DE10197008T1 - Bahn mit intelligenten Etiketten und Verfahren zu deren Herstellung - Google Patents
Bahn mit intelligenten Etiketten und Verfahren zu deren HerstellungInfo
- Publication number
- DE10197008T1 DE10197008T1 DE10197008T DE10197008T DE10197008T1 DE 10197008 T1 DE10197008 T1 DE 10197008T1 DE 10197008 T DE10197008 T DE 10197008T DE 10197008 T DE10197008 T DE 10197008T DE 10197008 T1 DE10197008 T1 DE 10197008T1
- Authority
- DE
- Germany
- Prior art keywords
- web
- processes
- production
- intelligent labels
- labels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
- Y10T156/1095—Opposed laminae are running length webs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
- Y10T156/1098—Feeding of discrete laminae from separate sources
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Error Detection And Correction (AREA)
- Detection And Correction Of Errors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20002707A FI112121B (fi) | 2000-12-11 | 2000-12-11 | Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa |
| FI20002707 | 2000-12-11 | ||
| PCT/FI2001/001038 WO2002049093A1 (en) | 2000-12-11 | 2001-11-29 | A smart label web and a method for its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE10197008T1 true DE10197008T1 (de) | 2003-10-30 |
| DE10197008B4 DE10197008B4 (de) | 2007-10-18 |
Family
ID=8559686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10197008T Expired - Fee Related DE10197008B4 (de) | 2000-12-11 | 2001-11-29 | Verfahren zur Herstellung einer Materialbahn, Materialbahn mit intelligenten Etiketten, Verfahren zur Herstellung einer Trägerbahn und Bauteil für ein intelligentes Etikett |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7244332B2 (de) |
| JP (1) | JP4071626B2 (de) |
| AU (1) | AU2002220764A1 (de) |
| DE (1) | DE10197008B4 (de) |
| FI (1) | FI112121B (de) |
| GB (1) | GB2388250B (de) |
| WO (1) | WO2002049093A1 (de) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468638B2 (en) | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
| FI112287B (fi) | 2000-03-31 | 2003-11-14 | Rafsec Oy | Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi |
| FI112121B (fi) | 2000-12-11 | 2003-10-31 | Rafsec Oy | Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa |
| US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
| FI112550B (fi) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
| US6606247B2 (en) | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
| FI117331B (fi) * | 2001-07-04 | 2006-09-15 | Rafsec Oy | Menetelmä ruiskuvaletun tuotteen valmistamiseksi |
| US7218527B1 (en) | 2001-08-17 | 2007-05-15 | Alien Technology Corporation | Apparatuses and methods for forming smart labels |
| FI119401B (fi) | 2001-12-21 | 2008-10-31 | Upm Raflatac Oy | Älytarraraina ja menetelmä sen valmistamiseksi |
| JP3770237B2 (ja) * | 2002-03-22 | 2006-04-26 | セイコーエプソン株式会社 | 電子デバイス製造装置および電子デバイスの製造方法 |
| US7023347B2 (en) | 2002-08-02 | 2006-04-04 | Symbol Technologies, Inc. | Method and system for forming a die frame and for transferring dies therewith |
| US7117581B2 (en) | 2002-08-02 | 2006-10-10 | Symbol Technologies, Inc. | Method for high volume assembly of radio frequency identification tags |
| JP3739752B2 (ja) | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
| US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
| US20050205202A1 (en) * | 2003-03-24 | 2005-09-22 | Precision Dynamics Corporation | Continuous lamination of RFID tags and inlets |
| US7694883B2 (en) * | 2003-05-01 | 2010-04-13 | Brother Kogyo Kabushiki Kaisha | RFID label, method for producing the RFID label, device for producing the RFID label, sheet member (tag sheet) used for the RFID label, and cartridge attached to the device for producing the RFID label |
| FI20030833A0 (fi) | 2003-06-04 | 2003-06-04 | Rafsec Oy | Älytarra ja menetelmä älytarran valmistamiseksi |
| US20050005434A1 (en) | 2003-06-12 | 2005-01-13 | Matrics, Inc. | Method, system, and apparatus for high volume transfer of dies |
