TR200002520T2 - Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler. - Google Patents
Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler.Info
- Publication number
- TR200002520T2 TR200002520T2 TR2000/02520T TR200002520T TR200002520T2 TR 200002520 T2 TR200002520 T2 TR 200002520T2 TR 2000/02520 T TR2000/02520 T TR 2000/02520T TR 200002520 T TR200002520 T TR 200002520T TR 200002520 T2 TR200002520 T2 TR 200002520T2
- Authority
- TR
- Turkey
- Prior art keywords
- fabric
- electronic circuit
- circuit boards
- inch2
- approx
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/24—Coatings containing organic materials
- C03C25/26—Macromolecular compounds or prepolymers
- C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/24—Coatings containing organic materials
- C03C25/26—Macromolecular compounds or prepolymers
- C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/42—Coatings containing inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Woven Fabrics (AREA)
- Reinforced Plastic Materials (AREA)
- Laser Surgery Devices (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3452598A | 1998-03-03 | 1998-03-03 | |
| US13027098A | 1998-08-06 | 1998-08-06 | |
| US17057898A | 1998-10-13 | 1998-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TR200002520T2 true TR200002520T2 (tr) | 2001-01-22 |
Family
ID=27364684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TR2000/02520T TR200002520T2 (tr) | 1998-03-03 | 1999-02-25 | Cam elyaf ile güçlendirilmiş laminatlar, elektronik devre kartları ve bir kumaşı dokumak için yöntemler. |
Country Status (16)
| Country | Link |
|---|---|
| EP (1) | EP1060144A1 (xx) |
| JP (1) | JP2002505216A (xx) |
| KR (1) | KR20010041518A (xx) |
| CN (1) | CN1291963A (xx) |
| AU (1) | AU2788999A (xx) |
| BR (1) | BR9908520A (xx) |
| CA (1) | CA2320746A1 (xx) |
| HU (1) | HUP0101382A3 (xx) |
| ID (1) | ID26528A (xx) |
| IL (1) | IL137977A0 (xx) |
| MX (2) | MXPA00008517A (xx) |
| NO (1) | NO20004272L (xx) |
| PL (1) | PL342654A1 (xx) |
| TR (1) | TR200002520T2 (xx) |
| TW (1) | TW436422B (xx) |
| WO (1) | WO1999044959A1 (xx) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593255B1 (en) * | 1998-03-03 | 2003-07-15 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| MXPA02001090A (es) * | 1999-07-30 | 2003-07-21 | Ppg Ind Ohio Inc | Hebras de fbira de vidrio impregnadas y productos que las incluyen. |
| CA2380975A1 (en) * | 1999-07-30 | 2001-02-08 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| MXPA01003660A (es) * | 1999-07-30 | 2001-07-01 | Torones de fibra de vidrio impregnados y productos que los inclu | |
| US20020051882A1 (en) * | 2000-02-18 | 2002-05-02 | Lawton Ernest L. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
| AU2001252916A1 (en) * | 2000-03-16 | 2001-09-24 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| AU2001252911A1 (en) * | 2000-03-16 | 2001-09-24 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| AU2001252915A1 (en) * | 2000-03-16 | 2001-09-24 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| AU2001247564A1 (en) * | 2000-03-16 | 2001-09-24 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| WO2001068749A1 (en) * | 2000-03-16 | 2001-09-20 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| WO2001068753A1 (en) * | 2000-03-16 | 2001-09-20 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US20030150641A1 (en) * | 2002-02-14 | 2003-08-14 | Noyan Kinayman | Multilayer package for a semiconductor device |
| US20050277721A1 (en) | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials aligned within resins |
| US7553781B2 (en) * | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Fabrics with high thermal conductivity coatings |
| JP5048307B2 (ja) | 2006-11-13 | 2012-10-17 | 信越石英株式会社 | 複合織物及びプリント配線基板 |
| DE102009045892A1 (de) * | 2009-10-21 | 2011-04-28 | Evonik Degussa Gmbh | Folie aus Polyarylenetherketon |
