DE102004008900A8 - Vorrichtung und Verfahren zum Verarbeiten von Wafern - Google Patents

Vorrichtung und Verfahren zum Verarbeiten von Wafern Download PDF

Info

Publication number: DE102004008900A8
Authority: DE; Germany
Prior art keywords: processing wafers; wafers; processing
Prior art date: 2003-02-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

DE102004008900A

Other languages

English (en)

Other versions

DE102004008900B4 (de

DE102004008900A1 (de

Inventor

Kun-Hyung Suwon Lee

Hyun-Ho Suwon Cho

Hee-Sun Yongin Chae

Sun-Yong Lee

Soo-Wong Suwon Lee

Jae-Hyung Yongin Jung

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Samsung Electronics Co Ltd

Original Assignee

Samsung Electronics Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-02-25

Filing date

2004-02-24

Publication date

2005-05-19

2003-02-25 Priority claimed from KR1020030011777A external-priority patent/KR100562500B1/ko

2004-02-24 Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd

2004-10-14 Publication of DE102004008900A1 publication Critical patent/DE102004008900A1/de

2005-05-19 Publication of DE102004008900A8 publication Critical patent/DE102004008900A8/de

2009-05-07 Application granted granted Critical

2009-05-07 Publication of DE102004008900B4 publication Critical patent/DE102004008900B4/de

2024-02-25 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10P72/0402—
- H10P72/3406—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting

DE102004008900A 2003-02-25 2004-02-24 Vorrichtung zum Verarbeiten von Wafern Expired - Fee Related DE102004008900B4 (de)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
KR1020030011777A KR100562500B1 (ko)	2003-02-25	2003-02-25	기판 이송 시스템 및 기판 이송 방법
KR03-11777		2003-02-25
US10/619112		2003-07-14
US10/619,112 US20040165973A1 (en)	2003-02-25	2003-07-14	Apparatus and method for processing wafers

Publications (3)

Publication Number	Publication Date
DE102004008900A1 DE102004008900A1 (de)	2004-10-14
DE102004008900A8 true DE102004008900A8 (de)	2005-05-19
DE102004008900B4 DE102004008900B4 (de)	2009-05-07

Family

ID=36386485

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE102004008900A Expired - Fee Related DE102004008900B4 (de)	2003-02-25	2004-02-24	Vorrichtung zum Verarbeiten von Wafern

Country Status (5)

Country	Link
US (1)	US7398801B2 (de)
JP (1)	JP4384519B2 (de)
CN (1)	CN100382231C (de)
DE (1)	DE102004008900B4 (de)
TW (1)	TWI228750B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4666183B2 (ja) *	2005-11-30	2011-04-06	Ｔｄｋ株式会社	密閉容器の蓋開閉システムに用いられるパージ用パイプユニット
JP4278676B2 (ja)	2005-11-30	2009-06-17	Ｔｄｋ株式会社	密閉容器の蓋開閉システム
JP4098338B2 (ja) *	2006-07-20	2008-06-11	川崎重工業株式会社	ウェハ移載装置および基板移載装置
FR2933813B1 (fr) *	2008-07-11	2010-12-24	Alcatel Lucent	Dispositif de purge et procede.
KR101690327B1 (ko) *	2009-03-31	2016-12-27	램 리써치 코포레이션	플라즈마 어레스터 인서트
WO2013040330A1 (en)	2011-09-14	2013-03-21	Brooks Automation, Inc.	Load station
JP2013161924A (ja) *	2012-02-03	2013-08-19	Tokyo Electron Ltd	基板収容容器のパージ装置及びパージ方法
KR101344215B1 (ko)	2012-06-01	2013-12-23	주식회사 테스	박막 증착장치
US9662688B2 (en)	2012-07-09	2017-05-30	Kla-Tencor Corporation	Apparatus and method for cross-flow purge for optical components in a chamber
CN117174611A (zh)	2013-08-12	2023-12-05	应用材料公司	具有工厂接口环境控制的基板处理系统、装置和方法
US9607873B2 (en) *	2014-02-07	2017-03-28	Taiwan Semiconductor Manufacturing Company Ltd.	Apparatus and operation method thereof
CN103904010B (zh) *	2014-03-20	2017-01-04	上海华力微电子有限公司	一种晶圆传送装置
KR20210080633A (ko)	2014-11-25	2021-06-30	어플라이드 머티어리얼스, 인코포레이티드	기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들
JP6429015B2 (ja) *	2014-12-26	2018-11-28	Tdk株式会社	ガスパージユニットおよびガスパージ装置
CN104766814A (zh) *	2015-03-31	2015-07-08	上海华力微电子有限公司	一种防止湿法清洗工艺中自然氧化膜生长的装置及方法
US10566216B2 (en) *	2017-06-09	2020-02-18	Lam Research Corporation	Equipment front end module gas recirculation
TWI635559B (zh) *	2017-07-25	2018-09-11	春田科技顧問股份有限公司	裝載埠的吹淨裝置及其吹淨方法
TWI779134B (zh) *	2017-11-27	2022-10-01	荷蘭商Ａｓｍ智慧財產控股私人有限公司	用於儲存晶圓匣的儲存裝置及批爐總成

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0408216A3 (en) *	1989-07-11	1991-09-18	Hitachi, Ltd.	Method for processing wafers and producing semiconductor devices and apparatus for producing the same
JPH0846005A (ja)	1994-07-26	1996-02-16	Takenaka Komuten Co Ltd	ウエーハ移載装置
TW344847B (en) *	1996-08-29	1998-11-11	Tokyo Electron Co Ltd	Substrate treatment system, substrate transfer system, and substrate transfer method
JP3425592B2 (ja) *	1997-08-12	2003-07-14	東京エレクトロン株式会社	処理装置
JP3722604B2 (ja) *	1997-11-13	2005-11-30	大日本スクリーン製造株式会社	基板処理装置
JP3367421B2 (ja)	1998-04-16	2003-01-14	東京エレクトロン株式会社	被処理体の収納装置及び搬出入ステージ
US6032704A (en) *	1998-04-30	2000-03-07	Taiwan Semiconductor Manufacturing Co., Ltd.	Method and apparatus for storing wafers without moisture absorption
NL1009327C2 (nl) *	1998-06-05	1999-12-10	Asm Int	Werkwijze en inrichting voor het overbrengen van wafers.
US6109915A (en) *	1998-12-08	2000-08-29	United Microelectronics Corp.	Drafting apparatus
US6364762B1 (en) *	1999-09-30	2002-04-02	Lam Research Corporation	Wafer atmospheric transport module having a controlled mini-environment
US7241993B2 (en) *	2000-06-27	2007-07-10	Ebara Corporation	Inspection system by charged particle beam and method of manufacturing devices using the system
US6593152B2 (en) *	2000-11-02	2003-07-15	Ebara Corporation	Electron beam apparatus and method of manufacturing semiconductor device using the apparatus
JP2002158155A (ja) *	2000-11-17	2002-05-31	Canon Inc	露光装置および露光方法
US6448537B1 (en) *	2000-12-11	2002-09-10	Eric Anton Nering	Single-wafer process chamber thermal convection processes
JP2002359273A (ja) *	2001-06-01	2002-12-13	Takehide Hayashi	ウェハー搬送容器用オープナー
JP2003007813A (ja) *	2001-06-20	2003-01-10	Nec Corp	半導体ウエハの保管ボックス、運搬装置、運搬方法及び保管倉庫
JP2003007799A (ja) *	2001-06-21	2003-01-10	Tokyo Electron Ltd	処理システム
JP2003092345A (ja) *	2001-07-13	2003-03-28	Semiconductor Leading Edge Technologies Inc	基板収納容器、基板搬送システム、保管装置及びガス置換方法
JP3880343B2 (ja) *	2001-08-01	2007-02-14	株式会社ルネサステクノロジ	ロードポート、基板処理装置および雰囲気置換方法

2004
- 2004-02-05 TW TW093102575A patent/TWI228750B/zh not_active IP Right Cessation
- 2004-02-19 JP JP2004043111A patent/JP4384519B2/ja not_active Expired - Fee Related
- 2004-02-24 DE DE102004008900A patent/DE102004008900B4/de not_active Expired - Fee Related
- 2004-02-25 CN CNB2004100070212A patent/CN100382231C/zh not_active Expired - Fee Related
2005
- 2005-12-02 US US11/292,674 patent/US7398801B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE102004008900B4 (de)	2009-05-07
JP2004260172A (ja)	2004-09-16
DE102004008900A1 (de)	2004-10-14
CN1525529A (zh)	2004-09-01
US20060104750A1 (en)	2006-05-18
TWI228750B (en)	2005-03-01
TW200416807A (en)	2004-09-01
JP4384519B2 (ja)	2009-12-16
US7398801B2 (en)	2008-07-15
CN100382231C (zh)	2008-04-16

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Legal Events

Date	Code	Title	Description
2004-10-14	OP8	Request for examination as to paragraph 44 patent law
2005-01-20	8181	Inventor (new situation)	Inventor name: CHAE, HEE-SUN, YONGIN, KYONGGI, KR Inventor name: LEE, SOO-WONG, SUWON, KYONGGI, KR Inventor name: LEE, KUN-HYUNG, SUWON, KYONGGI, KR Inventor name: JUNG, JAE-HYUNG, YONGIN, KYONGGI, KR Inventor name: CHO, HYUN-HO, SUWON, KYONGGI, KR Inventor name: LEE, SUN-YONG, SEOUL, KR
2005-05-19	8196	Reprint of faulty title page (publication) german patentblatt: part 1a6
2005-05-19	OP8	Request for examination as to paragraph 44 patent law
2009-11-05	8364	No opposition during term of opposition
2012-01-12	R119	Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee	Effective date: 20110901