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JP2018167458A - 離型フィルムおよびフレキシブルプリント基板の製造方法 - Google Patents

離型フィルムおよびフレキシブルプリント基板の製造方法 Download PDF

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Publication number
JP2018167458A
JP2018167458A JP2017065824A JP2017065824A JP2018167458A JP 2018167458 A JP2018167458 A JP 2018167458A JP 2017065824 A JP2017065824 A JP 2017065824A JP 2017065824 A JP2017065824 A JP 2017065824A JP 2018167458 A JP2018167458 A JP 2018167458A
Authority
JP
Japan
Prior art keywords
layer
release film
cushion layer
adhesive
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017065824A
Other languages
English (en)
Japanese (ja)
Inventor
田中 秀明
Hideaki Tanaka
秀明 田中
優人 谷川
Yuto Tanigawa
優人 谷川
勝司 安田
Shoji Yasuda
勝司 安田
喜吉 平塚
Kiyoshi Hiratsuka
喜吉 平塚
正志 中島
Masashi Nakajima
正志 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2017065824A priority Critical patent/JP2018167458A/ja
Priority to PCT/JP2017/047063 priority patent/WO2018179655A1/ja
Priority to TW107109678A priority patent/TW201836853A/zh
Publication of JP2018167458A publication Critical patent/JP2018167458A/ja
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68Release sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2017065824A 2017-03-29 2017-03-29 離型フィルムおよびフレキシブルプリント基板の製造方法 Pending JP2018167458A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017065824A JP2018167458A (ja) 2017-03-29 2017-03-29 離型フィルムおよびフレキシブルプリント基板の製造方法
PCT/JP2017/047063 WO2018179655A1 (ja) 2017-03-29 2017-12-27 離型フィルムおよびフレキシブルプリント基板の製造方法
TW107109678A TW201836853A (zh) 2017-03-29 2018-03-21 離型膜及柔性印刷電路板之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017065824A JP2018167458A (ja) 2017-03-29 2017-03-29 離型フィルムおよびフレキシブルプリント基板の製造方法

Publications (1)

Publication Number Publication Date
JP2018167458A true JP2018167458A (ja) 2018-11-01

Family

ID=63677700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017065824A Pending JP2018167458A (ja) 2017-03-29 2017-03-29 離型フィルムおよびフレキシブルプリント基板の製造方法

Country Status (3)

Country Link
JP (1) JP2018167458A (zh)
TW (1) TW201836853A (zh)
WO (1) WO2018179655A1 (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100588A (ja) * 1982-11-30 1984-06-09 日本メクトロン株式会社 回路基板へのカバ−フイルムの積層方法
JP2619034B2 (ja) * 1988-12-28 1997-06-11 三井石油化学工業株式会社 積層体からなる離型フィルム
JPH081858Y2 (ja) * 1990-02-16 1996-01-24 三菱化学エムケーブイ株式会社 キュアシート
JPH0433855A (ja) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc 金属箔張り積層板の製法
JP2003313313A (ja) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd 離型フィルム
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JP2005212453A (ja) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd 離型フィルム及び離型フィルムの製造方法
CN101479327B (zh) * 2006-06-27 2012-05-30 三井化学株式会社 膜及脱模膜
JP5368054B2 (ja) * 2008-10-15 2013-12-18 日本メクトロン株式会社 フレキシブル回路基板の製造方法及びフレキシブル回路基板
WO2011111826A1 (ja) * 2010-03-12 2011-09-15 積水化学工業株式会社 離型フィルム及び離型フィルムの製造方法

Also Published As

Publication number Publication date
WO2018179655A1 (ja) 2018-10-04
TW201836853A (zh) 2018-10-16

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