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AU2001253547A1 - Integrated ic chip package for electronic image sensor die - Google Patents

Integrated ic chip package for electronic image sensor die

Info

Publication number
AU2001253547A1
AU2001253547A1 AU2001253547A AU5354701A AU2001253547A1 AU 2001253547 A1 AU2001253547 A1 AU 2001253547A1 AU 2001253547 A AU2001253547 A AU 2001253547A AU 5354701 A AU5354701 A AU 5354701A AU 2001253547 A1 AU2001253547 A1 AU 2001253547A1
Authority
AU
Australia
Prior art keywords
integrated
image sensor
chip package
electronic image
sensor die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253547A
Inventor
Ken M. Lam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atmel Corp
Original Assignee
Atmel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Corp filed Critical Atmel Corp
Publication of AU2001253547A1 publication Critical patent/AU2001253547A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
AU2001253547A 2000-05-23 2001-04-10 Integrated ic chip package for electronic image sensor die Abandoned AU2001253547A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57720100A 2000-05-23 2000-05-23
US09/577,201 2000-05-23
PCT/US2001/012344 WO2001091193A2 (en) 2000-05-23 2001-04-10 Integrated ic chip package for electronic image sensor die

Publications (1)

Publication Number Publication Date
AU2001253547A1 true AU2001253547A1 (en) 2001-12-03

Family

ID=24307692

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253547A Abandoned AU2001253547A1 (en) 2000-05-23 2001-04-10 Integrated ic chip package for electronic image sensor die

Country Status (4)

Country Link
US (1) US6541284B2 (en)
AU (1) AU2001253547A1 (en)
TW (1) TW501244B (en)
WO (1) WO2001091193A2 (en)

Families Citing this family (175)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004512262A (en) * 2000-06-20 2004-04-22 アイデック　ファーマスーティカルズ　コーポレイション Non-radioactive anti-CD20 antibody / radiolabeled anti-CD22 antibody combination
DE10109787A1 (en) 2001-02-28 2002-10-02 Infineon Technologies Ag Digital camera with a light-sensitive sensor
WO2003028363A1 (en) * 2001-08-28 2003-04-03 Siemens Aktiengesellschaft Scanning camera
US7469932B2 (en) * 2001-09-13 2008-12-30 Entegris, Inc. Receptor for a separation module
JP2003116067A (en) * 2001-10-09 2003-04-18 Mitsubishi Electric Corp Method for manufacturing solid-state imaging device
DE10150581A1 (en) * 2001-10-12 2003-04-17 Schlafhorst & Co W yarn sensor
JP4033669B2 (en) * 2001-12-04 2008-01-16 シャープ株式会社 The camera module
US7813634B2 (en) 2005-02-28 2010-10-12 Tessera MEMS Technologies, Inc. Autofocus camera
US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
US20050224902A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US20050224899A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
FR2835653B1 (en) 2002-02-06 2005-04-15 St Microelectronics Sa OPTICAL SEMICONDUCTOR DEVICE
US6900508B2 (en) * 2002-04-16 2005-05-31 Stmicroelectronics, Inc. Embedded flat film molding
EP1357605A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package with castellation
US6873024B1 (en) 2002-05-15 2005-03-29 Eastman Kodak Company Apparatus and method for wafer level packaging of optical imaging semiconductor devices
JP2004074627A (en) * 2002-08-20 2004-03-11 Ricoh Co Ltd Image forming device
US7587803B2 (en) 2002-09-30 2009-09-15 Tpo Displays Corp. Method for assembling a camera module
FR2849275B1 (en) * 2002-12-24 2005-04-15 St Microelectronics Sa METHOD FOR ASSEMBLING AN OPTICAL SYSTEM IN FRONT OF AN OPTICAL HOUSING
US6940058B2 (en) * 2003-02-04 2005-09-06 Kingpak Technology, Inc. Injection molded image sensor module
US6939456B2 (en) * 2003-02-04 2005-09-06 Kingpak Technology Inc. Miniaturized image sensor module
TWI302153B (en) 2003-02-27 2008-10-21 Eternal Chemical Co Ltd Material composition for packaging photo-sensitive elements and method of using the same
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
KR100545133B1 (en) * 2003-04-28 2006-01-24 주식회사 스마텍 Sensor module using package structure and package structure
FR2854498B1 (en) 2003-04-29 2005-09-16 St Microelectronics Sa OPTICAL SENSOR SEMICONDUCTOR HOUSING INSERTING INSIDE AN OBJECT.
FR2854496B1 (en) * 2003-04-29 2005-09-16 St Microelectronics Sa SEMICONDUCTOR HOUSING
CN100350621C (en) * 2003-06-03 2007-11-21 胜开科技股份有限公司 Image sensor module and manufacturing method thereof
US6934065B2 (en) * 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
EP1665392A1 (en) * 2003-09-26 2006-06-07 Siemens Aktiengesellschaft Optical module and optical system
FR2860644B1 (en) * 2003-10-06 2006-03-03 St Microelectronics Sa COMPONENT, PLATE AND SEMICONDUCTOR HOUSING WITH OPTICAL SENSOR
JP3993862B2 (en) 2003-10-10 2007-10-17 松下電器産業株式会社 Optical device and manufacturing method thereof
FR2861217B1 (en) * 2003-10-21 2006-03-17 St Microelectronics Sa OPTICAL DEVICE FOR OPTICAL SEMICONDUCTOR HOUSING AND METHOD OF MANUFACTURING THE SAME
JP2005148254A (en) * 2003-11-13 2005-06-09 Canon Inc Lens holding apparatus, exposure apparatus, and device manufacturing method
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
US8724006B2 (en) * 2004-01-26 2014-05-13 Flir Systems, Inc. Focal plane coding for digital imaging
US7773143B2 (en) * 2004-04-08 2010-08-10 Tessera North America, Inc. Thin color camera having sub-pixel resolution
KR100673950B1 (en) * 2004-02-20 2007-01-24 삼성테크윈 주식회사 Image sensor module and camera module package with same
US7253397B2 (en) * 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
JP4181515B2 (en) * 2004-02-25 2008-11-19 シャープ株式会社 Optical semiconductor device and electronic device using the same
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages
JP2005284147A (en) * 2004-03-30 2005-10-13 Fuji Photo Film Co Ltd Imaging device
US8049806B2 (en) * 2004-09-27 2011-11-01 Digitaloptics Corporation East Thin camera and associated methods
