JP2018187622A - 三次元の多孔性複合材料の製造方法 - Google Patents
三次元の多孔性複合材料の製造方法 Download PDFInfo
- Publication number
- JP2018187622A JP2018187622A JP2018088667A JP2018088667A JP2018187622A JP 2018187622 A JP2018187622 A JP 2018187622A JP 2018088667 A JP2018088667 A JP 2018088667A JP 2018088667 A JP2018088667 A JP 2018088667A JP 2018187622 A JP2018187622 A JP 2018187622A
- Authority
- JP
- Japan
- Prior art keywords
- carbon nanotube
- composite material
- dimensional porous
- film
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/168—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/02—Cellular or porous
- B32B2305/026—Porous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/08—Aligned nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/002—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/20—Electroplating: Baths therefor from solutions of iron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Catalysts (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
Description
Claims (4)
- 不活性金属の塩溶液及び活性金属の塩溶液を提供するステップと、
基板を提供して、該基板の表面に前記不活性金属の塩溶液を電気めっきして、めっき膜Mを形成するステップと、
前記めっき膜Mの表面に一つのカーボンナノチューブ構造を設置するステップと、
前記カーボンナノチューブ構造の表面に前記活性金属の塩溶液を電気めっきして、めっき膜Nを形成して、前記基板を剥離して、複合構造を形成するステップと、
前記複合構造に対して高温でアニーリングして、前記複合構造における金属原子を合金に形成させ、プリフォーム体を獲得するステップと、
前記プリフォーム体を腐食して、多孔性構造に形成して、三次元の多孔性複合材料を獲得するステップと、
を含むことを特徴とする三次元の多孔性複合材料の製造方法。 - 前記カーボンナノチューブ構造の表面に前記活性金属の塩溶液を電気めっきして、めっき膜Nを形成して、前記基板を剥離して、複合構造を形成するステップでは、更に前記めっき膜Nの表面に繰り返して前記めっき膜M、前記カーボンナノチューブ構造及び前記めっき膜Nを形成して、複合構造を獲得することを含むことを特徴とする、請求項1に記載の三次元の多孔性複合材料の製造方法。
- 前記カーボンナノチューブ構造は、少なくとも一層のカーボンナノチューブフィルムを含み、少なくとも一層の前記カーボンナノチューブフィルムが、超配列カーボンナノチューブアレイから引き出して得られたものであることを特徴とする、請求項1に記載の三次元の多孔性複合材料の製造方法。
- 前記超配列カーボンナノチューブアレイからカーボンナノチューブフィルムを引き出す方法は、前記超配列カーボンナノチューブアレイから、一定の幅を有する複数のカーボンナノチューブセグメントを選択するステップ(A)と、所定の速度で前記超配列カーボンナノチューブアレイの生長方向に基本的に垂直する方向に沿って、複数の前記カーボンナノチューブセグメントを引き出し、連続のカーボンナノチューブフィルムを形成するステップ(B)とを含むことを特徴とする、請求項3に記載の三次元の多孔性複合材料の製造方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317874.3A CN108866412B (zh) | 2017-05-08 | 2017-05-08 | 三维多孔复合材料的制备方法 |
| CN201710317874.3 | 2017-05-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018187622A true JP2018187622A (ja) | 2018-11-29 |
| JP6634468B2 JP6634468B2 (ja) | 2020-01-22 |
Family
ID=64013982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018088667A Active JP6634468B2 (ja) | 2017-05-08 | 2018-05-02 | 三次元の多孔性複合材料の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10253423B2 (ja) |
| JP (1) | JP6634468B2 (ja) |
| CN (1) | CN108866412B (ja) |
| TW (1) | TWI652375B (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111636009A (zh) * | 2019-03-01 | 2020-09-08 | 清华大学 | 多孔铜复合材料及其制备方法 |
| CN111640947B (zh) * | 2019-03-01 | 2022-04-22 | 清华大学 | 锂离子电池集流体、负极及该集流体与负极的制备方法 |
| CN111763966A (zh) | 2019-04-02 | 2020-10-13 | 清华大学 | 纳米多孔镍复合材料的制备方法 |
