CN201064080Y - Fan-free heat dissipation system module - Google Patents

Abstract

The utility model relates to a system module of fan heat dissipation exempts from, including a housing element, a circuit module, a heat dissipation unit and a compel tight unit. The shell unit comprises a front shell and a rear cover body made of metal with good heat conductivity. The circuit module is accommodated in the shell unit and comprises a circuit board and a heating element which form electric connection. The heat dissipation unit comprises a heat conduction block and at least one heat dissipation piece; the heat conducting block is arranged on the inner surface of the rear cover body in a protruding way and corresponds to the position of the heating element, and is used for conducting the heat energy emitted by the heating element to the rear cover body; the heat sink is integrally formed on one surface of the rear cover body far away from the heating element, and the shape of the heat sink is generally in a fin shape. The tightening unit comprises at least two studs, at least two screw locking members and at least two elastic members, so that the heat conducting block and the heating element can be kept in close and good contact.

Description

System modules without fan cooling

technical field

The utility model relates to a fan-free system module for heat dissipation, in particular to a system module which directly has a heat dissipation unit and uses the principle of heat convection and heat conduction to achieve heat dissipation.

Background technique

The existing system module usually includes a casing and a circuit module inside the casing. Wherein, the circuit module is composed of a motherboard and a plurality of electronic components arranged on the motherboard, such as central processing unit, hard disk, memory, or IC.

Since the electronic components will generate heat energy when they are working, ventilation holes and fans will be installed at the appropriate positions of the system modules corresponding to the electronic components to dissipate heat and prevent the system modules from crashing and operating abnormally due to overheating of the electronic components.

However, conventional system modules using fans for heat dissipation have the following deficiencies, resulting in poor applicability:

(1) The production cost of the fan is high.

(2) The space occupation rate of the fan is large, resulting in low space utilization inside the system module.

(3) When the fan is running, it is easy to generate noise.

(4) After the fan has been used for a period of time, it is prone to failure.

In view of the defects of the above-mentioned existing system modules that use fans to dissipate heat, the designer actively conducts research and innovation based on years of rich practical experience and professional knowledge in the design and manufacture of such products, and cooperates with the application of academic theories, in order to create a A fan-free cooling system module with a novel structure can improve the general existing system module using a fan for cooling, making it more practical. Through continuous research, design, and after repeated trial samples and improvements, the utility model with practical value is finally created.

Contents of the invention

The main purpose of the utility model is to overcome the defects of the existing system modules that utilize fans to dissipate heat, and provide a new structure of fan-free system modules. The technical problem to be solved is to make its production cost low and Applicability is good, so it is more suitable for practical use.

Another object of the present invention is to provide a fan-free cooling system module with high utilization of the internal space of the device.

Another object of the present invention is to provide a system module with no noise and trouble-free fan-free heat dissipation.

According to the above purpose, the novel fan-free heat dissipation system module includes a housing unit, a circuit module, a heat dissipation unit, and a compression unit. The casing unit includes a front casing which is assembled together and cooperates to define an accommodating space, and a rear cover made of metal with good thermal conductivity. The circuit module is accommodated in the accommodating space, the circuit module includes a circuit board, and at least one heating element is arranged on the circuit board and forms an electrical connection with the circuit board and faces the rear cover; the rear cover The surfaces facing and away from the heating element are respectively defined as the inner surface and the back surface of the rear cover. The heat dissipation unit includes a heat conduction block and at least one heat dissipation element; the heat conduction block is arranged on the inner surface of the rear cover and protrudes from the inner surface, and is corresponding to the position of the heating element, and is used to conduct the heat energy emitted by the heating element to the The rear cover body and the radiator are integrally formed on the side of the rear cover body away from the heating element, and are generally fin-shaped. The pressing unit includes at least two studs, at least two screw locks, and at least two elastic members; the studs are arranged on the inner surface of the rear cover and are located at an opposite side of the heat conduction block, and each stud has an integrally formed A base protruding from the inside of the back cover, and a hollow socket part passing through the front side of the circuit board; two screw locks are respectively screwed in each socket part; two elastic parts are respectively sleeved on the Each of the socket parts is outside and located between each of the screw locks and the circuit board.

The aforementioned rear cover body is provided with a first hollow part and a second hollow part on the bottom side and the top side respectively, and the two hollow parts communicate with the accommodating space; and the circuit module further includes at least one signal transmission part It is inserted on the circuit board and forms an electrical connection with the circuit board, and at least one bracket is assembled on the inner side of the housing unit and has a through groove for the signal transmission member to pass through, and the bracket is provided with at least A through hole communicates with the first hollow part and the second hollow part.

The aforementioned second hollow portion includes a plurality of perforations penetrating through the top side of the rear cover.

The aforementioned heating element can be a central processing unit, a hard disk, a memory, or an IC.

The aforementioned rear cover includes a first cover and a second cover. The first cover is mutually assembled with the front case, and has a third hollow part through; and the second cover is detachably mounted on the third hollow part, and closes the hollow part .

The aforementioned first cover further has at least one positioning groove recessed on one side of the third hollow portion, and the second cover has at least one limiting tenon correspondingly combined with the positioning groove.

The aforementioned heat conduction block can be integrally formed on the inner surface of the rear cover; the heat conduction block can also be a different body from the rear cover.

The aforementioned heat dissipation unit further includes a heat-conducting medium, which is arranged between two pairs of the heating element, the heat-conducting block, and the rear cover.

The aforementioned heat conduction medium can be a flexible insulating heat conduction element or a heat conduction paste.

The above-mentioned rear cover body is provided with a plurality of exhaust holes and air intake holes at the upper and lower positions of its periphery respectively.

The aforementioned system module includes a display module, and the system module and the display module are erected on a base.

With the above technical solution, the fan-free cooling system module of the present invention has at least the following advantages:

To sum up the above, since the fan-free heat dissipation system module of the present invention does not require additional assembly of a heat dissipation unit, it uses the convection mechanism design of the first hollow part through the through hole and the second hollow part, and the fin-shaped The heat sink is integrally formed on the back of the rear cover, and the heat conduction block is used to conduct the heat generated by the heating element, and the tightness and fit between the heat conduction block and the heating element are strengthened by using the pressing unit and the heat transfer medium. The heat dissipation effect is improved, the production cost is low and there is no risk of noise and failure. In addition, since the space occupancy rate of each element of the heat dissipation unit is small, the user can effectively use the accommodation space in the housing unit, and the space utilization and applicability are good. Therefore, really reach the creation purpose of the utility model.

To sum up, the utility model has the above-mentioned many advantages and practical value, it has great improvement no matter in product structure or function, has significant progress in technology, and has produced easy-to-use and practical effects, and Compared with the existing system modules that use fans to dissipate heat, the present invention has enhanced outstanding functions, is more suitable for practical use, and has wide application value in the industry. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

FIG. 1 is a three-dimensional assembly view illustrating a preferred embodiment of the fan-free heat dissipation system module of the present invention, and shows the appearance of the system module mounted on a base.

FIG. 2 is a perspective view illustrating the appearance of a preferred embodiment of the system module.

FIG. 3 is a three-dimensional exploded view illustrating a housing unit, a circuit module, and a heat dissipation unit of a preferred embodiment of the module.

FIG. 4 is a partial perspective assembly view illustrating the disposition relationship of a second cover and a first cover in a preferred embodiment of the system module after they are separated.

FIG. 5 is an exploded perspective view illustrating a heat conduction block and a compression unit of a preferred embodiment of the system module.

FIG. 6 is a schematic cross-sectional side view illustrating the relative assembly relationship between a heat conduction block and a central processing unit in a preferred embodiment of the system module.

FIG. 7 is a schematic cross-sectional side view illustrating another embodiment of the heat conduction block of the preferred embodiment of the system module.

FIG. 8 is a schematic sectional side view illustrating another embodiment of the heat conduction block of the preferred embodiment of the system module; and

FIG. 9 is a schematic sectional side view illustrating another embodiment of the heat conduction block of the preferred embodiment of the system module.

1: Base body 2: System module

3: Housing unit 31: Accommodating space

32: Front shell 33: Rear cover

331: Inside 332: Back

333: the first cover 334: the second cover

335: The third hollow part 336: Positioning groove

337: Limit tenon 34: The first hollow part

35: The second hollow part 351: Perforation

4: Circuit module 41: Circuit board

42: heating element 42a: central processing unit

42b: hard disk 42c: memory

42d: IC 42e: IC

43: Signal transmission part 44: Bracket

441: slotting 442: through hole

5: Heat dissipation unit 51: Heat conduction block

52: Heat sink 53a: Air intake hole

53b: exhaust hole 54: heat transfer medium

5: Compression unit 61: Screw lock

611: screw 612: limit ring

613: Head 614: Shaft

62: Stud 621: Base

622: socket part 63: elastic piece

7: Display module

Detailed ways

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings.

