JP3077119U - Heat spreader - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a heat dissipating device which is effective for significantly reducing the volume and height and applying to electronic components of different specifications. The heat dissipating device of the present invention includes several heat dissipating pieces.
A hook 13 is provided on both sides of the heat guide 11 of the heat-dissipating piece 10, and a lower edge of the hook 13 is used for fitting and connecting the hook 13 of another heat-dissipating piece 10. The heat dissipating device is provided with the insertion hole 14 and can eliminate the limitations of the altitude and specifications of the conventional heat dissipating device main body, reduce the volume altitude, and adjust the number of heat dissipating pieces according to the application.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat dissipating device.

[0002]

[Prior art]

 The heat spreader has the function of diffusing the heat source conduction generated by the electronic components, preventing the electronic components from being overheated and damaged, and extending the service life. With the advancement of science and technology, people have come to demand a variety of things that are light, thin and portable. In particular, the important point when consumers consider purchasing is that the overall volume is small and light, so the use of notebook PCs is spreading more and more every day.

[0003]

[Problems to be solved by the invention]

 However, the conventional heat spreader applied in each personal computer is an extruded aluminum body, which mainly has a structure including a main body and some heat spreaders, and some heat spreaders are used. It is stretched upward from the main body, and the main body is attached to the surface of the electronic component to absorb the heat source generated by the electronic component, and then the heat is transmitted and diffused to the heat dissipating body. Although the conventional heat dissipating device has the effect of dissipating heat from electronic components, since the heat dissipating body is connected to the main body, the required height is limited to a specific height and cannot be reduced. Since the personal computer design is also restricted, the overall thickness cannot be reduced, which is inconvenient for consumers.

[0004] Further, since the conventional heat dissipating device is an aluminum extrusion molding, its specification is fixed. Therefore, when applied to electronic components of different standards, a separate mold must be molded, which leads to a low manufacturing cost. Result.

The purpose of the present invention is to connect the adjacent heat dissipating pieces with a hook portion and a fitting hole, so that the conventional heat dissipating device main body is not provided and the volume height is greatly reduced, so that the design of the personal computer can be reduced. An object of the present invention is to propose a portable heat dissipating device that solves the problem of thickness, which is an issue.

Another object of the present invention is to connect the heat dissipating pieces to each other by fitting a hook portion and a fitting hole, so that when applied to electronic components of different manufacturers and specifications, the size of the electronic component depends on the size of the electronic component. It is an object of the present invention to propose a heat dissipating device that can be applied to electronic components of various specifications by freely increasing or decreasing the number of heat dissipating pieces.

[0007]

[Means for Solving the Problems]

 In order to solve the above problem, the heat dissipating device according to claim 1 of the present invention is constituted by several heat dissipating pieces, and side plates are bent on both sides of the heat dissipating piece heat conductor. Forming, press-forming the folded hook portion above each side plate surface, and press-molding a fitting hole 14 on the lower edge of the hook portion 13 for fitting and connecting the hook portion 13 of the heat dissipation piece 10. Features.

A heat dissipating device according to a second aspect of the present invention is the heat dissipating device according to the first aspect, wherein the hook portion is a fitting body formed by bending.

A heat dissipating device according to a third aspect of the present invention is the heat dissipating device according to the first aspect, wherein the hook portion is a flat piece including a projection.

[0010]

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the heat dissipating device of the present invention is composed of several heat dissipating pieces 10, and a side plate 12 is formed on both sides of the heat conducting piece 11 of the heat dissipating piece 10. Each side plate 12 is press-molded with a folded hook 13 above the plate surface, each hook 13 is formed by bending a fitting piece 15, and a hook 13 of another heat dissipating piece 10 is fitted to the lower edge thereof. The press-fitting holes 14 for connection are formed.

At the time of assembling, the material is put into a mold to be continuously press-molded, and the heat-dissipating piece 10 is press-molded, and at the same time, the fitting pieces 15 and the fitting holes 14 of the connected heat-dissipating pieces 10 are fitted together. . Therefore, the required number of heat dissipating pieces 10 may be connected based on the size of the applied electronic component.

When used, as shown in FIG. 3, the assembled heat dissipating piece 10 is placed sideways on the electronic component surface and fixed. At this time, the heat source generated by the electronic component is transmitted from the heat-dissipating piece 10 and the side plate 12 that is in close contact with the surface of the electronic component to the heat conductor 11 and diffused. The overall height of the heat spreader can be greatly reduced compared to the height of the main body of the conventional heat spreader.

Further, as shown in FIG. 4, the hook portion 13 of the heat dissipating piece 10 is a flat piece 16 including a projection 17, and the projection 17 and the fitting hole 14 are fitted to each other to form the heat dissipating piece 10. They can also be interconnected.

[0015]

[Effect of the invention]

 As described above, the heat dissipating device of the present invention is constituted by several heat dissipating pieces 10, and the hooks 13 are provided on both sides of the heat conductor 11 of the heat dissipating piece 10, and the hooks 13 are provided. The lower edge of 13 has a feature that an insertion hole 14 for fitting and connecting the hook portion 13 of another heat dissipating piece 10 is provided. As a result, it is effective to significantly reduce the volume height and apply it to electronic parts with different specifications.

[Brief description of the drawings]

FIG. 1 is a structural sketch of a heat dissipating piece according to the present invention.

FIG. 2 is an assembled view of the present invention.

FIG. 3 is a sketch drawing of a use state of the present invention.

FIG. 4 is a perspective view of another heat dissipating piece structure of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Heat dispersing piece 11 Heat conductor 12 Side plate 13 Hook part 14 Fitting hole 15 Fitting piece 16 Piece 17 Projection

Claims (3)

[Utility model registration claims] 1. A heat dissipating device composed of several heat dissipating pieces, a side plate is formed on both sides of the heat dissipating piece heat conductor, and a folded hook portion is pressed above each side plate surface. On the lower edge of the molding and hook 13, the hook 13
A heat dissipating device, characterized by press-molding a fitting hole 14 for fitting and connecting the two. 2. The heat dissipating device according to claim 1, wherein the hook portion is a fitting body formed by bending. 3. The heat dissipating device according to claim 1, wherein the hook portion is a flat piece including a projection.