| CN114207755A (zh) | 2019-04-17 | 2022-03-18 | 加州理工学院 | 高纵横比电极结构上原子层沉积的改进 |
| CN115491665B (zh) * | 2022-09-16 | 2023-05-09 | 西南科技大学 | 一种超顺排碳纳米管薄膜化学镀铜工艺及其应用 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006059676A (ja) * | 2004-08-20 | 2006-03-02 | Konica Minolta Holdings Inc | 電子放出素子およびその製造方法 |
| JP2006190652A (ja) * | 2005-01-07 | 2006-07-20 | Samsung Electro Mech Co Ltd | 電界放出エミッタアレー及びその製造方法 |
| JP2009167084A (ja) * | 2008-01-16 | 2009-07-30 | Inha-Industry Partnership Inst | 水素貯蔵用遷移金属を電気めっきした多孔性炭素ナノファイバー複合体の製造方法 |
| JP2010267747A (ja) * | 2009-05-13 | 2010-11-25 | Nissan Motor Co Ltd | 金属基複合材料を使用した積層構造体 |
| JP2013185185A (ja) * | 2012-03-07 | 2013-09-19 | Shinshu Univ | Ni−W合金/CNT複合めっき方法およびNi−W合金/CNT複合めっき液 |
| CN105489872A (zh) * | 2015-12-30 | 2016-04-13 | 湘潭大学 | 一种铜/CNTs-锡/石墨多层结构锂离子电池负极材料及其制备方法 |
| CN105977038A (zh) * | 2016-06-21 | 2016-09-28 | 复旦大学 | 一种具有多孔结构的可拉伸超级电容器及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004018328A (ja) * | 2002-06-18 | 2004-01-22 | Japan Science & Technology Corp | カーボンナノチューブネットワークとその製造方法 |
| US8663446B2 (en) * | 2005-05-20 | 2014-03-04 | University Of Central Florida Research Foundation, Inc. | Electrochemical-codeposition methods for forming carbon nanotube reinforced metal composites |
| DE102007055019B4 (de) * | 2007-11-14 | 2019-04-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer nanoporösen Schicht |
| DE102008018695A1 (de) * | 2008-04-10 | 2009-10-15 | Siemens Aktiengesellschaft | Materialverbund, bestehend aus einer metallischen Matrix, in der CNT-Filamente verteilt sind, sowie Verfahren zur Herstellung eines solchen Materialverbundes |
| US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
| KR101092327B1 (ko) * | 2009-11-03 | 2011-12-09 | 한국과학기술연구원 | 다공성 구조체의 탄소나노튜브 필름을 포함하는 열전재료 및 그의 제조방법 |
| WO2012091139A1 (ja) * | 2010-12-28 | 2012-07-05 | 独立行政法人産業技術総合研究所 | Cnt金属複合材及びその製造方法 |
| JP5795686B2 (ja) * | 2011-06-13 | 2015-10-14 | エンパイア テクノロジー ディベロップメント エルエルシー | 多孔膜上への機能性および再使用可能電着コーティング |
| CN102745670B (zh) * | 2012-07-30 | 2014-10-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | 三维有序大孔复合材料的制备方法 |
| TWI478185B (zh) * | 2013-03-12 | 2015-03-21 | Univ Nat Taiwan | 超級電容器及其製造方法 |
| US9217084B2 (en) * | 2013-03-12 | 2015-12-22 | Hrl Laboratories, Llc | Constrained microlayer cellular material with high stiffness and damping |
| WO2015109137A1 (en) * | 2014-01-16 | 2015-07-23 | The University Of Akron | Conductive film and method of making same |
| US20180183041A1 (en) | 2015-06-09 | 2018-06-28 | William Marsh Rice University | Sulfur-containing carbon nanotube arrays as electrodes |
| CN106611627A (zh) | 2015-10-23 | 2017-05-03 | 苏州汉纳材料科技有限公司 | 高质量碳纳米管透明导电膜及其制备方法与应用 |
| CN105624747B (zh) * | 2015-12-29 | 2017-10-13 | 东莞市莞信企业管理咨询有限公司 | 一种铜/石墨烯复合多层散热膜 |
-
2017
