[go: up one dir, main page]

DE60322144D1 - Verfahren und Vorrichtung zum chemisch-mechanischen Polieren - Google Patents

Verfahren und Vorrichtung zum chemisch-mechanischen Polieren

Info

Publication number
DE60322144D1
DE60322144D1 DE60322144T DE60322144T DE60322144D1 DE 60322144 D1 DE60322144 D1 DE 60322144D1 DE 60322144 T DE60322144 T DE 60322144T DE 60322144 T DE60322144 T DE 60322144T DE 60322144 D1 DE60322144 D1 DE 60322144D1
Authority
DE
Germany
Prior art keywords
mechanical polishing
chemical mechanical
polishing
chemical
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60322144T
Other languages
English (en)
Inventor
Toshiro Doi
Takashi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOI, TOSHIRO, FUKUOKA-SHI, JP
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of DE60322144D1 publication Critical patent/DE60322144D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60322144T 2002-05-17 2003-05-16 Verfahren und Vorrichtung zum chemisch-mechanischen Polieren Expired - Fee Related DE60322144D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002142632A JP2003332274A (ja) 2002-05-17 2002-05-17 化学的機械研磨方法及び化学的機械研磨装置

Publications (1)

Publication Number Publication Date
DE60322144D1 true DE60322144D1 (de) 2008-08-28

Family

ID=29267831

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322144T Expired - Fee Related DE60322144D1 (de) 2002-05-17 2003-05-16 Verfahren und Vorrichtung zum chemisch-mechanischen Polieren

Country Status (6)

Country Link
US (2) US6969308B2 (de)
EP (1) EP1362670B8 (de)
JP (1) JP2003332274A (de)
KR (1) KR20030089508A (de)
DE (1) DE60322144D1 (de)
TW (1) TWI258815B (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US6764386B2 (en) * 2002-01-11 2004-07-20 Applied Materials, Inc. Air bearing-sealed micro-processing chamber
JP4448297B2 (ja) * 2002-12-27 2010-04-07 株式会社荏原製作所 基板研磨装置及び基板研磨方法
WO2004070778A2 (en) * 2003-01-27 2004-08-19 In Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US7421683B2 (en) * 2003-01-28 2008-09-02 Newmerix Corp£ Method for the use of information in an auxiliary data system in relation to automated testing of graphical user interface based applications
WO2004095516A2 (en) * 2003-04-21 2004-11-04 Inopla Inc. Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
JP2007118111A (ja) * 2005-10-26 2007-05-17 Incs Inc 物品加工装置および物品加工方法
CA2680130C (en) 2007-03-05 2016-01-12 Caridianbct, Inc. Cell expansion system and methods of use
ES2665024T3 (es) * 2007-03-05 2018-04-24 Terumo Bct, Inc. Métodos para controlar el movimiento celular en biorreactores de fibra hueca
AU2008236529B2 (en) * 2007-04-06 2013-09-05 Terumo Bct, Inc. Improved bioreactor surfaces
EP2148922B1 (de) * 2007-04-13 2020-03-04 Terumo BCT, Inc. Zellexpansionssystem und verfahren zu seiner verwendung
US20110104997A1 (en) * 2009-11-03 2011-05-05 Jeong In-Kwon Apparatuses and methods for polishing and cleaning semiconductor wafers
EP2566951B1 (de) 2010-05-05 2020-03-04 Terumo BCT, Inc. Verfahren zur neuaussaat von in einem hohlfaser-bioreaktorsystem gezüchteten adhärenten zellen
EP2625264B1 (de) 2010-10-08 2022-12-07 Terumo BCT, Inc. Verfahren und systeme für züchtung und ernte von zellen in einem hohlfaser-bioreaktorsystem mit steuerungsbedingungen
JP6466841B2 (ja) 2012-08-20 2019-02-06 テルモ ビーシーティー、インコーポレーテッド 細胞増殖システムのバイオリアクターにおける細胞の投入・分配方法
JP5927129B2 (ja) * 2013-01-31 2016-05-25 株式会社荏原製作所 研磨装置
US10513006B2 (en) * 2013-02-04 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High throughput CMP platform
EP3068866B1 (de) 2013-11-16 2018-04-25 Terumo BCT, Inc. Zellenexpansion in einem bioreaktor
CN106232800B (zh) 2014-03-25 2020-07-03 泰尔茂比司特公司 介质的被动替代
US10077421B2 (en) 2014-04-24 2018-09-18 Terumo Bct, Inc. Measuring flow rate
EP3198006B1 (de) 2014-09-26 2021-03-24 Terumo BCT, Inc. Geplante fütterung
KR101913702B1 (ko) * 2015-03-27 2018-11-01 주식회사 케이씨텍 화학 기계적 연마 장치
WO2017004592A1 (en) 2015-07-02 2017-01-05 Terumo Bct, Inc. Cell growth with mechanical stimuli
CN105483815B (zh) * 2015-12-18 2018-02-23 上海集成电路研发中心有限公司 一种电化学抛光装置及使用该装置的电化学抛光方法
JP6758066B2 (ja) * 2016-03-31 2020-09-23 株式会社荏原製作所 研磨装置
EP3464565A4 (de) 2016-05-25 2020-01-01 Terumo BCT, Inc. Zellexpansion
US11104874B2 (en) 2016-06-07 2021-08-31 Terumo Bct, Inc. Coating a bioreactor
US11685883B2 (en) 2016-06-07 2023-06-27 Terumo Bct, Inc. Methods and systems for coating a cell growth surface
US11624046B2 (en) 2017-03-31 2023-04-11 Terumo Bct, Inc. Cell expansion
WO2018184028A2 (en) 2017-03-31 2018-10-04 Terumo Bct, Inc. Cell expansion
US10879077B2 (en) * 2017-10-30 2020-12-29 Taiwan Semiconductor Manufacturing Company Ltd. Planarization apparatus and planarization method thereof
CN109732472A (zh) * 2017-10-31 2019-05-10 上海新昇半导体科技有限公司 抛光设备及方法
CN112959010B (zh) * 2021-02-18 2022-07-15 宁波江丰电子材料股份有限公司 一种靶材与铜背板的装配方法
CN117984221A (zh) 2022-11-03 2024-05-07 杭州众硅电子科技有限公司 一种处理导电型晶圆衬底的电化学机械抛光及平坦化设备
EP4364890B1 (de) * 2022-11-03 2025-07-02 Hangzhou Sizone Electronic Technology Inc. Elektrochemisch-mechanische polier- und planarisierungsvorrichtung zur verarbeitung eines leitfähigen wafersubstrats