Referring to FIG. 2 to FIG. 6 , it is a preferred embodiment of the fan-free cooling system module of the present invention. The system module 2 includes a housing unit 3 , a circuit module 4 , a heat dissipation unit 5 , and a compression unit 6 .

The casing unit 3 includes a front casing 32 that is assembled together and cooperates to define an accommodating space 31, and a rear cover made of a metal with good thermal conductivity (such as aluminum, copper, or an alloy thereof) body33.

Referring to FIGS. 2 to 5 , the circuit module 4 is accommodated in the accommodation space 31 of the housing unit 3 and includes a circuit board 41 , and at least one circuit board 41 is arranged on the circuit board 41 and is electrically connected to the circuit board 41 . Facing the heating element 42 of the rear cover 33 . The circuit module 4 further includes at least one signal transmission element 43 inserted on the circuit board 41 and electrically connected to the circuit board 41 , and a set of brackets 44 disposed on the inner side of the rear cover 33 of the housing unit 3 . Here, the surface of the rear cover 33 facing the heating element 42 is defined as the inner surface 331 of the rear cover 33 ; In addition, in this embodiment, the number of heating elements 42 is five, and they are respectively a central processing unit 42a, a hard disk 42b, a memory 42c, and ICs 42d and 42e.

The bracket 44 has through slots 441 penetrating in the vertical direction, the number and shape of which correspond to the signal transmission element 43 , and are used to bind and fix the signal transmission element 43 . The signal transmission part 43 of this embodiment can be a universal serial bus (Universal Serial Bus, USB), an AV terminal, or a PS2 port, etc. The bracket 44 also has a plurality of through holes 442 penetrating in the vertical direction, and the through holes 442 communicate with the first hollow portion 34 and the second hollow hole 35 described below.

It is worth mentioning here that, in this embodiment, in order to facilitate replacement of the hard disk 42b and the memory 42c, the hard disk 42b and the memory 42c are all designed to be detachably inserted on the circuit board 41; correspondingly, The rear cover 33 may include a first cover 333 and a second cover 334 . Wherein, the first cover 333 is assembled with the front case 32, and has a through third hollow portion 335 corresponding to the position of the hard disk 42b and the memory 42c; and the second cover 334 is detachably mounted on the the third hollow portion 335 of the first cover 333 and close the third hollow portion 335 . In practice, the first cover 333 also has at least one positioning groove 336 recessed on one side of the third hollow portion 335 , while the second cover 334 has at least one positioning card correspondingly combined with the positioning groove 336 The tenons 337 are used to connect the covers 333 , 334 together to form the rear cover 33 . In this way, if the user wants to install and remove the hard disk 42b or the memory 42c, he only needs to separate the stopper tenon 337 of the second cover 334 from the positioning groove 336 of the first cover 333, and then the hard disk 42b or the memory can be easily installed and removed. 42c.

In order to achieve the heat dissipation effect, the new fan-free cooling system module is implemented in two ways, as follows:

The first method uses the principle of thermal convection. Its embodiment is to form a first hollow part 34 and a second hollow part 35 through the bottom side and top side of the first cover 333 of the rear cover body 33 respectively, and the upper and lower positions on the periphery of the rear cover body 33 A plurality of exhaust holes 53b and air intake holes 53a are opened respectively. In this embodiment, the second hollow portion 35 is composed of a plurality of through holes 351 arranged at intervals on the top side of the first cover 333 . Accordingly, when the heating element 42 operates and generates heat, it will exchange heat with the adjacent air; the hot air will rise and be discharged from the second hollow portion 35 above and the exhaust hole 53b, while the cold air will flow from below. The first hollow portion 34 and the air intake hole 53 a flow in, and replenish into the accommodating space 31 through the through hole 442 of the bracket 44 to exchange heat with the heating element 42 again. If it is a convective circulation, it will be able to achieve the cooling effect.

The second method utilizes a heat dissipation unit 5 to achieve the heat dissipation effect based on the principle of heat conduction, and supplements a compression unit 6 to maintain its good heat dissipation effect.

The heat dissipation unit 5 includes a heat conduction block 51 and a heat dissipation element 52 . Wherein, the heat conduction block 51 is arranged on the inner surface 331 of the rear cover body 33 and protrudes from the inner surface, which corresponds to the position of the heating element 42 (such as the central processing unit 42a), and is used for conducting the heat energy emitted by the heating element to the rear cover body 33. The shape of the cooling element 52 is generally fin-like, and is integrally formed on the back side of the first cover 333 and the second cover 334 of the rear cover 33 (the side away from the circuit module 4 ); the cooling element 52 can be used In order to dissipate the heat absorbed by the rear cover 33 into the air.

