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DE112005001256T5 - Vorrichtung und Verfahren zum Prüfen von Halbleiter-Wafern - Google Patents

Vorrichtung und Verfahren zum Prüfen von Halbleiter-Wafern Download PDF

Info

Publication number
DE112005001256T5
DE112005001256T5 DE112005001256T DE112005001256T DE112005001256T5 DE 112005001256 T5 DE112005001256 T5 DE 112005001256T5 DE 112005001256 T DE112005001256 T DE 112005001256T DE 112005001256 T DE112005001256 T DE 112005001256T DE 112005001256 T5 DE112005001256 T5 DE 112005001256T5
Authority
DE
Germany
Prior art keywords
semiconductor wafers
testing semiconductor
testing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112005001256T
Other languages
English (en)
Other versions
DE112005001256B4 (de
Inventor
Fumi Nabeshima
Kazuya Togashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Komatsu Electronic Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd
Publication of DE112005001256T5 publication Critical patent/DE112005001256T5/de
Application granted granted Critical
Publication of DE112005001256B4 publication Critical patent/DE112005001256B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE112005001256.5T 2004-06-02 2005-06-01 Vorrichtung und Verfahren zum Prüfen von Halbleiter-Wafern Expired - Lifetime DE112005001256B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004164132A JP4510521B2 (ja) 2004-06-02 2004-06-02 半導体ウェハの検査装置及び方法
JP2004-164132 2004-06-02
PCT/JP2005/010051 WO2005119226A1 (ja) 2004-06-02 2005-06-01 半導体ウェハの検査装置及び方法

Publications (2)

Publication Number Publication Date
DE112005001256T5 true DE112005001256T5 (de) 2007-05-16
DE112005001256B4 DE112005001256B4 (de) 2015-02-12

Family

ID=35463016

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005001256.5T Expired - Lifetime DE112005001256B4 (de) 2004-06-02 2005-06-01 Vorrichtung und Verfahren zum Prüfen von Halbleiter-Wafern

Country Status (5)

Country Link
US (1) US7522290B2 (de)
JP (1) JP4510521B2 (de)
DE (1) DE112005001256B4 (de)
TW (1) TWI259510B (de)
WO (1) WO2005119226A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2914422B1 (fr) * 2007-03-28 2009-07-03 Soitec Silicon On Insulator Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.
KR101429723B1 (ko) * 2008-12-08 2014-09-24 삼성전자주식회사 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치
FR2959864B1 (fr) 2010-05-06 2013-01-18 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices en mouvement.
JP2017187350A (ja) * 2016-04-04 2017-10-12 住友化学株式会社 半導体ウエハーの表面検査方法
CN110794762B (zh) * 2019-11-06 2021-02-05 北京轩宇智能科技有限公司 用于打磨机器人的控制方法及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796495A (en) * 1972-05-30 1974-03-12 Zenith Radio Corp Apparatus and methods for scanning phase profilometry
JPS57132044A (en) * 1981-02-10 1982-08-16 Hitachi Metals Ltd Discriminating method of surface defect
JPH07239212A (ja) * 1994-02-28 1995-09-12 Nikon Corp 位置検出装置
JP2000162141A (ja) * 1998-11-27 2000-06-16 Hitachi Ltd 欠陥検査装置および方法
JP2001176943A (ja) * 1999-12-15 2001-06-29 Shin Etsu Handotai Co Ltd 半導体ウェーハの評価方法
JP3453128B2 (ja) * 2001-06-21 2003-10-06 レーザーテック株式会社 光学式走査装置及び欠陥検出装置
US6943898B2 (en) * 2002-05-07 2005-09-13 Applied Materials Israel, Ltd. Apparatus and method for dual spot inspection of repetitive patterns
US7012691B2 (en) * 2002-08-06 2006-03-14 Sharp Kabushiki Kaisha Optical moving information measuring apparatus and carrier system incorporating the same
US7019840B2 (en) * 2003-06-17 2006-03-28 Seagate Technology Llc Dual-beam interferometer for ultra-smooth surface topographical measurements

Also Published As

Publication number Publication date
US7522290B2 (en) 2009-04-21
JP2005347448A (ja) 2005-12-15
US20070229815A1 (en) 2007-10-04
TWI259510B (en) 2006-08-01
WO2005119226A1 (ja) 2005-12-15
DE112005001256B4 (de) 2015-02-12
TW200540948A (en) 2005-12-16
JP4510521B2 (ja) 2010-07-28

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Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20111228

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R082 Change of representative

Representative=s name: MERH-IP MATIAS ERNY REICHL HOFFMANN, DE

R081 Change of applicant/patentee

Owner name: SUMCO TECHXIV CORPORATION, OMURA-SHI, JP

Free format text: FORMER OWNER: KOMATSU ELECTRONIC METALS CO., LTD., TOKIO/TOKYO, JP

Effective date: 20141216

R082 Change of representative

Representative=s name: MERH-IP MATIAS ERNY REICHL HOFFMANN, DE

Effective date: 20141216

Representative=s name: MERH-IP MATIAS ERNY REICHL HOFFMANN PATENTANWA, DE

Effective date: 20141216

R020 Patent grant now final
R071 Expiry of right