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AU2002214066A1 - A method for attaching an integrated circuit on a silicon chip to a smart label - Google Patents

A method for attaching an integrated circuit on a silicon chip to a smart label

Info

Publication number
AU2002214066A1
AU2002214066A1 AU2002214066A AU1406602A AU2002214066A1 AU 2002214066 A1 AU2002214066 A1 AU 2002214066A1 AU 2002214066 A AU2002214066 A AU 2002214066A AU 1406602 A AU1406602 A AU 1406602A AU 2002214066 A1 AU2002214066 A1 AU 2002214066A1
Authority
AU
Australia
Prior art keywords
attaching
integrated circuit
silicon chip
smart label
smart
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002214066A
Inventor
Samuli Stromberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UPM Raflatac Oy
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Publication of AU2002214066A1 publication Critical patent/AU2002214066A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H10W46/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/042—Punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0825—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H10W46/601—
    • H10W72/07173—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
AU2002214066A 2000-11-20 2001-11-05 A method for attaching an integrated circuit on a silicon chip to a smart label Abandoned AU2002214066A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20002543 2000-11-20
FI20002543A FI113851B (en) 2000-11-20 2000-11-20 Method of attaching a chip's integrated circuit to an intelligent self-adhesive label and method of pre-treating a silicon wafer
PCT/FI2001/000961 WO2002041387A1 (en) 2000-11-20 2001-11-05 A method for attaching an integrated circuit on a silicon chip to a smart label

Publications (1)

Publication Number Publication Date
AU2002214066A1 true AU2002214066A1 (en) 2002-05-27

Family

ID=8559534

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002214066A Abandoned AU2002214066A1 (en) 2000-11-20 2001-11-05 A method for attaching an integrated circuit on a silicon chip to a smart label

Country Status (6)

Country Link
US (1) US20040005754A1 (en)
EP (1) EP1336194A1 (en)
JP (1) JP2004514291A (en)
AU (1) AU2002214066A1 (en)
FI (1) FI113851B (en)
WO (1) WO2002041387A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP3739752B2 (en) 2003-02-07 2006-01-25 株式会社 ハリーズ Small-piece transfer device capable of random-cycle shifting
ATE426215T1 (en) 2004-01-31 2009-04-15 Atlantic Zeiser Gmbh METHOD FOR PRODUCING CONTACTLESS CHIP CARDS
JP2005306470A (en) * 2004-03-25 2005-11-04 Tatsuo Sasazaki Sheet-like molding
US7109867B2 (en) * 2004-09-09 2006-09-19 Avery Dennison Corporation RFID tags with EAS deactivation ability
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
FI120018B (en) 2006-04-28 2009-05-29 Wisteq Oy Remote identifier and subject and procedure for making a remote identifier
US7546676B2 (en) * 2007-05-31 2009-06-16 Symbol Technologies, Inc. Method for manufacturing micro-strip antenna element

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE792488A (en) * 1971-12-08 1973-03-30 Dainippon Printing Co Ltd IDENTIFICATION CARDS AND METHOD FOR MANUFACTURING SUCH CARDS
DE3130032A1 (en) * 1981-07-30 1983-02-17 Agfa-Gevaert Ag, 5090 Leverkusen COUNTERFEIT-PROOF DOCUMENT
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US4954814A (en) * 1986-09-29 1990-09-04 Monarch Marking Systems, Inc. Tag and method of making same
JP2833111B2 (en) * 1989-03-09 1998-12-09 日立化成工業株式会社 Circuit connection method and adhesive film used therefor
KR0147813B1 (en) * 1989-05-16 1998-08-01 월터 클리웨인, 한스-피터 위트린 Laminated Structures and Manufacturing Method Thereof
JPH03239595A (en) * 1990-02-16 1991-10-25 Dainippon Printing Co Ltd Manufacture of card
JPH04321190A (en) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
JP3842362B2 (en) * 1996-02-28 2006-11-08 株式会社東芝 Thermocompression bonding method and thermocompression bonding apparatus
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
JPH1084014A (en) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd Method for manufacturing semiconductor device
JP3928753B2 (en) * 1996-08-06 2007-06-13 日立化成工業株式会社 Multi-chip mounting method and manufacturing method of chip with adhesive
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
AU761995B2 (en) * 1997-09-11 2003-06-12 Precision Dynamics Corporation Laminated radio frequency identification device
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
EP1014302B1 (en) * 1998-07-08 2005-09-21 Dai Nippon Printing Co., Ltd. Noncontact ic card and manufacture thereof
JP2000113147A (en) * 1998-10-08 2000-04-21 Hitachi Chem Co Ltd Ic card and its manufacture

Also Published As

Publication number Publication date
EP1336194A1 (en) 2003-08-20
WO2002041387A1 (en) 2002-05-23
FI20002543L (en) 2002-05-21
US20040005754A1 (en) 2004-01-08
FI20002543A0 (en) 2000-11-20
JP2004514291A (en) 2004-05-13
FI113851B (en) 2004-06-30

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