US8953087B2 (en) 2004-04-08 2015-02-10 Flir Systems Trading Belgium Bvba Camera system and associated methods
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
JP2005347416A (en) * 2004-06-01 2005-12-15 Sharp Corp Solid-state imaging device, semiconductor wafer, and camera module
US7005728B1 (en) 2004-06-03 2006-02-28 National Semiconductor Corporation Lead configuration for inline packages
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) * 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) * 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7294897B2 (en) * 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7416913B2 (en) * 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) * 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060023107A1 (en) * 2004-08-02 2006-02-02 Bolken Todd O Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
US7364934B2 (en) * 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7223626B2 (en) * 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7397066B2 (en) * 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
DE102004051379A1 (en) * 2004-08-23 2006-03-23 Osram Opto Semiconductors Gmbh Device for an optoelectronic component and component with an optoelectronic component and a device
US7425499B2 (en) * 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7115961B2 (en) * 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7429494B2 (en) * 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7276393B2 (en) 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US7646075B2 (en) * 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
EP1648181A1 (en) * 2004-10-12 2006-04-19 Dialog Semiconductor GmbH A multiple frame grabber
JP4091593B2 (en) * 2004-11-05 2008-05-28 Ｓｍｋ株式会社 Connection structure of camera module with autofocus function and module connector
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
DE102005000655A1 (en) * 2005-01-04 2006-07-13 Robert Bosch Gmbh Image capture device
US7262493B2 (en) * 2005-01-06 2007-08-28 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for mounting electrical devices
KR100740982B1 (en) 2005-01-31 2007-07-19 카바스(주) Optical axis adjuster of optical module assembly
US7214919B2 (en) * 2005-02-08 2007-05-08 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US20060177999A1 (en) * 2005-02-10 2006-08-10 Micron Technology, Inc. Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
DE102005006755A1 (en) * 2005-02-15 2006-08-17 Robert Bosch Gmbh Method for the optical adjustment of a camera
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
TWI484245B (en) * 2005-02-28 2015-05-11 Digitaloptics Corp Mems Autofocus camera
EP1859533B1 (en) * 2005-03-03 2009-07-15 Diabetes.Online AG Mobile telephone provided with a measuring device
CN100543570C (en) * 2005-06-10 2009-09-23 深圳富泰宏精密工业有限公司 Digital camera lens cap and manufacturing method thereof
US20060290001A1 (en) * 2005-06-28 2006-12-28 Micron Technology, Inc. Interconnect vias and associated methods of formation
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
TW200707768A (en) * 2005-08-15 2007-02-16 Silicon Touch Tech Inc Sensing apparatus capable of easily selecting the light-sensing curve
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US7622377B2 (en) * 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US8476591B2 (en) 2005-09-21 2013-07-02 Analog Devices, Inc. Radiation sensor device and method
US7897920B2 (en) * 2005-09-21 2011-03-01 Analog Devices, Inc. Radiation sensor device and method
GB2450261A (en) * 2006-02-21 2008-12-17 Cyberoptics Semiconductor Inc Capacitive distance sensing in semiconductor processing tools
US7893697B2 (en) * 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
KR101294419B1 (en) * 2006-03-10 2013-08-08 엘지이노텍 주식회사 Camera module and manufacturing method thereof
JP2007288755A (en) * 2006-04-14 2007-11-01 Optopac Co Ltd The camera module
EP2044629A4 (en) * 2006-07-17 2012-08-01 Digitaloptics Corp East CAMERA SYSTEM AND RELATED METHODS
US20080017940A1 (en) * 2006-07-18 2008-01-24 Cheng-Chieh Yang Image sensing module
DE112007002309T5 (en) 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substrate-like particle sensor
CN100517737C (en) * 2006-10-25 2009-07-22 鸿富锦精密工业（深圳）有限公司 Image sensor encapsulation structure
US8768157B2 (en) 2011-09-28 2014-07-01 DigitalOptics Corporation MEMS Multiple degree of freedom actuator
US8619378B2 (en) 2010-11-15 2013-12-31 DigitalOptics Corporation MEMS Rotational comb drive Z-stage
US7679167B2 (en) * 2007-01-08 2010-03-16 Visera Technologies Company, Limited Electronic assembly for image sensor device and fabrication method thereof
US20080246493A1 (en) * 2007-04-05 2008-10-09 Gardner Delrae H Semiconductor Processing System With Integrated Showerhead Distance Measuring Device
US20090015268A1 (en) * 2007-07-13 2009-01-15 Gardner Delrae H Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment
CN101349793A (en) * 2007-07-20 2009-01-21 鸿富锦精密工业（深圳）有限公司 camera module
EP2034718A1 (en) * 2007-09-05 2009-03-11 THOMSON Licensing System and method for positioning and fixing an image sensor to a beamsplitter
CN101419323A (en) * 2007-10-22 2009-04-29 鸿富锦精密工业（深圳）有限公司 Mini camera module and method for producing the same
US7709915B2 (en) * 2008-05-07 2010-05-04 Aptina Imaging Corporation Microelectronic devices having an EMI shield and associated systems and methods
US20090283665A1 (en) * 2008-05-13 2009-11-19 Eastman Kodak Company Image sensor with an aligned optical assembly
US20100194465A1 (en) * 2009-02-02 2010-08-05 Ali Salih Temperature compensated current source and method therefor
JP5596293B2 (en) * 2009-03-03 2014-09-24 オリンパス株式会社 Imaging unit
TWI384635B (en) * 2009-04-10 2013-02-01 Capella Microsystems Corp Light sensing module package structure and its packaging method
US7959364B2 (en) * 2009-05-04 2011-06-14 Tdk Taiwan Corporation Lens protection structure for miniature lens focusing mechanism
KR101032212B1 (en) * 2009-09-14 2011-05-02 삼성전기주식회사 Camera module, focusing method of the camera module and focusing device of the camera module
GB0920946D0 (en) * 2009-11-30 2010-01-13 St Microelectronics Res & Dev Electromagnetic shielding for camera modules
TWI425825B (en) * 2009-12-31 2014-02-01 Kingpak Tech Inc Adjustable focus image sensor package structure
KR20110135757A (en) * 2010-06-11 2011-12-19 삼성전자주식회사 Image sensor chip and camera module including same
US8358925B2 (en) 2010-11-15 2013-01-22 DigitalOptics Corporation MEMS Lens barrel with MEMS actuators
US9061883B2 (en) 2010-11-15 2015-06-23 DigitalOptics Corporation MEMS Actuator motion control features
US8605375B2 (en) 2010-11-15 2013-12-10 DigitalOptics Corporation MEMS Mounting flexure contacts
US8430580B2 (en) 2010-11-15 2013-04-30 DigitalOptics Corporation MEMS Rotationally deployed actuators
US8884381B2 (en) 2010-11-15 2014-11-11 DigitalOptics Corporation MEMS Guard trench
US8608393B2 (en) 2010-11-15 2013-12-17 DigitalOptics Corporation MEMS Capillary actuator deployment
US9019390B2 (en) 2011-09-28 2015-04-28 DigitalOptics Corporation MEMS Optical image stabilization using tangentially actuated MEMS devices
US8337103B2 (en) 2010-11-15 2012-12-25 DigitalOptics Corporation MEMS Long hinge actuator snubbing
US8637961B2 (en) 2010-11-15 2014-01-28 DigitalOptics Corporation MEMS MEMS actuator device
US8941192B2 (en) 2010-11-15 2015-01-27 DigitalOptics Corporation MEMS MEMS actuator device deployment
US9052567B2 (en) 2010-11-15 2015-06-09 DigitalOptics Corporation MEMS Actuator inside of motion control
US9515579B2 (en) 2010-11-15 2016-12-06 Digitaloptics Corporation MEMS electrical contact systems and methods
US8604663B2 (en) 2010-11-15 2013-12-10 DigitalOptics Corporation MEMS Motion controlled actuator
US8547627B2 (en) 2010-11-15 2013-10-01 DigitalOptics Corporation MEMS Electrical routing
US8947797B2 (en) 2010-11-15 2015-02-03 DigitalOptics Corporation MEMS Miniature MEMS actuator assemblies
US9352962B2 (en) 2010-11-15 2016-05-31 DigitalOptics Corporation MEMS MEMS isolation structures
US8803256B2 (en) 2010-11-15 2014-08-12 DigitalOptics Corporation MEMS Linearly deployed actuators
US8521017B2 (en) 2010-11-15 2013-08-27 DigitalOptics Corporation MEMS MEMS actuator alignment
