988-08-26 | 1990-10-30 | National Semiconductor Corporation | Electrolytic apparatus with unequal legged basket-carrier |
| JPH06216496A (en) * | 1993-01-13 | 1994-08-05 | Hitachi Ltd | Jig for thin plate |
| US5472503A (en) * | 1993-06-25 | 1995-12-05 | Lico, Inc. | Vertical load transferring apparatus |
| DE4323698C2 (en) | 1993-07-15 | 1995-06-14 | Atotech Deutschland Gmbh | Device for stabilizing printed circuit boards |
| FR2715146B1 (en) * | 1994-01-19 | 1996-02-16 | Tech Surfaces Sa | Device for processing specially shaped parts. |
| DK0792391T3 (en) * | 1994-11-15 | 1999-04-12 | Siemens Sa | Apparatus for the electrolytic treatment of plate-shaped materials, especially printed circuit boards |
| US5938899A (en) * | 1997-10-28 | 1999-08-17 | Forand; James L. | Anode basket for continuous electroplating |
| IT1296811B1 (en) * | 1997-11-28 | 1999-08-02 | Resco Srl | PROCESS AND MACHINES FOR THE PRODUCTION OF FLEXIBLE AND SEMI-RIGID PRINTED CIRCUITS |
| DE19813528A1 (en) * | 1998-03-26 | 1999-10-07 | Siemens Sa | Device for treating plate-shaped workpieces, in particular printed circuit boards |
| US6261426B1 (en) * | 1999-01-22 | 2001-07-17 | International Business Machines Corporation | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching |
| US6190530B1 (en) * | 1999-04-12 | 2001-02-20 | International Business Machines Corporation | Anode container, electroplating system, method and plated object |
-
2002
- 2002-06-05 DE DE10224817A patent/DE10224817B4/en not_active Expired - Fee Related
-
2003
- 2003-05-27 AU AU2003240725A patent/AU2003240725A1/en not_active Abandoned
- 2003-05-27 EP EP03730130A patent/EP1510111A1/en not_active Withdrawn
- 2003-05-27 US US10/507,137 patent/US20050224357A1/en not_active Abandoned
- 2003-05-27 CN CNA038100436A patent/CN1650679A/en active Pending
- 2003-05-27 KR KR10-2004-7019628A patent/KR20050008772A/en not_active Withdrawn
- 2003-05-27 BR BR0308809-0A patent/BR0308809A/en not_active IP Right Cessation
- 2003-05-27 JP JP2004512469A patent/JP2005529243A/en not_active Withdrawn
- 2003-05-27 WO PCT/EP2003/005587 patent/WO2003105546A1/en not_active Ceased
- 2003-06-05 TW TW092115247A patent/TW200403014A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE10224817A1 (en) | 2003-12-24 |
| JP2005529243A (en) | 2005-09-29 |
| US20050224357A1 (en) | 2005-10-13 |
| DE10224817B4 (en) | 2005-04-14 |
| CN1650679A (en) | 2005-08-03 |
| WO2003105546A1 (en) | 2003-12-18 |
| EP1510111A1 (en) | 2005-03-02 |
| BR0308809A (en) | 2005-01-04 |
| KR20050008772A (en) | 2005-01-21 |
| AU2003240725A1 (en) | 2003-12-22 |
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