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DE60103701D1 - Verfahren und Vorrichtung zum schleifen von Halbleiterscheiben - Google Patents

Verfahren und Vorrichtung zum schleifen von Halbleiterscheiben

Info

Publication number
DE60103701D1
DE60103701D1 DE60103701T DE60103701T DE60103701D1 DE 60103701 D1 DE60103701 D1 DE 60103701D1 DE 60103701 T DE60103701 T DE 60103701T DE 60103701 T DE60103701 T DE 60103701T DE 60103701 D1 DE60103701 D1 DE 60103701D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
grinding semiconductor
grinding
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60103701T
Other languages
English (en)
Other versions
DE60103701T2 (de
Inventor
Kazuhisa Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of DE60103701D1 publication Critical patent/DE60103701D1/de
Application granted granted Critical
Publication of DE60103701T2 publication Critical patent/DE60103701T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H10P95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE60103701T 2000-07-04 2001-07-03 Verfahren und Vorrichtung zum schleifen von Halbleiterscheiben Expired - Lifetime DE60103701T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000202661A JP2002025961A (ja) 2000-07-04 2000-07-04 半導体ウエーハの研削方法
JP2000202661 2000-07-04

Publications (2)

Publication Number Publication Date
DE60103701D1 true DE60103701D1 (de) 2004-07-15
DE60103701T2 DE60103701T2 (de) 2005-06-16

Family

ID=18700155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103701T Expired - Lifetime DE60103701T2 (de) 2000-07-04 2001-07-03 Verfahren und Vorrichtung zum schleifen von Halbleiterscheiben

Country Status (7)

Country Link
US (1) US6527627B2 (de)
EP (1) EP1170088B1 (de)
JP (1) JP2002025961A (de)
KR (1) KR100709457B1 (de)
DE (1) DE60103701T2 (de)
SG (1) SG116418A1 (de)
TW (1) TW490359B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010035163A (ko) * 2001-01-09 2001-05-07 이민기 세계 헤드헌터 네트워크를 이용한 국제 고급인력 수급인터넷망
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP2002359211A (ja) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd 切削機
US8268114B2 (en) * 2001-09-28 2012-09-18 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, workpiece polishing apparatus and polishing method
US7018268B2 (en) 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
JP2004319697A (ja) * 2003-04-15 2004-11-11 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置
JP4464113B2 (ja) * 2003-11-27 2010-05-19 株式会社ディスコ ウエーハの加工装置
US6910956B1 (en) 2003-12-22 2005-06-28 Powerchip Semiconductor Corp. Wafer grinding apparatus
US7011567B2 (en) * 2004-02-05 2006-03-14 Robert Gerber Semiconductor wafer grinder
US7163441B2 (en) * 2004-02-05 2007-01-16 Robert Gerber Semiconductor wafer grinder
JP4427396B2 (ja) * 2004-06-30 2010-03-03 株式会社ディスコ 加工装置
TWI251924B (en) * 2004-12-29 2006-03-21 Siliconware Precision Industries Co Ltd A process applied to semiconductor
US7713846B2 (en) * 2004-12-29 2010-05-11 Siliconware Precision Industries Co., Ltd. Process applied to semiconductor
JP2007243112A (ja) * 2006-03-13 2007-09-20 Disco Abrasive Syst Ltd ウェーハの凹状加工方法及び凹凸吸収パッド
JP4806282B2 (ja) * 2006-03-29 2011-11-02 株式会社ディスコ ウエーハの処理装置
JP4937674B2 (ja) * 2006-08-16 2012-05-23 株式会社ディスコ ウエーハのエッチング方法
KR101109078B1 (ko) * 2009-11-17 2012-03-13 (주)엘이티 기판 지지 유닛 및 이를 포함하는 기판 검사 장치, 그리고 이를 이용한 기판 검사 방법
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
CN107743430A (zh) * 2015-03-26 2018-02-27 毛瑟－韦尔克奥伯恩多夫机械制造有限公司 加工单元
KR20160125585A (ko) * 2015-04-21 2016-11-01 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
JP2018114573A (ja) * 2017-01-17 2018-07-26 株式会社ディスコ 研削装置
CN108000267A (zh) * 2017-12-26 2018-05-08 北京中电科电子装备有限公司 减薄机
JP7171140B2 (ja) * 2018-12-11 2022-11-15 株式会社ディスコ 被加工物の加工方法および樹脂シートユニット
US12176202B2 (en) * 2020-10-08 2024-12-24 Okmetic Oy Manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure
CN119017171B (zh) * 2024-10-25 2024-12-27 千予半导体材料(江苏)有限公司 一种半导体原料研磨设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377096A (en) 1967-06-02 1968-04-09 Wood S Powr Grip Co Inc Vacuum gripping pad
DE3771857D1 (de) * 1986-12-08 1991-09-05 Sumitomo Electric Industries Flaechenschleifmaschine.
JP3050910B2 (ja) * 1990-11-30 2000-06-12 東芝セラミックス株式会社 薄板状部材の保持装置
JPH06302572A (ja) * 1993-04-12 1994-10-28 Hitachi Ltd 半導体装置の製造方法及びテープ貼付剥離装置
DE4335980C2 (de) * 1993-10-21 1998-09-10 Wacker Siltronic Halbleitermat Verfahren zum Positionieren einer Werkstückhalterung
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
DE19641534C2 (de) * 1996-10-09 1998-09-10 Genauigkeits & Maschinenbau Nu Schleifautomat
US5816895A (en) * 1997-01-17 1998-10-06 Tokyo Seimitsu Co., Ltd. Surface grinding method and apparatus
JPH1123450A (ja) * 1997-07-09 1999-01-29 Mitsubishi Heavy Ind Ltd ガス濃度検知方法及び装置
SG70097A1 (en) * 1997-08-15 2000-01-25 Disio Corp Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
SG71182A1 (en) 1997-12-26 2000-03-21 Canon Kk Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
JP2000015570A (ja) * 1998-07-02 2000-01-18 Disco Abrasive Syst Ltd 研削装置
JP4009367B2 (ja) * 1998-08-04 2007-11-14 株式会社ディスコ スピン洗浄・乾燥方法
JP2000158334A (ja) * 1998-11-30 2000-06-13 Disco Abrasive Syst Ltd 作業用トレー及び研削方法
US6254155B1 (en) * 1999-01-11 2001-07-03 Strasbaugh, Inc. Apparatus and method for reliably releasing wet, thin wafers
US6227950B1 (en) * 1999-03-08 2001-05-08 Speedfam-Ipec Corporation Dual purpose handoff station for workpiece polishing machine

Also Published As

Publication number Publication date
EP1170088B1 (de) 2004-06-09
SG116418A1 (en) 2005-11-28
US6527627B2 (en) 2003-03-04
KR100709457B1 (ko) 2007-04-18
JP2002025961A (ja) 2002-01-25
TW490359B (en) 2002-06-11
EP1170088A2 (de) 2002-01-09
DE60103701T2 (de) 2005-06-16
KR20020017943A (ko) 2002-03-07
US20020004359A1 (en) 2002-01-10
EP1170088A3 (de) 2002-01-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition