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SG92691G - Chip-type resistor - Google Patents

Chip-type resistor

Info

Publication number
SG92691G
SG92691G SG926/91A SG92691A SG92691G SG 92691 G SG92691 G SG 92691G SG 926/91 A SG926/91 A SG 926/91A SG 92691 A SG92691 A SG 92691A SG 92691 G SG92691 G SG 92691G
Authority
SG
Singapore
Prior art keywords
chip
type resistor
resistor
type
Prior art date
Application number
SG926/91A
Other languages
English (en)
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61036627A external-priority patent/JPS62195101A/ja
Priority claimed from JP61044090A external-priority patent/JPS62202504A/ja
Priority claimed from JP62004473A external-priority patent/JPS63172401A/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of SG92691G publication Critical patent/SG92691G/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/12—Arrangements of current collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
SG926/91A 1986-02-21 1991-11-02 Chip-type resistor SG92691G (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61036627A JPS62195101A (ja) 1986-02-21 1986-02-21 チップ抵抗器の製造方法
JP61044090A JPS62202504A (ja) 1986-03-03 1986-03-03 チツプ抵抗器の製造方法
JP62004473A JPS63172401A (ja) 1987-01-12 1987-01-12 チツプ抵抗器、その集合体及びチツプ抵抗器の製造方法

Publications (1)

Publication Number Publication Date
SG92691G true SG92691G (en) 1991-12-13

Family

ID=27276296

Family Applications (1)

Application Number Title Priority Date Filing Date
SG926/91A SG92691G (en) 1986-02-21 1991-11-02 Chip-type resistor

Country Status (8)

Country Link
US (1) US4792781A (de)
KR (1) KR910000969B1 (de)
CA (1) CA1272769A (de)
DE (1) DE3705279C2 (de)
FR (1) FR2595000B1 (de)
GB (1) GB2187598B (de)
HK (1) HK106491A (de)
SG (1) SG92691G (de)

