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RU2390391C2 - Устройство и способ очистки объектов, в частности тонких дисков - Google Patents

Устройство и способ очистки объектов, в частности тонких дисков Download PDF

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Publication number
RU2390391C2
RU2390391C2 RU2008130519/12A RU2008130519A RU2390391C2 RU 2390391 C2 RU2390391 C2 RU 2390391C2 RU 2008130519/12 A RU2008130519/12 A RU 2008130519/12A RU 2008130519 A RU2008130519 A RU 2008130519A RU 2390391 C2 RU2390391 C2 RU 2390391C2
Authority
RU
Russia
Prior art keywords
tank
flushing
plates
fluid
cleaning
Prior art date
Application number
RU2008130519/12A
Other languages
English (en)
Russian (ru)
Other versions
RU2008130519A (ru
Inventor
Норберт БЮРГЕР (DE)
Норберт Бюргер
Original Assignee
Рена Зондермашинен Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Рена Зондермашинен Гмбх filed Critical Рена Зондермашинен Гмбх
Publication of RU2008130519A publication Critical patent/RU2008130519A/ru
Application granted granted Critical
Publication of RU2390391C2 publication Critical patent/RU2390391C2/ru

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Classifications

    • H10P50/00—
    • H10P72/0414—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H10P72/0404—
    • H10P72/0416—
    • H10P72/13—
    • H10P72/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
RU2008130519/12A 2006-12-15 2007-12-10 Устройство и способ очистки объектов, в частности тонких дисков RU2390391C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006059810A DE102006059810A1 (de) 2006-12-15 2006-12-15 Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben
DE102006059810.5 2006-12-15

Publications (2)

Publication Number Publication Date
RU2008130519A RU2008130519A (ru) 2010-01-27
RU2390391C2 true RU2390391C2 (ru) 2010-05-27

Family

ID=39106175

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2008130519/12A RU2390391C2 (ru) 2006-12-15 2007-12-10 Устройство и способ очистки объектов, в частности тонких дисков

Country Status (14)

Country Link
US (1) US20080295860A1 (ja)
EP (1) EP2102896B1 (ja)
JP (1) JP4763061B2 (ja)
KR (2) KR20080089629A (ja)
CN (2) CN101361166B (ja)
AT (1) ATE519221T1 (ja)
DE (2) DE102006059810A1 (ja)
DK (1) DK2102896T3 (ja)
ES (1) ES2371117T3 (ja)
NO (1) NO20082527L (ja)
RU (1) RU2390391C2 (ja)
TW (2) TWI344868B (ja)
UA (1) UA92773C2 (ja)
WO (2) WO2008071364A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2741977C2 (ru) * 2016-04-27 2021-02-01 Эльвема Аутомотив Гмбх Способ и устройство для очистки металлических заготовок
RU221525U1 (ru) * 2023-06-14 2023-11-09 Федеральное государственное унитарное предприятие "Ростовский-на-Дону научно-исследовательский институт радиосвязи" (ФГУП "РНИИРС") Оснастка для демонтажа тонких полупроводниковых пластин от временного носителя при изготовлении монолитных интегральных схем

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EP2218004B1 (de) * 2007-12-10 2012-02-15 RENA GmbH Vorrichtung und verfahren zum reinigen von gegenständen
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DE102008053597A1 (de) 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Reinigungsvorrichtung für einen Waferblock
DE102008053596A1 (de) 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock
DE102008053598A1 (de) * 2008-10-15 2010-04-22 Gebr. Schmid Gmbh & Co. Verfahren zum Lösen von Wafern von einem Waferträger und Vorrichtung dafür
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DE102009035343A1 (de) * 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger
DE102009035341A1 (de) 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Vorrichtung zur Reinigung von Substraten an einem Träger
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WO2012053500A1 (ja) * 2010-10-19 2012-04-26 三洋電機株式会社 半導体装置の製造方法およびそれに用いられる基板カセット
DE102010052635B4 (de) * 2010-11-29 2014-01-02 Rena Gmbh Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer
DE102011018523A1 (de) * 2011-03-23 2012-09-27 Schott Solar Ag Herstellung von gesägten Wafern durch Vereinzelung mit einem kalten Fluid
DE102011110592A1 (de) 2011-08-18 2013-02-21 Rena Gmbh Verfahren zum Konditionieren von flachen Gegenständen
DE102012001721A1 (de) * 2012-01-31 2013-08-01 Rena Gmbh Spüleinrichtung zum Abspülen einer Behandlungsflüssigkeit und Verfahren dazu
CN104969338A (zh) * 2012-11-30 2015-10-07 Memc新加坡私人有限公司 晶片清洗装置和方法
CN103302071B (zh) * 2013-05-16 2015-12-23 昆山市超声仪器有限公司 超声波洗瓶机用翻转装置
JP2015028971A (ja) * 2013-07-30 2015-02-12 パナソニックＩｐマネジメント株式会社 ウエハ洗浄装置およびウエハ洗浄方法
TWM508112U (zh) * 2015-04-30 2015-09-01 中勤實業股份有限公司 用於太陽能電池之基板載具
KR101932410B1 (ko) 2015-08-18 2018-12-31 주식회사 엘지화학 일체형 세척 및 건조 장치
CN107717640A (zh) * 2016-08-10 2018-02-23 云南民族大学 一种超声波辅助研磨抛光的方法
KR101905671B1 (ko) * 2016-11-15 2018-10-10 한국에너지기술연구원 파손 방지 효과가 우수한 실리콘 웨이퍼 세척 장치 및 세척 방법
GB201819238D0 (en) 2018-11-27 2019-01-09 Rolls Royce Plc Finishing a surface of a component made by additive manufacturing
CN110369393B (zh) * 2019-08-13 2021-04-06 安徽晶天新能源科技有限责任公司 一种硅片生产用超声波清洗机
CN111604305B (zh) * 2020-05-18 2022-06-21 聊城市洛溪信息科技有限公司 一种细纺锭子清洗设备用夹持装置的无极调节方法
CN112570370B (zh) * 2020-11-24 2022-04-29 森弘鑫智能设备(苏州)有限公司 一种超声波自动清洗装置
JP7583651B2 (ja) * 2021-03-11 2024-11-14 キオクシア株式会社 基板洗浄装置および基板洗浄方法
CN113866097A (zh) * 2021-09-09 2021-12-31 中国科学院大气物理研究所 光学仪器镜面自动清洁系统及其使用方法
TWI895047B (zh) * 2024-07-18 2025-08-21 李建盛 超音波晶圓清洗裝置

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SU791431A1 (ru) * 1978-09-08 1980-12-30 Проектный Институт Научно- Производственного Объединения "Лакокраспокрытие" Агрегат дл струйной обработки изделий
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2741977C2 (ru) * 2016-04-27 2021-02-01 Эльвема Аутомотив Гмбх Способ и устройство для очистки металлических заготовок
RU221525U1 (ru) * 2023-06-14 2023-11-09 Федеральное государственное унитарное предприятие "Ростовский-на-Дону научно-исследовательский институт радиосвязи" (ФГУП "РНИИРС") Оснастка для демонтажа тонких полупроводниковых пластин от временного носителя при изготовлении монолитных интегральных схем

Also Published As

Publication number Publication date
ES2371117T3 (es) 2011-12-27
UA92773C2 (ru) 2010-12-10
TWI447832B (zh) 2014-08-01
NO20082527L (no) 2009-09-10
TWI344868B (en) 2011-07-11
WO2008071365A1 (de) 2008-06-19
RU2008130519A (ru) 2010-01-27
JP4763061B2 (ja) 2011-08-31
CN101361167A (zh) 2009-02-04
WO2008071364A1 (de) 2008-06-19
TW200941617A (en) 2009-10-01
KR20080089629A (ko) 2008-10-07
DE102006059810A1 (de) 2008-06-19
TW200848171A (en) 2008-12-16
EP2102896B1 (de) 2011-08-03
ATE519221T1 (de) 2011-08-15
DE202006020339U1 (de) 2008-04-10
DK2102896T3 (da) 2011-11-21
EP2102896A1 (de) 2009-09-23
JP2009529781A (ja) 2009-08-20
US20080295860A1 (en) 2008-12-04
CN101361166A (zh) 2009-02-04
KR20080069676A (ko) 2008-07-28
CN101361166B (zh) 2010-06-23

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