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IL160189A0 - Method for producing contacts and printed circuit packages - Google Patents

Method for producing contacts and printed circuit packages

Info

Publication number
IL160189A0
IL160189A0 IL16018902A IL16018902A IL160189A0 IL 160189 A0 IL160189 A0 IL 160189A0 IL 16018902 A IL16018902 A IL 16018902A IL 16018902 A IL16018902 A IL 16018902A IL 160189 A0 IL160189 A0 IL 160189A0
Authority
IL
Israel
Prior art keywords
printed circuit
circuit packages
producing contacts
contacts
producing
Prior art date
Application number
IL16018902A
Other languages
English (en)
Original Assignee
Zeiss Stiftung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10141571A external-priority patent/DE10141571B8/de
Priority claimed from DE10225373A external-priority patent/DE10225373A1/de
Application filed by Zeiss Stiftung filed Critical Zeiss Stiftung
Publication of IL160189A0 publication Critical patent/IL160189A0/xx

Links

Classifications

    • H10W72/071—
    • H10W20/056—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W20/023—
    • H10W20/0234—
    • H10W20/0242—
    • H10W20/0245—
    • H10W72/0198—
    • H10W72/20—
    • H10W74/129—
    • H10W90/00—
    • H10W99/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H10P72/7432—
    • H10W70/65—
    • H10W70/656—
    • H10W72/012—
    • H10W72/019—
    • H10W72/07251—
    • H10W72/244—
    • H10W72/248—
    • H10W72/251—
    • H10W72/29—
    • H10W72/922—
    • H10W72/923—
    • H10W72/952—
    • H10W72/983—
    • H10W90/22—
    • H10W90/291—
    • H10W90/297—
    • H10W90/722—
IL16018902A 2001-08-24 2002-08-26 Method for producing contacts and printed circuit packages IL160189A0 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10141558 2001-08-24
DE10141571A DE10141571B8 (de) 2001-08-24 2001-08-24 Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist
DE10225373A DE10225373A1 (de) 2001-08-24 2002-06-06 Verfahren zum Kontaktieren und Gehäusen von integrierten Schaltungen
PCT/EP2002/009498 WO2003019653A2 (de) 2001-08-24 2002-08-26 Verfahren zum kontaktieren und gehäusen von integrierten schaltungen

Publications (1)

Publication Number Publication Date
IL160189A0 true IL160189A0 (en) 2004-07-25

Family

ID=27214577

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16018902A IL160189A0 (en) 2001-08-24 2002-08-26 Method for producing contacts and printed circuit packages
IL160189A IL160189A (en) 2001-08-24 2004-02-03 Method for producing contacts and printed circuit packages

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL160189A IL160189A (en) 2001-08-24 2004-02-03 Method for producing contacts and printed circuit packages

Country Status (8)

Country Link
US (6) US6911392B2 (xx)
EP (2) EP2287916A3 (xx)
JP (2) JP4499412B2 (xx)
KR (1) KR100638379B1 (xx)
CN (2) CN100578816C (xx)
AU (1) AU2002356147A1 (xx)
IL (2) IL160189A0 (xx)
WO (1) WO2003019653A2 (xx)

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JP2005501414A (ja) 2005-01-13
US20100065883A1 (en) 2010-03-18
US20110021002A1 (en) 2011-01-27
JP5329996B2 (ja) 2013-10-30
US20130137259A1 (en) 2013-05-30
US8349707B2 (en) 2013-01-08
CN101714516A (zh) 2010-05-26
US6911392B2 (en) 2005-06-28
US7821106B2 (en) 2010-10-26
CN1547778A (zh) 2004-11-17
US20050042786A1 (en) 2005-02-24
WO2003019653A2 (de) 2003-03-06
AU2002356147A8 (en) 2003-03-10
CN100578816C (zh) 2010-01-06
US7880179B2 (en) 2011-02-01
IL160189A (en) 2007-12-03
EP1419534A2 (de) 2004-05-19
JP4499412B2 (ja) 2010-07-07
US20030113979A1 (en) 2003-06-19
US20080150063A1 (en) 2008-06-26
US7700957B2 (en) 2010-04-20
EP2287916A3 (de) 2012-01-25
AU2002356147A1 (en) 2003-03-10
WO2003019653A3 (de) 2003-11-20
EP2287916A2 (de) 2011-02-23
KR100638379B1 (ko) 2006-10-26
JP2009094540A (ja) 2009-04-30
KR20040036735A (ko) 2004-04-30

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