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JPH03129701A (ja) * 1989-09-19 1991-06-03 Mitsubishi Electric Corp 抵抗体装置
FR2653588B1 (fr) * 1989-10-20 1992-02-07 Electro Resistance Resistance electrique sous forme de puce a montage de surface et son procede de fabrication.
DE4143217A1 (de) * 1991-01-18 1992-07-23 Tech Wissenschaftliche Ges Thi Chipwiderstand und chip-leiterbahnbruecke in duennschichttechnik und verfahren zu deren herstellung
US5179366A (en) * 1991-06-24 1993-01-12 Motorola, Inc. End terminated high power chip resistor assembly
JPH05275162A (ja) * 1992-03-26 1993-10-22 Rohm Co Ltd ライン型加熱体
US5287083A (en) * 1992-03-30 1994-02-15 Dale Electronics, Inc. Bulk metal chip resistor
JP3294331B2 (ja) * 1992-08-28 2002-06-24 ローム株式会社 チップ抵抗器及びその製造方法
JPH0722222A (ja) * 1993-06-30 1995-01-24 Rohm Co Ltd チップ型電子部品
US5379017A (en) * 1993-10-25 1995-01-03 Rohm Co., Ltd. Square chip resistor
US5680092A (en) * 1993-11-11 1997-10-21 Matsushita Electric Industrial Co., Ltd. Chip resistor and method for producing the same
DE4339551C1 (de) * 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
GB2316541B (en) * 1994-06-09 1998-11-18 Chipscale Inc Resistor fabrication
DE19580604T1 (de) * 1994-06-09 1997-05-07 Chipscale Inc Widerstandsfabrikation
JP3082575B2 (ja) * 1994-07-05 2000-08-28 株式会社村田製作所 セラミック電子部品の製造方法
US5916395A (en) * 1994-07-05 1999-06-29 Murata Manufacturing Co., Ltd. Method for fabricating ceramic electronic parts
DE4429794C1 (de) * 1994-08-23 1996-02-29 Fraunhofer Ges Forschung Verfahren zum Herstellen von Chip-Widerständen
US5929746A (en) * 1995-10-13 1999-07-27 International Resistive Company, Inc. Surface mounted thin film voltage divider
US5649350A (en) * 1995-10-18 1997-07-22 Ericsson Inc. Method of mass producing printed circuit antennas
US5884391A (en) * 1996-01-22 1999-03-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
US6144287A (en) * 1996-06-26 2000-11-07 Rohm Co., Ltd. Chip resistor and method for manufacturing the same
TW373197B (en) * 1997-05-14 1999-11-01 Murata Manufacturing Co Electronic device having electric wires and the manufacturing method thereof
US5896081A (en) * 1997-06-10 1999-04-20 Cyntec Company Resistance temperature detector (RTD) formed with a surface-mount-device (SMD) structure
EP0923085A4 (de) * 1997-06-16 2005-12-28 Matsushita Electric Industrial Co Ltd Leiterplatte für widerstände und methode zu deren herstellung
KR100333298B1 (ko) * 1997-07-03 2002-04-25 모리시타 요이찌 저항기 및 그 제조방법
JPH11176642A (ja) * 1997-12-08 1999-07-02 Taiyo Yuden Co Ltd 電子部品とその製造方法
TW424245B (en) * 1998-01-08 2001-03-01 Matsushita Electric Industrial Co Ltd Resistor and its manufacturing method
US6171921B1 (en) * 1998-06-05 2001-01-09 Motorola, Inc. Method for forming a thick-film resistor and thick-film resistor formed thereby
JP2000164402A (ja) * 1998-11-27 2000-06-16 Rohm Co Ltd チップ抵抗器の構造
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
JP2002025802A (ja) * 2000-07-10 2002-01-25 Rohm Co Ltd チップ抵抗器
US6609292B2 (en) * 2000-08-10 2003-08-26 Rohm Co., Ltd. Method of making chip resistor
WO2002019347A1 (en) * 2000-08-30 2002-03-07 Matsushita Electric Industrial Co., Ltd. Resistor and production method therefor
JP2002260901A (ja) * 2001-03-01 2002-09-13 Matsushita Electric Ind Co Ltd 抵抗器
US7034652B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
WO2003007452A1 (en) * 2001-07-10 2003-01-23 Littelfuse, Inc. Electrostatic discharge apparatus for network devices
GB0122752D0 (en) * 2001-09-21 2001-11-14 Koninkl Philips Electronics Nv A micromechanical switch and method of manufacturing the same
JP3846312B2 (ja) 2002-01-15 2006-11-15 松下電器産業株式会社 多連チップ抵抗器の製造方法
US6878004B2 (en) * 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US7132922B2 (en) 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
WO2003088356A1 (en) 2002-04-08 2003-10-23 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US7233474B2 (en) * 2003-11-26 2007-06-19 Littelfuse, Inc. Vehicle electrical protection device and system employing same
JP4358664B2 (ja) * 2004-03-24 2009-11-04 ローム株式会社 チップ抵抗器およびその製造方法
DE202006020215U1 (de) * 2006-12-20 2008-02-21 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, insbesondere SMD-Widerstand
JP5225598B2 (ja) * 2007-03-19 2013-07-03 コーア株式会社 電子部品およびその製造法
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
JP4498433B2 (ja) * 2008-06-05 2010-07-07 北陸電気工業株式会社 チップ状電気部品及びその製造方法
TWI473121B (zh) * 2010-07-02 2015-02-11 Viking Tech Corp The method of alloy resistor
JP2013153129A (ja) 2011-09-29 2013-08-08 Rohm Co Ltd チップ抵抗器および抵抗回路網を有する電子機器
JP6227877B2 (ja) * 2013-02-26 2017-11-08 ローム株式会社 チップ抵抗器、およびチップ抵抗器の製造方法
KR20150119746A (ko) * 2014-04-16 2015-10-26 에스케이하이닉스 주식회사 반도체 장치, 레지스터 및 그 제조 방법
JP6258116B2 (ja) * 2014-04-25 2018-01-10 Koa株式会社 抵抗器の製造方法
EP3499552A1 (de) * 2017-12-14 2019-06-19 Nexperia B.V. Halbleiterbauelement und verfahren zur herstellung
TWI718971B (zh) * 2020-07-07 2021-02-11 旺詮股份有限公司 大批量產生微型電阻元件的製作方法
CN113113199B (zh) * 2021-04-14 2022-09-06 南京萨特科技发展有限公司 一种大功率合金箔电阻器及制造方法

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US3742120A (en) * 1970-10-28 1973-06-26 Us Navy Single layer self-destruct circuit produced by co-deposition of tungstic oxide and aluminum
JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
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DE2927561A1 (de) * 1979-07-07 1981-04-16 Philips Patentverwaltung Gmbh, 2000 Hamburg Passives elektrisches bauelement
DE3104419C2 (de) * 1981-02-09 1983-06-09 Draloric Electronic GmbH, 8672 Selb Verfahren zur Herstellung von Chipwiderständen
DE3148778A1 (de) * 1981-05-21 1982-12-09 Resista Fabrik elektrischer Widerstände GmbH, 8300 Landshut Bauelemente in chip-bauweise und verfahren zu dessen herstellung
DE3234895A1 (de) * 1982-09-21 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, insbesondere chip-bauelement und verfahren zur herstellung des bauelements
DE3301666A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zur herstellung einer mehrschichtigen kontaktmetallisierung
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JPS61210601A (ja) * 1985-03-14 1986-09-18 進工業株式会社 チツプ抵抗器

Also Published As

Publication number Publication date
DE3705279A1 (de) 1987-08-27
GB2187598A (en) 1987-09-09
FR2595000B1 (fr) 1992-08-14
DE3705279C2 (de) 1994-11-10
CA1272769A (en) 1990-08-14
US4792781A (en) 1988-12-20
KR870008339A (ko) 1987-09-25
GB2187598B (en) 1989-02-01
HK106491A (en) 1992-01-03
KR910000969B1 (ko) 1991-02-19
GB8704141D0 (en) 1987-04-01
FR2595000A1 (fr) 1987-08-28

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