US8308379B2 (en) 2010-12-01 2012-11-13 Digitaloptics Corporation Three-pole tilt control system for camera module
US8616791B2 (en) 2011-09-28 2013-12-31 DigitalOptics Corporation MEMS Rotationally deployed actuator devices
US9350271B2 (en) 2011-09-28 2016-05-24 DigitalOptics Corporation MEMS Cascaded electrostatic actuator
US9281763B2 (en) 2011-09-28 2016-03-08 DigitalOptics Corporation MEMS Row and column actuator control
US8853975B2 (en) 2011-09-28 2014-10-07 DigitalOptics Corporation MEMS Electrostatic actuator control
US8869625B2 (en) 2011-09-28 2014-10-28 DigitalOptics Corporation MEMS MEMS actuator/sensor
US8855476B2 (en) 2011-09-28 2014-10-07 DigitalOptics Corporation MEMS MEMS-based optical image stabilization
US8571405B2 (en) 2011-09-28 2013-10-29 DigitalOptics Corporation MEMS Surface mount actuator
US9029759B2 (en) * 2012-04-12 2015-05-12 Nan Chang O-Film Optoelectronics Technology Ltd Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same
DE102012219397A1 (en) 2012-07-04 2014-01-09 Robert Bosch Gmbh Cutting length indicator
US9144938B2 (en) 2012-08-06 2015-09-29 Apple Inc. Methods for attaching structures using ultraviolet and visible light curing adhesive
US9001268B2 (en) 2012-08-10 2015-04-07 Nan Chang O-Film Optoelectronics Technology Ltd Auto-focus camera module with flexible printed circuit extension
TWI575271B (en) * 2013-03-06 2017-03-21 鴻海精密工業股份有限公司 Optical communication module and glue dispensing method for the optical communication module
JP2015099262A (en) * 2013-11-19 2015-05-28 ソニー株式会社 Solid-state imaging device, camera module, and electronic device
JP2016057384A (en) * 2014-09-08 2016-04-21 株式会社ケンコー・トキナー Filter unit
US9576177B2 (en) * 2014-12-11 2017-02-21 Fingerprint Cards Ab Fingerprint sensing device
CN105789197B (en) * 2014-12-25 2019-03-15 日月光半导体制造股份有限公司 Optical module, method of manufacturing the same, and electronic device having the same
US9688453B2 (en) 2015-02-09 2017-06-27 Cisco Technology, Inc. Heat dissipation in hermetically-sealed packaged devices
KR102282687B1 (en) 2016-02-18 2021-07-28 닝보 써니 오포테크 코., 엘티디. Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof
US10466501B2 (en) * 2016-05-26 2019-11-05 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules including an optical system tilted with respect to a focal plane
CN206602107U (en) * 2016-11-23 2017-10-31 创智能科技股份有限公司 Fingerprint sensing and identification package structure
FR3060851B1 (en) * 2016-12-20 2018-12-07 3D Plus OPTOELECTRONIC 3D IMAGING MODULE
US11678445B2 (en) 2017-01-25 2023-06-13 Apple Inc. Spatial composites
US10171715B2 (en) * 2017-01-26 2019-01-01 Asia Vital Components Co., Ltd. Camera module with integrated chip-on-board image sensing chip
US10656714B2 (en) 2017-03-29 2020-05-19 Apple Inc. Device having integrated interface system
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
CN111279287B (en) 2017-09-29 2023-08-15 苹果公司 Multipart device housing
EP3685253A1 (en) 2018-05-25 2020-07-29 Apple Inc. Portable computer with dynamic display interface
US11175769B2 (en) 2018-08-16 2021-11-16 Apple Inc. Electronic device with glass enclosure
US11258163B2 (en) 2018-08-30 2022-02-22 Apple Inc. Housing and antenna architecture for mobile device
US11189909B2 (en) 2018-08-30 2021-11-30 Apple Inc. Housing and antenna architecture for mobile device
US10705570B2 (en) 2018-08-30 2020-07-07 Apple Inc. Electronic device housing with integrated antenna
CN114399015B (en) 2019-04-17 2025-05-27 苹果公司 Wireless locatable tags
CN114402431A (en) * 2019-09-12 2022-04-26 株式会社村田制作所 Semiconductor device and method for manufacturing the same
US12009576B2 (en) 2019-12-03 2024-06-11 Apple Inc. Handheld electronic device
US11838432B2 (en) 2019-12-03 2023-12-05 Apple Inc. Handheld electronic device
US11528399B2 (en) * 2020-03-06 2022-12-13 Apple Inc. Housing structure for handheld electronic device
CN119759180A (en) 2020-03-06 2025-04-04 苹果公司 Housing structure for handheld electronic device
EP4150411A1 (en) 2020-05-13 2023-03-22 Apple Inc. Wearable electronic device with glass shell
US12088748B2 (en) 2021-03-02 2024-09-10 Apple Inc. Handheld electronic device

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224047A (en) * 1986-03-26 1987-10-02 Hitachi Ltd Solid-state image pickup device
DE3923023A1 (en) 1989-07-12 1991-01-24 Siemens Ag UV CURABLE ADHESIVE FOR A SEMICONDUCTOR CHIP ASSEMBLY PROCESS
JPH0732208B2 (en) 1989-10-31 1995-04-10 三菱電機株式会社 Semiconductor device
CH680390A5 (en) * 1990-05-18 1992-08-14 Landis & Gyr Betriebs Ag
US5270491A (en) 1990-10-09 1993-12-14 Eastman Kodak Company Hermetically sealed microelectronic package
KR930010072B1 (en) 1990-10-13 1993-10-14 금성일렉트론 주식회사 CCD package and manufacturing method
US5136152A (en) 1990-12-19 1992-08-04 Hoetron, Inc. Hybrid optical pickup with integrated power emission and reading photodetectors
US5534725A (en) 1992-06-16 1996-07-09 Goldstar Electron Co., Ltd. Resin molded charge coupled device package and method for preparation thereof
JPH0629577A (en) * 1992-07-10 1994-02-04 Sumitomo Electric Ind Ltd Method for manufacturing semiconductor light emitting device
KR960001345B1 (en) 1992-08-28 1996-01-26 금성일렉트론주식회사 Glass lead mounting style semiconductor device
US5529936A (en) 1992-09-30 1996-06-25 Lsi Logic Corporation Method of etching a lens for a semiconductor solid state image sensor
US5340420A (en) 1993-01-28 1994-08-23 Eastman Kodak Company Method for bonding a color separation filter to an image sensor
US5666569A (en) 1994-08-25 1997-09-09 Flashpoint Technology, Inc. System and method for detecting and indicating proper focal distance in a fixed lens camera
KR0148733B1 (en) 1995-04-27 1998-08-01 문정환 Package for solid-state imaging device and manufacturing method thereof
JP3472660B2 (en) * 1995-06-22 2003-12-02 日本オプネクスト株式会社 Optical semiconductor array module, assembling method thereof, and external substrate mounting structure
EP0753893B1 (en) 1995-07-13 2004-04-21 Eastman Kodak Company An image sensor assembly and packaging method
JPH09181287A (en) * 1995-10-24 1997-07-11 Sony Corp Light receiving device and manufacturing method thereof
KR100186329B1 (en) 1996-06-14 1999-03-20 문정환 Semiconductor Package for Solid State Imaging Devices
US5925898A (en) * 1996-07-18 1999-07-20 Siemens Aktiengesellschaft Optoelectronic transducer and production methods
US5821532A (en) 1997-06-16 1998-10-13 Eastman Kodak Company Imager package substrate
JP3310910B2 (en) * 1997-06-24 2002-08-05 日本板硝子株式会社 Optical module
US6067025A (en) * 1997-12-03 2000-05-23 Stmicroelectronics, Inc. Apparatus and method for detecting the height above a silicon surface
US6037655A (en) 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
US6037641A (en) * 1998-08-25 2000-03-14 Hewlett-Packard Company Optical device package including an aligned lens
JP3486378B2 (en) * 1998-09-14 2004-01-13 シーメンス アクチエンゲゼルシヤフト Method for manufacturing a photoelectric device
US6753922B1 (en) 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
US6150653A (en) 1998-11-25 2000-11-21 Intel Corporation Lens system for photodetectors
DE19958229B4 (en) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optical semiconductor sensor device

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