CN2488107Y

CN2488107Y - Heat sink combination device

Info

Publication number: CN2488107Y
Application number: CN 01228852
Authority: CN
Inventors: 王启仁
Original assignee: Tianmai Enterprise Co ltd
Current assignee: Tianmai Enterprise Co ltd
Priority date: 2001-07-05
Filing date: 2001-07-05
Publication date: 2002-04-24
Anticipated expiration: 2011-07-05

Abstract

A heat sink plate combining device for heat dissipation of chip in computer host is prepared as forming heat sink plate by heat conduction material, combining heat sink plate with a fixing plate, setting a chip butt-jointing seat on plate body of heat sink plate, setting multiple convex portions on plate surface of heat sink plate at equal distance, setting multiple positioning convex columns corresponding to positioning holes of fixing plate on bottom surface of plate body of heat sink plate in downward extending mode, setting length of each positioning convex column to be greater than thickness of plate of fixing plate and combining each positioning convex column with each positioning hole correspondingly. The utility model discloses can promote the equipment convenience of heating panel and fixed plate, and then promote the packaging efficiency.

Description

The heat sink coupling apparatus

(1) technical field:

The utility model is the heat sink coupling apparatus about using as chip cooling in a kind of host computer.

(2) background technology:

Process chip avoids damaging because of the high temperature that running itself is produced when operating in the computer in order to make, and adds members such as heat sink, fan usually to assist the chip quick heat radiating on chip.

The heat sink that is applied to use as chip cooling in the host computer at present designs varied too numerous to enumerate, and in numerous radiator structure designs, it is to be mounted on design on the chip in conjunction with the metal fixed head that a kind of heat sink is arranged, please cooperate and consult Fig. 4, shown in Figure 5, this heat sink (30) is the object that an aluminum alloy materials is made through facility, extending one on its plate body (31) can corresponding central processing unit or the chip carrier (32) of other chips, and most individual equidistantly being laid on the plate body (31), can be the lug boss (33) of fin shape or column, be provided with the fixed orifice (34) of most corresponding fixed head (40) pilot holes (41) again in plate body (31), when heat sink (30) and fixed head (40) winding, be to make heat sink (30) smooth on fixed head (40), providing fixed head (40) pilot hole (41) back spiral shell with most screws (42) again is located in the fixed orifice (34) of heat sink (30), make heat sink (30) and the fixed one of fixed head (40), and when heat sink (30) and fixed head (40) winding, also can be coated with solid (35) in the binding face between heat sink (30) and fixed head (40) and bind.

Above-mentionedly commonly use combining of heat sink and fixed head, need by the hand tool of hand-held screwdriver of assembler and so on most screws one by one spiral shell establish fixing, the two is integrally combined, so the operating personnel is always repeating loaded down with trivial details action when assembling, and cause the many puzzlements of assembler, and packaging efficiency can't effectively be promoted.

(3) summary of the invention:

The purpose of this utility model is to be to provide a kind of can effectively promote the heat sink coupling apparatus that combines convenience between heat sink and fixed head.

In order to achieve the above object, the utility model provides a kind of heat sink coupling apparatus, this heat sink is to be made by a Heat Conduction Material, this heat sink combines with a fixed head, this heat sink comprises a plate body, on this plate body, establish a chip butt seat, and equidistantly be evenly equipped with most lug bosses on this plate body, it is characterized in that:

This fixed head is provided with most pilot holes, and the plate body bottom surface of this heat sink is towards dividing into most to positioning convex column that should pilot hole, and the length of this positioning convex column is greater than the thickness of this fixed head, the corresponding combination of this each pilot hole of each positioning convex column and this.

Described heat sink coupling apparatus is characterized in that: this positioning convex column can form an end greater than pilot hole in conjunction with the outer end of pilot hole.

Heat sink coupling apparatus of the present utility model, it mainly is to make corresponding fixed head pilot hole place, heat sink bottom surface form most and the integrated positioning convex column of heat sink, heat sink can directly be provided in the pilot hole of fixed head by positioning convex column, cooperate compression motion again, make the projection outer end form an end greater than pilot hole, heat sink and fixed head are firm to be combined and make, through above design, can effectively promote the assembling convenience of the two, and improve packaging efficiency with this.

Via above explanation, can know and find out that advantage of the present utility model is: the utility model is by designing with the integrated positioning convex column in heat sink bottom surface, can directly combine with fixed head, exert pressure fixed slightly to the projection protuberance again, can finish combining of heat sink and fixed head easily, so can provide a kind of design that has simple and convenient assembly to assembler, and effectively promote packaging efficiency.

(4) description of drawings:

Fig. 1: be perspective exploded view of the present utility model.

Fig. 2: be the diagrammatic cross-section after the utility model combination.

Fig. 3: be the diagrammatic cross-section of setting up viscose between the utility model heat sink and fixed head.

Fig. 4: be the schematic perspective view of commonly using heat sink.

Fig. 5: be the diagrammatic cross-section of commonly using after the heat sink group is established.

(5) embodiment:

At first please cooperate consult shown in Figure 1, heat sink of the present utility model (10) is an one-body molded object of making through facility with Heat Conduction Material, it has a plate body (11), extending one on the plate body (11) can corresponding central processing unit or chip butt seat (12) and most lug boss (13) of other chips, above-mentioned lug boss (13) can be the kenel of fin shape or column, and evenly be laid on the plate body (11) with suitable spacing, plate body (11) bottom surface extends the positioning convex column (14) of most corresponding metal fixed heads (20) pilot holes (21) down again, and positioning convex column (14) length is slightly larger than fixed head (20) thickness of slab.

About assembling of the present utility model and use situation, please cooperate and consult Fig. 1, shown in Figure 2, when heat sink (10) and fixed head (20) winding, be to make heat sink (10) smooth on the plate face of fixed head (20), each positioning convex column (14) correspondence respectively provides pilot hole (21) on the fixed head (20), with facility positioning convex column (14) is protruded the part pressurization of fixed head (20) bottom surface and formed an end (141) greater than pilot hole (21) aperture again, can make heat sink (10) and the fixed one of fixed head (20), finished product after this heat sink (10) and fixed head (20) are fixed can be assembled the side of establishing the tool chip, maybe can cooperate DC fan, the high temperature that is produced when impelling the chip running is able to rapid evacuation.

Please cooperate and consult shown in Figure 3ly, when above-mentioned heat sink (10) and fixed head (20) are affixed, can be coated with solid (15), use the consolidation effect between increase heat sink (10) and fixed head (20) in the binding face between heat sink (10) and fixed head (20).

In sum, the advantage that the utility model has been taken off before really having possessed, and also possess handy, practical effect compared to commonly using structure.

Claims

1. A combination device for a heat dissipation plate, the heat dissipation plate is made of a heat conducting material, the heat dissipation plate is combined with a fixed plate, the heat dissipation plate includes a plate body, a chip abutting seat is arranged on the plate body, and There are a plurality of protrusions equidistantly distributed on the board body, which is characterized in that:

The fixing plate is provided with a plurality of positioning holes, and the bottom surface of the heat dissipation plate is downwardly provided with a plurality of positioning protrusions corresponding to the positioning holes. The length of the positioning protrusions is greater than the thickness of the fixing plate. Correspondingly combined with each positioning hole.

2. The heat dissipation plate combination device according to claim 1, wherein the positioning protrusion is combined with the outer end of the positioning hole to form an end larger than the positioning hole.