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NO20082527L - Anordning og fremgangsmate for rensing av tynne disker - Google Patents

Anordning og fremgangsmate for rensing av tynne disker

Info

Publication number
NO20082527L
NO20082527L NO20082527A NO20082527A NO20082527L NO 20082527 L NO20082527 L NO 20082527L NO 20082527 A NO20082527 A NO 20082527A NO 20082527 A NO20082527 A NO 20082527A NO 20082527 L NO20082527 L NO 20082527L
Authority
NO
Norway
Prior art keywords
carrier
shower
liquid
moved
shower device
Prior art date
Application number
NO20082527A
Other languages
English (en)
Inventor
Joachim Sturken
Norbert Buerger
Original Assignee
Rena Sondermaschinen Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen Gmbh filed Critical Rena Sondermaschinen Gmbh
Publication of NO20082527L publication Critical patent/NO20082527L/no

Links

Classifications

    • H10P50/00—
    • H10P72/0414—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H10P72/0404—
    • H10P72/0416—
    • H10P72/13—
    • H10P72/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Oppfinnelsen vedrører et apparat for rensing av tynne skiver (6), hvor skivene (6) er festet med en side til en bæreanordning (2) og hvor et mellomrom (7) er utformet mellom to tilgrensende substrater. Apparatet består i det vesentlige av en dusjanordning (15) hvormed væske innføres i de respektive mellomrom (7), og et basseng (14) som kan fylles med væske og som er dimensjonert slik at det rommer bæreanordningen (2). Ifølge oppfinnelsen kan valgfritt enten dusjanordningen (15) beveges i forhold til den ubevegelige bæreanordning (2), eller bæreanordningen (2) kan beveges i forhold til den ubevegelige dusjanordning (15), eller både bære anordningen (2) og dusjanordningen (15) kan beveges i forhold til hverandre. Fremgangsmåten skiller seg ut ved det faktum at i en foretrukket renseprosess finner det først sted en dusjing med varm væske hvorved bæreanordningen (2) beveges i bassenget, etterfulgt av en ultralydrensing i kald væske og igjen dusjing med varm væske.
NO20082527A 2006-12-15 2008-06-05 Anordning og fremgangsmate for rensing av tynne disker NO20082527L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006059810A DE102006059810A1 (de) 2006-12-15 2006-12-15 Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben
PCT/EP2007/010734 WO2008071364A1 (de) 2006-12-15 2007-12-10 Vorrichtung und verfahren zum reinigen von gegenständen, insbesondere von dünnen scheiben

Publications (1)

Publication Number Publication Date
NO20082527L true NO20082527L (no) 2009-09-10

Family

ID=39106175

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20082527A NO20082527L (no) 2006-12-15 2008-06-05 Anordning og fremgangsmate for rensing av tynne disker

Country Status (14)

Country Link
US (1) US20080295860A1 (no)
EP (1) EP2102896B1 (no)
JP (1) JP4763061B2 (no)
KR (2) KR20080089629A (no)
CN (2) CN101361166B (no)
AT (1) ATE519221T1 (no)
DE (2) DE102006059810A1 (no)
DK (1) DK2102896T3 (no)
ES (1) ES2371117T3 (no)
NO (1) NO20082527L (no)
RU (1) RU2390391C2 (no)
TW (2) TWI344868B (no)
UA (1) UA92773C2 (no)
WO (2) WO2008071364A1 (no)

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KR101932410B1 (ko) 2015-08-18 2018-12-31 주식회사 엘지화학 일체형 세척 및 건조 장치
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KR101905671B1 (ko) * 2016-11-15 2018-10-10 한국에너지기술연구원 파손 방지 효과가 우수한 실리콘 웨이퍼 세척 장치 및 세척 방법
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CN111604305B (zh) * 2020-05-18 2022-06-21 聊城市洛溪信息科技有限公司 一种细纺锭子清洗设备用夹持装置的无极调节方法
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JP7583651B2 (ja) * 2021-03-11 2024-11-14 キオクシア株式会社 基板洗浄装置および基板洗浄方法
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Also Published As

Publication number Publication date
ES2371117T3 (es) 2011-12-27
UA92773C2 (ru) 2010-12-10
TWI447832B (zh) 2014-08-01
TWI344868B (en) 2011-07-11
WO2008071365A1 (de) 2008-06-19
RU2008130519A (ru) 2010-01-27
JP4763061B2 (ja) 2011-08-31
CN101361167A (zh) 2009-02-04
WO2008071364A1 (de) 2008-06-19
TW200941617A (en) 2009-10-01
KR20080089629A (ko) 2008-10-07
DE102006059810A1 (de) 2008-06-19
TW200848171A (en) 2008-12-16
EP2102896B1 (de) 2011-08-03
ATE519221T1 (de) 2011-08-15
DE202006020339U1 (de) 2008-04-10
RU2390391C2 (ru) 2010-05-27
DK2102896T3 (da) 2011-11-21
EP2102896A1 (de) 2009-09-23
JP2009529781A (ja) 2009-08-20
US20080295860A1 (en) 2008-12-04
CN101361166A (zh) 2009-02-04
KR20080069676A (ko) 2008-07-28
CN101361166B (zh) 2010-06-23

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