CN107531815B - 固化性组合物及电子部件的制造方法 - Google Patents
固化性组合物及电子部件的制造方法 Download PDFInfo
- Publication number
- CN107531815B CN107531815B CN201680024029.0A CN201680024029A CN107531815B CN 107531815 B CN107531815 B CN 107531815B CN 201680024029 A CN201680024029 A CN 201680024029A CN 107531815 B CN107531815 B CN 107531815B
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- China
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- curable composition
- acrylic monomer
- weight
- titanium oxide
- resist
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015228779 | 2015-11-24 | ||
| JP2015-228779 | 2015-11-24 | ||
| PCT/JP2016/084798 WO2017090680A1 (ja) | 2015-11-24 | 2016-11-24 | 硬化性組成物及び電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107531815A CN107531815A (zh) | 2018-01-02 |
| CN107531815B true CN107531815B (zh) | 2021-05-11 |
Family
ID=58764351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680024029.0A Active CN107531815B (zh) | 2015-11-24 | 2016-11-24 | 固化性组合物及电子部件的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6145232B1 (zh) |
| KR (1) | KR102639455B1 (zh) |
| CN (1) | CN107531815B (zh) |
| TW (1) | TWI724068B (zh) |
| WO (1) | WO2017090680A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019017047A1 (ja) * | 2017-07-21 | 2019-01-24 | 積水化学工業株式会社 | 硬化性組成物、電子部品及び電子部品の製造方法 |
| JP6646641B2 (ja) * | 2017-11-16 | 2020-02-14 | 積水化学工業株式会社 | 非現像型レジスト硬化性組成物、プリント配線板及び電子部品の製造方法 |
| JP6646640B2 (ja) * | 2017-11-16 | 2020-02-14 | 積水化学工業株式会社 | 非現像型レジスト光硬化性組成物及び電子部品の製造方法 |
| JP7362992B2 (ja) * | 2018-03-30 | 2023-10-18 | 太陽ホールディングス株式会社 | 硬化性組成物、その硬化物およびこれを有する電子部品 |
| JP7362991B2 (ja) * | 2018-03-30 | 2023-10-18 | 太陽ホールディングス株式会社 | インクジェット印刷用硬化性組成物、その硬化物、及びその硬化物を有する電子部品 |
| TW201942144A (zh) * | 2018-03-30 | 2019-11-01 | 日商太陽油墨製造股份有限公司 | 噴墨印刷用硬化性組成物、其之硬化物、及具有該硬化物之電子零件 |
| JP2020002280A (ja) * | 2018-06-29 | 2020-01-09 | 三菱ケミカル株式会社 | 活性エネルギー線硬化性組成物及び積層体 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5650460B2 (ja) * | 2010-08-18 | 2015-01-07 | 株式会社タムラ製作所 | 白色硬化性樹脂組成物 |
| JP2012053254A (ja) * | 2010-09-01 | 2012-03-15 | Sekisui Chem Co Ltd | 光及び熱硬化性組成物、ソルダーレジスト組成物及びプリント配線板 |
| JP2014114402A (ja) | 2012-12-11 | 2014-06-26 | Taiyo Ink Mfg Ltd | 光硬化性組成物および成型品 |
| JP6635497B2 (ja) * | 2013-07-25 | 2020-01-29 | 東レ株式会社 | タッチパネル用ネガ型感光性白色組成物、タッチパネル及びタッチパネルの製造方法 |
| JP6359814B2 (ja) | 2013-09-17 | 2018-07-18 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| US11220604B2 (en) * | 2013-11-06 | 2022-01-11 | Sekisui Chemical Co., Ltd. | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
| JP2015106160A (ja) | 2015-01-19 | 2015-06-08 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
-
2016
- 2016-11-24 TW TW105138731A patent/TWI724068B/zh active
- 2016-11-24 JP JP2016570123A patent/JP6145232B1/ja active Active
- 2016-11-24 KR KR1020177028748A patent/KR102639455B1/ko active Active
- 2016-11-24 WO PCT/JP2016/084798 patent/WO2017090680A1/ja not_active Ceased
- 2016-11-24 CN CN201680024029.0A patent/CN107531815B/zh active Active
-
2017
- 2017-04-24 JP JP2017085177A patent/JP2017141472A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN107531815A (zh) | 2018-01-02 |
| JPWO2017090680A1 (ja) | 2017-11-24 |
| JP6145232B1 (ja) | 2017-06-07 |
| KR20180087137A (ko) | 2018-08-01 |
| WO2017090680A1 (ja) | 2017-06-01 |
| JP2017141472A (ja) | 2017-08-17 |
| TWI724068B (zh) | 2021-04-11 |
| KR102639455B1 (ko) | 2024-02-23 |
| TW201734059A (zh) | 2017-10-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240117 Address after: Saitama Prefecture, Japan Patentee after: TAIYO HOLDINGS Co.,Ltd. Address before: Osaka, Japan Patentee before: SEKISUI CHEMICAL Co.,Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20180102 Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: X2025990000228 Denomination of invention: Manufacturing method of curable composition and electronic components Granted publication date: 20210511 License type: Common License Record date: 20250609 |