JP2026011648A - Processing device and method for processing workpiece - Google Patents

Abstract

A processing device is provided that can reduce the likelihood of a workpiece being damaged due to holding the workpiece via foreign matter adhering to the workpiece.
[Solution] The processing device comprises a holding table for holding a workpiece with one side of the workpiece exposed, a processing unit for processing one side of the workpiece held on the holding table, a support table for supporting the workpiece with one side of the workpiece processed by the processing unit exposed, a conveying unit including a holding part for holding the workpiece supported on the support table and a moving mechanism for moving the holding part holding the workpiece, and a foreign matter removal unit provided above the support table and for removing foreign matter adhering to at least one of the holding part when not holding a workpiece or the workpiece held by the holding part.
[Selected Figure] Figure 6

Description

The present invention relates to a processing device for processing one side of a workpiece that includes one side and another side located opposite the first side, and a processing method for processing the one side of the workpiece.

Chips for devices such as ICs (Integrated Circuits) are essential components in various electronic devices, including mobile phones and personal computers. These chips are manufactured by dividing a disk-shaped workpiece, such as a wafer with multiple devices formed on its surface, along the boundaries between the devices. Furthermore, the workpiece may be thinned prior to division in order to reduce the height of the resulting chips.

Thinning of the workpiece is achieved, for example, by grinding the workpiece in a grinding device (see, for example, Patent Document 1). This grinding device includes a holding table for holding the workpiece with its back surface exposed, and a grinding unit for grinding the back surface of the workpiece held on the holding table. Furthermore, the grinding unit includes a spindle, the tip of which is attached a grinding wheel having multiple grinding stones arranged discretely in an annular pattern.

When grinding a workpiece with this grinding device, the workpiece is first held on the holding table so that its back surface is exposed. Next, while both the spindle and holding table are rotated, the grinding wheel and holding table are brought closer together so that the multiple grinding stones come into contact with the back surface of the workpiece, and grinding fluid is supplied to the contact interface between the two. This results in the workpiece being ground down to make it thinner.

JP 2009-141176 A

When a workpiece is ground, grinding chips are generated. While most of this chips are washed away by the grinding fluid, some of them may scatter inside the grinding machine. Foreign matter such as grinding chips that scatter inside the grinding machine may temporarily adhere to the transport unit used to transport the workpiece, and then adhere to the workpiece when the unground workpiece is transported using this transport unit.

If a workpiece is held on the holding table via a foreign object, a strong external force may be applied locally to the workpiece, potentially causing damage to the workpiece. This type of problem does not only occur in grinding machines, but can also occur in all processing machines that process workpieces while holding them.

In light of this, an object of the present invention is to provide a processing device and a method for processing a workpiece that can reduce the likelihood of damage to the workpiece caused by holding the workpiece via foreign matter adhering to the workpiece.

One aspect of the present invention provides a processing device for processing one side of a workpiece having one side and another side opposite the one side, the processing device comprising: a holding table for holding the workpiece with the one side of the workpiece exposed; a processing unit for processing the one side of the workpiece held on the holding table; a support table for supporting the workpiece with the one side of the workpiece processed by the processing unit exposed; a transport unit including a holding part for holding the workpiece supported on the support table and a movement mechanism for moving the holding part holding the workpiece; and a foreign matter removal unit disposed above the support table for removing foreign matter adhering to at least one of the holding part when not holding the workpiece or the workpiece held by the holding part.

Preferably, the foreign matter removal unit removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holder. Also, preferably, the foreign matter removal unit removes foreign matter adhering to at least one of the support table when not supporting the workpiece or the workpiece supported on the support table.

Furthermore, the foreign matter removal unit preferably has a blower section for blowing gas diagonally downward and rearward, and a suction section provided behind the blower section for sucking the gas. Alternatively, the foreign matter removal unit preferably has a static eliminator section for blowing gas containing ions downward.

According to another aspect of the present invention, a method for processing one surface of a workpiece, the workpiece including one surface and another surface located opposite the one surface, includes a first transport step in which the workpiece stored in a cassette is held by a holding portion of a transport unit and then the holding portion is moved to transport the workpiece from the cassette; a holding step in which, after the first transport step, the workpiece is held on a holding table with the one surface exposed; a processing step in which, after the holding step, the one surface of the workpiece held on the holding table is processed; and a step in which, after the processing step, the one surface of the workpiece whose one surface has been processed is exposed. The method for processing a workpiece includes: a supporting step in which the workpiece is supported on a support table in a state where the workpiece is supported; a second transport step in which, after the supporting step, the workpiece supported on the support table is held by the holder and then the holder is moved to transport the workpiece to the cassette; and a removal step in which, before the first transport step, foreign matter adhering to the holder is removed using a foreign matter removal unit provided above the support table, and/or, during the first transport step, foreign matter adhering to the workpiece held by the holder is removed using the foreign matter removal unit.

Preferably, the removal step removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holder. Also, preferably, the method further includes a second removal step in which the foreign matter removal unit is used to remove foreign matter adhering to the support table before the supporting step, and/or the foreign matter removal unit is used to remove foreign matter adhering to the workpiece during the supporting step.

Furthermore, in the removal step, it is preferable that gas be sprayed from an upper front angle toward the holding part or the workpiece, and that the gas that collides with the holding part or the workpiece be sucked upward. Alternatively, it is preferable that in the removal step, gas containing ions be sprayed from above toward the holding part or the workpiece.

In this invention, a foreign matter removal unit provided above the support table can be used to remove foreign matter adhering to at least one of the holding section of the transport unit when not holding a workpiece or the workpiece held by the holding section. Therefore, in this invention, it is possible to reduce the likelihood of the workpiece being damaged due to being held via foreign matter adhering to the workpiece.

