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BR9711030A - CartÆo de chip processo para produ-Æo de um cartÆo de chip e chip semicondutor para uso em um cartÆo de chip - Google Patents

CartÆo de chip processo para produ-Æo de um cartÆo de chip e chip semicondutor para uso em um cartÆo de chip

Info

Publication number
BR9711030A
BR9711030A BR9711030A BR9711030A BR9711030A BR 9711030 A BR9711030 A BR 9711030A BR 9711030 A BR9711030 A BR 9711030A BR 9711030 A BR9711030 A BR 9711030A BR 9711030 A BR9711030 A BR 9711030A
Authority
BR
Brazil
Prior art keywords
contact areas
chip
chip card
card
card body
Prior art date
Application number
BR9711030A
Other languages
English (en)
Inventor
Michael Huber
Peter Stampka
Detlef Houdeau
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR9711030A publication Critical patent/BR9711030A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
BR9711030A 1996-08-08 1997-07-14 CartÆo de chip processo para produ-Æo de um cartÆo de chip e chip semicondutor para uso em um cartÆo de chip BR9711030A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19632113A DE19632113C1 (de) 1996-08-08 1996-08-08 Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
PCT/DE1997/001479 WO1998007113A1 (de) 1996-08-08 1997-07-14 Chipkarte, verfahren zur herstellung einer chipkarte und halbleiterchip zur verwendung in einer chipkarte

Publications (1)

Publication Number Publication Date
BR9711030A true BR9711030A (pt) 1999-08-17

Family

ID=7802185

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9711030A BR9711030A (pt) 1996-08-08 1997-07-14 CartÆo de chip processo para produ-Æo de um cartÆo de chip e chip semicondutor para uso em um cartÆo de chip

Country Status (12)

Country Link
US (1) US6188580B1 (pt)
EP (1) EP0978093B1 (pt)
JP (1) JP2000516361A (pt)
KR (1) KR20000029830A (pt)
CN (1) CN1146983C (pt)
AT (1) ATE207227T1 (pt)
BR (1) BR9711030A (pt)
DE (2) DE19632113C1 (pt)
ES (1) ES2166094T3 (pt)
RU (1) RU2190879C2 (pt)
UA (1) UA58516C2 (pt)
WO (1) WO1998007113A1 (pt)

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DE19845665C2 (de) * 1998-10-05 2000-08-17 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein zum Einbau in Chipkarten
JP3339838B2 (ja) * 1999-06-07 2002-10-28 ローム株式会社 半導体装置およびその製造方法
FR2796760B1 (fr) * 1999-07-23 2002-02-01 Gemplus Card Int Etiquette electronique et procede pour sa fabrication
DE19955537B4 (de) * 1999-11-18 2006-04-13 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
ATE263398T1 (de) 1999-12-02 2004-04-15 Infineon Technologies Ag Chipkartenmodul mit anisotrop leitfähiger trägerfolie
ES2348860T3 (es) * 2000-05-05 2010-12-16 Infineon Technologies Ag olloooo.
KR100757486B1 (ko) * 2001-12-24 2007-09-11 치앤 유안 챈 칩카드의 제조방법
KR100757487B1 (ko) * 2001-12-24 2007-09-11 치앤 유안 챈 다매체카드의 제조방법
FR2855637B1 (fr) * 2003-05-26 2005-11-18 A S K Procede de fabrication d'un ticket sans contact et ticket obtenu a partir de ce procede
DE102005058101B4 (de) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
US8358155B2 (en) * 2008-01-29 2013-01-22 Oracle America, Inc. Circuit that facilitates proximity communication
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
KR102010909B1 (ko) * 2012-08-30 2019-08-14 삼성전자주식회사 패키지 기판, 이를 구비하는 반도체 패키지, 및 반도체 패키지의 제조방법
FR2996944B1 (fr) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps Module electronique simplifie pour carte a puce a double interface de communication
US11481596B2 (en) * 2013-01-18 2022-10-25 Amatech Group Limited Smart cards with metal layer(s) and methods of manufacture
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
CN203894790U (zh) * 2013-04-11 2014-10-22 德昌电机(深圳)有限公司 智能卡、身份识别卡、银行卡及智能卡触板
US9195929B2 (en) * 2013-08-05 2015-11-24 A-Men Technology Corporation Chip card assembling structure and method thereof
TW201545614A (zh) * 2014-05-02 2015-12-01 R&D Circuits Inc 製備殼體以接收用於嵌入式元件印刷電路板之元件的結構和方法
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN105470207A (zh) * 2015-12-24 2016-04-06 华天科技（西安）有限公司 基于高平整度基板的指纹识别芯片封装结构及其制造方法
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
JP7247086B2 (ja) 2016-07-27 2023-03-28 コンポセキュア，リミティド ライアビリティ カンパニー 取引カードのためのオーバーモールド加工電子部品及びその製造方法
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
FI3679523T3 (fi) 2017-09-07 2023-05-05 Composecure Llc Maksukortti upotetuilla elektroniikkakomponenteilla ja menetelmä sen valmistamiseksi
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
ES2993542T3 (en) 2017-10-18 2025-01-02 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting
US10438895B1 (en) 2018-06-08 2019-10-08 American Semiconductor, Inc. Flexible micro-module
USD983261S1 (en) 2019-12-20 2023-04-11 Capital One Services, Llc Vented laminated card

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2625067A1 (fr) 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
US5208450A (en) * 1988-04-20 1993-05-04 Matsushita Electric Industrial Co., Ltd. IC card and a method for the manufacture of the same
EP0339763A3 (en) * 1988-04-28 1990-04-25 Citizen Watch Co. Ltd. Ic card
DE4034225C2 (de) * 1990-10-26 1994-01-27 Reinhard Jurisch Datenträger für Identifikationssysteme
RU2011225C1 (ru) * 1990-12-25 1994-04-15 Губин Юрий Васильевич Абонентская карточка
FR2695234B1 (fr) * 1992-08-26 1994-11-04 Gemplus Card Int Procédé de marquage d'une carte à puce.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置

Also Published As

Publication number Publication date
ATE207227T1 (de) 2001-11-15
JP2000516361A (ja) 2000-12-05
UA58516C2 (uk) 2003-08-15
EP0978093A1 (de) 2000-02-09
DE19632113C1 (de) 1998-02-19
RU2190879C2 (ru) 2002-10-10
DE59705013D1 (de) 2001-11-22
CN1227648A (zh) 1999-09-01
WO1998007113A1 (de) 1998-02-19
EP0978093B1 (de) 2001-10-17
CN1146983C (zh) 2004-04-21
US6188580B1 (en) 2001-02-13
KR20000029830A (ko) 2000-05-25
ES2166094T3 (es) 2002-04-01

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A, 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1903 DE 26/06/2007.