| KR101890915B1 (ko) * | 2012-07-04 | 2018-09-28 | 에스케이케미칼 주식회사 | 폴리아릴렌 설파이드계 수지 조성물 및 성형품 |
| CN103788583B (zh) * | 2014-01-13 | 2016-04-06 | 安徽省瑞发复合材料制造有限公司 | 一种耐高温抗静电人造合成石及其制造工艺 |
| FR3020361B1 (fr) * | 2014-04-28 | 2016-05-06 | Saint Gobain | Procede de fabrication de verre mince |
| CN108349796A (zh) * | 2015-11-02 | 2018-07-31 | 中央硝子株式会社 | 电磁屏蔽性金属被覆玻璃纤维填料、电磁屏蔽性金属被覆玻璃纤维填料的制造方法、以及电磁屏蔽性树脂物品 |
| CN105517325B (zh) * | 2015-11-30 | 2018-07-24 | 卢美珍 | 印刷电路板的覆金属层叠板结构 |
| CN105517324B (zh) * | 2015-11-30 | 2018-07-24 | 卢美珍 | 印刷电路板的覆金属层基板结构 |
| CN105517322B (zh) * | 2015-11-30 | 2018-08-14 | 卢美珍 | 印刷电路板的织物基层覆金属的叠板结构 |
| CN105517321B (zh) * | 2015-11-30 | 2018-06-19 | 燕山大学里仁学院 | 电子元件封装体的覆金属层基板结构 |
| CN105517323B (zh) * | 2015-11-30 | 2018-09-18 | 赣州市金顺科技有限公司 | 印刷电路板的负载导体图案的叠层板 |
| CN105517332B (zh) * | 2015-12-21 | 2019-02-19 | 广东生益科技股份有限公司 | 一种用于多层压合的粘结片及其制备方法 |
| WO2018176067A2 (en) * | 2017-08-07 | 2018-09-27 | Zoltek Corporation | Polyvinyl alcohol-sized fillers for reinforcing plastics |
| CN110981223B (zh) * | 2019-12-18 | 2022-05-03 | 安徽省宁国昊成高温材料有限公司 | 一种耐高温玻璃纤维及其制备方法 |
| EP4067410A1 (de) * | 2021-03-29 | 2022-10-05 | Evonik Operations GmbH | Verwendung von polyamin- und/oder polyalkanolamin-basierten carbonsäurederivaten in wässrigen polyurethandispersionen |
| CN119246404B (zh) * | 2024-08-27 | 2025-08-26 | 中国海洋大学 | 超高频高速pcb用低介电玻璃纤维脱粉性能测试装置及测试方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3312569A (en) * | 1965-05-07 | 1967-04-04 | Owens Corning Fiberglass Corp | Compatible fibrous glass reinforcements of superior bonding and wetting characteristics |
| US5217778A (en) * | 1982-10-21 | 1993-06-08 | Raymark Industries, Inc. | Composite fiber friction facing |
| DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
| JPH0818853B2 (ja) * | 1989-11-15 | 1996-02-28 | 日東紡績株式会社 | ガラスクロスの製造方法 |
| JP3520604B2 (ja) * | 1995-05-23 | 2004-04-19 | 日立化成工業株式会社 | コンポジット積層板 |
| US5773146A (en) * | 1995-06-05 | 1998-06-30 | Ppg Industries, Inc. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
-
1999
- 1999-02-25 CN CN99803572A patent/CN1291963A/zh active Pending
- 1999-02-25 TR TR2000/02520T patent/TR200002520T2/xx unknown
- 1999-02-25 BR BR9908520-8A patent/BR9908520A/pt not_active IP Right Cessation
- 1999-02-25 HU HU0101382A patent/HUP0101382A3/hu unknown
- 1999-02-25 KR KR1020007009688A patent/KR20010041518A/ko not_active Abandoned
- 1999-02-25 AU AU27889/99A patent/AU2788999A/en not_active Abandoned
- 1999-02-25 WO PCT/US1999/004086 patent/WO1999044959A1/en not_active Ceased
- 1999-02-25 ID IDW20001683A patent/ID26528A/id unknown
- 1999-02-25 EP EP99908457A patent/EP1060144A1/en not_active Withdrawn
- 1999-02-25 CA CA002320746A patent/CA2320746A1/en not_active Abandoned
- 1999-02-25 PL PL99342654A patent/PL342654A1/xx unknown
- 1999-02-25 IL IL13797799A patent/IL137977A0/xx unknown
- 1999-02-25 JP JP2000534512A patent/JP2002505216A/ja active Pending
- 1999-05-27 TW TW088103238A patent/TW436422B/zh not_active IP Right Cessation
-
2000
- 2000-08-25 NO NO20004272A patent/NO20004272L/no not_active Application Discontinuation
- 2000-08-31 MX MXPA00008517 patent/MXPA00008517A/es not_active Application Discontinuation
- 2000-09-01 MX MXPA00008554 patent/MXPA00008554A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BR9908520A (pt) | 2000-10-24 |
| CA2320746A1 (en) | 1999-09-10 |
| NO20004272D0 (no) | 2000-08-25 |
| ID26528A (id) | 2001-01-11 |
| TW436422B (en) | 2001-05-28 |
| WO1999044959A1 (en) | 1999-09-10 |
| MXPA00008554A (es) | 2001-03-01 |
| MXPA00008517A (es) | 2001-03-01 |
| IL137977A0 (en) | 2001-10-31 |
| AU2788999A (en) | 1999-09-20 |
| JP2002505216A (ja) | 2002-02-19 |
| EP1060144A1 (en) | 2000-12-20 |
| NO20004272L (no) | 2000-11-01 |
| HUP0101382A3 (en) | 2002-10-28 |
| HUP0101382A2 (hu) | 2001-08-28 |
| PL342654A1 (en) | 2001-07-02 |
| KR20010041518A (ko) | 2001-05-25 |
| CN1291963A (zh) | 2001-04-18 |
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