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2182952A (en) * 1938-04-30 1939-12-12 Hanson Van Winkle Munning Co Air conditioned buffing and polishing system
US4544446A (en) * 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor
JPS62136317A (ja) 1985-12-06 1987-06-19 Inoue Japax Res Inc 電解研削加工方法
US5160590A (en) * 1989-09-06 1992-11-03 Kawasaki Steel Corp. Electrolytic processing method for electrolytically processing metal surface
JPH10199832A (ja) * 1997-01-13 1998-07-31 Disco Abrasive Syst Ltd ウェーハの研削方法
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
JPH1158205A (ja) * 1997-08-25 1999-03-02 Unique Technol Internatl Pte Ltd 電解研磨併用ポリシング・テクスチャー加工装置および加工方法ならびにそれに使用する電解研磨併用ポリシング・テクスチャーテープ
WO1999026758A1 (en) * 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
JPH11307481A (ja) * 1998-04-24 1999-11-05 Sony Corp 電解めっき装置および電解めっき方法
JP2000058521A (ja) * 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2000306874A (ja) * 1999-04-23 2000-11-02 Sony Corp 研磨装置および研磨方法
JP4513145B2 (ja) * 1999-09-07 2010-07-28 ソニー株式会社 半導体装置の製造方法および研磨方法
US6368190B1 (en) 2000-01-26 2002-04-09 Agere Systems Guardian Corp. Electrochemical mechanical planarization apparatus and method
US6478936B1 (en) * 2000-05-11 2002-11-12 Nutool Inc. Anode assembly for plating and planarizing a conductive layer
KR100470137B1 (ko) 2000-08-23 2005-02-04 주식회사 에프에스티 냉각 패드를 구비하는 연마 장치 및 이를 이용한 연마 방법
US6580053B1 (en) * 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
JP4644926B2 (ja) * 2000-10-13 2011-03-09 ソニー株式会社 半導体製造装置および半導体装置の製造方法
EP1405336A2 (de) * 2000-12-04 2004-04-07 Ebara Corporation Substratverarbeitungsverfahren
JP2002254248A (ja) * 2001-02-28 2002-09-10 Sony Corp 電解加工装置
US6855037B2 (en) * 2001-03-12 2005-02-15 Asm-Nutool, Inc. Method of sealing wafer backside for full-face electrochemical plating
DE10228998B4 (de) * 2002-06-28 2004-05-13 Advanced Micro Devices, Inc., Sunnyvale Vorrichtung und Verfahren zum elektrochemischen Behandeln eines Substrats bei reduzierter Metallkorrosion
DE10229000A1 (de) * 2002-06-28 2004-01-29 Advanced Micro Devices, Inc., Sunnyvale Vorrichtung und Verfahren zum Reduzieren der Oxidation von polierten Metalloberflächen in einem chemisch-mechanischen Poliervorgang
US6858531B1 (en) * 2002-07-12 2005-02-22 Lsi Logic Corporation Electro chemical mechanical polishing method
US7189146B2 (en) * 2003-03-27 2007-03-13 Asm Nutool, Inc. Method for reduction of defects in wet processed layers

Also Published As

Publication number Publication date
US7785175B2 (en) 2010-08-31
TWI258815B (en) 2006-07-21
TW200308010A (en) 2003-12-16
EP1362670A2 (de) 2003-11-19
EP1362670B1 (de) 2008-07-16
US20040009738A1 (en) 2004-01-15
EP1362670A3 (de) 2005-03-02
KR20030089508A (ko) 2003-11-21
JP2003332274A (ja) 2003-11-21
EP1362670B8 (de) 2009-11-04
US6969308B2 (en) 2005-11-29
US20050205433A1 (en) 2005-09-22

Similar Documents

Publication Publication Date Title
DE60322144D1 (de) Verfahren und Vorrichtung zum chemisch-mechanischen Polieren
DE60320227D1 (de) Verfahren und einrichtung zum polieren
DE60216640D1 (de) Verfahren und vorrichtung zum selbständigen glätten
DE60209262D1 (de) Verfahren und vorrichtung zum bildvergleich
DE60331902D1 (de) Verfahren und vorrichtung zum rührreibschweissen
DE60309549D1 (de) Vorrichtung und Verfahren zum Rührmischen
DE60222730D1 (de) Verfahren und Vorrichtung zum Ausführen von Aufgaben
DE602004018436D1 (de) Vorrichtung und Verfahren zum Herstellen dünner Schichten
DE602004006654D1 (de) Vorrichtung und Verfahren zur Oberflächen-Endbearbeitung
DE60323015D1 (de) Vorrichtung und Verfahren zum Gewinnen von Röntgenstrahlendaten
DE60217289D1 (de) Vorrichtung und Verfahren zum Verarbeiten von bewegten Bildern
DE60221158D1 (de) Vorrichtung und verfahren für oberflächeneigenschaften
DE60226830D1 (de) Verfahren und Vorrichtung zum Reibschweissen
DE602005012917D1 (de) Verfahren und Vorrichtung zum Umformen
DE602005017318D1 (de) Verfahren und Vorrichtung zum Bereitstellen von Entwurfsdaten
DE60306247D1 (de) Vorrichtung und Verfahren zum Sterilisieren
DE60328118D1 (de) Lehnvorrichtung und verfahren zum arretieren der vorrichtung
DE102004008900A8 (de) Vorrichtung und Verfahren zum Verarbeiten von Wafern
DE602004007418D1 (de) Vorrichtung und Verfahren zur Oberflächen-Endbearbeitung
ATE488986T1 (de) Vorrichtung und verfahren zum unterirdischen indizieren
DE60315540D1 (de) Vorrichtung und Verfahren zum Dispergieren
DE60306215D1 (de) Verfahren und Vorrichtung zum superplastischen Verformen
DE60229325D1 (de) Verfahren und Vorrichtung zum Aufkohlen
DE60204394D1 (de) Vorrichtung und Verfahren zum Aufschäumen
DE60227465D1 (de) Verfahren und Vorrichtung zum Abdecken

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: DOI, TOSHIRO, FUKUOKA-SHI, JP

Owner name: TOKYO SEIMITSU CO. LTD., MITAKA-SHI, TOKIO/TOK, JP

8339 Ceased/non-payment of the annual fee