FIG. 1 is a perspective view schematically showing an example of a workpiece. FIG. 2 is a block diagram showing a schematic diagram of an example of a grinding apparatus for grinding a workpiece. FIG. 3 is a perspective view schematically showing a cassette table that supports a cassette containing a workpiece. FIG. 4 is a perspective view schematically showing a transport unit for transporting a workpiece. FIG. 5 is a diagram schematically illustrating the grinding unit of the grinding device. FIG. 6 is a perspective view schematically showing an inspection unit of the grinding device. FIG. 7 is a flow chart that schematically shows an example of a method for grinding a workpiece in a grinding device. FIG. 8 is a flow chart showing in schematic form the specific contents of the transport step for transporting the workpiece from the cassette to the position adjustment unit.

Embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 is a perspective view showing a schematic example of a workpiece. The workpiece 11 shown in Figure 1 includes, for example, a wafer 13 having a circular front surface 13a and a back surface 13b, and made of a semiconductor material such as silicon (Si).

A plurality of devices 15 are formed in a matrix on the surface 13a of the wafer 13. In other words, the boundaries between the devices 15 extend in a grid pattern. The workpiece 11 may also include a film-like tape that is applied to the surface 13a of the wafer 13 so as to cover the devices 15. This tape has a diameter roughly equal to the diameter of the wafer 13 and is made of, for example, resin.

This tape protects the multiple devices 15 by absorbing the impact on the front surface 13a of the wafer 13 when grinding the back surface 13b. There are no restrictions on the material, shape, structure, or size of the wafer 13. Furthermore, the workpiece 11 may include, in addition to or instead of the wafer 13 and the tape attached to its front surface 13a, a portion made of a semiconductor material other than silicon, ceramic, resin, or metal.

Figure 2 is a block diagram showing a schematic example of a grinding device for grinding workpiece 11. In Figure 2, the movement path of workpiece 11 before one surface (specifically, back surface 13b of wafer 13) is ground is indicated by a dashed arrow, and the movement path of workpiece 11 after one surface is ground is indicated by a solid arrow.

The grinding device 2 shown in Figure 2 is equipped with a cassette table 4 for supporting a cassette containing a workpiece 11. Figure 3 is a perspective view showing a schematic view of the cassette table 4 supporting the cassette containing the workpiece 11. The cassette table 4 has a rectangular upper surface 4a that is generally vertical, and a cassette 6 is placed on this upper surface 4a.

The cassette 6 has a flat top panel 6a. This top panel 6a has a rectangular shape with two adjacent corners that are chamfered, while the remaining pair of corners remain unchamfered. The upper end of a side panel (not shown) extending perpendicular to the top panel 6a (height direction) is fixed to the underside of the end (rear end) of the top panel 6a located between the two chamfered corners.

Furthermore, the upper ends of side panels 6b and 6c extending in the height direction are fixed to the underside of the two ends (left and right ends) of the tabletop 6a located between the chamfered portion and the unchamfered corner. On the other hand, there is no side panel below the end (front end) of the tabletop 6a located between the pair of unchamfered corners. In other words, the underside of the front end of the tabletop 6a is open.

Furthermore, multiple grooves 6d, each extending in the front-to-rear direction, are formed on the inner surfaces of the side plates 6b and 6c at approximately equal intervals in the height direction. Specifically, each of the multiple grooves 6d formed on the inner surface of the side plate 6b is arranged to face one of the multiple grooves 6d formed on the inner surface of the side plate 6c.

The cross-sectional shape of the grooves 6d is generally rectangular. In other words, the grooves 6d have a pair of side surfaces that are generally perpendicular to the height direction and a bottom surface that is generally parallel to the height direction. The workpieces 11 are placed in the cassette 6 by placing the outer periphery of the workpiece 11 on the side surface of each of the multiple grooves 6d that is farther from the top plate 6a. In other words, the workpieces 11 are supported on the inner surface of each pair of opposing grooves 6d that is farther from the top plate 6a.

There is no limit to the number of grooves 6d formed on the inner surface of side plate 6b and the inner surface of side plate 6c. For example, the cassette 6 may have grooves 6d formed in the number corresponding to one lot of workpieces 11 (approximately 25 pieces). The lower part of side plate 6b and the lower part of side plate 6c are connected via a long, thin, plate-shaped connecting member 6e.

The workpiece 11 stored in the cassette 6 is transported by the transport unit 8 (see Figure 2). Figure 4 is a schematic perspective view of the transport unit 8. This transport unit 8 includes a robot hand (holding unit) 10 for holding the workpiece 11, and a movement mechanism 12 for moving the robot hand 10 holding the workpiece 11.

The movement mechanism 12 has a cylindrical first drive unit 14 that extends vertically. This first drive unit 14 includes, for example, an actuator (not shown) such as an air cylinder that can raise and lower a rod that extends vertically, a rotation mechanism (not shown) such as a motor that rotates the actuator around a rotation axis that is a straight line along the rod, and a case 14a that houses the actuator and rotation mechanism.

A horizontal movement mechanism (not shown) is also connected to the case 14a. This horizontal movement mechanism includes, for example, a support plate that supports the case 14a, a ball screw for moving the support plate in the horizontal direction, and a motor for rotating the screw shaft of the ball screw. When this motor is operated, the first drive unit 14 moves in the horizontal direction together with the support plate.

An opening through which a rod passes is formed in the top plate of the case 14a. An arm 16 is connected to the upper end of the rod. Therefore, when the actuator of the first drive unit 14 is operated, the arm 16 moves (raises and lowers) in the vertical direction, and when the rotation mechanism is operated, the arm 16 rotates around a rotation axis that is a straight line along the rod.

