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CN201408392Y - A CPU backplane structure - Google Patents

A CPU backplane structure Download PDF

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Publication number
CN201408392Y
CN201408392Y CN2009201314481U CN200920131448U CN201408392Y CN 201408392 Y CN201408392 Y CN 201408392Y CN 2009201314481 U CN2009201314481 U CN 2009201314481U CN 200920131448 U CN200920131448 U CN 200920131448U CN 201408392 Y CN201408392 Y CN 201408392Y
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backplane
cpu
installation
boss
concave
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李重志
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蔡添庆
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Abstract

本实用新型涉及电脑配件技术技术领域,特指一种CPU背板结构。该背板上成型有凹凸部,凹凸部的凹凸方向在背板的正反面上是对应的,于背板上还开设数个螺孔,并在螺孔的一端凸设一凸台,以适配PCB主板安装。凹凸部可增强背板的结构强度,不易变形,并可有效减小背板厚度,节约制作成本,提高背板的使用性和经济性;背板的螺孔一端凸设有凸台,以适配PCB主板安装,具有定位安装之作用,提高安装的便利性和准确性。

Figure 200920131448

The utility model relates to the technical field of computer accessories, and particularly to a CPU backplane structure. The backplane is formed with a concave-convex portion, and the concave-convex direction of the concave-convex portion is corresponding on the front and back sides of the backplane. Several screw holes are also provided on the backplane, and a boss is convexly provided at one end of the screw hole to adapt to the installation of a PCB motherboard. The concave-convex portion can enhance the structural strength of the backplane, is not easy to deform, and can effectively reduce the thickness of the backplane, save manufacturing costs, and improve the usability and economy of the backplane; a boss is convexly provided at one end of the screw hole of the backplane to adapt to the installation of the PCB motherboard, which has the function of positioning installation and improves the convenience and accuracy of installation.

Figure 200920131448

Description

一种CPU背板结构 A CPU backplane structure

技术领域: Technical field:

本实用新型涉及电脑配件技术技术领域,特指一种CPU背板。The utility model relates to the technical field of computer accessories, in particular to a CPU backboard.

背景技术: Background technique:

CPU安装在PCB主板上时,需要在PCB主板背面附加有背板,以满足CPU及其散热部件的安装要求。传统的CPU背板存在如下问题:要么体形笨重,制作成本高;要么结构强度不足,容易扭曲变形,所以实为有必要进行改进。When the CPU is installed on the PCB main board, a backplane needs to be attached to the back of the PCB main board to meet the installation requirements of the CPU and its cooling components. Traditional CPU backplanes have the following problems: either they are bulky and expensive to manufacture; or they are not strong enough in structure and easily distorted, so it is necessary to improve them.

本申请人有鉴于上述习知CPU背板结构之缺失与不便之处,秉持着研究创新、精益求精之精神,利用其专业眼光和专业知识,研究出一种应用范围广,符合产业利用价值的CPU背板。In view of the lack and inconvenience of the above-mentioned conventional CPU backplane structure, the applicant adheres to the spirit of research, innovation and excellence, and uses his professional vision and professional knowledge to develop a CPU that has a wide range of applications and meets the value of industrial utilization. backplane.

发明内容: Invention content:

本实用新型的目的在于提供一种结构强度好,体形轻小,安装方便的CPU背板结构。The purpose of the utility model is to provide a CPU backboard structure with good structural strength, light and small body shape and convenient installation.

为达到上述目的,本实用新型采用如下技术方案:In order to achieve the above object, the utility model adopts the following technical solutions:

一种CPU背板结构,该背板上成型有凹凸部,凹凸部呈筋条形式,凹凸部的凹凸方向在背板的正反面上是对应的。A CPU backplane structure, the backplane is formed with concavo-convex parts in the form of ribs, and the concavity and convexity directions of the concavo-convex parts are corresponding on the front and back surfaces of the backplane.

于背板上还开设数个螺孔,并在螺孔的一端凸设一凸台,以适配PCB主板安装,凸台为圆形,与背板一体冲压成型制作。Several screw holes are also provided on the back plate, and a boss is protruded from one end of the screw hole to adapt to the installation of the PCB main board. The boss is circular and is integrally stamped and formed with the back plate.

