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SG92822A1 - Crystallized epozy resins, their production method, and curable compositions comprising them - Google Patents

Crystallized epozy resins, their production method, and curable compositions comprising them

Info

Publication number
SG92822A1
SG92822A1 SG200107614A SG200107614A SG92822A1 SG 92822 A1 SG92822 A1 SG 92822A1 SG 200107614 A SG200107614 A SG 200107614A SG 200107614 A SG200107614 A SG 200107614A SG 92822 A1 SG92822 A1 SG 92822A1
Authority
SG
Singapore
Prior art keywords
epozy
crystallized
resins
production method
curable compositions
Prior art date
Application number
SG200107614A
Other languages
English (en)
Inventor
Murata Yasuyuki
Tsutsumi Masayuki
Ikebata Kiyotaka
Tanaka Ken
Original Assignee
Japan Epoxy Resins Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Epoxy Resins Co Ltd filed Critical Japan Epoxy Resins Co Ltd
Publication of SG92822A1 publication Critical patent/SG92822A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
SG200107614A 2000-12-28 2001-12-07 Crystallized epozy resins, their production method, and curable compositions comprising them SG92822A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000400013A JP3712610B2 (ja) 2000-12-28 2000-12-28 エポキシ樹脂結晶化物、硬化性組成物及び硬化物

Publications (1)

Publication Number Publication Date
SG92822A1 true SG92822A1 (en) 2002-11-19

Family

ID=18864681

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200107614A SG92822A1 (en) 2000-12-28 2001-12-07 Crystallized epozy resins, their production method, and curable compositions comprising them

Country Status (7)

Country Link
US (1) US6531549B2 (zh)
JP (1) JP3712610B2 (zh)
KR (1) KR20020055372A (zh)
CN (1) CN1239567C (zh)
MY (1) MY117631A (zh)
SG (1) SG92822A1 (zh)
TW (1) TW593403B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0122195D0 (en) * 2001-09-14 2001-10-31 Hexcel Composites Ltd Epoxy resin composition
JP5320384B2 (ja) * 2008-03-03 2013-10-23 新日鉄住金化学株式会社 変性エポキシ樹脂、エポキシ樹脂組成物及び硬化物
MY181374A (en) 2014-12-04 2020-12-21 Mitsubishi Chem Corp Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material
JP2019104906A (ja) * 2017-12-12 2019-06-27 三菱ケミカル株式会社 エポキシ樹脂組成物、硬化物及び電気・電子部品
CN111735738A (zh) * 2020-07-01 2020-10-02 道生天合材料科技(上海)股份有限公司 一种液体环氧树脂结晶倾向性的测定方法
DE102020211111A1 (de) 2020-09-03 2022-03-03 Siemens Aktiengesellschaft Pulverlack-Formulierung für ein Isolationssystem einer elektrischen Maschine, elektrische Maschine mit einem solchen Isolationssystem und Verfahren zum Herstellen eines solchen Isolationssystems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5098965A (en) * 1991-01-31 1992-03-24 Shell Oil Company Process for preparing low-chlorine epoxy resins
JPH04175331A (ja) * 1990-11-08 1992-06-23 Yuka Shell Epoxy Kk エポキシ樹脂粉体組成物
JPH07179564A (ja) * 1993-12-24 1995-07-18 Nippon Steel Chem Co Ltd 低粘度結晶性エポキシ樹脂の製造方法
JPH0873563A (ja) * 1994-09-09 1996-03-19 Nippon Steel Chem Co Ltd 結晶状エポキシ樹脂、その製造法、それを用いたエポキシ樹脂組成物および硬化物
WO1997049748A1 (fr) * 1996-06-26 1997-12-31 Nippon Steel Chemical Co., Ltd. Procede de preparation de resine epoxyde solide

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072656A (en) 1976-05-24 1978-02-07 Ici Americas Inc. Glycidyl ethers derived from 3,3',5,5'-tetraalkyl-4,4'-dihydroxybiphenyl
JPS5839677A (ja) 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JPS6067475A (ja) 1983-09-22 1985-04-17 Mitsubishi Petrochem Co Ltd ビスヒドロキシビフエニル誘導体系ジエポキシ化合物の精製法
JPS6198726A (ja) 1984-10-19 1986-05-17 Mitsubishi Petrochem Co Ltd 電子部品封止用エポキシ樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04175331A (ja) * 1990-11-08 1992-06-23 Yuka Shell Epoxy Kk エポキシ樹脂粉体組成物
US5098965A (en) * 1991-01-31 1992-03-24 Shell Oil Company Process for preparing low-chlorine epoxy resins
JPH07179564A (ja) * 1993-12-24 1995-07-18 Nippon Steel Chem Co Ltd 低粘度結晶性エポキシ樹脂の製造方法
JPH0873563A (ja) * 1994-09-09 1996-03-19 Nippon Steel Chem Co Ltd 結晶状エポキシ樹脂、その製造法、それを用いたエポキシ樹脂組成物および硬化物
WO1997049748A1 (fr) * 1996-06-26 1997-12-31 Nippon Steel Chemical Co., Ltd. Procede de preparation de resine epoxyde solide

Also Published As

Publication number Publication date
KR20020055372A (ko) 2002-07-08
JP2002201255A (ja) 2002-07-19
TW593403B (en) 2004-06-21
US20020123602A1 (en) 2002-09-05
CN1239567C (zh) 2006-02-01
MY117631A (en) 2004-07-31
US6531549B2 (en) 2003-03-11
JP3712610B2 (ja) 2005-11-02
CN1361191A (zh) 2002-07-31

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