CN201115234Y - Liquid cooling type heat absorption device - Google Patents

Abstract

A liquid-cooled heat absorber includes a water-cooled base and a water tank base. The water cooling seat comprises a heat conduction substrate, a plurality of radiating fins and an outer shell covering the heat conduction substrate, and the outer shell, the heat conduction substrate and the radiating fins are matched to define a flow guide space. The water tank seat is assembled on the water cooling seat, is matched with the outer shell to define a containing space which can contain liquid flowing through the radiating fins, and comprises a water outlet pipe communicated with the position, close to the bottom point, of the containing space. Through the design of liquid circulation between the flow guiding space and the containing space, the heat conducted to the radiating fins can be quickly dissipated by the liquid in the containing space, and the temperature of the heating element is further quickly reduced.

Description

Liquid-cooled heat sink

technical field

The utility model relates to a heat absorbing device, in particular to a liquid-cooled heat absorbing device.

Background technique

During the operation of electronic equipment such as computer hosts, LCD screens, and plasma TVs, some electronic components will generate high temperatures, so it is usually necessary to use some heat absorbing devices to force heat dissipation. In recent years, the industry has successively developed a variety of heat absorbing devices. They can be respectively installed on different electronic parts, and the heat sink device installed on the video control card (Video Graphics Array, VGA for short) installed in the host computer will be explained below.

As shown in FIGS. 1 and 2 , a general video control card 1 roughly includes a horizontal substrate 12 and a Graphic Processing Unit (GPU) 13 fixedly mounted on the substrate 12 . Generally, the heat absorbing device 11 includes a heat absorbing plate 111 , a plurality of cooling fins 112 , and a fan 113 . The heat-absorbing plate 111 is attached to the graphics processor 13, and the heat-absorbing fins 112 protrude from the heat-absorbing plate 111 at intervals. The air is blown to the cooling fins 112 for dissipating heat.

Although this kind of heat sink 11 can dissipate heat, it only utilizes the flow of air to dissipate heat, and it is difficult to take away a large amount of heat immediately and quickly. Especially, the graphics processor 13 will generate more heat when it is running. The temperature of the air will also increase accordingly, so the heat dissipation effect is poor and needs to be improved.

Utility model content

The purpose of the utility model is to provide a liquid-cooled heat absorbing device with good heat dissipation effect.

Therefore, the liquid-cooled heat absorbing device described in the utility model is suitable for dissipating the heat generated by a heating element, and includes a water cooling seat and a water tank seat arranged beside the water cooling seat. The water-cooling seat includes a heat-conducting base plate that is reliable against the heating element, an outer shell covering the heat-conducting base plate, and a plurality of heat-dissipating fins protruding from the inner surface of the heat-conducting base plate at intervals. The outer shell has a water injection hole, In addition, the outer shell, the heat conduction base plate and the heat dissipation fin cooperate to define a flow guide space that can accept the liquid flowing in through the water injection hole and through the heat dissipation fin. The water tank seat is assembled on the water-cooling seat, cooperates with the outer shell to define a storage space that can accept the liquid flowing through the cooling fins, and includes a water outlet pipe that communicates with the lowest point of the storage space.

In the liquid-cooled heat absorbing device described in the utility model, the water tank seat is assembled on the side of the water-cooled seat, and also includes a connecting plate fixed on one side of the heat-conducting substrate, and a cover fixed on the connecting plate It is a hollow box that is fixedly connected with the outer shell, and the box, the connecting plate and the outer shell cooperate to define the accommodation space, the outlet pipe is fixed on the box, and has a Inlets connected at points.

In the liquid-cooled heat absorbing device described in the utility model, the heat-conducting substrate is horizontally abutted against the bottom surface of the heating element, the heat-dissipating fins protrude from the bottom surface of the heat-conducting substrate, the outer casing is covered on the bottom surface of the heat-conducting substrate, and the box The peripheral edge is fixed on the bottom surface of the connecting plate and the outer casing, and the accommodating space covers the bottom surface of the connecting plate and the bottom surface of the outer casing.

In the liquid-cooled heat absorbing device described in the utility model, the heat-conducting substrate is horizontally abutted against the bottom surface of the heating element, the heat-dissipating fins protrude from the bottom surface of the heat-conducting substrate, the outer casing is covered on the bottom surface of the heat-conducting substrate, and the box cover It is arranged on the bottom surface of the connecting plate and fixedly connected to one side of the outer casing.

