[go: up one dir, main page]

HK1112012B - 高分子材料，高分子材料制泡沫，以及使用其制成的研磨垫 - Google Patents

高分子材料，高分子材料制泡沫，以及使用其制成的研磨垫 Download PDF

Info

Publication number
HK1112012B
HK1112012B HK08107090.6A HK08107090A HK1112012B HK 1112012 B HK1112012 B HK 1112012B HK 08107090 A HK08107090 A HK 08107090A HK 1112012 B HK1112012 B HK 1112012B
Authority
HK
Hong Kong
Prior art keywords
polishing
polishing pad
polyurethane
diol
weight
Prior art date
Application number
HK08107090.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
HK1112012A1 (zh
Inventor
Chihiro Okamoto
Shinya Kato
Shunji Kaneda
Hirofumi Kikuchi
Original Assignee
Kuraray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co., Ltd. filed Critical Kuraray Co., Ltd.
Priority claimed from PCT/JP2006/319215 external-priority patent/WO2007034980A1/ja
Publication of HK1112012A1 publication Critical patent/HK1112012A1/zh
Publication of HK1112012B publication Critical patent/HK1112012B/zh

Links

HK08107090.6A 2005-09-22 2006-09-21 高分子材料，高分子材料制泡沫，以及使用其制成的研磨垫 HK1112012B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005275768 2005-09-22
JP2005275768 2005-09-22
JP2006094698 2006-03-30
JP2006094698 2006-03-30
PCT/JP2006/319215 WO2007034980A1 (ja) 2005-09-22 2006-09-21 高分子材料、それから得られる発泡体及びこれらを用いた研磨パッド

Publications (2)

Publication Number Publication Date
HK1112012A1 HK1112012A1 (zh) 2008-08-22
HK1112012B true HK1112012B (zh) 2017-04-07

Family

ID=

Similar Documents

Publication Publication Date Title
EP1927605B1 (en) Polymer material, foam obtained from same, and polishing pad using those
EP3493244B1 (en) Polishing pad and polishing method using same
KR101084808B1 (ko) 금속 막 연마용 패드 및 그것을 이용하는 금속 막의 연마 방법
EP3213868B1 (en) Nonporous molded article for polishing layer, polishing pad, and polishing method
EP3225357B1 (en) Polishing-layer molded body, and polishing pad
CN101678527A (zh) 用于抛光垫的衬垫和使用该衬垫的抛光垫
JP2008184597A (ja) 研磨パッドの製造方法
JP4994894B2 (ja) 樹脂発泡体およびそれからなる研磨パッド
JP6948196B2 (ja) ポリウレタン、研磨層用ポリウレタン成形体及び研磨パッド
JP4950564B2 (ja) 高分子材料、それから得られる発泡体およびこれらを用いた研磨パッド
TW202328258A (zh) 研磨層用熱塑性聚胺基甲酸酯、研磨層、及研磨墊
HK1112012B (zh) 高分子材料，高分子材料制泡沫，以及使用其制成的研磨垫
JP7611411B2 (ja) 研磨パッド
JP2007091898A (ja) 樹脂発泡体及びこれを用いた研磨パッド
EP4474106A1 (en) Polishing layer, polishing pad, method for manufacturing polishing pad, and polishing method
HK1138108A (zh) 金属膜抛光垫和使用该金属膜抛光垫的金属膜抛光方法
HK1138108B (zh) 金属膜抛光垫和使用该金属膜抛光垫的金属膜抛光方法
HK1236889A1 (zh) 抛光层用成型体及抛光垫