The arm 16 has multiple joints. Specifically, the arm 16 has a plate-shaped first arm 16a that extends in a direction perpendicular to the up-down direction. The lower side of one end of the first arm 16a is connected to the upper end of a rod of an actuator included in the first drive unit 14 so as to move and rotate together with the rod. The lower side of a cylindrical first joint (not shown) is connected to the upper side of the other end of the first arm 16a.

A plate-shaped second arm 16b extending in a direction perpendicular to the vertical direction is connected to the upper side of the first joint. The lower side of one end of this second arm 16b is connected to the upper side of the other end of the first arm 16a via the first joint in a manner that allows it to rotate around a straight line along the vertical direction as its axis of rotation. Furthermore, the lower side of a cylindrical second joint 16c is connected to the upper side of the other end of the second arm 16b. The second drive unit 18 is connected to the upper side of the second joint 16c.

The second drive unit 18 has a rectangular parallelepiped case 18a extending in a direction perpendicular to the vertical direction, and a spindle 18b inserted into the case 18a through an opening formed in a side panel located at one end of the case 18a. The lower side of one end of the case 18a is connected to the upper side of the other end of the second arm 16b via the second joint 16c in a manner that allows rotation around a straight line extending in the vertical direction as a rotation axis.

The case 18a also houses a motor (not shown) connected to the base end of the spindle 18b. When this motor is operated, the spindle 18b rotates around a rotation axis that is a straight line perpendicular to the up-down direction. The U-shaped robot hand 10 is connected to the tip of the spindle 18b.

Specifically, the robot hand 10 has a base end 10a to which the tip of the spindle 18b is connected in the center, and a pair of arms 10b extending from both ends of the base end 10a so that each arm is parallel to the spindle 18b. The distance between the pair of arms 10b is smaller than the diameter of the workpiece 11. Each robot hand 10 has a generally flat front and back surface, and multiple suction holes (not shown) are formed on these surfaces.

The multiple suction holes formed on the surface of the robot hand 10 can be connected to a suction source (not shown) or a gas supply source (not shown). The suction source may include, for example, an ejector. The gas supply source may include, for example, a tank for storing gas such as air, a filter for removing foreign matter mixed in with the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

When a suction source connected to multiple suction holes formed on the surface of the robot hand 10 is operated, the pressure in the multiple suction holes becomes negative, and a suction force acts on the space near the surface of the robot hand 10. Furthermore, by applying this suction force to the workpiece 11, it is possible to hold the workpiece 11 on the surface side of the robot hand 10.

Furthermore, while the workpiece 11 is held in this manner, if the suction source is stopped and the gas supply source connected to the multiple suction holes is operated, the pressure in the multiple suction holes returns to normal pressure, and the workpiece 11 is no longer sucked toward the surface of the robot hand 10. Furthermore, since this suction force no longer acts on the workpiece 11, it becomes easier to separate the workpiece 11 from the surface of the robot hand 10.

Furthermore, when the motor connected to the base end of the spindle 18b is operated while the workpiece 11 is held on the surface side of the robot hand 10, the robot hand 10 and workpiece 11 rotate along with the spindle 18b. Therefore, by rotating the spindle 18b, for example, by 180°, it is possible to turn the workpiece 11 upside down.

The workpiece 11 is transported from the cassette 6, for example, in the following order. First, the movement mechanism 12 is operated so that one surface of the workpiece 11 (the back surface 13b of the wafer 13) stored in the cassette 6 faces closely to the surface of the robot hand 10. Next, a suction source communicating with multiple suction holes formed on the surface of the robot hand 10 is operated so that the workpiece 11 is held on the surface side of the robot hand 10.

Next, while holding the workpiece 11 on the surface side of the robot hand 10, the movement mechanism 12 is operated to transport the workpiece 11 to the desired position (e.g., the position adjustment unit 20 (see Figure 2)). Next, the operation of the suction source is stopped and the gas supply source communicating with the multiple suction holes is operated so that the workpiece 11 is separated from the surface of the robot hand 10.

The position adjustment unit 20 is provided with a disk-shaped positioning table 20a whose diameter is smaller than the workpiece 11, and a position adjustment mechanism 20b for aligning the center of the workpiece 11 placed on this positioning table 20a to a predetermined position. This position adjustment mechanism 20b is arranged around the periphery of the positioning table 20a, and includes, for example, multiple pins that are each movable radially around the positioning table 20a in a plan view.

The position adjustment unit 20 then places the workpiece 11 on the positioning table 20a so that one side of the workpiece 11 is exposed, and then moves the pins radially inward until they contact the workpiece 11. This aligns the center of the workpiece 11 to a predetermined position.

The workpiece 11, whose center is aligned to a predetermined position, is transported from the position adjustment unit 20 to the grinding unit 22 and ground. Figure 5 is a schematic diagram of the grinding unit 22. This grinding unit 22 is provided with a circular chuck table (holding table) 24 with a diameter larger than that of the workpiece 11. This chuck table 24 has a frame 26 made of ceramics or the like.

The frame 26 has a disk-shaped bottom wall 26a and a cylindrical side wall 26b extending from the outer periphery of the bottom wall 26a. That is, a recess is defined on the top surface of the frame 26 by the bottom wall 26a and the side wall 26b. A disk-shaped porous plate 28 made of porous ceramics or the like is fixed in this recess.

The diameter of the porous plate 28 is smaller than the diameter of the workpiece 11. The upper surfaces of the side walls 26b of the frame 26 and the upper surface of the porous plate 28 have a shape equivalent to the side of a cone, and function as the holding surface of the chuck table 24 when holding the workpiece 11. The bottom wall 26a also has a flow path 26c that opens at the bottom of the recess and penetrates the bottom wall 26a.

