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DE10311965A1 - Flip-Chip Anordnung auf einem Substratträger - Google Patents

Flip-Chip Anordnung auf einem Substratträger Download PDF

Info

Publication number
DE10311965A1
DE10311965A1 DE10311965A DE10311965A DE10311965A1 DE 10311965 A1 DE10311965 A1 DE 10311965A1 DE 10311965 A DE10311965 A DE 10311965A DE 10311965 A DE10311965 A DE 10311965A DE 10311965 A1 DE10311965 A1 DE 10311965A1
Authority
DE
Germany
Prior art keywords
chip
contact elements
substrate
substrate carrier
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10311965A
Other languages
German (de)
English (en)
Inventor
Erik Heinemann
Frank PÜSCHNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10311965A priority Critical patent/DE10311965A1/de
Priority to PCT/DE2004/000504 priority patent/WO2004084303A2/fr
Publication of DE10311965A1 publication Critical patent/DE10311965A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H10W70/66—
    • H10W70/699—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W72/072—
    • H10W72/073—
    • H10W72/251—
    • H10W72/5522—
    • H10W72/856—
    • H10W72/884—
    • H10W74/00—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE10311965A 2003-03-18 2003-03-18 Flip-Chip Anordnung auf einem Substratträger Ceased DE10311965A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE10311965A DE10311965A1 (de) 2003-03-18 2003-03-18 Flip-Chip Anordnung auf einem Substratträger
PCT/DE2004/000504 WO2004084303A2 (fr) 2003-03-18 2004-03-12 Dispositif a puce a bosses sur support de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10311965A DE10311965A1 (de) 2003-03-18 2003-03-18 Flip-Chip Anordnung auf einem Substratträger

Publications (1)

Publication Number Publication Date
DE10311965A1 true DE10311965A1 (de) 2004-10-14

Family

ID=32980617

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10311965A Ceased DE10311965A1 (de) 2003-03-18 2003-03-18 Flip-Chip Anordnung auf einem Substratträger

Country Status (2)

Country Link
DE (1) DE10311965A1 (fr)
WO (1) WO2004084303A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015059915A1 (ja) * 2013-10-22 2017-03-09 凸版印刷株式会社 Ｉｃモジュール及びｉｃカード、ｉｃモジュール基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0863567A (ja) * 1994-08-19 1996-03-08 Citizen Watch Co Ltd Ｉｃカード用モジュール
WO2002093649A2 (fr) * 2001-05-11 2002-11-21 Valtronic S.A. Module electronique et son procede d'assemblage
DE10139395A1 (de) * 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
DE10145752A1 (de) * 2001-09-17 2003-04-30 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302858A (ja) * 1994-04-28 1995-11-14 Toshiba Corp 半導体パッケージ
FR2736452B1 (fr) * 1995-07-05 1997-09-19 Solaic Sa Procede de fabrication d'une carte intelligente comprenant un corps en matiere fibreuse, et carte intelligente ainsi obtenue
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
EP0905657B1 (fr) * 1997-09-23 2003-05-28 STMicroelectronics S.r.l. Billet de banque comportant un circuit integré
FR2773642B1 (fr) * 1998-01-13 2000-03-03 Schlumberger Ind Sa Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0863567A (ja) * 1994-08-19 1996-03-08 Citizen Watch Co Ltd Ｉｃカード用モジュール
WO2002093649A2 (fr) * 2001-05-11 2002-11-21 Valtronic S.A. Module electronique et son procede d'assemblage
DE10139395A1 (de) * 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
DE10145752A1 (de) * 2001-09-17 2003-04-30 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015059915A1 (ja) * 2013-10-22 2017-03-09 凸版印刷株式会社 Ｉｃモジュール及びｉｃカード、ｉｃモジュール基板
EP3062266A4 (fr) * 2013-10-22 2017-07-19 Toppan Printing Co., Ltd. Module de ci, carte à ci et substrat de module de ci

Also Published As

Publication number Publication date
WO2004084303A3 (fr) 2004-12-23
WO2004084303A2 (fr) 2004-09-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection