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JP2018039959A - 導電性接着剤組成物 - Google Patents

導電性接着剤組成物 Download PDF

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Publication number
JP2018039959A
JP2018039959A JP2016177044A JP2016177044A JP2018039959A JP 2018039959 A JP2018039959 A JP 2018039959A JP 2016177044 A JP2016177044 A JP 2016177044A JP 2016177044 A JP2016177044 A JP 2016177044A JP 2018039959 A JP2018039959 A JP 2018039959A
Authority
JP
Japan
Prior art keywords
conductive adhesive
adhesive composition
conductive
wiring board
inorganic particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016177044A
Other languages
English (en)
Japanese (ja)
Inventor
晃司 高見
Koji Takami
晃司 高見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2016177044A priority Critical patent/JP2018039959A/ja
Priority to KR1020197004703A priority patent/KR20190046796A/ko
Priority to PCT/JP2017/032554 priority patent/WO2018047957A1/ja
Priority to CN201780051113.6A priority patent/CN109563382A/zh
Priority to TW106130874A priority patent/TWI699787B/zh
Publication of JP2018039959A publication Critical patent/JP2018039959A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
JP2016177044A 2016-09-09 2016-09-09 導電性接着剤組成物 Pending JP2018039959A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016177044A JP2018039959A (ja) 2016-09-09 2016-09-09 導電性接着剤組成物
KR1020197004703A KR20190046796A (ko) 2016-09-09 2017-09-08 도전성 접착제 조성물
PCT/JP2017/032554 WO2018047957A1 (ja) 2016-09-09 2017-09-08 導電性接着剤組成物
CN201780051113.6A CN109563382A (zh) 2016-09-09 2017-09-08 导电性胶粘剂组合物
TW106130874A TWI699787B (zh) 2016-09-09 2017-09-08 導電性黏著劑組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016177044A JP2018039959A (ja) 2016-09-09 2016-09-09 導電性接着剤組成物

Publications (1)

Publication Number Publication Date
JP2018039959A true JP2018039959A (ja) 2018-03-15

Family

ID=61562855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016177044A Pending JP2018039959A (ja) 2016-09-09 2016-09-09 導電性接着剤組成物

Country Status (5)

Country Link
JP (1) JP2018039959A (zh)
KR (1) KR20190046796A (zh)
CN (1) CN109563382A (zh)
TW (1) TWI699787B (zh)
WO (1) WO2018047957A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020116409A1 (ja) * 2018-12-03 2020-06-11 タツタ電線株式会社 グランド部材及びシールドプリント配線板
JPWO2021167047A1 (zh) * 2020-02-19 2021-08-26
DE102020204215A1 (de) 2020-04-01 2021-10-07 Rampf Holding GmbH + Co. KG Leitfähiges Polyurethan
JP7747156B1 (ja) * 2024-12-17 2025-10-01 ａｒｔｉｅｎｃｅ株式会社 シート状インダクタ、フレキシブルプリント配線板、モジュール、及び積層体の使用方法
WO2025206251A1 (ja) * 2024-03-29 2025-10-02 タツタ電線株式会社 電磁波シールドフィルム

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113811583A (zh) * 2019-05-20 2021-12-17 拓自达电线株式会社 导电性接合片
JP6904464B2 (ja) * 2019-06-12 2021-07-14 東洋インキＳｃホールディングス株式会社 プリント配線板
JP6956926B1 (ja) * 2020-01-07 2021-11-02 タツタ電線株式会社 電磁波シールドフィルム
KR20230075473A (ko) * 2020-09-28 2023-05-31 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 무기 필러 함유 조성물, 및, 회로 접속 구조체 및 그 제조 방법
CN112852328A (zh) * 2021-01-11 2021-05-28 常州威斯双联科技有限公司 一种超导电膜及其制备工艺
TWI862884B (zh) * 2021-02-24 2024-11-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
TWI832229B (zh) * 2021-11-19 2024-02-11 達發科技股份有限公司 半導體封裝

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07292048A (ja) * 1994-04-28 1995-11-07 Denki Kagaku Kogyo Kk 硬化性樹脂組成物
JPH1021746A (ja) * 1996-07-02 1998-01-23 Toshiba Chem Corp 異方性導電膜
JP2000123639A (ja) * 1998-10-12 2000-04-28 Sony Chem Corp 遮光性異方性導電性接着フィルム及び液晶表示素子
WO2001072921A1 (fr) * 2000-03-28 2001-10-04 Fujitsu Limited Composition adhesive
JP2013077557A (ja) * 2011-09-13 2013-04-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
WO2014046053A1 (ja) * 2012-09-21 2014-03-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2016102204A (ja) * 2014-11-12 2016-06-02 デクセリアルズ株式会社 熱硬化性接着組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1189173A (en) 1981-11-20 1985-06-18 Alice W.L. Lin Elements and methods of preparing elements containing low-resistance contact electrodes for cdte semiconductor materials
JP4031545B2 (ja) * 1997-01-24 2008-01-09 富士通株式会社 接着剤
KR20090027845A (ko) * 2007-09-13 2009-03-18 광운대학교 산학협력단 Ｎａｎｏ ｆｕｍｅｄ ｓｉｌｉｃａ를 포함하는 칩 적층용비 전도성 접착제의 제조방법
JP6255816B2 (ja) 2013-09-09 2018-01-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
WO2016082138A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Composition for electrically insulating polymer-inorganic hybrid material with high thermal conductivity

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07292048A (ja) * 1994-04-28 1995-11-07 Denki Kagaku Kogyo Kk 硬化性樹脂組成物
JPH1021746A (ja) * 1996-07-02 1998-01-23 Toshiba Chem Corp 異方性導電膜
JP2000123639A (ja) * 1998-10-12 2000-04-28 Sony Chem Corp 遮光性異方性導電性接着フィルム及び液晶表示素子
WO2001072921A1 (fr) * 2000-03-28 2001-10-04 Fujitsu Limited Composition adhesive
JP2013077557A (ja) * 2011-09-13 2013-04-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
WO2014046053A1 (ja) * 2012-09-21 2014-03-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2016102204A (ja) * 2014-11-12 2016-06-02 デクセリアルズ株式会社 熱硬化性接着組成物

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113170603B (zh) * 2018-12-03 2025-03-28 拓自达电线株式会社 接地构件及屏蔽印制线路板
KR102640186B1 (ko) * 2018-12-03 2024-02-22 타츠타 전선 주식회사 그라운드 부재 및 차폐 프린트 배선판
KR20210095876A (ko) * 2018-12-03 2021-08-03 타츠타 전선 주식회사 그라운드 부재 및 차폐 프린트 배선판
WO2020116409A1 (ja) * 2018-12-03 2020-06-11 タツタ電線株式会社 グランド部材及びシールドプリント配線板
JPWO2020116409A1 (ja) * 2018-12-03 2021-10-14 タツタ電線株式会社 グランド部材及びシールドプリント配線板
US11653439B2 (en) 2018-12-03 2023-05-16 Tatsuta Electric Wire & Cable Co., Ltd. Ground member and shielded printed wiring board
CN113170603A (zh) * 2018-12-03 2021-07-23 拓自达电线株式会社 接地构件及屏蔽印制线路板
JP7282802B2 (ja) 2018-12-03 2023-05-29 タツタ電線株式会社 グランド部材及びシールドプリント配線板
WO2021167047A1 (ja) * 2020-02-19 2021-08-26 タツタ電線株式会社 導電性接着剤、電磁波シールドフィルム及び導電性ボンディングフィルム
JP7470179B2 (ja) 2020-02-19 2024-04-17 タツタ電線株式会社 導電性接着剤、電磁波シールドフィルム及び導電性ボンディングフィルム
JPWO2021167047A1 (zh) * 2020-02-19 2021-08-26
KR102887121B1 (ko) * 2020-02-19 2025-11-17 타츠타 전선 주식회사 도전성 접착제, 전자파 차폐 필름 및 도전성 본딩 필름
DE102020204215A1 (de) 2020-04-01 2021-10-07 Rampf Holding GmbH + Co. KG Leitfähiges Polyurethan
WO2021198215A1 (de) 2020-04-01 2021-10-07 Rampf Holding Gmbh & Co. Kg Leitfähiges polyurethan
WO2025206251A1 (ja) * 2024-03-29 2025-10-02 タツタ電線株式会社 電磁波シールドフィルム
JP7747156B1 (ja) * 2024-12-17 2025-10-01 ａｒｔｉｅｎｃｅ株式会社 シート状インダクタ、フレキシブルプリント配線板、モジュール、及び積層体の使用方法

Also Published As

Publication number Publication date
TW201812795A (zh) 2018-04-01
CN109563382A (zh) 2019-04-02
TWI699787B (zh) 2020-07-21
WO2018047957A1 (ja) 2018-03-15
KR20190046796A (ko) 2019-05-07

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