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BRPI1010627A2 - "dispositivo de vídeo el e método para a fabricação do mesmo" - Google Patents

"dispositivo de vídeo el e método para a fabricação do mesmo"

Info

Publication number
BRPI1010627A2
BRPI1010627A2 BRPI1010627A BRPI1010627A BRPI1010627A2 BR PI1010627 A2 BRPI1010627 A2 BR PI1010627A2 BR PI1010627 A BRPI1010627 A BR PI1010627A BR PI1010627 A BRPI1010627 A BR PI1010627A BR PI1010627 A2 BRPI1010627 A2 BR PI1010627A2
Authority
BR
Brazil
Prior art keywords
manufacture
video device
video
Prior art date
Application number
BRPI1010627A
Other languages
English (en)
Inventor
Manabu Niboshi
Takeshi Hirase
Yuhki Kobayashi
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI1010627A2 publication Critical patent/BRPI1010627A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
BRPI1010627A 2009-06-11 2010-03-03 "dispositivo de vídeo el e método para a fabricação do mesmo" BRPI1010627A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009140069 2009-06-11
PCT/JP2010/001465 WO2010143337A1 (ja) 2009-06-11 2010-03-03 有機ｅｌ表示装置およびその製造方法

Publications (1)

Publication Number Publication Date
BRPI1010627A2 true BRPI1010627A2 (pt) 2016-03-15

Family

ID=43308600

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1010627A BRPI1010627A2 (pt) 2009-06-11 2010-03-03 "dispositivo de vídeo el e método para a fabricação do mesmo"

Country Status (8)

Country Link
US (1) US8710492B2 (pt)
EP (1) EP2442621A4 (pt)
JP (1) JPWO2010143337A1 (pt)
KR (1) KR20120024658A (pt)
CN (1) CN102450098A (pt)
BR (1) BRPI1010627A2 (pt)
RU (1) RU2011147916A (pt)
WO (1) WO2010143337A1 (pt)

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US8723415B2 (en) * 2009-12-14 2014-05-13 Sharp Kabushiki Kaisha Moisture-proof film, method for manufacturing the same, and organic electronic device including the same
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WO2012114685A1 (ja) * 2011-02-24 2012-08-30 シャープ株式会社 有機ｅｌ表示装置の製造方法およびその方法により製造された有機ｅｌ表示装置
WO2012127443A2 (pt) * 2011-03-22 2012-09-27 Efacec Engenharia E Sistemas, S.A. Substrato e eléctrodo para células solares e respectivo processo de fabrico
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CN103165821A (zh) * 2011-12-08 2013-06-19 上海天马微电子有限公司 Oled显示模组封装结构
JP2013125718A (ja) * 2011-12-16 2013-06-24 Sharp Corp 表示装置及びその製造方法
KR101924526B1 (ko) * 2012-08-22 2018-12-04 삼성디스플레이 주식회사 유기 발광 표시장치 및 그 제조방법
KR20140029202A (ko) * 2012-08-28 2014-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
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JP6127637B2 (ja) * 2013-03-26 2017-05-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
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KR102092706B1 (ko) * 2013-09-02 2020-04-16 삼성디스플레이 주식회사 조성물, 상기 조성물을 포함하는 유기 발광 표시 장치 및 상기 유기 발광 표시 장치의 제조 방법
KR20150033195A (ko) 2013-09-23 2015-04-01 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2015115185A (ja) * 2013-12-11 2015-06-22 東京エレクトロン株式会社 有機ｅｌモジュールおよびその製造方法
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JP2015129822A (ja) * 2014-01-07 2015-07-16 株式会社ジャパンディスプレイ 表示装置
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CN103915573B (zh) * 2014-03-05 2017-05-17 厦门天马微电子有限公司 一种封装盖板及制作方法、显示装置
KR20150108463A (ko) * 2014-03-17 2015-09-30 삼성디스플레이 주식회사 유기발광 표시장치 및 그의 제조방법
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CN104299981B (zh) 2014-09-22 2017-02-08 京东方科技集团股份有限公司 Oled显示面板及其封装方法和oled显示装置
KR101640076B1 (ko) * 2014-11-05 2016-07-15 앰코 테크놀로지 코리아 주식회사 웨이퍼 레벨의 칩 적층형 패키지 및 이의 제조 방법
JP6404361B2 (ja) * 2014-11-28 2018-10-10 パイオニア株式会社 発光装置
KR102304722B1 (ko) 2014-12-05 2021-09-27 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN104600204B (zh) * 2014-12-26 2017-11-10 深圳市华星光电技术有限公司 Oled封装结构及封装方法
CN104821376A (zh) * 2015-04-24 2015-08-05 京东方科技集团股份有限公司 一种oled面板及其制造方法、显示装置
CN104882556B (zh) * 2015-06-08 2017-06-27 京东方科技集团股份有限公司 一种封装件及其封装方法、oled装置
US10401689B2 (en) 2016-01-08 2019-09-03 Apple Inc. Electronic device displays with laser-welded edges
CN105609660B (zh) 2016-03-22 2017-11-24 京东方科技集团股份有限公司 一种oled显示面板及其封装方法、显示装置
CN107329303A (zh) * 2017-06-30 2017-11-07 联想(北京)有限公司 一种显示屏、电子设备及显示屏的制备方法
CN107170906B (zh) * 2017-07-19 2020-03-24 京东方科技集团股份有限公司 一种封框胶结构、显示面板及显示装置
WO2019064372A1 (ja) 2017-09-27 2019-04-04 シャープ株式会社 基板の封止構造体、及び表示装置とその製造方法
CN107946480A (zh) * 2017-11-01 2018-04-20 深圳市华星光电半导体显示技术有限公司 Oled封装方法与oled封装结构
WO2019123649A1 (ja) * 2017-12-22 2019-06-27 堺ディスプレイプロダクト株式会社 封止構造体、有機ｅｌ表示装置、表示装置及び表示装置の製造方法
KR102560099B1 (ko) * 2018-03-30 2023-07-26 삼성디스플레이 주식회사 표시 장치
CN108962963B (zh) * 2018-08-01 2021-01-22 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
KR102582465B1 (ko) * 2018-09-19 2023-09-25 삼성디스플레이 주식회사 표시 장치
CN113196881B (zh) * 2018-12-17 2024-05-14 夏普株式会社 电致发光元件以及显示器件
KR102089351B1 (ko) * 2018-12-21 2020-03-16 세메스 주식회사 디스플레이 소자 및 디스플레이 소자의 제조 방법
JP6831860B2 (ja) * 2019-01-04 2021-02-17 シャープ株式会社 基板の封止構造体、及び表示装置とその製造方法
CN110112323B (zh) * 2019-06-14 2022-05-13 京东方科技集团股份有限公司 一种oled封装结构、封装方法及显示器件
CN110828704A (zh) * 2019-10-28 2020-02-21 深圳市华星光电半导体显示技术有限公司 显示面板的封装方法及封装结构
KR102809214B1 (ko) * 2020-05-08 2025-05-19 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
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Also Published As

Publication number Publication date
CN102450098A (zh) 2012-05-09
RU2011147916A (ru) 2013-10-27
US8710492B2 (en) 2014-04-29
EP2442621A4 (en) 2013-10-09
JPWO2010143337A1 (ja) 2012-11-22
KR20120024658A (ko) 2012-03-14
US20120080671A1 (en) 2012-04-05
EP2442621A1 (en) 2012-04-18
WO2010143337A1 (ja) 2010-12-16

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A E 6A ANUIDADES

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2369 DE 31-05-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.