This flow path 26c is connected to a suction source 32a via valve 30a and to a gas supply source 32b via valve 30b. The suction source 32a includes, for example, an ejector. The gas supply source 32b includes, for example, a tank for storing a gas such as air, a filter for removing foreign matter mixed in with the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

Furthermore, the chuck table 24 is connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a motor and a pulley. When this rotation mechanism is operated, the chuck table 24 rotates around a rotation axis that is a straight line passing through the center of the holding surface of the chuck table 24.

The chuck table 24 is also supported by a tilt adjustment mechanism (not shown) via bearings (not shown) or the like. This tilt adjustment mechanism includes, for example, two movable shafts and one fixed shaft arranged at approximately equal angular intervals along the circumferential direction of the chuck table 24. When at least one of the two movable shafts partially raises or lowers the chuck table 24, the tilt of the rotation axis of the chuck table 24 is adjusted.

The chuck table 24 is also connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a turntable to which the chuck table 24 is connected in an area near its outer periphery, and a motor for rotating the turntable. When this rotation mechanism is operated, the chuck table 24 rotates around a rotation axis that passes through the center of the turntable and is aligned vertically.

A grinding unit (processing unit) 34 is provided above the chuck table 24. This grinding unit 34 has a spindle 36 that extends in the vertical direction. The lower end (tip) of the spindle 36 forms a disk-shaped mount 36a whose diameter is larger than the radius of the workpiece 11.

The outer periphery of the mount 36a is formed with multiple holes (not shown) that penetrate the mount 36a in its thickness direction, and a bolt (not shown) is inserted into each hole. Furthermore, a grinding wheel 38 is attached to the underside of the mount 36a using multiple bolts.

The grinding wheel 38 has an annular base 38a made of a metal material such as stainless steel or an aluminum alloy. The outer diameter of the base 38a is roughly equal to the diameter of the mount 36a, and multiple grinding stones 38b are provided on its underside in a circular, discrete pattern.

Each of the multiple grinding wheels 38b contains a bond material such as vitrified or resinoid, and abrasive grains such as diamond dispersed in the bond material. The abrasive grains are exposed on the underside of each of the multiple grinding wheels 38b, and this underside functions as a grinding surface when grinding the workpiece 11.

Furthermore, a motor (not shown) is connected to the base end (upper end) of the spindle 36. When this motor is operated, the grinding wheels 38 rotate together with the spindle 36, with a rotation axis that is a straight line along the direction in which the spindle 36 extends (here, the up-and-down direction). At this time, the grinding surfaces of each of the multiple grinding stones 38b trace a circular trajectory whose outer diameter is greater than the radius of the workpiece 11.

The spindle 36 is also connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a motor and a ball screw. When this vertical movement mechanism is operated, the spindle 36 moves in the vertical direction.

In addition, a grinding fluid supply unit (not shown) is provided near the grinding wheel 38. This grinding fluid supply unit includes, for example, a grinding fluid nozzle located inside the grinding wheel 38 in a plan view, and a grinding fluid pump connected to this grinding fluid nozzle.

Then, by operating the rotation mechanism so that the center of the holding surface of the chuck table 24 is positioned directly below the trajectory of each grinding surface of the multiple grinding wheels 38b when the spindle 36 is rotated, and then operating the grinding fluid pump, grinding fluid (e.g., water) is supplied from the grinding fluid nozzle toward the chuck table 24.

The grinding of the workpiece 11 in the grinding unit 22 is performed, for example, in the following order: First, the workpiece 11 is placed on the chuck table 24 so that one side is exposed, then the suction source 32a is activated and the valve 30a is opened.

This creates a negative pressure in the flow path 26c formed in the bottom wall 26a of the frame 26 of the chuck table 24, and a suction force acts on the workpiece 11 via the porous plate 28. As a result, the workpiece 11 is held on the chuck table 24 in a state where it elastically deforms so that it conforms to the holding surface of the chuck table 24, specifically, so that the other surface assumes a shape equivalent to the side of a cone.

Then, the rotation mechanism is operated so that the center of the holding surface of the chuck table 24 is positioned directly below the trajectory of each grinding surface of the multiple grinding wheels 38b when the spindle 36 is rotated. Next, the tilt of the chuck table 24 is adjusted so that the portion of the holding surface of the chuck table 24 that overlaps with the trajectory is roughly perpendicular to the vertical direction.

Next, both the chuck table 24 and spindle 36 are rotated, and the spindle 36 is lowered while grinding fluid is supplied from the grinding fluid nozzle toward the chuck table 24. As a result, one side of the workpiece 11 is ground by the multiple grinding wheels 38b, with grinding fluid being supplied to the contact interface (processing point) between one side of the workpiece 11 and the grinding surfaces of each of the multiple grinding wheels 38b. This grinding continues until the workpiece 11 reaches the specified thickness.

When the workpiece 11 reaches the specified thickness, the spindle 36 is raised to separate the multiple grinding wheels 38b from one side of the workpiece 11, and the rotation of both the chuck table 24 and the spindle 36 is stopped. Next, the operation of the suction source 32a is stopped and the valve 30a is closed, after which the gas supply source 32b is operated and the valve 30b is opened.

As a result, the flow path 26c formed in the bottom wall 26a of the frame 26 of the chuck table 24 returns to normal pressure, and the suction force acting on the workpiece 11 disappears. As a result, the workpiece 11 is no longer held by the chuck table 24 but simply placed there. This completes grinding one side of the workpiece 11 in the grinding section 22.

The workpiece 11, one side of which has been ground, is transported from the grinding section 22 to the cleaning section 40 for cleaning (see Figure 2). This cleaning section 40 is equipped with a spinner table 40a that can hold the workpiece 11 and rotate it circumferentially, and a cleaning unit 40b that cleans the workpiece 11 held on this spinner table 40a.

