GB2316541B - Resistor fabrication - Google Patents
Resistor fabricationInfo
- Publication number
- GB2316541B GB2316541B GB9723470A GB9723470A GB2316541B GB 2316541 B GB2316541 B GB 2316541B GB 9723470 A GB9723470 A GB 9723470A GB 9723470 A GB9723470 A GB 9723470A GB 2316541 B GB2316541 B GB 2316541B
- Authority
- GB
- United Kingdom
- Prior art keywords
- resistor fabrication
- fabrication
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
- H10D1/47—Resistors having no potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25772694A | 1994-06-09 | 1994-06-09 | |
| GB9623265A GB2302452B (en) | 1994-06-09 | 1995-06-01 | Resistor fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9723470D0 GB9723470D0 (en) | 1998-01-07 |
| GB2316541A GB2316541A (en) | 1998-02-25 |
| GB2316541B true GB2316541B (en) | 1998-11-18 |
Family
ID=26310358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9723470A Expired - Fee Related GB2316541B (en) | 1994-06-09 | 1995-06-01 | Resistor fabrication |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2316541B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4529960A (en) * | 1983-05-26 | 1985-07-16 | Alps Electric Co., Ltd. | Chip resistor |
| US4639391A (en) * | 1985-03-14 | 1987-01-27 | Cts Corporation | Thick film resistive paint and resistors made therefrom |
| GB2187598A (en) * | 1986-02-21 | 1987-09-09 | Tdk Corp | Chip resistor |
| US4760369A (en) * | 1985-08-23 | 1988-07-26 | Texas Instruments Incorporated | Thin film resistor and method |
| EP0546799A1 (en) * | 1991-12-10 | 1993-06-16 | Mitsubishi Materials Corporation | Method for producing rare earth alloy magnet powder |
| US5244536A (en) * | 1991-07-03 | 1993-09-14 | Murata Manufacturing Co., Ltd. | Method of manufacturing platinum temperature sensor |
| US5287083A (en) * | 1992-03-30 | 1994-02-15 | Dale Electronics, Inc. | Bulk metal chip resistor |
| US5294910A (en) * | 1991-07-01 | 1994-03-15 | Murata Manufacturing Co., Ltd. | Platinum temperature sensor |
| US5563572A (en) * | 1993-11-19 | 1996-10-08 | Isabellenhutte Heusler Gmbh Kg | SMD resistor |
-
1995
- 1995-06-01 GB GB9723470A patent/GB2316541B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4529960A (en) * | 1983-05-26 | 1985-07-16 | Alps Electric Co., Ltd. | Chip resistor |
| US4639391A (en) * | 1985-03-14 | 1987-01-27 | Cts Corporation | Thick film resistive paint and resistors made therefrom |
| US4760369A (en) * | 1985-08-23 | 1988-07-26 | Texas Instruments Incorporated | Thin film resistor and method |
| GB2187598A (en) * | 1986-02-21 | 1987-09-09 | Tdk Corp | Chip resistor |
| US5294910A (en) * | 1991-07-01 | 1994-03-15 | Murata Manufacturing Co., Ltd. | Platinum temperature sensor |
| US5244536A (en) * | 1991-07-03 | 1993-09-14 | Murata Manufacturing Co., Ltd. | Method of manufacturing platinum temperature sensor |
| EP0546799A1 (en) * | 1991-12-10 | 1993-06-16 | Mitsubishi Materials Corporation | Method for producing rare earth alloy magnet powder |
| US5287083A (en) * | 1992-03-30 | 1994-02-15 | Dale Electronics, Inc. | Bulk metal chip resistor |
| US5563572A (en) * | 1993-11-19 | 1996-10-08 | Isabellenhutte Heusler Gmbh Kg | SMD resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2316541A (en) | 1998-02-25 |
| GB9723470D0 (en) | 1998-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20130601 |