In the liquid-cooled heat absorbing device described in the utility model, the box body has a lower convex portion protruding downward, and the water outlet pipe is connected and fixedly connected to the lower convex portion.

In the liquid-cooled heat absorbing device described in the utility model, the water outlet pipe extends inwardly from the lower convex part into the storage space, and the water outlet pipe is located at the water inlet in the storage space near the lowest point of the storage space.

In the liquid-cooled heat absorbing device described in the utility model, the heat-conducting substrate of the water-cooling seat stands upright against the side of the heating element, the outer shell is covered on the outer surface of the heat-conducting substrate facing away from the heating element, and the box body uses its The peripheral edge is fixed on the outer surface of the connecting plate facing away from the heating element.

In the liquid-cooled heat absorbing device described in the utility model, the water outlet pipe extends downward from the box body into the storage space, and the water outlet pipe is located at the water inlet in the storage space near the lowest point of the storage space.

In the liquid-cooled heat absorbing device described in the utility model, the water outlet pipe is connected and fixedly connected to the side of the box body, and the water inlet of the water outlet pipe is close to the lowest point of the containing space.

In the liquid-cooled heat absorbing device described in the utility model, the water outlet pipe is connected and fixedly connected to the bottom surface of the box body, and the water inlet is connected to the lowest point of the containing space.

In the liquid-cooled heat absorbing device described in the utility model, the water tank seat also includes a hollow box with a cover fixed on the outer surface of the outer shell facing away from the heating element, and the box cooperates with the outer shell to define a It covers the accommodation space on the outer surface of the outer shell, and the outer surface of the outer shell has a communication hole connecting the flow guiding space and the accommodation space, the outlet pipe is fixed on the box body, and has a The water inlet connected at the lowest point.

The beneficial effect of the utility model is that: through the design of the liquid circulation between the diversion space and the storage space, the liquid in the storage space can quickly dissipate the heat conducted to the heat dissipation fins, and then quickly reduce the heat dissipation of the heating element. temperature.

Description of drawings

Fig. 1 is a perspective view of a general air convection heat absorbing device;

Fig. 2 is the side view of this general heat sink assembled on a VGA card;

Fig. 3 is a three-dimensional exploded view of the first embodiment of the liquid-cooled heat absorbing device of the present invention;

Figure 4 is a top sectional view of the first embodiment;

Figure 5 is a front side sectional view of the first embodiment;

Fig. 6 is a left side view of the first embodiment, illustrating another configuration of a water outlet pipe;

Fig. 7 is a front side view of the first embodiment when it is erected, illustrating another configuration of the outlet pipe;

Fig. 8 is a view similar to Fig. 7, illustrating another configuration of the outlet pipe;

Fig. 9 is a view similar to Fig. 8, illustrating another configuration of the outlet pipe;

Fig. 10 is a front side sectional view of the second embodiment of the liquid-cooled heat absorbing device of the present invention;

Fig. 11 is a perspective view of the third embodiment of the liquid-cooled heat absorbing device of the present invention;

Fig. 12 is a front side sectional view of the third embodiment.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

As shown in Figures 3 to 5, the first embodiment of the liquid-cooled heat absorbing device of the present invention is suitable for being assembled on a heating element 21. In this embodiment, the heating element 21 is a VGA card (Video Graphics Array, video control card) 2 graphics processor (Graphic Processing Unit, referred to as GPU), and the liquid-cooled heat absorbing device is horizontally against the bottom surface of the heating element 21, but it can be implemented according to the type of heating element 21 The installation method of the liquid-cooled heat absorbing device can be changed according to the installation location, and is not limited to the above.

The liquid-cooled diffuser includes a water-cooling seat 3 which can be used to abut against the bottom surface of the heating element 21 , and a water-tank seat 4 connected and fixed to the left side of the water-cooling seat 3 . The water cooling base 3 includes a horizontal heat conduction substrate 31 made of a material with good heat conduction, a plurality of intervals extending back and forth and protruding from the bottom surface of the heat conduction substrate 31 in parallel with cooling fins 32 , and three intervals protruding from the bottom surface of the heat conduction substrate 31 There are partition plates 33 respectively interposed between three adjacent heat dissipation fins 32 , and a cover-shaped outer casing 34 that covers the heat dissipation fins 32 and the partition plates 33 and is fixedly connected to the bottom surface of the heat conduction substrate 31 with its peripheral edge.

The outer casing 34 abuts against the bottom side of the heat dissipation fins 32 and the partition plate 33 with its bottom wall 342, and has a forward water injection hole 341 passing through its inner and outer peripheral surfaces, and the outer casing 34, heat conduction The substrate 31 cooperates with the cooling fins 32 to define a flow guide space 30 . The partition plates 33 on the left and right sides abut against the inner peripheral surface of the outer casing 34 with their front sides respectively, and the partition plates 33 in the middle abut against the inner peripheral surface of the outer casing 34 with their rear sides. And the diversion space 30 is partitioned into a one-way return channel connected between the water injection hole 341 and the water tank seat 4 .

The water tank seat 4 includes a connection plate 41 made of a material with good heat conduction and fixed to the left side of the heat conduction substrate 31 , a cover with an opening facing upwards and fixed to the bottom surface of the connection plate 41 and the bottom surface of the outer shell 34 with its peripheral edge Body shape box body 42, and a water outlet pipe 43 that communicates and is fixedly connected to the front side of box body 42 left half. The left half of the box body 42 has a downward protruding lower convex portion 421, and the water tank seat 42, the connecting plate 41 cooperates with the outer shell 34 to define a space that communicates with the flow guide space 30 and covers the connecting plate 41. The accommodating space 40 between the bottom surface and the bottom surface of the outer casing 34 has a volume larger than that of the diversion space 30, and the outlet pipe 43 is connected to the lower convex portion 421 of the box body 42 near the bottom side of the front side, and has a The water inlet 431 communicates with the container space 40 near the lowest point.

In this embodiment, the heat-conducting substrate 31 and the connecting plate 41 are integrally formed, and the outer shell 34 is connected to the box body 42, and the connected outer shell 34 and the box body 42 are covered on the heat-conducting substrate. 31 and connecting plate 41 to constitute the liquid-cooled heat absorber, but during implementation, the assembly structure of the water-cooling seat 3 and the water tank seat 4 is not limited to this.

When the liquid-cooled heat absorbing device is used, the integrally connected heat-conducting substrate 31 and connecting plate 41 are assembled and fixed on the bottom surface of the VGA card 2 , so that the heat-conducting substrate 31 is directly attached to the bottom surface of the heating element 21 . And when in use, the water injection hole 341 of the water cooling seat 3 and the water outlet pipe 43 of the water tank seat 4 will be connected to a pump (not shown in the figure) through a water pipe (not shown in the figure) respectively, and will be ahead of the water tank seat 4 Fill the cooling liquid with the water cooling seat 3.

When the pump operates, the liquid in the containing space 40 will be continuously pumped out, enter the water pipe through the water inlet 431 of the water outlet pipe 43, and enter the flow guide space 30 through the water injection hole 341 of the outer shell 34, so that the liquid entering the The liquid in the flow guide space 30 gradually passes through the heat dissipation fins 32 in a meandering way, and gradually takes away the heat transferred from the heating element 21 to the heat dissipation fins 32 through the heat conduction substrate 31 , and the liquid heated by the heat of the heat dissipation fins 32 When it flows out of the diversion space 30 and enters the storage space 40, it will immediately mix with a large amount of liquid at a lower temperature to cool down, and then be drawn out by the pump through the outlet pipe 43 for circulation, so that the relatively high temperature in the storage space 40 can be kept constant. The cryogenic liquid cools down the cooling fins 32 . In addition, the liquid located in the containing space 40 and covered by the bottom wall 342 also absorbs the heat transferred to the connecting plate 41 and the outer shell 34 , and helps to dissipate the heat.

Because the liquid in the liquid-cooled heat absorbing device circulates through the water pipe connected between the water outlet pipe 43 and the water injection hole 341 of the outer shell 34, during the long-term cooling process, it is inevitable that some liquid will pass through the water pipe itself or The joint gap between the water pipe and the liquid-cooled heat absorbing device evaporates, causing the liquid in the containing space 40 to decrease. The structural design of the connecting structure near the lowest point of the storage space 40, when the water level in the storage space 40 is lowered, the outlet pipe 43 will still be maintained under the liquid level, and it can be ensured that there will be water in a long period of time. The liquid can be pumped into the water pipe and the flow guide space 30 for circulation and cooling.

But during implementation, this outlet pipe 43 is not limited to the place near the bottom edge of the front side of the lower convex part 421, and can also be arranged at a higher place on any side of the casing 42. As shown in Figure 6, the outlet pipe 43 The section located in the accommodating space 40 is designed to bend down and extend close to the bottom edge of the inner surface of the lower convex portion 421, so that the water inlet 431 is located near the lowest point of the accommodating space 40, so that the accommodating space 40 can still be accommodated. The temperature of the remaining liquid inside is circulated and cooled, so that the liquid-cooled heat absorbing device can maintain a certain cooling level.

In addition, the liquid-cooled heat absorbing device can also be changed to be installed upright beside the heating element (not shown in the figure), as shown in Figures 7 to 9, at this time, the water outlet pipe 43 can be designed to be inserted up and down On the box body 42, and extend down into the storage space 40, so that the water inlet 431 is adjacent to the lowest point of the storage space 40, or it is designed to be connected and fixed to the left side of the box body 42 near the bottom edge, Or it is designed to communicate and be fixedly connected to the bottom surface of the box body 42 .

During implementation, an opening mechanism (not shown) for replenishing liquid for heat dissipation can also be provided on the box body 42, and when necessary, the liquid in the housing space 40 can be replenished in good time, so that the liquid-cooled suction The thermal device maintains the best cooling effect, but the implementation is not limited thereto. In this embodiment, the heat dissipation fins 32 and the partition plate 33 of the water cooling seat 3 are integrally formed on the heat conduction substrate 31, but during implementation, the number and arrangement of the heat dissipation fins 32 and the partition plate 33 are different. This is the limit, and it is not necessary to provide the partition plate 33 . In addition, the setting position of the lower convex part 421 of the box body 42 can also be changed according to needs, and is not limited to the above-mentioned position, for example, it can be protruded downward at the right end or middle part of the box body 42, etc., and the lower part is not set. The convex part 421 is necessary.

As shown in FIG. 10 , the difference between the second embodiment of the liquid-cooled heat absorbing device of the present invention and the first embodiment lies only in the structure of the tank body 42 of the water tank seat 4 . The following only describes the differences between this embodiment and the first embodiment.

In this embodiment, the box body 42 is integrally fixed to the left side of the outer shell 34 in communication with the flow guiding space 30 of the outer shell 34 , and does not cover the bottom surface of the outer shell 34 . Through this kind of assembly structure design, the liquid circulation between the receiving space 40 and the flow guide space 30 can still be used to take away the heat conducted to the heat dissipation fins 32 to achieve the effect of heat dissipation. However, during implementation, the outer shape of the box body 42 is not limited thereto.

As shown in Fig. 11 and Fig. 12, the difference between the third embodiment of the liquid-cooled heat absorbing device of the present invention and the first embodiment lies in the joint structure design of the water tank seat 4 and the water-cooling seat 3 .

In this embodiment, a communication hole 343 communicating with the flow guide space 30 is pierced on the left side of the outer shell 34 of the water cooling seat 3 on the bottom surface facing away from the heat conduction substrate 31 . The water tank seat 4 is not provided with a connecting plate 41, and the casing 42 is fixedly connected to the bottom surface of the outer shell 34 with its peripheral edge, and cooperates with the outer shell 34 to define a communication hole 343 that is communicated with and covers the outer shell. 34 accommodating space 40 on the bottom surface. The outlet pipe 43 is fixedly connected to the right half of the box body 42 and communicates with the container space 40 near the lowest point.

Through the above structural design, the liquid can be used to enter the flow guide space 30 and flow through the heat dissipation fins 32 to gradually take away the heat transferred from the heating element 21 to the heat conduction substrate 31, and make the liquid flowing out of the flow guide space 30 pass through the communication The hole 343 enters the housing space 40, and can be mixed with the lower temperature liquid in the housing space 40 to cool down, and then discharged to the external circulation to cool down through the outlet pipe 43, and the heat generated by the heating element 21 can still be dissipated quickly, and then Avoid heating element 21 overheating.

During implementation, the liquid-cooled heat absorbing device of this embodiment can also stand upright against the heat-generating element 21 with the heat-conducting substrate 31, and the outlet pipe 43 can adopt the structural design disclosed in FIGS. 7 to 9 of the first embodiment, but the implementation Time is not limited to this.

