JP2020183000A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing apparatus which does not cause a problem that the workpiece cannot be carried out from a cassette, the workpiece cannot be conveyed in the processing apparatus, or the workpiece is not damaged.
A processing apparatus 2 is carried out by a chuck table 4 capable of selectively holding at least two types of workpieces W, a processing means 6, and a carrying-out means 12 for carrying out a workpiece W from a cassette 8. The control means 90 is provided with a transport means 16 for transporting the workpiece W temporarily placed in the temporary placement means 14 to the chuck table 4, and the control means 90 stores the image of the cassette 8 captured by the camera 88 and the image storage unit 98. A determination unit 100 that compares the image of the cassette 8 with the image of the cassette 8 and determines whether or not the cassette 8 imaged by the camera 88 is a cassette 8 according to the size of the workpiece W selected by the size selection unit 96. It has.
[Selection diagram] Fig. 1

Description

The present invention relates to a processing apparatus capable of processing at least two sizes of workpieces.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by a planned division line and formed on the front surface is formed into a predetermined thickness by grinding the back surface by a grinding device, and then individual devices are formed by a dicing device, a laser processing device, or the like. It is divided into chips, and each divided device chip is used for electric devices such as mobile phones and personal computers.

The grinding device includes a chuck table for holding a workpiece, a grinding means for grinding the workpiece held on the chuck table, a cassette mounting portion on which a cassette for accommodating a plurality of workpieces is placed, and the like. A unloading means for carrying out the work piece from the cassette placed on the cassette mounting portion, a temporary placement means for temporarily placing the work piece carried out by the carry-out means, and a work piece temporarily placed on the temporary placement means. The wafer can be processed to a desired thickness, which is generally composed of a transport means for transporting an object to a chuck table.

Further, the wafer has different sizes such as 5 inches, 6 inches, and 8 inches in diameter, and the size is appropriately selected depending on the type and size of the device.

Then, a cassette corresponding to the size of the wafer is placed on the cassette mounting portion of the grinding device (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2005-153090

However, if the cassette mounted on the cassette mounting part does not correspond to the size of the wafer to be processed, the wafer cannot be carried out from the cassette, the wafer cannot be transported in the grinding device, or the wafer is damaged. There is a problem such as The above-mentioned problem may occur not only in the grinding device but also in various processing devices including a dicing device, a laser processing device and the like capable of processing according to the size of the wafer.

The problem of the present invention made in view of the above facts is that the work piece cannot be carried out from the cassette, the work piece cannot be conveyed in the processing apparatus, or the work piece is damaged. It is to provide no processing equipment.

In order to solve the above problems, the present invention provides the following processing apparatus. That is, a chuck table capable of selectively holding at least two sizes of workpieces, a processing means for processing the workpieces held on the chuck table, and a cassette accommodating a plurality of workpieces are mounted. A cassette mounting portion to be placed, a carrying-out means for carrying out a work piece from a cassette placed on the cassette mounting part, and a temporary placing means for temporarily placing a work piece carried out by the carrying-out means. A processing device provided with a transport means for transporting a work piece temporarily placed on the temporary placement means to the chuck table, a camera for capturing an image of the cassette mounted on the cassette mounting portion, and a cover. A control means including at least a size selection unit for selecting the size of the workpiece and an image storage unit for storing a cassette image according to the size of the workpiece selected by the size selection unit. The control means compares the image of the cassette captured by the camera with the image of the cassette stored in the image storage unit, and the cassette imaged by the camera is the workpiece selected by the size selection unit. It is a processing device equipped with a judgment unit for determining whether or not the cassette is a cassette according to the size.

Preferably, the determination unit instructs the cassette to be replaced if the cassette imaged by the camera does not correspond to the size of the workpiece selected by the size selection unit. The processing means is preferably a grinding means for grinding the workpiece held on the chuck table with a grinding wheel or a polishing means for polishing the workpiece held on the chuck table with a polishing pad.