| US7370808B2 (en) | 2004-01-12 | 2008-05-13 | Symbol Technologies, Inc. | Method and system for manufacturing radio frequency identification tag antennas |
| WO2005070143A2 (en) | 2004-01-12 | 2005-08-04 | Symbol Technologies, Inc. | Radio frequency identification tag inlay sortation and assembly |
| EP1560155B1 (de) * | 2004-01-31 | 2009-03-18 | Atlantic ZeiserGmbH | Verfahren zur Herstellung von kontaklosen Chip-Karten |
| TWI288885B (en) * | 2004-06-24 | 2007-10-21 | Checkpoint Systems Inc | Die attach area cut-on-fly method and apparatus |
| CA2576772A1 (en) | 2004-08-17 | 2006-03-02 | Symbol Technologies, Inc. | Singulation of radio frequency identification (rfid) tags for testing and/or programming |
| US7500307B2 (en) | 2004-09-22 | 2009-03-10 | Avery Dennison Corporation | High-speed RFID circuit placement method |
| US7385284B2 (en) | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
| US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
| ATE488985T1 (de) | 2004-12-03 | 2010-12-15 | Hallys Corp | Zwischenglied-bondierungseinrichtung |
| US7506813B2 (en) * | 2005-01-06 | 2009-03-24 | Quad/Graphics, Inc. | Resonator use in the print field |
| WO2006109678A1 (ja) | 2005-04-06 | 2006-10-19 | Hallys Corporation | 電子部品の製造装置 |
| US7623034B2 (en) * | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
| US7555826B2 (en) | 2005-12-22 | 2009-07-07 | Avery Dennison Corporation | Method of manufacturing RFID devices |
| ES2355057T3 (es) | 2006-05-12 | 2011-03-22 | Confidex Oy | Método para fabricar productos que comprenden transpondedores. |
| DE102006028760B3 (de) * | 2006-06-23 | 2007-11-29 | Mühlbauer Ag | Sortiereinrichtung sowie Verfahren zum Sortieren von RFID-Etiketten |
| DE102007001411A1 (de) | 2007-01-09 | 2008-07-10 | Mühlbauer Ag | Verfahren zur Herstellung eines elektronischen Datenträgers mit textilem Substrat sowie elektronischer Datenträger mit textilem Substrat |
| US20080263854A1 (en) * | 2007-04-04 | 2008-10-30 | Hirschmann Car Communication Gmbh | Method of making a motor -vehicle antenna assembly |
| US7546676B2 (en) * | 2007-05-31 | 2009-06-16 | Symbol Technologies, Inc. | Method for manufacturing micro-strip antenna element |
| DE102009022299B4 (de) * | 2008-05-26 | 2014-07-17 | Technische Universität Chemnitz | Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat |
| CN102047402B (zh) | 2008-06-02 | 2017-11-03 | Nxp股份有限公司 | 一种电子器件制造方法 |
| DE102008046338B4 (de) * | 2008-07-10 | 2012-10-31 | Gera-Ident Gmbh | Identifikationsmittel für eine kontaktlose Datenübertragung und Herstellungsverfahren hierfür |
Family Cites Families (181)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3628977A (en) | 1969-10-02 | 1971-12-21 | Addressograph Multigraph | Multilayer tape for coating intaglio depressions and process for using same |
| BE792488A (fr) * | 1971-12-08 | 1973-03-30 | Dainippon Printing Co Ltd | Cartes d'identification et procede de fabrication de ces cartes |
| US4021705A (en) * | 1975-03-24 | 1977-05-03 | Lichtblau G J | Resonant tag circuits having one or more fusible links |
| FR2435778A1 (fr) | 1978-08-01 | 1980-04-04 | Pyral Soc | Support d'enregistrement magnetique securitaire |
| US4253899A (en) * | 1979-03-08 | 1981-03-03 | Avery International Corporation | Method of making matrix free thin labels |
| US4288499A (en) * | 1979-05-08 | 1981-09-08 | Rohm And Haas Company | Polymers adherent to polyolefins |
| DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
| JPS57142798A (en) | 1981-02-26 | 1982-09-03 | Nippon Piston Ring Co Ltd | Powder molding method and molded article |
| DE3130032A1 (de) * | 1981-07-30 | 1983-02-17 | Agfa-Gevaert Ag, 5090 Leverkusen | Faelschungssicheres dokument |
| US5294290A (en) * | 1982-06-07 | 1994-03-15 | Reeb Max E | Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits |
| US4443491A (en) * | 1982-06-10 | 1984-04-17 | Acumeter Laboratories, Inc. | Method of and apparatus for producing adhesive-coated sheet materials usable with radiation-cured silicone release coatings and the like |
| AU589144B2 (en) * | 1984-11-16 | 1989-10-05 | Toyo Seikan Kaisha Ltd. | Packaging material comprising iron foil, and container and container lid composed thereof |
| JPS61268416A (ja) | 1985-05-23 | 1986-11-27 | Ryoden Kasei Co Ltd | 樹脂成形体の製造方法 |
| EP0227293A3 (de) | 1985-12-05 | 1988-02-03 | General Binding Corporation | Verfahren für Schichtstoffherstellung |
| US4866505A (en) * | 1986-03-19 | 1989-09-12 | Analog Devices, Inc. | Aluminum-backed wafer and chip |
| NL8601404A (nl) | 1986-05-30 | 1987-12-16 | Papier Plastic Coating Groning | Gegevensdragende kaart, werkwijze voor het vervaardigen van een dergelijke kaart en inrichting voor het uitvoeren van deze werkwijze. |
| US4954814A (en) * | 1986-09-29 | 1990-09-04 | Monarch Marking Systems, Inc. | Tag and method of making same |
| US4846922A (en) * | 1986-09-29 | 1989-07-11 | Monarch Marking Systems, Inc. | Method of making deactivatable tags |
| DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
| JPH0696357B2 (ja) * | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | Icカードの製造方法 |
| US4841712A (en) * | 1987-12-17 | 1989-06-27 | Package Service Company, Inc. | Method of producing sealed protective pouchs with premium object enclosed therein |
| EP0545910A3 (en) | 1987-12-23 | 1993-10-20 | Alusuisse Lonza Services Ag | Laminated foil for making high-frequency field interfering elements |
| GB8817239D0 (en) | 1988-07-20 | 1988-08-24 | Adhesive Materials Ltd | Adhesive labels & methods for their manufacture |
| JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
| KR0147813B1 (ko) * | 1989-05-16 | 1998-08-01 | 월터 클리웨인, 한스-피터 위트린 | 적층 구조물 및 그의 제조방법 |
| JPH03239595A (ja) | 1990-02-16 | 1991-10-25 | Dainippon Printing Co Ltd | カード製造方法 |
| JP2687661B2 (ja) * | 1990-03-26 | 1997-12-08 | 三菱電機株式会社 | Icカードの製造方法 |
| DE69304042T2 (de) | 1990-07-12 | 1996-12-19 | C A Lawton Co | Verfahren und Vorrichtung zur Herstellung von strukturellen verstärkten Vorformlingen, mit energetischen temporären Verkleben oder Heften |
| CH680823A5 (de) | 1990-08-17 | 1992-11-13 | Kobe Properties Ltd | |
| DE4034430C1 (de) | 1990-10-29 | 1992-06-17 | Rota-Druck W. Kieser Kg, 8902 Neusaess, De | |
| JPH04321190A (ja) * | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | 非接触型携帯記憶装置のアンテナ回路 |
| US5201976A (en) * | 1991-05-06 | 1993-04-13 | Morgan Adhesives Company | Method of producing a continuous label web |
| GB9114793D0 (en) * | 1991-07-09 | 1991-08-28 | Scient Generics Ltd | Novel rf tag |
| JPH05160290A (ja) * | 1991-12-06 | 1993-06-25 | Rohm Co Ltd | 回路モジュール |
| JPH05169843A (ja) | 1991-12-25 | 1993-07-09 | Nitto Denko Corp | 可逆性感熱記録材料 |
| US5244836A (en) * | 1991-12-30 | 1993-09-14 | North American Philips Corporation | Method of manufacturing fusible links in semiconductor devices |
| US5302431A (en) * | 1992-01-06 | 1994-04-12 | National Poly Products, Inc. | Deformable label |
| US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| US5266355A (en) * | 1992-06-18 | 1993-11-30 | Eastman Kodak Company | Chemical vapor deposition of metal oxide films |
| US5344808A (en) * | 1992-09-09 | 1994-09-06 | Toppan Printing Co., Ltd. | Intermediate transfer medium and process for producing image-recorded article making use of the same |
| US5404044A (en) * | 1992-09-29 | 1995-04-04 | International Business Machines Corporation | Parallel process interposer (PPI) |
| US5693421A (en) * | 1992-12-22 | 1997-12-02 | Dai Nippon Printing Co., Ltd. | Information recording medium and information recording and reproducing method |
| DE4327642C2 (de) * | 1993-05-17 | 1998-09-24 | Anatoli Stobbe | Lesegerät für ein Detektierplättchen |
| GB2279612A (en) | 1993-07-02 | 1995-01-11 | Gec Avery Ltd | Integrated circuit or smart card. |
| US5534372A (en) * | 1993-07-28 | 1996-07-09 | Konica Corporation | IC card having image information |
| CA2134156A1 (en) * | 1993-11-22 | 1995-05-23 | Thomas P. Klun | Coatable compositions, abrasive articles made therefrom, and methods of making and using same |
| DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
| FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
| FR2716555B1 (fr) | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
| US5751256A (en) * | 1994-03-04 | 1998-05-12 | Flexcon Company Inc. | Resonant tag labels and method of making same |
| JP3673521B2 (ja) * | 1994-03-31 | 2005-07-20 | イビデン株式会社 | 電子部品搭載装置 |
| US5464690A (en) * | 1994-04-04 | 1995-11-07 | Novavision, Inc. | Holographic document and method for forming |
| FR2721733B1 (fr) | 1994-06-22 | 1996-08-23 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé. |
| US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| US5852289A (en) | 1994-09-22 | 1998-12-22 | Rohm Co., Ltd. | Non-contact type IC card and method of producing the same |
| US5541399A (en) | 1994-09-30 | 1996-07-30 | Palomar Technologies Corporation | RF transponder with resonant crossover antenna coil |
| DE59502482D1 (de) | 1994-11-03 | 1998-07-16 | Fela Holding Ag | Basis Folie für Chip Karte |
| GB2294899B (en) | 1994-11-11 | 1997-08-27 | Plessey Telecomm | Method of manufacturing a smartcard |
| DE4444789C3 (de) | 1994-12-15 | 2001-05-10 | Ods Landis & Gyr Gmbh & Co Kg | Verfahren zum Herstellen von Chipkarten, Chipkarte und Vorrichtung zum Durchführen des Verfahrens |
| DE4446369A1 (de) * | 1994-12-23 | 1996-06-27 | Giesecke & Devrient Gmbh | Datenträger mit einem elektronischen Modul |
| US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
| DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
| DE69506285D1 (de) | 1995-01-27 | 1999-01-07 | Interprint Formularios Ltd | Speicherkarte und verfahren zu ihrer herstellung |
| JP3488547B2 (ja) | 1995-03-03 | 2004-01-19 | 日東電工株式会社 | 共振回路タグ、その製造方法およびその共振特性を変化させる方法 |
| DE19511300A1 (de) | 1995-03-28 | 1996-10-02 | Telefunken Microelectron | Antennenstruktur |
| JP2814477B2 (ja) | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
| US5976690A (en) | 1995-05-18 | 1999-11-02 | 3M Innovative Properties Company | Opaque adhesives and method therefor |
| JPH08316411A (ja) | 1995-05-18 | 1996-11-29 | Hitachi Ltd | 半導体装置 |
| US6090484A (en) * | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
| US5714305A (en) * | 1995-05-24 | 1998-02-03 | Polaroid Corporation | Overcoat-releasing laminate and method for the manufacture thereof |
| US6221191B1 (en) * | 1996-06-07 | 2001-04-24 | Qpf, L.L.C. | Polyester-containing biaxially-oriented polypropylene films and method of making the same |
| FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
| FR2736740A1 (fr) | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue |
| DE19530823A1 (de) | 1995-08-23 | 1997-02-27 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
| EP0855064A4 (de) | 1995-10-11 | 2001-07-18 | Motorola Inc | Ferngesteuertes elektronisches etikett und zugehörige erreger-/leseeinrichtung und entsprechendes verfahren |
| JPH09156267A (ja) * | 1995-12-06 | 1997-06-17 | Watada Insatsu Kk | プラスチックカード |
| US5937512A (en) * | 1996-01-11 | 1999-08-17 | Micron Communications, Inc. | Method of forming a circuit board |
| JPH09197965A (ja) | 1996-01-17 | 1997-07-31 | Toshiba Chem Corp | 電子タグの製造方法 |
| FR2744270A1 (fr) | 1996-01-30 | 1997-08-01 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
| US5639696A (en) | 1996-01-31 | 1997-06-17 | Lsi Logic Corporation | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array |
| JP3842362B2 (ja) * | 1996-02-28 | 2006-11-08 | 株式会社東芝 | 熱圧着方法および熱圧着装置 |
| US5781110A (en) * | 1996-05-01 | 1998-07-14 | James River Paper Company, Inc. | Electronic article surveillance tag product and method of manufacturing same |
| US5936847A (en) * | 1996-05-02 | 1999-08-10 | Hei, Inc. | Low profile electronic circuit modules |
| US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
| DE19634473C2 (de) | 1996-07-11 | 2003-06-26 | David Finn | Verfahren zur Herstellung einer Chipkarte |
| JPH1084014A (ja) * | 1996-07-19 | 1998-03-31 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP3928753B2 (ja) | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
| EP0869408B2 (de) * | 1996-09-19 | 2015-04-29 | Dai Nippon Printing Co., Ltd. | Mehrschichtiges volumenhologramm und etikett zur herstellung eines mehrschichtigen volumenhologramms |
| EP0929399B1 (de) * | 1996-09-27 | 2005-07-20 | Avery Dennison Corporation | Haftkleberverbünde und -laminate |
| US6122010A (en) * | 1996-12-16 | 2000-09-19 | Vidicast Ltd. | Television signal data transmission system |
| US5867102C1 (en) * | 1997-02-27 | 2002-09-10 | Wallace Comp Srvices Inc | Electronic article surveillance label assembly and method of manufacture |
| DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
| FI102304B (fi) | 1997-04-02 | 1998-11-13 | Valmet Corp | Kalanterointimenetelmä ja menetelmää soveltava kalanteri |
| SE9701612D0 (sv) | 1997-04-29 | 1997-04-29 | Johan Asplund | Smartcard and method for its manufacture |
| US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
| US5963134A (en) * | 1997-07-24 | 1999-10-05 | Checkpoint Systems, Inc. | Inventory system using articles with RFID tags |
| US6025780A (en) * | 1997-07-25 | 2000-02-15 | Checkpoint Systems, Inc. | RFID tags which are virtually activated and/or deactivated and apparatus and methods of using same in an electronic security system |
| DE19733800A1 (de) | 1997-08-05 | 1999-02-11 | Sachsenring Automobiltechnik | Verfahren zur Herstellung eines Abstellteils mit einem Antirutschbelag |
| DK1002306T3 (da) | 1997-08-08 | 2002-07-22 | Sca Coordination Ct Nv | Polymere radiofrekvente resonansetiketter og fremgangsmåde til fremstilling |
| US6180256B1 (en) * | 1997-08-26 | 2001-01-30 | Arkwright Incorporated | Heat shrinkable ink jet recording medium |
| DE19737565A1 (de) | 1997-08-28 | 1999-03-04 | Etr Elektronik Und Technologie | Chipkarte, bestehend aus einem Kartenkörper, mit wenigstens einem elektronischen Chip, Kontaktfeld mit Kontakten und/oder Spulen |
| AU761995B2 (en) * | 1997-09-11 | 2003-06-12 | Precision Dynamics Corporation | Laminated radio frequency identification device |
| US5982284A (en) | 1997-09-19 | 1999-11-09 | Avery Dennison Corporation | Tag or label with laminated thin, flat, flexible device |
| FR2769110B1 (fr) * | 1997-09-26 | 1999-12-03 | Gemplus Card Int | Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette |
| FR2769440B1 (fr) * | 1997-10-03 | 1999-12-03 | Gemplus Card Int | Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede |
| JPH11115328A (ja) * | 1997-10-16 | 1999-04-27 | Dainippon Printing Co Ltd | 熱転写受像シート及びその製造方法 |
| US6177859B1 (en) * | 1997-10-21 | 2001-01-23 | Micron Technology, Inc. | Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus |
| FR2770172B1 (fr) | 1997-10-24 | 1999-12-10 | Allibert Equipement | Procede de moulage pour realiser une piece en matiere plastique munie sur une surface d'un element rapporte de faible epaisseur, et piece ainsi realisee |
| BR9812784A (pt) | 1997-11-12 | 2000-10-10 | Supercom Ltd | "método e aparelho para a produção automática de cartões e bolsos" |
| DE19751043C2 (de) * | 1997-11-18 | 2001-11-08 | David Finn | Gehäuste Transponderanordnung |
| FR2772494B1 (fr) * | 1997-12-15 | 2001-02-23 | Gemplus Card Int | Carte a puce munie d'une etiquette de garantie |
| DE19758057C1 (de) | 1997-12-29 | 1999-05-12 | Meinen Ziegel & Co Gmbh | Verfahren zum Herstellen eines Moduls mit einer Leiterbahnanordnung, insbesondere Antennenanordnung, für eine kontaktlose oder kontaktlos- und kontaktbehaftete IC-Karte |
| EP1051885A1 (de) | 1998-02-06 | 2000-11-15 | FLEXcon Company, Inc. | Übertragbare dünnschichtige elektronische komponenten |
| JPH11221986A (ja) | 1998-02-09 | 1999-08-17 | Konica Corp | Icカードの製造方法 |
| DE19829617A1 (de) * | 1998-02-18 | 1999-08-26 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte sowie nach dem Verfahren hergestellte Chipkarte |
| ATE221233T1 (de) * | 1998-03-06 | 2002-08-15 | Security Graphics B V | Identifikationskennzeichnung mit einer optisch und elektronisch lesbaren markierung |
| TW424312B (en) | 1998-03-17 | 2001-03-01 | Sanyo Electric Co | Module for IC cards, method for making a module for IC cards, hybrid integrated circuit module and method for making same |
| DE29804579U1 (de) | 1998-03-18 | 1998-11-26 | Georg Siegel GmbH, 59174 Kamen | Radiofrequenzetikett mit kupferbeschichteter Ferrit-Folie |
| US6315856B1 (en) | 1998-03-19 | 2001-11-13 | Kabushiki Kaisha Toshiba | Method of mounting electronic component |
| US6040630A (en) * | 1998-04-13 | 2000-03-21 | Harris Corporation | Integrated circuit package for flip chip with alignment preform feature and method of forming same |
| US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
| FR2780534B1 (fr) | 1998-06-25 | 2002-08-16 | Solaic Sa | Procede de realisation d'objets portatifs a composants electroniques et objets portatifs tels qu'obtenus par ledit procede |
| JP2000021588A (ja) | 1998-06-30 | 2000-01-21 | Toshiba Lighting & Technology Corp | 放電灯点灯装置および照明装置 |
| DE69927342T2 (de) * | 1998-07-08 | 2006-06-22 | Dai Nippon Printing Co., Ltd. | Kontaktlose chipkarte und verfahren zu ihrer herstellung |
| US6161761A (en) | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
| JP2000048153A (ja) | 1998-07-31 | 2000-02-18 | Sony Corp | 非接触icカード |
| JP2000057287A (ja) | 1998-08-10 | 2000-02-25 | Sony Corp | 非接触式データキャリア |
| DE69942811D1 (de) * | 1998-08-14 | 2010-11-11 | 3M Innovative Properties Co | Anwendungen für Funkfrequenzinformationssysteme |
| US6066377A (en) * | 1998-08-17 | 2000-05-23 | Furon | Laminated air brake tubing |
| FR2782821B1 (fr) | 1998-08-27 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
| DE19845296A1 (de) * | 1998-09-03 | 2000-03-16 | Fraunhofer Ges Forschung | Verfahren zur Kontaktierung eines Schaltungschips |
| US6204764B1 (en) * | 1998-09-11 | 2001-03-20 | Key-Trak, Inc. | Object tracking system with non-contact object detection and identification |
| KR100629923B1 (ko) | 1998-09-30 | 2006-09-29 | 돗빤호무즈가부시기가이샤 | 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체 |
| US6358588B1 (en) * | 1998-10-03 | 2002-03-19 | Brady Worldwide, Inc. | Tags having a metallic heft and appearance and process for making them |
| JP2000113147A (ja) * | 1998-10-08 | 2000-04-21 | Hitachi Chem Co Ltd | Icカードとその製造法 |
| US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
| US6569280B1 (en) * | 1998-11-06 | 2003-05-27 | The Standard Register Company | Lamination by radiation through a ply |
| US6501721B2 (en) * | 1999-01-14 | 2002-12-31 | Hewlett-Packard Company | Spliceless editing of a read/write optical medium |
| FI990055A7 (fi) | 1999-01-14 | 2000-08-28 | Rafsec Oy | Menetelmä tuoteanturin muodostamiseksi |
| EP1035503B2 (de) * | 1999-01-23 | 2010-03-03 | X-ident technology GmbH | RFID-Transponder mit bedruckbarer Oberfläche |
| US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
| JP4402190B2 (ja) | 1999-02-16 | 2010-01-20 | 大日本印刷株式会社 | コンデンサ内蔵非接触型icカード用基体とコンデンサ内蔵非接触型icカードの製造方法 |
| JP2000242740A (ja) | 1999-02-18 | 2000-09-08 | Sony Corp | ラベル形記憶装置。 |
| CN1217791C (zh) * | 1999-02-25 | 2005-09-07 | 皮茨菲尔德编织有限公司 | 用于生产标签的方法和设备 |
| DE19915765C2 (de) | 1999-04-08 | 2001-06-21 | Cubit Electronics Gmbh | Kontaktloser Transponder und Verfahren zu seiner Herstellung |
| US6288905B1 (en) * | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
| US6248199B1 (en) * | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
| US6353420B1 (en) * | 1999-04-28 | 2002-03-05 | Amerasia International Technology, Inc. | Wireless article including a plural-turn loop antenna |
| US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
| IT1317426B1 (it) * | 1999-05-19 | 2003-07-09 | Bosch Gmbh Robert | Procedimento e dispositivo per comandare l'unita' motrice di unveicolo. |
| US6694872B1 (en) * | 1999-06-18 | 2004-02-24 | Holographic Label Converting, Inc. | In-line microembossing, laminating, printing, and diecutting |