背板安装在PCB主板的背面,在背板和PCB主板之间嵌入有绝缘胶垫,背板上的凸台对应插入PCB主板的通孔中,且凸台上套设有环套;环套系由绝缘胶垫拉伸成型制作,套接凸台后一起对应插入PCB主板的通孔中。The backplane is installed on the back of the PCB mainboard, and an insulating rubber pad is embedded between the backplane and the PCB mainboard. The bosses on the backplane are correspondingly inserted into the through holes of the PCB mainboard, and the bosses are covered with rings; It is made by stretching and forming the insulating rubber pad, which is inserted into the through hole of the PCB main board after being socketed with the boss.

本实用新型通过在背板上成型有筋条形式的凹凸部,以此可增强背板的结构强度,不易变形,并可有效减小背板厚度,节约制作成本,提高背板的使用性和经济性。The utility model can enhance the structural strength of the backboard by forming concave-convex parts in the form of ribs on the backboard, which is not easily deformed, and can effectively reduce the thickness of the backboard, save production costs, and improve the usability and durability of the backboard. economy.

本实用新型再一优点是在背板的螺孔一端凸设有凸台,以适配PCB主板安装,具有定位安装之作用,提高安装的便利性和准确性。Another advantage of the utility model is that a boss is provided on one end of the screw hole of the back plate to adapt to the installation of the PCB main board, and has the function of positioning and installation, improving the convenience and accuracy of installation.

附图说明: Description of drawings:

附图1为本实用新型所述的背板结构示意图;Accompanying drawing 1 is the structural representation of backboard described in the utility model;

附图2为本实用新型所述的背板安装示意图;Accompanying drawing 2 is the schematic diagram of backplane installation described in the utility model;

附图3为本实用新型安装后的外形示意图;Accompanying drawing 3 is the outline schematic diagram after the utility model is installed;

附图4为本实用新型安装后的内部结构示意图。Accompanying drawing 4 is the internal structure diagram of the utility model after installation.

具体实施方式: Detailed ways:

为了使审查委员能对本实用新型之目的、特征及功能有更进一步了解,兹举较佳实施例并配合图式详细说明如下:In order to enable the review committee to have a further understanding of the purpose, features and functions of the present utility model, the preferred embodiments are hereby given in detail with the accompanying drawings as follows:

首先请参阅图1所示,系为本实用新型之较佳实施例的结构示意图,本实用新型是有关CPU背板结构,该背板10上成型有凹凸部11,凹凸部11呈筋条形式,在背板10的中部平行设计,凹凸部的凹凸方向在背板的正反面上是对应的。该凹凸部11结构可相对增加背板的结构强度,使之不易扭曲变形,提升背板的使用性,由此满足CPU及其散热部件的安装强度要求。通过设计凹凸部11,达到所需要的结构强度时,背板的厚度还可相对减小,节约材料,降低制作成本,背板的体形小巧、轻便。First please refer to Fig. 1, which is a schematic structural view of a preferred embodiment of the present invention. The present invention is related to the CPU backplane structure. The backplane 10 is formed with concave-convex parts 11, and the concave-convex parts 11 are in the form of ribs. , in the middle of the backboard 10, the design is parallel, and the concave-convex direction of the concave-convex part is corresponding on the front and back of the backplane. The structure of the concavo-convex part 11 can relatively increase the structural strength of the backplane, making it less likely to be twisted and deformed, improving the usability of the backplane, thereby meeting the installation strength requirements of the CPU and its cooling components. By designing the concavo-convex part 11, when the required structural strength is achieved, the thickness of the backboard can be relatively reduced, saving materials and reducing manufacturing costs, and the backboard is compact and light.

图1所示,在背板上还开设数个螺孔12,以配合CPU支架螺钉安装,在螺孔12的一端凸设一凸台13,以适配PCB主板20安装。凸台13为圆形,与背板一体冲压成型制作。As shown in FIG. 1 , several screw holes 12 are also provided on the back plate to cooperate with the CPU bracket screw installation, and a boss 13 is protruded from one end of the screw hole 12 to adapt to the installation of the PCB main board 20 . The boss 13 is circular and is integrally punched and formed with the back plate.

图2、3、4所示,实施时,背板10安装在PCB主板20的背面,而CPU支架50安装在PCB主板20的正面,在背板10和PCB主板20之间嵌入有绝缘胶垫30,背板10上的凸台13对应插入PCB主板20的通孔21中,且凸台13上套设有环套40,以和通孔21形成良好的定位配合。本实施例中,环套40系由绝缘胶垫30直接拉伸成型制作,有效节约成本的同时,还可优化组装结构,达到组装方便之功效。As shown in Figures 2, 3 and 4, during implementation, the backplane 10 is installed on the back of the PCB mainboard 20, and the CPU bracket 50 is installed on the front of the PCB mainboard 20, and an insulating rubber pad is embedded between the backplane 10 and the PCB mainboard 20 30 , the boss 13 on the backplane 10 is correspondingly inserted into the through hole 21 of the PCB main board 20 , and the boss 13 is covered with a collar 40 to form a good positioning fit with the through hole 21 . In this embodiment, the ring sleeve 40 is directly stretched and formed by the insulating rubber pad 30 , which not only saves cost effectively, but also optimizes the assembly structure to achieve the effect of convenient assembly.

组装后,背板10紧密贴在PCB主板20的背面,以配合CPU及其散热部件的安装,背板上的凹凸部11有力的增强背板结构强度,可承受较大的负载力,不易扭曲变形,背板体形轻小,安装相当方便,提升了背板的使用性和经济性。After assembly, the backplane 10 is closely attached to the back of the PCB main board 20 to match the installation of the CPU and its heat dissipation components. The concave and convex parts 11 on the backplane strongly enhance the structural strength of the backplane, which can withstand a large load and is not easy to twist Deformation, the backboard is light and small in size, and the installation is quite convenient, which improves the usability and economy of the backboard.

Claims (6)

1、一种CPU背板结构,其特征在于:该背板(10)上成型有凹凸部(11),凹凸部的凹凸方向在背板的正反面上是对应的。1. A CPU backplane structure, characterized in that: the backplane (10) is formed with concavo-convex parts (11), and the concavo-convex directions of the concavo-convex parts are corresponding on the front and back surfaces of the backplane. 2、根据权利要求1所述的CPU背板结构,其特征在于:于背板上还开设数个螺孔(12),并在螺孔(12)的一端凸设一凸台(13),以适配PCB主板(20)安装。2. The CPU backplane structure according to claim 1, characterized in that several screw holes (12) are provided on the backplane, and a boss (13) is protruded from one end of the screw hole (12), To adapt to the installation of the PCB main board (20). 3、根据权利要求2所述的CPU背板结构,其特征在于:凸台(13)为圆形,与背板一体冲压成型制作。3. The CPU backplane structure according to claim 2, characterized in that: the boss (13) is circular and is integrally stamped and formed with the backplane. 4、根据权利要求1所述的CPU背板结构,其特征在于:凹凸部(11)呈筋条形式。4. The CPU backplane structure according to claim 1, characterized in that the concave-convex portion (11) is in the form of ribs. 5、根据权利要求1或2所述的CPU背板结构,其特征在于:背板(10)安装在PCB主板(20)的背面,在背板(10)和PCB主板(20)之间嵌入有绝缘胶垫(30),背板(10)上的凸台(13)对应插入PCB主板(20)的通孔(21)中,且凸台(13)上套设有环套(40)。5. The CPU backplane structure according to claim 1 or 2, characterized in that: the backplane (10) is installed on the back of the PCB main board (20), embedded between the backplane (10) and the PCB main board (20) There is an insulating rubber pad (30), and the boss (13) on the back plate (10) is correspondingly inserted into the through hole (21) of the PCB main board (20), and the boss (13) is covered with a ring (40) . 6、根据权利要求5所述的CPU背板结构,其特征在于:环套(40)系由绝缘胶垫(30)拉伸成型制作。6. The CPU backplane structure according to claim 5, characterized in that the ring sleeve (40) is made by stretching the insulating rubber pad (30).
CN2009201314481U 2009-05-14 2009-05-14 A CPU backplane structure Expired - Fee Related CN201408392Y (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI551209B (en) * 2015-12-14 2016-09-21 英業達股份有限公司 Backboard structure and its motherboard assembly structure
US11621212B2 (en) 2019-12-19 2023-04-04 International Business Machines Corporation Backing plate with manufactured features on top surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI551209B (en) * 2015-12-14 2016-09-21 英業達股份有限公司 Backboard structure and its motherboard assembly structure
US11621212B2 (en) 2019-12-19 2023-04-04 International Business Machines Corporation Backing plate with manufactured features on top surface

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Granted publication date: 20100217

Termination date: 20130514