The processing apparatus provided by the present invention includes a chuck table capable of selectively holding at least two sizes of workpieces, a processing means for processing the workpieces held on the chuck table, and a plurality of workpieces. Temporary provisions include a cassette mounting unit on which a cassette for accommodating an object is placed, a unloading means for carrying out a work piece from the cassette mounted on the cassette mounting part, and a work piece carried out by the unloading means. A camera provided with a temporary placing means to be placed and a carrying means for transporting the workpiece temporarily placed on the temporary placing means to the chuck table, and an image of the cassette mounted on the cassette mounting portion. A control means including at least a size selection unit for selecting the size of the work piece and an image storage unit for storing an image of a cassette according to the size of the work piece selected by the size selection unit. The control means compares the image of the cassette captured by the camera with the image of the cassette stored in the image storage unit, and the cassette imaged by the camera is the workpiece selected by the size selection unit. Since it is equipped with a judgment unit that determines whether or not the cassette is suitable for the size of the cassette, it is not possible to carry out the work piece from the cassette, transport the work piece in the processing device, or damage the work piece. There is no problem of making it happen.

The perspective view of the processing apparatus configured according to this invention. The perspective view of the chuck table shown in FIG. FIG. 6 is a schematic view of a top image of a cassette stored in the image storage unit shown in FIG. 1 according to the size of the workpiece.

Hereinafter, preferred embodiments of the processing apparatus configured according to the present invention will be described with reference to the drawings.

FIG. 1 shows a grinding device 2 capable of grinding at least two sizes of workpieces as an example of a processing device configured according to the present invention. Other examples of the processing apparatus of the present invention include, for example, a dicing apparatus provided with a rotatably cutting blade for performing cutting on the workpiece, a laser machining apparatus for performing laser processing on the workpiece, and the like. Be done.

The grinding apparatus 2 includes a chuck table 4 capable of selectively holding at least two sizes of workpieces, a processing means 6 for processing the workpieces held on the chuck table 4, and a plurality of workpieces. A cassette mounting portion 10 on which the cassette 8 to be accommodated is placed, a carry-out means 12 for carrying out the workpiece from the cassette 8 mounted on the cassette mounting portion 10, and a workpiece carried out by the carry-out means 12. It is provided with a temporary placing means 14 for temporarily placing the machine, and a conveying means 16 for transporting the workpiece temporarily placed on the temporary placing means 14 to the chuck table 4.

As shown in FIG. 1, the grinding device 2 includes a rectangular parallelepiped base 18, and a circular turntable 20 is rotatably provided on the upper surface of the base 18. The turntable 20 is a turntable motor (not shown) built in the base 18, and is rotated counterclockwise when viewed from above. Three chuck tables 4 are rotatably mounted on the peripheral edge side of the upper surface of the turntable 20 at equal intervals in the circumferential direction, and the chuck table 4 is for a chuck table mounted on the lower surface of the turntable 20. It is rotated around an axis extending in the vertical direction by a motor (not shown). Further, in FIG. 1, each chuck table 4 is sequentially positioned by the rotation of the turntable 20 at the attachment / detachment position indicated by reference numeral A, the rough grinding position indicated by reference numeral B, and the finish grinding position indicated by reference numeral C. ing.

Explaining with reference to FIG. 2, the upper end portion of the chuck table 4 has a porous circular first suction chuck 22 and a porous annular shape concentrically arranged with the first suction chuck 22. A second suction chuck 24 is provided. Both the first suction chuck 22 and the second suction chuck 24 are connected to a suction means (not shown), and a valve (FIG.) is connected to the flow path connecting the second suction chuck 24 and the suction means. Not shown) is provided. Further, in the illustrated embodiment, the diameter of the first suction chuck 22 corresponds to the diameter of the smaller workpiece (for example, a wafer having a diameter of 6 inches) among the two sizes of workpieces, and the second The outer diameter of the suction chuck 24 of the above corresponds to the diameter of the larger work piece (for example, a wafer having a diameter of 8 inches) out of the two sizes of the work piece.

Then, in the chuck table 4, the suction force is generated on the upper surface of the first suction chuck 22 by the suction means in the state where the valve is closed, so that the small work piece is sucked by the first suction chuck 22. By generating suction force on the upper surfaces of the first suction chuck 22 and the second suction chuck 24 with the suction means while holding and opening the valve, the first suction chuck 22 and the second suction chuck 22 and the second suction chuck 24 are sucked. The chuck 24 is designed to suck and hold a large-sized workpiece.