The pressing unit 6 includes four screw locks 61 , four studs 62 , and four elastics 63 . Wherein, each screw lock 61 is composed of a screw 611 and a limit ring 612; the screw 611 has a head 613 connected with a shaft portion 614; the limit ring 612 is set on the head of the screw 611 outside of portion 613.

The studs 62 are integrally formed and projected at intervals on the inner surface 331 of the rear cover 33 near the heating element 42 ( 42 a ), and are located on an opposite side of the heat conducting block 51 . Each stud 62 has a base 621 formed on the inner surface 331 , and a hollow socket 622 extending forward from the base 621 . The sleeve part 622 can pass through the circuit board 41 and be screwed and fixed with the shaft part 614 of the screw 611, so that the stud 62 and the screw lock part 61 can jointly compress the central processing unit 42a through the elastic part 63 described below With heat conduction block 51. It must be noted here that the height of the hollow stud 62 is smaller than the height of the stud used for assembling the housing unit 3 , so as to avoid affecting the connection between the front housing 32 and the rear cover 33 .

The elastic member 63 of this embodiment is implemented in the form of a compression spring, which is sleeved outside the sleeve portion 622 and limited by the circuit board 41 and the limit ring 612 to provide a buffer force to prevent the stud 62 and the screw lock 61 are too screwed together to damage the circuit board 41, and at the same time, the tight and good contact between the heating element 42 (42a) and the heat conducting block 51 can also be pressed by its elastic force.

Through the cooperation of the heat dissipation unit 5 and the pressing unit 6, when the heating element 42 (42a) operates and generates heat energy, the heat energy will be directly and rapidly conducted to the rear cover body 33 and the heat dissipation element 52 through the heat conduction block 51, Then dissipate in the air to achieve the effect of heat dissipation, and can effectively avoid the overheating failure of the heating element 42 .

It must be noted here that the screw 611 and the elastic member 63 of this embodiment are all products of general specifications. Since the cross-section of the head 613 of the selected screw 611 is smaller than the cross-section of the elastic member 63, in order to position the elastic member 63, Therefore, a limiting ring 612 is added; however, the designer can directly select a screw with a cross-section larger than the elastic member 63, and it is not limited thereto. In addition, in this embodiment, the number of studs 62 and the corresponding screw locks 61 and elastic members is four; of course, the designer can also adjust the number of the above-mentioned elements according to actual needs, and it is not limited by this embodiment. Only those who disclose.

Referring to FIG. 6 , in practice, the heat conduction block 51 can be integrally formed on the inner surface 331 of the rear cover 33 . However, referring to FIG. 7, the heat conduction block 51 can also be different from the rear cover body 33, so the size and thickness of the heat conduction block 51 can depend on the heat generated by the heating element 42; and according to this structure, the heat conduction The block 51 can be specially selected from materials with better thermal conductivity, so that the heat energy of the heating element 42 can be transmitted to the rear cover 33 more quickly, and the heat dissipation efficiency can be improved.

Furthermore, referring to Fig. 8 and Fig. 9, the aforesaid heat dissipation unit 5 further includes a heat conducting medium 54, which is arranged between the heating element 42 (42a) and the heat conducting block 51, or is arranged on the heating element 42 (42a) , between two of the heat conducting block 51 and the rear cover 33 . The heat-conducting medium can be a flexible insulating heat-conducting element, or a heat-conducting paste; the heat-conducting medium 54 can make the combined components have a better fit and improve heat dissipation efficiency.

Referring also to FIG. 1 , the system module 2 further includes a display module 7 , and the system module 2 and the display module 7 are erected on the base 1 to facilitate viewing of the display module 7 .

To sum up the above, since the fan-free heat dissipation system module of the present invention does not require additional assembly of a heat dissipation unit, it uses the convection mechanism design of the first hollow part through the through hole and the second hollow part, and the fin-shaped The heat sink is integrally formed on the back of the rear cover, and the heat conduction block is used to conduct the heat generated by the heating element, and the tightness and fit between the heat conduction block and the heating element are strengthened by using the pressing unit and the heat transfer medium. The heat dissipation effect is improved, the production cost is low and there is no risk of noise and failure. In addition, since the space occupancy rate of each element of the heat dissipation unit is small, the user can effectively use the accommodation space in the housing unit, and the space utilization and applicability are good. Therefore, really reach the creation purpose of the utility model.

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments without departing from the technical solution of the present utility model. Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (16)

1. exempt from system's module that fan dispels the heat for one kind, it is characterized in that this system's module comprises:

One housing unit, it comprises mutual winding together and match and define a procapsid of an accommodation space, and one by the made rear cover body of the good metal of thermal conductivity;

One circuit module is located in this accommodation space, and this circuit module comprises a circuit board, and at least one heater element is arranged on this circuit board and form with this circuit board and to be electrically connected and to face this rear cover body; This rear cover body is in the face of reaching the inner face and the back side that is defined as this rear cover body away from the face of this heater element respectively;

One heat-sink unit comprises:

One heat-conducting block is located at the inner face of this rear cover body and is protruded from this inner face, and it is corresponding to the position of this heater element, in order to conduct heat energy that this heater element sends to this rear cover body; And

At least one heat sink, it is integrally formed in the back side of this rear cover body, and shape is the fin shape; And

One packing unit comprises:

At least two double-screw bolts are located at the inner face of this rear cover body, and are positioned at the position of this heat-conducting block one opposite side, and respectively this double-screw bolt has integrated one base portion that is convexly set in this rear cover body inner face, and a socket part that passes the hollow of this circuit board front side;

At least two spiral locks, spiral shell is located at respectively in this socket part respectively; And

At least two elastic components are sheathed on respectively outside this socket part respectively and lay respectively at respectively between this spiral lock and this circuit board.

2. system's module of exempting from the fan heat radiation according to claim 1 is characterized in that the bottom side of described rear cover body and top side are respectively equipped with one first hollow-out parts and one second hollow-out parts, and these two hollow-out parts communicate with this accommodation space; And this circuit module further includes at least one signal Transmission Part, and that is inserted on this circuit board and forms with this circuit board and is electrically connected, and at least one groups of holders is located at the inboard of this housing unit and is run through and has the groove of wearing and wear appearance for this signal Transmission Part, and this support is provided with at least one through hole that runs through, and this through hole communicates with this first hollow-out parts and this second hollow-out parts.

3. system's module of exempting from the fan heat radiation according to claim 2 is characterized in that described second hollow-out parts comprises most the perforation that run through this rear cover body top side.

4. system's module of exempting from the fan heat radiation according to claim 1 and 2 is characterized in that described heater element can be a central processing unit, a hard disk, a memory, or an IC.

5. system's module of exempting from the fan heat radiation according to claim 1 and 2 is characterized in that described rear cover body comprises:

One first cover piece, itself and this procapsid is organized mutually and is established, and has the 3rd hollow-out parts that runs through; And

One second cover piece is installed in the 3rd hollow-out parts removably, and seals this hollow-out parts.

6. system's module of exempting from the fan heat radiation according to claim 5, it is characterized in that described first cover piece has more at least one location notch and is arranged with a sidepiece in the 3rd hollow-out parts, this second cover piece then have at least one spacing trip that with the corresponding combination of this location notch.

7. system's module of exempting from the fan heat radiation according to claim 1 and 2 is characterized in that described heat-conducting block is the inner face that is formed at this rear cover body in one piece.

8. system's module of exempting from the fan heat radiation according to claim 7 is characterized in that described heat-sink unit more comprises a heat-conducting medium, and it is located between this heater element and this heat-conducting block.

9. system's module of exempting from fan heat radiation according to claim 8 is characterized in that described heat-conducting medium is one to have flexible insulating heat-conductive spare.

10. system's module of exempting from the fan heat radiation according to claim 8 is characterized in that described heat-conducting medium is a heat-conducting cream.

11. system's module of exempting from fan heat radiation according to claim 1 and 2 is characterized in that described heat-conducting block and this rear cover body are consubstantiality not.

12. system's module of exempting from the fan heat radiation according to claim 11 is characterized in that described heat-sink unit more comprises two heat-conducting mediums, it is located at this heater element, this heat-conducting block, this rear cover body respectively between any two.

13. system's module of exempting from fan heat radiation according to claim 11 is characterized in that described heat-conducting medium is one to have flexible insulating heat-conductive spare.

14. system's module of exempting from the fan heat radiation according to claim 11 is characterized in that described heat-conducting medium is a heat-conducting cream.

15. system's module of exempting from the fan heat radiation according to claim 1 and 2 is characterized in that the upper and lower position of the periphery of described rear cover body offers most steam vents and air admission hole respectively.

16. system's module of exempting from fan heat radiation according to claim 1 and 2 is characterized in that described system module includes one and shows module, and this system's module and this demonstration module are to be set up on the pedestal.

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