| JP2001018040A (ja) | 1999-06-30 | 2001-01-23 | Kawasaki Steel Corp | 連続鋳造片の製造方法 |
| FR2796183B1 (fr) | 1999-07-07 | 2001-09-28 | A S K | Ticket d'acces sans contact et son procede de fabrication |
| WO2001006558A1 (en) * | 1999-07-16 | 2001-01-25 | Matsushita Electric Industrial Co., Ltd. | Package of semiconductor device and method of manufacture thereof |
| JP4588139B2 (ja) * | 1999-08-31 | 2010-11-24 | リンテック株式会社 | Icカードの製造方法 |
| US6147662A (en) | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
| US6557766B1 (en) * | 1999-10-01 | 2003-05-06 | Keith R. Leighton | Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process |
| US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
| WO2001035457A1 (en) * | 1999-11-08 | 2001-05-17 | Amerasia International Technology, Inc. | Wafer level application of tack-free die-attach adhesive film |
| US6259408B1 (en) * | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
| US6520544B1 (en) * | 2000-01-10 | 2003-02-18 | Moore North America, Inc. | Radio frequency labels on reusable containers |
| US6451154B1 (en) * | 2000-02-18 | 2002-09-17 | Moore North America, Inc. | RFID manufacturing concepts |
| JP3557990B2 (ja) | 2000-03-09 | 2004-08-25 | ソニーケミカル株式会社 | 情報記録タグ |
| US6478229B1 (en) | 2000-03-14 | 2002-11-12 | Harvey Epstein | Packaging tape with radio frequency identification technology |
| US6249199B1 (en) * | 2000-04-10 | 2001-06-19 | George Liu | Quick magnetizing and demagnetizing device for screwdrivers |
| JP3597754B2 (ja) * | 2000-04-24 | 2004-12-08 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| WO2001085451A1 (en) | 2000-05-05 | 2001-11-15 | 3M Innovative Properties Company | Durable security card and method for making same |
| JP4688396B2 (ja) | 2000-05-12 | 2011-05-25 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
| US6555213B1 (en) * | 2000-06-09 | 2003-04-29 | 3M Innovative Properties Company | Polypropylene card construction |
| US6977112B2 (en) | 2000-07-10 | 2005-12-20 | Canon Finetech, Inc. | Non-contact information recording medium for ink-jet recording and image forming process |
| JP2002109491A (ja) * | 2000-09-29 | 2002-04-12 | Sony Corp | Icカード及びその製造方法 |
| GB0024070D0 (en) * | 2000-10-02 | 2000-11-15 | Innavisions Ltd | Mpulding apparatus and method |
| JP2002140672A (ja) | 2000-11-01 | 2002-05-17 | Toppan Printing Co Ltd | 非接触icカード用基板及び非接触icカード |
| US6480110B2 (en) | 2000-12-01 | 2002-11-12 | Microchip Technology Incorporated | Inductively tunable antenna for a radio frequency identification tag |
| FI112121B (fi) | 2000-12-11 | 2003-10-31 | Rafsec Oy | Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa |
| US6600418B2 (en) * | 2000-12-12 | 2003-07-29 | 3M Innovative Properties Company | Object tracking and management system and method using radio-frequency identification tags |
| FI111039B (fi) | 2001-04-06 | 2003-05-15 | Rafsec Oy | Älykorttiraina ja menetelmä sen valmistamiseksi |
| JP4789348B2 (ja) * | 2001-05-31 | 2011-10-12 | リンテック株式会社 | 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法 |
| US6644551B2 (en) | 2001-11-09 | 2003-11-11 | G + D Cardtech, Inc. | Card |
| FI119401B (fi) * | 2001-12-21 | 2008-10-31 | Upm Raflatac Oy | Älytarraraina ja menetelmä sen valmistamiseksi |
| US6843422B2 (en) * | 2001-12-24 | 2005-01-18 | Digimarc Corporation | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
-
2000
- 2000-12-11 FI FI20002707A patent/FI112121B/fi not_active IP Right Cessation
-
2001
- 2001-11-29 WO PCT/FI2001/001038 patent/WO2002049093A1/en not_active Ceased
- 2001-11-29 JP JP2002550306A patent/JP4071626B2/ja not_active Expired - Fee Related
- 2001-11-29 DE DE10197008T patent/DE10197008B4/de not_active Expired - Fee Related
- 2001-11-29 AU AU2002220764A patent/AU2002220764A1/en not_active Abandoned
- 2001-11-29 GB GB0314166A patent/GB2388250B/en not_active Expired - Fee Related
-
2003
- 2003-05-23 US US10/444,692 patent/US7244332B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FI112121B (fi) | 2003-10-31 |
| GB2388250B (en) | 2005-03-09 |
| DE10197008B4 (de) | 2007-10-18 |
| GB0314166D0 (en) | 2003-07-23 |
| US20040004295A1 (en) | 2004-01-08 |
| US7244332B2 (en) | 2007-07-17 |
| FI20002707A0 (fi) | 2000-12-11 |
| JP2004516538A (ja) | 2004-06-03 |
| FI20002707L (fi) | 2002-06-12 |
| WO2002049093A1 (en) | 2002-06-20 |
| JP4071626B2 (ja) | 2008-04-02 |
| AU2002220764A1 (en) | 2002-06-24 |
| GB2388250A (en) | 2003-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE10197008T1 (de) | Bahn mit intelligenten Etiketten und Verfahren zu deren Herstellung | |
| DE60000478D1 (de) | Mehrschichtige rfid etikettenanordnung und verfahren zu deren herstellung | |
| DE69929311D1 (de) | Oximanderivate und verfahren zu ihrer herstellung | |
| DE60036440D1 (de) | Absorbierender Artikel mit Seitenflügel, und Verfahren zu dessen Herstellung | |
| DE60031949D1 (de) | Leiterplatte und verfahren zu ihrer herstellung | |
| DE60039859D1 (de) | Witterungsbeständige mehrschichtige kunststoffartikel sowie verfahren zu ihrer herstellung | |
| ATE551940T1 (de) | Mehrschichtfolie und verfahren zu deren herstellung | |
| DE60133497D1 (de) | Perfluorpolyether und verfahren zur ihrer herstellung | |
| EP1339492A4 (de) | Veresterungskatalysator, polyesterverfahren und polyestergegenstand | |
| DE69931631D1 (de) | Dreilagiges saugfähiges papierprodukt und verfahren zu seiner herstellung | |
| DE69926762D1 (de) | Zusammengesetzte dichtung mit doppelelastizitätsmodul und verfahren zu deren herstellung | |
| DE60024801D1 (de) | Polyurethanharnstofffasern und verfahren zu ihrer herstellung | |
| DE69918466D1 (de) | Beleuchtungsvorrichtung und verfahren zu ihrer herstellung | |
| DE60231885D1 (de) | Flammhemmende polyesterzusammensetzung, verfahren zu deren herstellung, und daraus hergestellte artikel | |
| DE60004665D1 (de) | Polyethylenterephthalatfolie höher festigkeit und verfahren zu deren herstellung | |
| DE69941027D1 (de) | Zusammendrückbeständige rolle mit innenabzug und verfahren zu ihrer herstellung | |
| ATE234842T1 (de) | Epithilonderivate, verfahren zu deren herstellung und deren verwendung | |
| DE59813228D1 (de) | Kunststoffbehälter und verfahren zu seiner herstellung | |
| DE69912160D1 (de) | Hochfeste polyethylenfasern und verfahren zu deren herstellung | |
| DE69936203D1 (de) | Polyalphaolefine mit vervesserter oxidationsstabilität und verfahren zu deren herstellung | |
| DE59902568D1 (de) | Lipopeptidantibiotika-calciumsalze, verfahren zu ihrer herstellung und verwendung | |
| DE69708336D1 (de) | Luftreifen und verfahren zu deren herstellung | |
| DE69826268D1 (de) | Extrudierte/blasgeformte flasche, sowie verfahren und material zu deren herstellung | |
| DE60123292D1 (de) | Uht-milchkonzentratspackung und verfahren zu ihrer herstellung | |
| DE60040411D1 (de) | Gerter freigabe und verfahren zu ihrer herstellung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8127 | New person/name/address of the applicant |
Owner name: UPM RAFLATAC OY, TAMPERE, FI |
|
| 8364 | No opposition during term of opposition | ||
| R082 | Change of representative |
Representative=s name: HOFFMANN - EITLE, DE |
|
| R081 | Change of applicant/patentee |
Owner name: SMARTRAC IP B.V., NL Free format text: FORMER OWNER: UPM RAFLATAC OY, TAMPERE, FI Effective date: 20130102 Owner name: SMARTRAC INVESTMENT B.V., NL Free format text: FORMER OWNER: UPM RAFLATAC OY, TAMPERE, FI Effective date: 20130102 |
|
| R082 | Change of representative |
Representative=s name: HOFFMANN - EITLE, DE Effective date: 20130102 Representative=s name: HOFFMANN - EITLE PATENT- UND RECHTSANWAELTE PA, DE Effective date: 20130102 |
|
| R081 | Change of applicant/patentee |
Owner name: SMARTRAC INVESTMENT B.V., NL Free format text: FORMER OWNER: SMARTRAC IP B.V., AMSTERDAM, NL |
|
| R082 | Change of representative |
Representative=s name: HOFFMANN - EITLE PATENT- UND RECHTSANWAELTE PA, DE |
|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |