TWI551209B - Backboard structure and its motherboard assembly structure - Google Patents

Description

Backboard structure and its motherboard assembly structure

The present invention relates to a backplane structure and a motherboard assembly structure thereof, and more particularly to a backplane structure and a motherboard assembly structure using the metal backplane and the structure on the insulating sheet to fix the insulating sheet on the metal backplane.

Generally speaking, the motherboard assembly method on a computer device (such as a personal computer or a server) is usually by attaching an insulating sheet to a metal back plate by means of adhesive bonding, and then locking the motherboard by using a screw locking method. It is fixed on the metal back plate with the insulating sheet attached. In this way, not only the high rigidity of the metal back plate can be used to provide sufficient bottom support for the motherboard, but also the metal back plate and the host through the configuration of the insulating sheet. Board insulation. However, the above-mentioned manner of attaching the insulating sheet to the metal backing plate by using the backing adhesive tends to cause the problem of excessive assembly cost and heavy work of the metal backing plate and the insulating sheet.

SUMMARY OF THE INVENTION An object of the present invention is to provide a backplane structure in which a metal backplane is engaged with a structure on an insulating sheet to fix an insulating sheet on a metal backplane, and a motherboard assembly structure thereof, which can solve the above problems.

According to an embodiment, the backplane structure of the present invention is configured to carry a motherboard, and the backplane structure includes an insulating sheet and a metal backplane. The insulating sheet has at least one first opening and at least one second opening, and the at least one second opening is formed adjacent to the at least one first opening in an assembly direction. The insulating sheet is disposed on the surface of the metal back plate, and the insulating sheet is superposed on the metal back plate. The metal back plate protrudes from the second opening to form a buckle. The buckle has a first The bent arm portion and one of the hook portions extending from the first bent arm portion toward the at least one first opening. When the insulating sheet is laminated on the metal back plate such that the hook passes through the at least one second opening and the insulating sheet moves in the assembly direction relative to the metal back plate, the at least one second opening is opposite to the second opening The hook moves to abut the first bent arm portion against the at least one second opening and the buckle hook portion buckles the at least one first opening to fix the insulating sheet on the metal back plate When the motherboard is loaded on the backplane structure, the metal backplane is insulated from the motherboard.

According to another embodiment, the motherboard assembly structure of the present invention includes a motherboard and a backplane structure. The backplane structure is disposed under the motherboard for carrying the motherboard. The backplane structure includes an insulating sheet and a metal backplane. The insulating sheet has at least one first opening and at least one second opening, and the at least one second opening is formed adjacent to the at least one first opening in an assembly direction. The insulating sheet is disposed on the surface of the metal back plate, and the insulating sheet is superposed on the metal back plate. The metal back plate protrudes from the second opening to form a buckle. The buckle has a first The bent arm portion and one of the hook portions extending from the first bent arm portion toward the at least one first opening. When the insulating sheet is laminated on the metal back plate such that the hook passes through the at least one second opening and the insulating sheet moves in the assembly direction relative to the metal back plate, the at least one second opening is opposite to the second opening The hook moves to abut the first bent arm portion against the at least one second opening and the buckle hook portion buckles the at least one first opening to fix the insulating sheet on the metal back plate When the motherboard is loaded on the backplane structure, the metal backplane is insulated from the motherboard.

Compared with the prior art, the adhesive sheet is attached to the metal back plate by adhesive bonding, and the invention uses the metal back plate to engage with the structure on the insulating sheet to fix the insulating sheet on the metal back plate. The present invention can effectively reduce the assembly cost of the metal back plate and the insulating sheet without using a high-cost adhesive bonding method, and is also permeable to the assembly and disassembly of the metal back plate and the insulating sheet. The simple operation can be completed, so the invention can greatly improve the reworkability of the metal back plate and the insulating sheet.

The advantages and spirit of the present invention will be further understood from the following embodiments and the accompanying drawings.

Please refer to FIG. 1 , which is a schematic exploded view of a motherboard assembly structure 10 according to the present invention. As shown in FIG. 1 , the motherboard assembly structure 10 includes a motherboard 12 and a backplane structure 14 , wherein The structural design of the backplane structure 14 is shown in FIG. 1 only by dashed lines. The motherboard 12 is preferably disposed in a common computer device (such as a personal computer, a server, etc., but not limited thereto) for signal transmission and control of the computer device, and the related description is common in the prior art. This will not be repeated here.

The backplane structure 14 is disposed under the motherboard 12 for carrying the motherboard 12 , and the backplane structure 14 includes an insulating sheet 16 and a metal back panel 18 . In this embodiment, the insulating sheet 16 is preferably a Mylar diaphragm, but is not limited thereto, and may also be other insulating film, such as a silicone film, etc. 1 shows that the insulating sheet 16 can have at least one first opening 20, at least one second opening 22, and at least one third opening 24, and the second opening 22 is in an assembly direction A with respect to the first opening 20 (ie, as in the first 1 - the Y-axis direction is formed adjacently, wherein the first opening 20 and the second opening 22 respectively display two in the first figure, and the third opening 24 shows three in the first figure, but not This is limited. In practical applications, as shown in FIG. 1, the first opening 20 and the second opening 22 are arranged at the edges of the insulating sheet 16 to evenly press the tension of the insulating sheet 16 on the metal backing plate 18.

As for the structural design of the metal back plate 18, as shown in FIG. 1, the surface of the metal back plate 18 is used to provide the insulating sheet 16 so that the insulating sheet 16 can be laminated on the metal back plate 18, and the metal back plate 18 corresponds to the first A buckle 26 is formed on the second opening 22, and the buckle 26 has a first bending arm portion 28 and a hook portion 30 extending from the first bending arm portion 28 toward the first opening 20 for buckle The first opening 20 is hooked, wherein the first bent arm portion 28 of the buckle 26 abuts against the second opening 22 of the insulating sheet 16 to restrict the sliding of the insulating sheet 16 on the metal back plate 18, and the hook 26 The hook portion 30 abuts against the insulating sheet 16 between the first opening 20 and the second opening 22 to limit the normal direction of the insulating sheet 16 in the metal back plate 18 (ie, ±Z as shown in FIG. 1) Movement on the axis). In addition, a clamping piece 32 can be protruded from the position of the metal back plate 18 corresponding to the third opening 24, and the clamping piece 32 can have a second bending arm portion 34 and from the second bending arm portion 34. One of the assembly direction A is reversely extended (i.e., extending in the +Y-axis direction shown in Fig. 1) to hold the sheet portion 36 for holding the insulating sheet 16 together with the metal backing plate 18.

The following is a detailed description of the assembly and disassembly of the motherboard assembly structure 10, please refer to FIG. 2 and FIG. 3, and FIG. 2 is a schematic view of the insulation sheet 16 of FIG. 1 superposed on the metal back panel 18, 3 is a schematic view showing the insulating sheet 16 of FIG. 2 fixed on the metal back plate 18. First, in the assembly of the motherboard assembly structure 10, the user only needs to first align the second opening 22 and the third opening 24 of the insulating sheet 16 with the hook 26 of the metal back plate 18 and the clamping piece 32, respectively. The insulating sheet 16 is then laminated on the metal backing plate 18 such that the hooks 26 of the metal backing plate 18 and the holding tabs 32 pass through the second opening 22 and the third opening 24, respectively (as shown in FIG. 2). Next, the user can push the insulating sheet 16 relative to the metal back plate 18 to move in the assembly direction A (ie, the -Y axis direction as shown in FIG. 2) to move the second opening 22 relative to the buckle 26 and The third opening 24 is moved relative to the clamping piece 32 until the first bending arm portion 28 abuts against the second opening 22 and the second bending arm portion 34 abuts against the third opening 24, at this time, as shown in FIG. As shown, as the insulating sheet 16 moves toward the assembly direction A, the hook portion 30 can buckle the first opening 20, and the holding sheet portion 34 can hold the insulating sheet 16 together with the metal back sheet 18. As a result, the displacement of the insulating sheet 16 to the ±X axis, the ±Y axis, and the ±Z axis can be abutted by the first bent arm portion 28 and the second opening 22, and the second bent arm portion 34 and the third portion The abutment of the opening 24, the engagement of the hook portion 30 with the first opening 20, and the clamping of the clamping piece portion 34 and the metal back plate 18 to the insulating sheet 16 are a three-axis positioning mechanism. The insulating sheet 16 can be firmly fixed to the metal backing plate 18. Finally, the user only needs to fix the motherboard 12 to the metal back plate 18 on which the insulating sheet 16 is assembled by using a common fixing method (such as screw locking, etc.), so that the assembly of the motherboard assembly structure 10 can be completed and achieved. The main board 12 is insulated from the metal back board 18 via the arrangement of the insulating sheets 16.

In addition, in the disassembly of the motherboard assembly structure 10, after the user removes the motherboard 12 from the backplane structure 14 (for example, by a screwdriver, etc.), the user only needs to pull the buckle portion 30 and The sheet portion 34 is clamped to release the engagement of the hook portion 30 with the first opening 20 and the clamping of the holding sheet portion 34 with the metal back plate 18 against the insulating sheet 16, and simultaneously push the insulating sheet 16 relative to the metal back sheet 18. Move in the opposite direction of the assembly direction A (ie, the +Y-axis direction as shown in FIG. 3) until the insulating sheet 16 returns to the position as shown in FIG. 2, at this time, since the hook portion 30 is no longer The first opening 20 is fastened and the insulating sheet 16 is no longer held by the holding piece 34 and the metal backing plate 18, so that the user can smoothly detach the insulating sheet 16 from the metal backing plate 18, thereby The disassembly of the motherboard assembly structure 10 is completed quickly and easily.

It should be noted that the third opening on the insulating sheet and the clamping piece on the metal back plate are designed to be omitted, thereby simplifying the structural design of the back plate structure, that is, omitting the third opening and the clamping piece. In another embodiment of the configuration, the back plate structure can only utilize the abutting of the first bent arm portion of the buckle and the second opening of the insulating sheet, and the engagement of the buckle portion with the first opening of the insulating sheet. The insulating sheet is fixed to the metal back plate. Compared with the prior art, the adhesive sheet is attached to the metal back plate by adhesive bonding, and the invention uses the metal back plate to engage with the structure on the insulating sheet to fix the insulating sheet on the metal back plate. The present invention can effectively reduce the assembly cost of the metal back plate and the insulating sheet without using a high-cost adhesive bonding method, and is also permeable to the assembly and disassembly of the metal back plate and the insulating sheet. The simple operation can be completed, so the invention can greatly improve the reworkability of the metal back plate and the insulating sheet. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10‧‧‧ motherboard assembly structure
12‧‧‧ motherboard
14‧‧‧ Backplane structure
16‧‧‧Insulation sheet
18‧‧‧Metal backplane
20‧‧‧ first opening
22‧‧‧second opening
24‧‧‧ third opening
26‧‧‧ buckle
28‧‧‧First bent arm
30‧‧‧ buckle hook
32‧‧‧Clamping piece
34‧‧‧Second bent arm
36‧‧‧Clamping
A‧‧‧assembly direction

Fig. 1 is a schematic exploded view of an assembled structure of a motherboard according to the present invention. Fig. 2 is a schematic view showing the insulating sheet of Fig. 1 laminated on a metal back plate. Fig. 3 is a schematic view showing the insulating sheet of Fig. 2 fixed on a metal back plate.

14‧‧‧ Backplane structure

16‧‧‧Insulation sheet

18‧‧‧Metal backplane

20‧‧‧ first opening

22‧‧‧second opening

24‧‧‧ third opening

26‧‧‧ buckle

28‧‧‧First bent arm

30‧‧‧ buckle hook

32‧‧‧Clamping piece

34‧‧‧Second bent arm

36‧‧‧Clamping

Claims (10)