- 2017-05-08 CN CN201710317874.3A patent/CN108866412B/zh active Active
- 2017-06-08 TW TW106118969A patent/TWI652375B/zh active
- 2017-10-25 US US15/792,791 patent/US10253423B2/en active Active
-
2018
- 2018-05-02 JP JP2018088667A patent/JP6634468B2/ja active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006059676A (ja) * | 2004-08-20 | 2006-03-02 | Konica Minolta Holdings Inc | 電子放出素子およびその製造方法 |
| JP2006190652A (ja) * | 2005-01-07 | 2006-07-20 | Samsung Electro Mech Co Ltd | 電界放出エミッタアレー及びその製造方法 |
| JP2009167084A (ja) * | 2008-01-16 | 2009-07-30 | Inha-Industry Partnership Inst | 水素貯蔵用遷移金属を電気めっきした多孔性炭素ナノファイバー複合体の製造方法 |
| JP2010267747A (ja) * | 2009-05-13 | 2010-11-25 | Nissan Motor Co Ltd | 金属基複合材料を使用した積層構造体 |
| JP2013185185A (ja) * | 2012-03-07 | 2013-09-19 | Shinshu Univ | Ni−W合金/CNT複合めっき方法およびNi−W合金/CNT複合めっき液 |
| CN105489872A (zh) * | 2015-12-30 | 2016-04-13 | 湘潭大学 | 一种铜/CNTs-锡/石墨多层结构锂离子电池负极材料及其制备方法 |
| CN105977038A (zh) * | 2016-06-21 | 2016-09-28 | 复旦大学 | 一种具有多孔结构的可拉伸超级电容器及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180319664A1 (en) | 2018-11-08 |
| CN108866412B (zh) | 2020-09-29 |
| JP6634468B2 (ja) | 2020-01-22 |
| CN108866412A (zh) | 2018-11-23 |
| US10253423B2 (en) | 2019-04-09 |
| TW201843351A (zh) | 2018-12-16 |
| TWI652375B (zh) | 2019-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6621500B2 (ja) | リチウムイオン電池負極及びリチウムイオン電池 | |
| JP6634468B2 (ja) | 三次元の多孔性複合材料の製造方法 | |
| JP6546680B2 (ja) | 三次元の多孔性複合材料 | |
| CN101497437B (zh) | 碳纳米管复合膜的制备方法 | |
| JP5663646B2 (ja) | 反応器 | |
| JP4504453B2 (ja) | 線状カーボンナノチューブ構造体の製造方法 | |
| JP5663648B2 (ja) | 反応器 | |
| JP6078024B2 (ja) | 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法 | |
| CN111640947B (zh) | 锂离子电池集流体、负极及该集流体与负极的制备方法 | |
| CN103794298A (zh) | 一种石墨烯导线的制备方法 | |
| CN105836735A (zh) | 超三维石墨烯的制备方法 | |
| CN109534315B (zh) | 一种无定形碳/纳-微米网络薄膜及其制备方法 | |
| JP2018190724A (ja) | 燃料電池電極及び燃料電池 | |
| JP6703033B2 (ja) | 生物センサーミクロ電極及び生物センサー | |
| EP3306685B1 (en) | Nanostructures of concentric layers | |
| JP2014065617A (ja) | グラフェンのバンドギャップ形成方法 | |
| KR101279316B1 (ko) | 탄소나노튜브 에미터, 그 제조방법 및 이를 이용한 전계방출소자 | |
| JP2006335583A (ja) | グラファイトナノファイバーの製造方法 | |
| JP6945424B2 (ja) | 導電性炭素皮膜の形成方法 | |
| CN119976751A (zh) | 一种兼具强度和韧性的六方氮化硼/石墨烯悬空复合支撑膜的制备方法与应用 | |
| CN118899205A (zh) | 金规则微筛支持膜的制备方法 | |
| TW201025415A (en) | Method for manufacturing field emission cathode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180502 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190731 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190924 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191204 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191216 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6634468 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |