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FR2780551B1 - Micromodule electronique integre et procede de fabrication d'un tel micromodule - Google Patents

Micromodule electronique integre et procede de fabrication d'un tel micromodule

Info

Publication number
FR2780551B1
FR2780551B1 FR9808426A FR9808426A FR2780551B1 FR 2780551 B1 FR2780551 B1 FR 2780551B1 FR 9808426 A FR9808426 A FR 9808426A FR 9808426 A FR9808426 A FR 9808426A FR 2780551 B1 FR2780551 B1 FR 2780551B1
Authority
FR
France
Prior art keywords
micromodule
insulation layer
integrated circuit
manufacturing
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9808426A
Other languages
English (en)
Other versions
FR2780551A1 (fr
Inventor
Jacek Kowalski
Didier Serra
Frederic Bertholio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inside Technologies SA
Original Assignee
Inside Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9808426A priority Critical patent/FR2780551B1/fr
Application filed by Inside Technologies SA filed Critical Inside Technologies SA
Priority to JP2000557500A priority patent/JP2002519866A/ja
Priority to AU42687/99A priority patent/AU4268799A/en
Priority to PCT/FR1999/001405 priority patent/WO2000001013A1/fr
Priority to CNB998100951A priority patent/CN100342536C/zh
Priority to EP99925077A priority patent/EP1097479A1/fr
Priority to US09/720,701 priority patent/US6319827B1/en
Publication of FR2780551A1 publication Critical patent/FR2780551A1/fr
Application granted granted Critical
Publication of FR2780551B1 publication Critical patent/FR2780551B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils
    • H04B5/263—Multiple coils at either side
    • H10W44/501—
    • H10W70/09—
    • H10W70/093—
    • H10W70/699—
    • H10W44/248—
    • H10W70/099—
    • H10W70/60—
    • H10W72/073—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/874—
    • H10W72/9413—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
FR9808426A 1998-06-29 1998-06-29 Micromodule electronique integre et procede de fabrication d'un tel micromodule Expired - Fee Related FR2780551B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR9808426A FR2780551B1 (fr) 1998-06-29 1998-06-29 Micromodule electronique integre et procede de fabrication d'un tel micromodule
AU42687/99A AU4268799A (en) 1998-06-29 1999-06-14 Integrated electronic micromodule and method for making same
PCT/FR1999/001405 WO2000001013A1 (fr) 1998-06-29 1999-06-14 Micromodule electronique integre et procede de fabrication d'un tel micromodule
CNB998100951A CN100342536C (zh) 1998-06-29 1999-06-14 集成电子微组件及制造该微组件的方法
JP2000557500A JP2002519866A (ja) 1998-06-29 1999-06-14 集積電子マイクロモジュール及びその製造方法
EP99925077A EP1097479A1 (fr) 1998-06-29 1999-06-14 Micromodule electronique integre et procede de fabrication d'un tel micromodule
US09/720,701 US6319827B1 (en) 1998-06-29 1999-06-14 Integrated electronic micromodule and method for making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9808426A FR2780551B1 (fr) 1998-06-29 1998-06-29 Micromodule electronique integre et procede de fabrication d'un tel micromodule

Publications (2)

Publication Number Publication Date
FR2780551A1 FR2780551A1 (fr) 1999-12-31
FR2780551B1 true FR2780551B1 (fr) 2001-09-07

Family

ID=9528147

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9808426A Expired - Fee Related FR2780551B1 (fr) 1998-06-29 1998-06-29 Micromodule electronique integre et procede de fabrication d'un tel micromodule

Country Status (7)

Country Link
US (1) US6319827B1 (fr)
EP (1) EP1097479A1 (fr)
JP (1) JP2002519866A (fr)
CN (1) CN100342536C (fr)
AU (1) AU4268799A (fr)
FR (1) FR2780551B1 (fr)
WO (1) WO2000001013A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2778034C1 (ru) * 2021-06-03 2022-08-12 Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы") Микромодуль космического назначения

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FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード
FR2812482B1 (fr) 2000-07-28 2003-01-24 Inside Technologies Dispositif electronique portable comprenant plusieurs circuits integres sans contact
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
US7498196B2 (en) 2001-03-30 2009-03-03 Megica Corporation Structure and manufacturing method of chip scale package
US6882239B2 (en) * 2001-05-08 2005-04-19 Formfactor, Inc. Electromagnetically coupled interconnect system
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW503496B (en) 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
TW544882B (en) 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
US7652359B2 (en) 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
JP4763463B2 (ja) * 2003-02-28 2011-08-31 シーメンス アクチエンゲゼルシヤフト 基板とパワーエレクトロニクス素子を備えた装置およびその製造方法
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
US7566001B2 (en) 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US7466157B2 (en) 2004-02-05 2008-12-16 Formfactor, Inc. Contactless interfacing of test signals with a device under test
US8407097B2 (en) * 2004-04-15 2013-03-26 Hand Held Products, Inc. Proximity transaction apparatus and methods of use thereof
US20060202269A1 (en) 2005-03-08 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and electronic appliance having the same
JP4547625B2 (ja) * 2005-07-04 2010-09-22 ソニー株式会社 通信ボード
US7410894B2 (en) * 2005-07-27 2008-08-12 International Business Machines Corporation Post last wiring level inductor using patterned plate process
US7795700B2 (en) * 2008-02-28 2010-09-14 Broadcom Corporation Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
DE102008046407B4 (de) * 2008-09-09 2015-12-03 Infineon Technologies Ag Datenträger für kontaktlose Datenübertragung und ein Verfahren zur Herstellung eines solchen Datenträgers
US8724340B2 (en) 2008-09-09 2014-05-13 Infineon Technologies Ag Data carrier for contactless data transmission and a method for producing such a data carrier
US9146207B2 (en) * 2012-01-10 2015-09-29 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
CN103366215B (zh) * 2012-04-05 2016-08-03 英飞凌科技股份有限公司 用于无接触数据传输的数据载体及其产生方法
US20140042230A1 (en) * 2012-08-09 2014-02-13 Infineon Technologies Ag Chip card module with separate antenna and chip card inlay using same
US9202162B2 (en) * 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
FR3040534A1 (fr) 2015-08-28 2017-03-03 St Microelectronics Sa Dispositif electronique muni d'une couche conductrice et procede de fabrication
FR3040535B1 (fr) 2015-08-28 2019-07-05 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique muni d'un element conducteur integre et procede de fabrication
FR3041859B1 (fr) 2015-09-30 2018-03-02 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique muni d'un fil conducteur integre et procede de fabrication
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
FR3123778B1 (fr) * 2021-06-07 2025-01-17 Eyco Procédé de fabrication d’un circuit imprimé intégrant un composant électronique et module de carte à puce obtenu par ledit procédé.

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JP3190057B2 (ja) * 1990-07-02 2001-07-16 株式会社東芝 複合集積回路装置
JPH05226506A (ja) * 1992-02-18 1993-09-03 Mitsubishi Materials Corp 表面実装型複合部品及びその製造方法
GB2300068B (en) * 1992-07-21 1997-01-22 Mitsubishi Electric Corp Semiconductor device
JPH0714876A (ja) * 1993-06-17 1995-01-17 Matsushita Electron Corp 集積回路装置及びその製造方法
JPH07106514A (ja) * 1993-10-07 1995-04-21 Toshiba Corp 半導体集積回路装置
DE19536464C2 (de) * 1995-09-29 1998-06-04 Siemens Ag Transponder und Verfahren zu seiner Herstellung
JP2904086B2 (ja) * 1995-12-27 1999-06-14 日本電気株式会社 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2778034C1 (ru) * 2021-06-03 2022-08-12 Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы") Микромодуль космического назначения

Also Published As

Publication number Publication date
FR2780551A1 (fr) 1999-12-31
EP1097479A1 (fr) 2001-05-09
CN1315056A (zh) 2001-09-26
JP2002519866A (ja) 2002-07-02
WO2000001013A1 (fr) 2000-01-06
AU4268799A (en) 2000-01-17
US6319827B1 (en) 2001-11-20
CN100342536C (zh) 2007-10-10

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
GC Lien (pledge) constituted
AU Other action affecting the ownership or exploitation of an industrial property right
GC Lien (pledge) constituted
RG Lien (pledge) cancelled
ST Notification of lapse

Effective date: 20110228