This cleaning unit 40b includes, for example, a cleaning liquid nozzle, a cleaning liquid pump connected to the cleaning liquid nozzle, and a swing mechanism that can swing the cleaning liquid nozzle between a position where it overlaps with the spinner table 40a in a plan view and a position where it does not overlap with the spinner table 40a. When the swing mechanism is operated to position the cleaning liquid nozzle at a position where it overlaps with the spinner table 40a in a plan view and then the cleaning liquid pump is operated, cleaning liquid (e.g., water) is supplied from the cleaning liquid nozzle toward the spinner table 40a.

In the cleaning section 40, for example, the workpiece 11 is held on the spinner table 40a so that one side of the workpiece 11 is exposed, and then cleaning liquid is supplied from a cleaning liquid nozzle toward the spinner table 40a while the spinner table 40a is rotated. This cleans one side of the workpiece 11.

The workpiece 11, one side of which has been cleaned, is transported by the transport unit 8 from the cleaning section 40 to the inspection section 42 where it is inspected. Specifically, it is checked whether the workpiece 11 has been ground properly (for example, whether the workpiece 11 has been damaged during grinding).

Figure 6 is a perspective view showing the inspection unit 42. This inspection unit 42 is provided with an inspection table (support table) 44 that can be pulled out from the housing of the grinding device 2. This inspection table 44 has a structure similar to that of the chuck table 24 provided in the grinding unit 22, except that its upper surface is generally flat rather than shaped to correspond to the side of a cone.

That is, the inspection table 44 has a frame 44a having a disk-shaped bottom wall and cylindrical side walls extending from the outer periphery of the bottom wall, and a porous plate 44b fixed to a recess formed on the upper surface of the frame 44a. Furthermore, a flow path is formed in the bottom wall of the frame 44a, which opens at the bottom surface of the recess and penetrates the bottom wall.

This flow path is connected to a suction source (not shown) via a valve (not shown) and to a gas supply source (not shown) via another valve (not shown). The suction source and gas supply source that can communicate with the flow path formed in the bottom wall of frame 44a have the same structure as, for example, suction source 32a and gas supply source 32b described above.

A foreign matter removal unit 46 is provided above the inspection table 44. This foreign matter removal unit 46 is used, for example, to remove foreign matter adhering to the inspection table 44 and the workpiece 11 held on the inspection table 44, as well as foreign matter adhering to the robot hand 10 and the workpiece 11 held on the surface side of the robot hand 10.

This foreign matter removal unit 46 has a cover 48 that includes a flat top plate 48a and a rectangular cylindrical side plate 48b. A through-hole that penetrates the side plate 48b in the left-right direction is formed at the front end of the side plate 48b, and a pipe nozzle (air blower) 50 is inserted into this through-hole.

This pipe nozzle 50 is connected via a hose (not shown) or the like to a gas supply source having a structure similar to the gas supply source 32b described above. The lower rear side of the pipe nozzle 50 has multiple nozzles aligned in the left-right direction, and when the gas supply source is operated, gas is sprayed diagonally downward and rearward from the multiple nozzles.

Furthermore, a suction unit 52 is provided behind the pipe nozzle 50. Specifically, a through-hole that passes through the top plate 48a in the vertical direction is formed in the central rear portion of the top plate 48a, and the suction unit 52 is provided so as to communicate with this through-hole.

This suction unit 52 has a duct hose 52a, the lower end of which is connected to the rear center of the top plate 48a, and a fan 52b, which is connected to the upper end of the duct hose 52a. When the fan 52b is operated, gas present inside and below the cover 48 is sucked upward through the duct hose 52a.

Furthermore, the foreign object removal unit 46 (specifically, the cover 48) is connected to a front-to-rear movement mechanism (not shown) and a vertical movement mechanism. Each of these movement mechanisms includes, for example, a motor and a ball screw. When the front-to-rear movement mechanism is operated, the foreign object removal unit 46 moves in the front-to-rear direction, and when the vertical movement mechanism is operated, the foreign object removal unit 46 moves in the vertical direction.

The inspection unit 42 inspects whether the workpiece 11 has been ground properly, for example, in the following order: First, the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the inspection table 44, and the forward/backward movement mechanism and/or the vertical movement mechanism is operated to bring the two closer together until the vertical distance between them is less than a predetermined distance (for example, 1 cm).

Next, the foreign matter removal unit 46 is used to remove foreign matter adhering to the inspection table 44. Specifically, while the gas supply source and fan 52b, which are connected to the pipe nozzle 50 via a hose or the like, are both operating, the forward/backward movement mechanism is operated to gradually move the foreign matter removal unit 46 forward.

As a result, gas is sprayed from an upper front diagonal position toward the area near the rear end of the upper surface (holding surface) of the inspection table 44, from the area near the front end, and the gas that hits each area is sucked upward. At this time, any foreign matter adhering to the inspection table 44 is also sucked upward along with the gas. As a result, any foreign matter adhering to the inspection table 44 is removed.

When using the foreign matter removal unit 46 to remove foreign matter adhering to the inspection table 44, a gas supply source communicating with a flow path formed in the bottom wall of the frame 44a of the inspection table 44 may be operated. In this case, foreign matter stuck in the porous plate 44b can be more easily removed.

Then, the workpiece 11 is carried onto the inspection table 44 by the transport unit 8. Specifically, first, while holding one side of the workpiece 11 on the front side of the robot hand 10, the movement mechanism 12 is operated so that the other side of the workpiece 11 comes into contact with the holding surface of the inspection table 44.

Next, the suction source is stopped and the gas supply source connected to the multiple suction holes is activated so that the workpiece 11 is separated from the surface of the robot hand 10. This completes the transfer of the workpiece 11 onto the inspection table 44.

Next, the suction source communicating with the flow path formed in the bottom wall of the frame 44a of the inspection table 44 is operated so that the workpiece 11 is held on the inspection table 44 with one side exposed.

Next, the foreign matter adhering to the workpiece 11 is removed using the foreign matter removal unit 46. Note that foreign matter adhering to the workpiece 11 is removed using the same procedure as foreign matter adhering to the inspection table 44, so a detailed explanation of this procedure will be omitted.

Next, the operator, for example, pulls out the inspection table 44 from the housing of the grinding device 2. The operator then visually inspects the workpiece 11 held on the inspection table 44 to confirm whether the workpiece 11 has been ground properly.

Once it has been confirmed that the workpiece 11 has been ground properly, the operator, for example, pushes the inspection table 44 into the inside of the housing of the grinding device 2. Then, the operation of the suction source connected to the flow path formed in the bottom wall of the frame 44a of the inspection table 44 is stopped, and the gas supply source connected to this flow path is then operated.

As a result, the flow path formed in the bottom wall of the frame 44a of the inspection table 44 returns to normal pressure, and the suction force acting on the workpiece 11 disappears. As a result, the workpiece 11 is no longer held by the inspection table 44 but simply placed there. This completes the inspection by the inspection unit 42 to determine whether the workpiece 11 has been ground properly.

Figure 7 is a flowchart showing a schematic example of a method for grinding a workpiece 11 using the grinding device 2. Below, we will omit explanations of the specific steps included in this method that overlap with those described above, and will only explain the main points of the operation of each step.

In this method, first, foreign matter adhering to the robot hand 10 is removed (removal step S1). In this removal step S1, first, the movement mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second drive unit 18) is operated so that the surface of the robot hand 10 faces upward.

Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so that the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the robot hand 10 (e.g., the tips of the pair of arms 10b of the robot hand 10) and the two are brought closer together until the vertical distance between them is less than a predetermined distance (e.g., 1 cm).

Next, while operating the gas supply source and fan 52b, which are connected to the pipe nozzle 50 via a hose or the like, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the arm 16) are operated to gradually move the robot hand 10 backward.

As a result, gas is sprayed from an upper front diagonal direction from the area near the rear end of the robot hand 10 to the area near the front end (for example, the base end 10a of the robot hand 10), and the gas that hits each area is sucked upward. At this time, any foreign matter adhering to the surface of the robot hand 10 is also sucked upward along with the gas. As a result, the foreign matter adhering to the surface of the robot hand 10 is removed.

Furthermore, in the removal step S1, foreign matter adhering to not only the front surface but also the back surface of the robot hand 10 may be removed. Note that foreign matter adhering to the back surface of the robot hand 10 is removed using the same procedure as foreign matter adhering to the front surface, so a detailed explanation of this procedure will be omitted.

After removal step S1, the workpiece 11 is transported from the cassette 6 to the position adjustment unit 20 (transport step S2). Figure 8 is a flowchart that schematically illustrates the specific details of transport step S2. In this transport step S2, first, one side of the workpiece 11 stored in the cassette 6 is held on the front side of the robot hand 10, and then the robot hand 10 is moved to transport the workpiece 11 out of the cassette 6 (transport step S21).

After the carry-out step S21, the foreign matter removal unit 46 is used to remove foreign matter adhering to the workpiece 11 held on the front side of the robot hand 10 (removal step S22). In this removal step S22, first, the movement mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second drive unit 18) is operated so that the other side of the workpiece 11 faces upward, i.e., so that the workpiece 11 is positioned above the robot hand 10.

Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so that the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the workpiece 11 and the two approach each other until the vertical distance between them is less than a predetermined distance (e.g., 1 cm).

Next, the gas supply source and fan 52b, which are connected to the pipe nozzle 50 via a hose or the like, are operated, while the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the arm 16) are operated to gradually move the workpiece 11 backward.

As a result, gas is sprayed from an upper front diagonal direction toward the area near the rear end of the other surface of the workpiece 11, in order from the area near the front end to the area near the front end, and the gas that hits each area is sucked upward. At this time, any foreign matter adhering to the other surface of the workpiece 11 is also sucked upward along with the gas. As a result, the foreign matter adhering to the other surface of the workpiece 11 is removed.

Furthermore, in the removal step S22, foreign matter adhering to one surface of the workpiece 11 (specifically, the area of one surface that does not overlap with the robot hand 10) as well as the other surface may be removed. Note that foreign matter adhering to one surface of the workpiece 11 is removed using the same procedure as foreign matter adhering to the other surface, and therefore a detailed description thereof will be omitted.

After the removal step S22, the workpiece 11 is loaded onto the positioning table 20a so that one side of the workpiece 11 is exposed (loading step S23). In this loading step S23, the movement mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second drive unit 18) is first operated so that the other side of the workpiece 11 faces downward, i.e., so that the workpiece 11 is positioned below the robot hand 10.

Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so that the top surface of the positioning table 20a comes into contact with the other surface of the workpiece 11. Next, the operation of the suction source is stopped and the gas supply source connected to the multiple suction holes is operated so that the workpiece 11 is separated from the surface of the robot hand 10. This completes the transfer step S2.

After the transport step S2, the position of the workpiece 11 is adjusted in the position adjustment unit 20 (adjustment step S3). In this adjustment step S3, for example, multiple pins arranged around the positioning table 20a are moved radially inward of the positioning table 20a in a plan view so as to come into contact with the workpiece 11.

After adjustment step S3, the workpiece 11 is held on the chuck table 24 with one surface exposed (holding step S4). In this holding step S4, the workpiece 11 is placed on the chuck table 24 so that one surface is exposed, and then the suction source 32a is operated and the valve 30a is opened.

After holding step S4, the grinding unit 34 is used to grind one surface of the workpiece 11 held on the chuck table 24 (grinding step S5). In this grinding step S5, both the chuck table 24 and the spindle 36 are rotated, and grinding fluid is supplied from the grinding fluid nozzle toward the chuck table 24. The spindle 36 is lowered with multiple grinding wheels 38b in contact with one surface of the workpiece 11.

After grinding step S5, one side of the workpiece 11 is cleaned in the cleaning section 40 (cleaning step S6). In this cleaning step S6, for example, the workpiece 11 is held on the spinner table 40a so that one side is exposed, and then cleaning liquid is supplied from a cleaning liquid nozzle toward the spinner table 40a while the spinner table 40a is rotated.

After cleaning step S6, the workpiece 11 is held on the inspection table 44 with one surface exposed (holding step S7). In this holding step S7, the workpiece 11 is placed on the inspection table 44 so that one surface is exposed, and then a suction source communicating with a flow path formed in the bottom wall of the frame 44a of the inspection table 44 is activated.

After holding step S7, it is inspected whether grinding of the workpiece 11 was performed normally (inspection step S8). In this inspection step S8, for example, the operator pulls out the inspection table 44 from the housing of the grinding device 2 and then visually inspects the workpiece 11 held on the inspection table 44.

After inspection step S8, the workpiece 11 is transported from the inspection unit 42 to the cassette 6 (transport step S9). In this transport step S9, one side of the workpiece 11 is held on the front side of the robot hand 10, and then the robot hand 10 is moved to transport the workpiece 11 from the inspection unit 42 to the cassette 6.

In the grinding device 2, the foreign matter removal unit 46 provided above the inspection table 44 can be used to remove foreign matter adhering to the robot hand 10 of the transport unit 8 when it is not holding a workpiece 11 in removal step S1, and to remove foreign matter adhering to the workpiece 11 held on the surface side of the robot hand 10 in removal step S22.

Therefore, in the grinding device 2, it is possible to reduce the likelihood of the workpiece 11 being damaged due to holding the workpiece 11 via foreign matter adhering to the workpiece 11 in the holding step S7.

Note that the above is one aspect of the present invention, and the present invention is not limited to the above. For example, the processing device of the present invention may be any device that processes the workpiece 11 while holding it. In other words, the processing device of the present invention is not limited to a grinding device, and may be, for example, a cutting device or a laser processing device.

In addition, the processing apparatus of the present invention may be equipped with a transport unit 8 having a robot hand capable of holding the workpiece 11 on either side (front and back) of the robot hand 10. In this case, it is preferable because it reduces the likelihood of foreign matter adhering to the workpiece 11 from the robot hand 10.

Specifically, in this case, the unground workpiece 11 can be held only on the front side of the robot hand, and the ground workpiece 11 can be held only on the back side. In other words, in this case, even if foreign matter adheres to the back side of the robot hand from the ground workpiece 11, the unground workpiece 11 will not be transported on this back side. Therefore, in this case, the likelihood of foreign matter adhering to the workpiece 11 from the robot hand 10 can be reduced.

On the other hand, a robot hand capable of holding the workpiece 11 on either side tends to be thicker than the robot hand 10. Furthermore, when the robot hand is thicker, there is a higher probability that the robot hand will come into contact with the workpiece 11 already contained in the cassette 6 when the workpiece 11 is being removed from or loaded into the cassette 6, resulting in damage to the workpiece 11.

Therefore, compared to robot hands that can hold the workpiece 11 on either side, the robot hand 10 is advantageous in that it can transport the workpiece 11 out of and into the cassette 6 without damaging the workpiece 11.

In addition, the processing device of the present invention may be equipped with a transport unit 8 that has, instead of the robot hand 10, a gripping mechanism capable of gripping the outer periphery of the workpiece 11 as a holding unit. This gripping mechanism includes three or more gripping members that are spaced at approximately equal angular intervals in a plan view.

In this type of transport unit 8, the workpiece 11 is held by gripping the outer periphery of the workpiece 11 with each gripping member. In this case, it is preferable to use the foreign matter removal unit 46 in order to remove foreign matter adhering to almost the entire surface of both sides (one side and the other side) of the workpiece 11 held by the gripping mechanism.

On the other hand, when the workpiece 11 is held by such a gripping mechanism, the workpiece 11 is more likely to fall when, for example, the workpiece 11 is turned upside down. If the workpiece 11 falls, there is a risk that the workpiece 11 will be damaged, and it will be necessary to stop all processing in the grinding device 2 and recover the fallen workpiece 11.

Therefore, compared to such gripping mechanisms, the robot hand 10 is preferable in that it reduces the likelihood of damage to the workpiece 11 and can improve the throughput of the grinding device 2.

Furthermore, the processing apparatus of the present invention may not be equipped with the position adjustment unit 20 and/or the cleaning unit 40. In this case, the workpiece 11 may be loaded onto and/or unloaded from the chuck table 24 using the transport unit 8.

In addition, the processing device of the present invention may be provided with an inspection unit 42 that is provided with an inspection table that simply supports the workpiece 11 without holding it, instead of the inspection table 44. In this case, the structure of the inspection unit 42 is simplified, which is preferable in that it reduces manufacturing costs.

On the other hand, if the inspection table is pulled out from the housing of the grinding device 2 while the workpiece 11 is simply supported, the workpiece 11 is likely to fall from the inspection table. If the workpiece 11 falls, there is a risk that the workpiece 11 will be damaged, and it will be necessary to stop all processing in the grinding device 2 and recover the fallen workpiece 11.

Therefore, compared to an inspection table that simply supports the workpiece 11 without holding it, the inspection table 44 is preferable in that it reduces the likelihood of damage to the workpiece 11 and can improve throughput in the grinding device 2.

The processing apparatus of the present invention may also include an inspection section 42 in which a blower-type ionizer (static eliminator) is provided as a foreign matter removal unit, instead of or in addition to the pipe nozzle (blower) 50 and duct hose 52a and fan 52b (suction section 52). This ionizer is provided, for example, inside the cover 48, and is capable of blowing ion-containing gas downward.

Furthermore, the workpiece processing method of the present invention may be any method that removes foreign matter adhering to at least one of the robot hand 10 when not holding the workpiece 11 or the workpiece 11 held on the surface side of the robot hand 10 prior to holding the workpiece 11 on the chuck table 24.

For example, the workpiece processing method of the present invention may be a workpiece processing method that includes the steps described in Figures 7 and 8, except that it does not include removal step S1 before conveying step S2, which includes removal step S22. Alternatively, the workpiece processing method of the present invention may be a workpiece processing method that includes the steps described in Figures 7 and 8, except that it does not include removal step S22.

Furthermore, in the workpiece processing method of the present invention, the removal step S1 may be performed every time before the transport step S2, or the removal step S1 may be performed every time the transport step S2 is performed a predetermined number of times (for example, the number of times corresponding to one lot of workpieces 11 contained in the cassette 6 (for example, 25 times)).

Furthermore, in the workpiece processing method of the present invention, between the cleaning step S6 and the holding step S7, foreign matter adhering to the workpiece 11 held on the surface side of the robot hand 10 may be removed using the foreign matter removal unit 46.

In addition, the structures and methods of the above-described embodiments may be modified as appropriate without departing from the scope of the present invention.

2: Grinding device 4: Cassette table (4a: upper surface)
6: Cassette (6a: top plate, 6b, 6c: side plates, 6d: groove, 6e: connecting member)
8: Transport unit 10: Robot hand (holding part)
(10a: proximal end, 10b: arm)
11: Workpiece 12: Moving mechanism 13: Wafer (13a: front surface, 13b: back surface)
14: First drive unit (14a: case)
15: Device 16: Arm (16a: First arm, 16b: Second arm, 16c: Second joint)
18: Second drive unit (18a: case, 18b: spindle)
20: Position adjustment unit (20a: positioning table, 20b: position adjustment mechanism)
22: Grinding unit 24: Chuck table (holding table)
26: Frame (26a: bottom wall, 26b: side wall, 26c: flow path)
28: Porous plate 30a, 30b: Valve 32a: Suction source 32b: Gas supply source 34: Grinding unit (processing unit)
36: Spindle (36a: Mount)
38: Grinding wheel (38a: base, 38b: grinding stone)
40: Cleaning section (40a: spinner table, 40b: cleaning unit)
42: Inspection unit 44: Inspection table (support table)
(44a: frame, 44b: porous plate)
46: Foreign substance removal unit 48: Cover (48a: top plate, 48b: side plate)
50: Pipe nozzle (blower)
52: Suction unit (52a: duct hose, 52b: fan)

Claims (10)

A processing device for processing one surface of a workpiece including one surface and another surface located opposite to the one surface,
a holding table for holding the workpiece with the one surface of the workpiece exposed;
a processing unit for processing the one surface side of the workpiece held on the holding table;
a support table for supporting the workpiece in a state in which the one surface of the workpiece processed by the processing unit is exposed;
a conveying unit including a holder for holding the workpiece supported on the support table, and a moving mechanism for moving the holder holding the workpiece;
a foreign matter removal unit provided above the support table for removing foreign matter adhering to at least one of the holder when not holding the workpiece and the workpiece held by the holder;
A processing device comprising: The processing device described in claim 1, wherein the foreign matter removal unit removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holding portion. The processing device described in claim 1, wherein the foreign matter removal unit removes foreign matter adhering to at least one of the support table when not supporting the workpiece and the workpiece supported on the support table. The foreign matter removal unit comprises:
a blower for blowing gas diagonally downward toward the rear;
4. The processing apparatus according to claim 1, further comprising a suction section provided behind the blower section for sucking the gas. A processing device according to any one of claims 1 to 3, wherein the foreign matter removal unit has a static eliminator for blowing ion-containing gas downward. A method for processing a workpiece, the method comprising: processing one surface of a workpiece including one surface and another surface located opposite to the one surface;
a first conveying step of holding the workpiece accommodated in a cassette by a holding portion of a conveying unit and then conveying the workpiece from the cassette by moving the holding portion;
a holding step of holding the workpiece on a holding table with the one surface exposed after the first conveying step;
a processing step of processing the one surface side of the workpiece held on the holding table after the holding step;
a supporting step of supporting the workpiece on a support table in a state where the one surface of the workpiece whose one surface has been processed is exposed after the processing step;
a second conveying step of, after the supporting step, holding the workpiece supported on the support table by the holding unit and then moving the holding unit to convey the workpiece to the cassette;
a removal step of removing foreign matter adhering to the holder using a foreign matter removal unit provided above the support table before the first transport step, and/or removing foreign matter adhering to the workpiece held by the holder using the foreign matter removal unit during the first transport step;
A method for processing a workpiece, comprising: The method for processing a workpiece according to claim 6, wherein the removing step removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holding portion. The method for processing a workpiece according to claim 6, further comprising a second removal step in which foreign matter adhering to the support table is removed using the foreign matter removal unit before the supporting step, and/or foreign matter adhering to the workpiece is removed using the foreign matter removal unit during the supporting step. A method for processing a workpiece according to any one of claims 6 to 8, wherein in the removal step, gas is blown toward the holding part or the workpiece from an upper front obliquely upward direction, and the gas that collides with the holding part or the workpiece is sucked upward. A method for processing a workpiece according to any one of claims 6 to 8, wherein, in the removal step, a gas containing ions is sprayed from above toward the holder or the workpiece.