In view of the above, through the design of taking away the heat conducted to the heat dissipation fins 32 of the water cooling seat 3 by circulating liquid, the constant low temperature liquid in the accommodation space 40 can be used to quickly dissipate the heat conducted to the heat dissipation fins 32 Compared with the general heat dissipation method simply by air convection, it has an excellent heat dissipation effect. In addition, the water inlet 431 of the outlet pipe 43 is connected to the structural design near the bottom edge of the storage space 40. When the water level of the liquid in the storage space 40 drops, the remaining liquid in the storage space 40 can still be circulated. cooling, so that the liquid-cooled heat absorbing device has a certain level of cooling effect.

Claims (11)

1. liquid-cooled heat sink, being applicable to looses removes the heat that a heater element produces, it is characterized in that, comprise a water-cooled seat, and water tank seat that is connected on the water-cooled seat, this water-cooled seat comprises a heat-conducting substrate that reliably is butted on this heater element, a shell body that is covered on the heat-conducting substrate, and a plurality of intervals are convexly set in the radiating fin of heat-conducting substrate medial surface, this shell body has a water injection hole, and this shell body, heat-conducting substrate matches with radiating fin and defines the diversion space that can accept by the liquid of the water injection hole inflow and the radiating fin of flowing through, this water tank seat is connected on the water-cooled seat, and match with shell body and to define the space that is installed in of the liquid that can accept the radiating fin of flowing through, and comprise one with near being installed in the outlet pipe that minimum point place, space is communicated with.

2. liquid-cooled heat sink according to claim 1, it is characterized in that, this water tank seat is assembled in water-cooled seat side, and also comprise a connecting plate that is fixed in a side of heat-conducting substrate, and lid establish be fixed on the connecting plate and with the casing of the affixed hollow of shell body, and this casing, connecting plate match with shell body and define this and be installed in the space, and this outlet pipe is fixed on the casing, and have one with near being installed in the water inlet that minimum point place, space is communicated with.

3. liquid-cooled heat sink according to claim 2, it is characterized in that, this heat-conducting substrate level is against being connected to the heater element bottom surface, radiating fin is based in the heat-conducting substrate bottom surface respectively, this shell body is covered on the heat-conducting substrate bottom surface, and this casing is consolidated in connecting plate and shell body bottom surface with its periphery, and this is installed in the space and contains connecting plate bottom surface and shell body bottom surface.

4. liquid-cooled heat sink according to claim 2, it is characterized in that, this heat-conducting substrate level is against being connected to the heater element bottom surface, radiating fin is based in the heat-conducting substrate bottom surface respectively, this shell body is covered on the heat-conducting substrate bottom surface, and this Box Cover is located at the connecting plate bottom surface and is fixed in a side of shell body.

5. according to claim 3 or 4 described liquid-cooled heat sinks, it is characterized in that this casing has a down following protuberance of projection, this outlet pipe connection is fixed in down protuberance.

6. liquid-cooled heat sink according to claim 5 is characterized in that, oneself following protuberance of this outlet pipe extends into toward in and is installed in the space, and this outlet pipe is positioned at the close minimum point place, space that is installed in of the water inlet that is installed in the space.

7. liquid-cooled heat sink according to claim 2, it is characterized in that, the heat-conducting substrate of this water-cooled seat is uprightly against being connected to the heater element side, this shell body is covered on the heat-conducting substrate lateral surface of heater element dorsad, and this casing is consolidated in the connecting plate lateral surface of heater element dorsad with its periphery.

8. liquid-cooled heat sink according to claim 7 is characterized in that, this outlet pipe down extends into from casing and is installed in the space, and this outlet pipe is positioned at the close minimum point place, space that is installed in of the water inlet that is installed in the space.

9. liquid-cooled heat sink according to claim 7 is characterized in that, this outlet pipe connection is fixed in the casing side, and the water inlet of this outlet pipe is near being installed in minimum point place, space.

10. liquid-cooled heat sink according to claim 7 is characterized in that, this outlet pipe is communicated with and is fixed in tank floor, and its water inlet is communicated in and is installed in minimum point place, space.

11. liquid-cooled heat sink according to claim 1, it is characterized in that, this water tank seat comprises also that a lid is established and is fixed in the shell body casing of the hollow of the lateral surface of heater element dorsad, and this casing matches with shell body and defines the space that is installed in of the lateral surface of containing shell body, and the lateral surface of this shell body has one and is communicated with diversion space and the intercommunicating pore that is installed in the space, this outlet pipe is fixed on the casing, and have one with near being installed in the water inlet that minimum point place, space is communicated with.

Images