A backplane structure for carrying a motherboard, the backplane structure comprising: an insulating sheet having at least one first opening and at least one second opening, the at least one second opening being opposite to the at least one first The opening is formed adjacent to an assembly direction; and a metal back plate is disposed on the surface of the insulating sheet, and the insulating sheet is superposed on the metal back plate, and the metal back plate protrudes corresponding to the position of the at least one second opening Forming a buckle having a first bent arm portion and a hook portion extending from the first bent arm portion toward the at least one first opening, when the insulating sheet is superposed on the metal back plate When the hook is passed through the at least one second opening and the insulating sheet is moved relative to the metal back plate in the assembly direction, the at least one second opening is moved relative to the buckle to make the first bend The arm portion abuts the at least one second opening and the buckle hook portion fastens the at least one first opening to fix the insulating sheet on the metal back plate to enable the motherboard to be carried on the back plate structure The metal back plate is insulated from the motherboard. The backplane structure of claim 1, wherein the insulating sheet further has at least one third opening, and the metal backing plate protrudes from the position of the at least one third opening to form a clamping piece, the clamping piece has a a second bending arm portion and a piece extending from the second bending arm portion in a direction opposite to the assembly direction, wherein the insulating sheet is superposed on the metal back plate to pass the clamping piece When the at least one third opening is open and the insulating sheet moves relative to the metal back plate in the assembly direction, the at least one third opening moves relative to the clamping piece to abut the second bending arm portion against the at least one The insulating sheet is sandwiched between the clamping piece and the metal backing plate to fix the insulating sheet to the metal backing plate. The back sheet structure of claim 2, wherein the insulating sheet is a Mylar diaphragm. The backplane structure of claim 1, wherein the at least one first opening and the at least one second opening are arranged at an edge of the insulating sheet to average the tension of the insulating sheet on the metal backing plate. . The backplane structure of claim 1, wherein the first bent arm portion of the buckle abuts against the at least one second opening of the insulating sheet to limit the insulating sheet on the metal back plate Sliding, and the hook portion of the buckle abuts against the insulating sheet between the at least one first opening and the at least one second opening to limit the insulating sheet to a normal direction of the metal back plate Move on. A motherboard assembly structure comprising: a motherboard; and a backplane structure disposed under the motherboard for carrying the motherboard, the backplane structure comprising: an insulating sheet having at least a first An opening and at least one second opening formed adjacent to the at least one first opening in an assembly direction; and a metal back plate having a surface disposed on the insulating sheet, and the insulating sheet is laminated a metal backing plate, the metal backing plate is formed with a buckle corresponding to the position of the at least one second opening, the buckle has a first bending arm portion and the at least one from the first bending arm portion The first opening extends a hook portion, and the insulating sheet is superposed on the metal back plate to pass the hook through the at least one second opening and the insulating sheet moves relative to the metal back plate in the assembly direction Moving the at least one second opening relative to the buckle to abut the first bending arm against the at least one second opening and the buckle hooking the at least one first opening to the insulating sheet Fixed on the metal back plate and on the host The metal backing plate is insulated from the motherboard when the board is supported on the backplane structure. The motherboard assembly structure of claim 6, wherein the insulating sheet further has at least one third opening, the metal back plate protrudingly forming a clamping piece corresponding to the position of the at least one third opening, the clamping piece having a second bent arm portion and a piece extending from the second bent arm portion in the assembly direction oppositely to the clamping piece, when the insulating sheet is superposed on the metal back plate to pass the holding piece When the at least one third opening and the insulating sheet move relative to the metal back plate in the assembly direction, the at least one third opening moves relative to the clamping piece to abut the second bending arm portion against the at least one The third opening and the clamping piece portion and the metal back plate sandwich the insulating sheet to fix the insulating sheet on the metal back plate. The motherboard assembly structure of claim 7, wherein the insulating sheet is a Mylar diaphragm. The motherboard assembly structure of claim 6, wherein the at least one first opening and the at least one second opening are arranged at an edge of the insulating sheet to evenly hook the insulating sheet to the metal back plate. tension. The motherboard assembly structure of claim 6, wherein the first bent arm portion of the buckle abuts against the at least one second opening of the insulating sheet to limit the insulating sheet on the metal back plate Sliding, and the hook portion of the buckle abuts against the insulating sheet between the at least one first opening and the at least one second opening to limit one of the normals of the insulating sheet on the metal back plate Movement in the direction.