As described above, the chuck table 4 of the illustrated embodiment can selectively suck and hold the workpieces of two different sizes. The chuck table 4 can selectively suck and hold three or more sizes of workpieces by arranging a plurality of annular suction chucks concentrically with the first suction chuck 22 at the upper end portion. It may be like this.

Explaining with reference to FIG. 1, the processing means 6 is mounted on one side of the mounting wall 26, which extends upward from the end portion (back end portion in FIG. 1) of the base 18, and which can be moved up and down. The first elevating plate 28 and the second elevating plate 30, the first elevating means 32 for raising and lowering the first elevating plate 28, and the second elevating means 34 for raising and lowering the second elevating plate 30. including.

The first elevating means 32 has a ball screw 36 extending in the vertical direction along one surface of the mounting wall 26, and a motor 38 for rotating the ball screw 36. The nut portion (not shown) of the ball screw 36 is connected to the first elevating plate 28. Then, in the first elevating means 32, the rotary motion of the motor 38 is converted into a linear motion by the ball screw 36 and transmitted to the first elevating plate 28, and is transmitted to the guide rail 26a attached to one side of the mounting wall 26. The first elevating plate 28 is moved up and down along the line. Since the second elevating means 34 may have the same configuration as the first elevating means 32, the same reference numerals as those of the first elevating means 32 will be added, and the description thereof will be omitted.

Further, the processing means 6 includes a rough grinding unit 40 mounted on one side of the first lifting plate 28 and a finish grinding unit 42 mounted on one side of the second lifting plate 30. The rough grinding unit 40 is provided on a support wall 44 protruding from one side of the first elevating plate 28, a spindle 46 rotatably supported by the support wall 44 about an axis extending in the vertical direction, and an upper surface of the support wall 44. It has a motor 48 mounted on it to rotate the spindle 46. A disk-shaped wheel mount 50 is fixed to the lower end of the spindle 46, and a grinding wheel 52 for rough grinding is fixed to the lower surface of the wheel mount 50. Regarding the finish grinding unit 42, a grinding wheel 54 for finish grinding formed from abrasive grains having a smaller particle size than the grinding wheels 52 for rough grinding is fixed to the lower surface of the wheel mount 50. Since the structure may be the same as that of the rough grinding unit 40, the same reference numerals as those of the rough grinding unit 40 will be added, and the description thereof will be omitted.

Then, in the processing means 6, the workpiece held on the chuck table 4 positioned at the rough grinding position B is roughly ground by the grinding wheel 52 of the rough grinding unit 40, and at the finish grinding position C. The work piece held on the positioned chuck table 4 is subjected to finish grinding by the grinding wheel 54 of the finish grinding unit 42.

As described above, the processing means 6 of the illustrated embodiment is configured as a grinding means for grinding the workpiece held on the chuck table 4 with the grinding wheels 52 and 54, but the polishing pad is provided on the lower surface of the wheel mount 50. The processing means 6 may be composed of polishing means for polishing the workpiece fixed and held on the chuck table 4 with a polishing pad. Further, the grinding wheel may be fixed to one wheel mount 50, the polishing pad may be fixed to the other wheel mount 50, and the processing means 6 may be composed of both the grinding means and the polishing means.

A cleaning water nozzle 56 for injecting cleaning water is provided on the upper surface of the base 18 adjacent to the attachment / detachment position A. Then, after the rough grinding process and the finish grinding process are performed, the cleaning water is ejected from the cleaning water nozzle 56 toward the upper surface (grinding surface) of the workpiece positioned at the attachment / detachment position A, so that the workpiece is processed. The top surface of the surface is cleaned.

In the cassette mounting portion 10 of the illustrated embodiment, a first cassette 8a accommodating a plurality of disk-shaped workpieces (for example, a wafer W having a diameter of 6 inches or a diameter of 8 inches) before grinding is placed. It has a first cassette mounting portion 10a to be mounted, and a second cassette mounting portion 10b on which a second cassette 8b for accommodating a plurality of workpieces after grinding is mounted. As shown in FIG. 1, the first cassette mounting portion 10a and the second cassette mounting portion 10b are provided at the upper surface end portion (front side end portion in FIG. 1) of the base 18 at intervals from each other. There is.

Each of the first cassette mounting section 10a and the second cassette mounting section 10b has a space in which cassettes 8 of at least two different sizes can be selectively mounted. As the cassette 8 having at least two sizes, for example, as shown in FIG. 3, the 6-inch cassettes P1 to P4 accommodating a wafer having a diameter of 6 inches and the cassette G1 to 8 inches accommodating an 8-inch wafer. It is G4.

As shown in FIG. 1, the carrying-out means 12 is arranged between the first cassette mounting portion 10a and the second cassette mounting portion 10b. The carrying-out means 12 is detachably attached to the articulated arm 58 supported by the base 18, an electric or air-driven actuator (not shown) for operating the articulated arm 58, and the tip of the articulated arm 58. Includes the attached holding piece 60. The holding piece 60 having a plurality of suction holes (not shown) formed on one surface is connected to a suction means (not shown).

Then, in the carrying-out means 12, the suction means generates a suction force on one side of the holding piece 60 to suck and hold the workpiece on one side of the holding piece 60, and the actuator operates the articulated arm 58. The work piece before grinding, which was sucked and held on one side of the holding piece 60, was carried out from the first cassette 8a to the temporary placing means 14, and the work piece after grinding was sucked and held on one side of the holding piece 60. The object is carried into the second cassette 8b from the cleaning means 74 described later.

In the carrying-out means 12, at least two sizes of holding pieces 60 are selectively attached to the tips of the articulated arms 58, so that at least two types of workpieces can be sucked and held. .. The holding pieces 60 having at least two sizes include, for example, a 6-inch holding piece for sucking and holding a wafer having a diameter of 6 inches, and an 8-inch holding piece for sucking and holding a wafer having a diameter of 8 inches. ..

As shown in FIG. 1, the temporary placing means 14 is arranged adjacent to the first cassette mounting portion 10a. The temporary placing means 14 includes a substrate 62 mounted on the upper surface of the base 18, and a circular temporary placing table 64 arranged in the central portion of the upper surface of the substrate 62 and smaller than the diameter of the workpiece. A plurality of elongated holes 62a extending in the radial direction of the temporary placement table 64 are formed on the substrate 62 at intervals around the temporary placement table 64. Further, a plurality of pins 66 extending upward through the elongated holes 62a are movably mounted on the base 18 along the elongated holes 62a, and the plurality of pins 66 are synchronized along the elongated holes 62a. A pin moving means (not shown) for moving the pin is attached.

Then, in the temporary placing means 14, the plurality of pins 66 are synchronously moved by the pin moving means, and the plurality of pins 66 are abutted against the peripheral edge of the work piece temporarily placed on the temporary placing table 64. The center of the work piece is aligned with the center of the temporary storage table 64.

In the temporary placement means 14, by changing the initial position of the pin 66, it is possible to align the workpieces of at least two sizes. For example, when centering a wafer with a diameter of 6 inches, the initial position of the pin 66 is set in the middle of the slot 62a, and when centering a wafer with a diameter of 8 inches, the initial position of the pin 66 is set. It is set at the end of the elongated hole 62a (the radial outer end of the temporary table 64). In this way, by setting the initial position of the pin 66 on the circumference slightly larger than the diameter of the workpiece to be centered, the movement of the pin 66 until the pin 66 abuts on the peripheral edge of the workpiece. The distance is shortened, and the process time can be shortened.

As shown in FIG. 1, the transport means 16 is arranged between the temporary storage means 14 and the turntable 20. The transport means 16 is rotatably and vertically mounted on the base 18, a rotating shaft 68 extending upward from the upper surface of the base 18, an arm 70 extending substantially horizontally from the upper end of the rotating shaft 68, and a tip of the arm 70. A disk-shaped suction piece 72 detachably attached to the lower surface, a rotary shaft motor (not shown) for rotating the rotary shaft 68, and an electric cylinder for raising and lowering the rotary shaft 68 (FIG. Not shown.) And. The suction piece 72 having a plurality of suction holes (not shown) formed on the lower surface is connected to the suction means (not shown).

Then, in the transport means 16, the work piece temporarily placed on the temporary placement table 64 is sucked and held by the lower surface of the suction piece 72 by generating a suction force on the lower surface of the suction piece 72 by the suction means. Further, the transport means 16 positions the workpiece sucked and held on the lower surface of the suction piece 72 at the attachment / detachment position A from the temporary placement means 14 by raising / lowering and rotating the rotary shaft 68 with the lifting means and the rotary shaft motor. It is designed to be conveyed to the chuck table 4 provided.

In the transport means 16, the suction pieces 72 of at least two sizes are selectively attached to the lower surface of the tip of the arm 70, so that the workpieces of at least two sizes can be sucked and held. The suction pieces 72 having at least two sizes include, for example, a 6-inch suction piece for sucking and holding a wafer having a diameter of 6 inches, and an 8-inch suction piece for sucking and holding a wafer with a diameter of 8 inches. ..

In the illustrated embodiment, as shown in FIG. 1, the grinding apparatus 2 has a cleaning means 74 for cleaning the ground workpiece and a second cleaning means 74 for transporting the ground workpiece from the chuck table 4 to the cleaning means 74. Further provided with a transport means 76.

The cleaning means 74 arranged adjacent to the second cassette mounting portion 10b includes a circular spinner table 78 rotatably mounted on the base 18 and a spinner table motor (rotating the spinner table 78). (Not shown), a cleaning water nozzle that injects cleaning water onto the workpiece held on the spinner table 78 (not shown), and dry air on the workpiece held on the spinner table 78. Includes an air nozzle (not shown) to inject. A porous circular suction chuck 80 connected to a suction means (not shown) is arranged at the upper end portion of the spinner table 78.

Then, in the cleaning means 74, the work piece placed on the upper surface of the spinner table 78 is sucked and held by generating a suction force on the upper surface of the suction chuck 80 by the suction means. Further, the cleaning means 74 injects cleaning water from the cleaning water nozzle to clean the workpiece and injects dry air from the air nozzle to be processed while rotating the spinner table 78 that sucks and holds the workpiece. It is designed to dry things.

The diameter of the spinner table 78 is formed to be smaller than the diameter of the smallest workpiece among the workpieces of at least two sizes, and the cleaning means 74 uses the workpieces of at least two sizes. It can be washed and dried by sucking and holding it on the spinner table 78.

The second transport means 76 arranged between the cleaning means 74 and the turntable 20 is rotatably and vertically mounted on the base 18, and rotates with a rotating shaft 82 extending upward from the upper surface of the base 18. An arm 84 extending substantially horizontally from the upper end of the shaft 82, a circular plate 86 mounted on the lower surface of the tip of the arm 84, a rotary shaft motor (not shown) for rotating the rotary shaft 82, and a rotary shaft. Includes an elevating means (not shown) such as an electric cylinder that elevates the 82. A porous suction pad (not shown) connected to a suction means (not shown) is arranged in the central portion of the lower surface of the plate 86.

Then, in the second transport means 76, a suction force is generated on the lower surface of the suction pad by the suction means to plate the ground workpiece held on the chuck table 4 located at the attachment / detachment position A. The suction is held on the lower surface of the 86. Further, the second transport means 76 is a spinner of the cleaning means 74 from the chuck table 4 for sucking and holding the workpiece on the lower surface of the plate 86 by raising and lowering and rotating the rotary shaft 82 with the lifting means and the rotary shaft motor. It is designed to be transported to the table 78.

Further, the diameter of the plate 86 of the second transport means 76 is formed to be larger than the diameter of the largest workpiece among the workpieces of at least two sizes, and the second transport means 76 is formed. , At least two sizes of workpieces can be sucked and held by the plate 86.

As shown in FIG. 1, the grinding device 2 further includes a camera 88 that captures an image of the cassette 8 mounted on the cassette mounting portion 10, and a control means 90 that is electrically connected to the camera 88. The camera 88 of the illustrated embodiment is arranged on the upper part of the grinding device 2, and is mounted on the first cassette 8a and the second cassette mounting portion 10b mounted on the first cassette mounting portion 10a. An image with the second cassette 8b to be placed is taken. Further, the data of the image captured by the camera 88 is sent to the control means 90. Although a single camera 88 is shown in FIG. 1, the grinding device 2 may include a plurality of cameras 88.

The control means 90 composed of a computer includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program and the like, and a readable and writable random access that stores the arithmetic results and the like. Includes memory (RAM) (neither is shown). An operation panel 92 and a monitor 94 arranged at the upper end portion (front end portion in FIG. 1) of the base 18 are electrically connected to the control means 90. The operation panel 92 may consist of a keyboard or a touch panel. The touch panel as the operation panel 92 may be displayed on the monitor 94.

In the read-only memory of the control means 90, a size selection unit 96 for selecting the size of the work piece is stored as a control program, and a cassette corresponding to the size of the work piece selected by the size selection unit 96 is stored. An image storage unit 98 for storing an image is set.

The size selection unit 96 stores in advance the sizes of at least two types of workpieces (for example, 6 inches in diameter and 8 inches in diameter) that can be ground by the grinding device 2. Then, the size selection unit 96 selects the size of the workpiece from at least two types of workpiece sizes stored in advance based on the operation of the operation panel 92 by the operator. There is.

The image storage unit 98 stores in advance images of cassettes corresponding to the sizes of at least two types of workpieces that can be ground by the grinding device 2. For example, as shown in FIG. 3, as a top image of a cassette corresponding to a wafer having a diameter of 6 inches, a plurality of cassette images P1, P2, P3, P4 for 6 inches and as a top image of a cassette corresponding to a wafer having a diameter of 8 inches. A plurality of 8-inch cassette images G1, G2, G3, and G4 are stored in the image storage unit 98. The image stored in the image storage unit 98 may be an image captured by the camera 88 of the grinding device 2, or may be an image captured by a camera other than the camera 88. Further, the image stored in the image storage unit 98 does not have to be the upper surface image of the cassette, and may be an image captured from an oblique angle.

Further, the read-only memory of the control means 90 includes an image of the cassette 8 captured by the camera 88 when the grinding apparatus 2 starts grinding, and images P1 to P4 and G1 of the cassette stored in the image storage unit 98. A determination unit 100 (see FIG. 1) determines whether or not the cassette 8 imaged by the camera 88 is a cassette according to the size of the workpiece selected by the size selection unit 96 by comparing with the G4. It is stored as a control program.

When grinding a wafer as a work piece using the grinding device 2 as described above, first, the first cassette 8a containing a plurality of wafers is placed on the first cassette mounting portion 10a, and the grinding is performed. An empty second cassette 8b accommodating a plurality of processed wafers is placed on the second cassette mounting portion 10b.

Next, the operation panel 92 is operated to input the size of the workpiece to be ground and to input the operation start instruction of the grinding device 2. Here, it is assumed that a diameter of 6 inches is input as the size of the workpiece. Then, the size selection unit 96 of the control means 90 selects a diameter of 6 inches as the size of the workpiece from among the sizes of the plurality of workpieces that can be ground by the grinding device 2. Further, the first and second cassettes 8a and 8b mounted on the first and second cassette mounting portions 10a and 10b are imaged by the camera 88.

When the first and second cassettes 8a and 8b are imaged by the camera 88, the determination unit 100 of the control means 90 stores the images of the first and second cassettes 8a and 8b imaged by the camera 88 in advance. The first and second cassettes 8a and 8b imaged by the camera 88 are processed by the size selection unit 96 by comparing the plurality of 6-inch cassette images P1 to P4 stored in the unit 98. It is determined whether or not the cassette is based on the size of the object (6 inches in diameter).

The images of the first and second cassettes 8a and 8b correspond to any of the plurality of 6-inch cassette images P1 to P4, and the first and second cassettes 8a and 8b imaged by the camera 88 have sizes. When the determination unit 100 determines that the cassette is a 6-inch cassette according to the size of the workpiece selected by the selection unit 96, a plurality of wafers housed in the first cassette 8a are sequentially carried out. Then, after the wafer is ground, a series of steps in which the ground wafer is carried into the second cassette 8b is started.

Specifically, a temporary placing step of carrying out the wafer from the first cassette 8a by the carrying-out means 12 and temporarily placing the wafer on the temporary placing means 14, and a position for attaching and detaching the wafer temporarily placed on the temporary placing means 14 by the conveying means 16. The first transfer step of transferring to the chuck table 4 of A, the grinding step of performing rough grinding and finish grinding on the upper surface of the wafer held by the chuck table 4 by the processing means 6, and the upper surface of the ground wafer. The washing water injection step of injecting the washing water from the washing water nozzle 56, the second conveying step of conveying the ground wafer from the chuck table 4 to the cleaning means 74 by the second conveying means 76, and the ground wafer. A series of steps including a washing / drying step of cleaning and drying with the cleaning means 74 and a cassette loading step of carrying out the washed wafer from the cleaning means 74 with the carrying-out means 12 and carrying it into the second cassette 8b are sequentially performed. Will be implemented.

As a result of comparing both images, it is found that the first and second cassettes 8a and 8b imaged by the camera 88 are 6-inch cassettes according to the size of the workpiece selected by the size selection unit 96. When the determination unit 100 determines, the monitor 94 may display the fact.

On the other hand, as a result of comparing both images, one or both of the first and second cassettes 8a and 8b imaged by the camera 88 must be cassettes corresponding to the size of the workpiece selected by the size selection unit 96. If the determination unit 100 determines, the above series of steps is not started. Further, in such a case, the determination unit 100 notifies the operator by displaying on the monitor 94 that one or both of the first and second cassettes 8a and 8b do not correspond to the size of the workpiece. On the other hand, it may be instructed to replace the cassette.

As described above, in the grinding apparatus 2 of the illustrated embodiment, the first and second cassettes 8a and 8b imaged by the camera 88 correspond to the size of the workpiece selected by the size selection unit 96. If the determination unit 100 determines that the cassette is not a cassette, a series of steps for grinding the workpiece is not started, so that the workpiece is carried out from the first cassette 8a and the workpiece in the grinding apparatus 2 is processed. There is no problem that the work piece cannot be transported or the work piece is damaged.

2: Grinding equipment (processing equipment)
4: Chuck table 6: Processing means 8: Cassette 8a: First cassette 8b: Second cassette 10: Cassette mounting part 10a: First cassette mounting part 10b: Second cassette mounting part 12: Carrying out Means 14: Temporary storage means 16: Transport means 88: Camera 90: Control means 96: Size selection unit 98: Image storage unit 100: Judgment unit

Claims (3)

A chuck table capable of selectively holding at least two sizes of workpieces, a processing means for processing the workpieces held on the chuck table, and a cassette accommodating a plurality of workpieces are mounted. A cassette mounting unit, a carrying-out means for carrying out a work piece from a cassette mounted on the cassette mounting part, a temporary placing means for temporarily placing a work piece carried out by the carrying-out means, and the like. A processing device provided with a transport means for transporting a work piece temporarily placed on the temporary placement means to the chuck table.
A camera that captures an image of a cassette mounted on the cassette mounting portion,
A control means including at least a size selection unit for selecting the size of the work piece and an image storage unit for storing an image of a cassette according to the size of the work piece selected by the size selection unit. ,
The control means compares the image of the cassette captured by the camera with the image of the cassette stored in the image storage unit, and the cassette imaged by the camera is the workpiece selected by the size selection unit. A processing device equipped with a judgment unit that determines whether or not the cassette is a cassette according to its size. The processing apparatus according to claim 1, wherein the determination unit instructs the replacement of the cassette when the cassette imaged by the camera does not correspond to the size of the workpiece selected by the size selection unit. The processing according to claim 1, wherein the processing means is a grinding means for grinding a work piece held on the chuck table with a grinding wheel or a polishing means for polishing a work piece held on the chuck table with a polishing pad. apparatus.