AU2001232248A1 - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- AU2001232248A1 AU2001232248A1 AU2001232248A AU3224801A AU2001232248A1 AU 2001232248 A1 AU2001232248 A1 AU 2001232248A1 AU 2001232248 A AU2001232248 A AU 2001232248A AU 3224801 A AU3224801 A AU 3224801A AU 2001232248 A1 AU2001232248 A1 AU 2001232248A1
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- semiconductor
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/785—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
- G11C29/789—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes using non-volatile cells or latches
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/84—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability
- G11C29/848—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability by adjacent switching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
- H10D89/105—Integrated device layouts adapted for thermal considerations
-
- H10P74/232—
-
- H10W46/00—
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/0068—Ingredients with a function or property not provided for elsewhere in C04B2103/00
- C04B2103/0097—Anion- and far-infrared-emitting materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00017—Aspects relating to the protection of the environment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00439—Physico-chemical properties of the materials not provided for elsewhere in C04B2111/00
- C04B2111/00456—Odorless cements
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00482—Coating or impregnation materials
- C04B2111/00517—Coating or impregnation materials for masonry
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/20—Resistance against chemical, physical or biological attack
- C04B2111/2092—Resistance against biological degradation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/02—Structural aspects of erasable programmable read-only memories
- G11C2216/10—Floating gate memory cells with a single polysilicon layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/50—Peripheral circuit region structures
-
- H10W20/4421—
-
- H10W46/403—
-
- H10W46/601—
-
- H10W72/075—
-
- H10W72/5363—
-
- H10W72/5445—
-
- H10W72/932—
-
- H10W72/951—
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nanotechnology (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structural Engineering (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Mathematical Physics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000038167A JP4191355B2 (en) | 2000-02-10 | 2000-02-10 | Semiconductor integrated circuit device |
| JP2000-038167 | 2000-02-10 | ||
| PCT/JP2001/000887 WO2001059789A1 (en) | 2000-02-10 | 2001-02-08 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001232248A1 true AU2001232248A1 (en) | 2001-08-20 |
Family
ID=18561945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001232248A Abandoned AU2001232248A1 (en) | 2000-02-10 | 2001-02-08 | Semiconductor integrated circuit device |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US6611458B2 (en) |
| EP (1) | EP1262996B1 (en) |
| JP (1) | JP4191355B2 (en) |
| KR (2) | KR100816924B1 (en) |
| CN (2) | CN101916591B (en) |
| AU (1) | AU2001232248A1 (en) |
| DE (1) | DE60143643D1 (en) |
| TW (1) | TW506135B (en) |
| WO (1) | WO2001059789A1 (en) |
Families Citing this family (53)
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|---|---|---|---|---|
| BR9815420A (en) * | 1997-11-28 | 2001-07-17 | Abb Ab | Method and device for controlling the magnetic flux with an auxiliary winding on a rotating high voltage alternating current machine |
| US6829737B1 (en) | 2000-08-30 | 2004-12-07 | Micron Technology, Inc. | Method and system for storing device test information on a semiconductor device using on-device logic for determination of test results |
| JP4043703B2 (en) * | 2000-09-04 | 2008-02-06 | 株式会社ルネサステクノロジ | Semiconductor device, microcomputer, and flash memory |
| DE10120670B4 (en) * | 2001-04-27 | 2008-08-21 | Qimonda Ag | Method for repairing hardware faults in memory chips |
| US6754108B2 (en) * | 2001-08-30 | 2004-06-22 | Micron Technology, Inc. | DRAM cells with repressed floating gate memory, low tunnel barrier interpoly insulators |
| US7135734B2 (en) * | 2001-08-30 | 2006-11-14 | Micron Technology, Inc. | Graded composition metal oxide tunnel barrier interpoly insulators |
| US6963103B2 (en) * | 2001-08-30 | 2005-11-08 | Micron Technology, Inc. | SRAM cells with repressed floating gate memory, low tunnel barrier interpoly insulators |
| US7068544B2 (en) | 2001-08-30 | 2006-06-27 | Micron Technology, Inc. | Flash memory with low tunnel barrier interpoly insulators |
| US7075829B2 (en) * | 2001-08-30 | 2006-07-11 | Micron Technology, Inc. | Programmable memory address and decode circuits with low tunnel barrier interpoly insulators |
| US7087954B2 (en) * | 2001-08-30 | 2006-08-08 | Micron Technology, Inc. | In service programmable logic arrays with low tunnel barrier interpoly insulators |
| US7476925B2 (en) | 2001-08-30 | 2009-01-13 | Micron Technology, Inc. | Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interploy insulators |
| JP3821697B2 (en) | 2001-12-07 | 2006-09-13 | エルピーダメモリ株式会社 | Method for verifying semiconductor integrated circuit device and semiconductor integrated circuit device |
| US6943575B2 (en) * | 2002-07-29 | 2005-09-13 | Micron Technology, Inc. | Method, circuit and system for determining burn-in reliability from wafer level burn-in |
| JP2004079138A (en) * | 2002-08-22 | 2004-03-11 | Renesas Technology Corp | Nonvolatile semiconductor memory device |
| EP1453062B1 (en) * | 2003-02-27 | 2006-06-28 | STMicroelectronics S.r.l. | Built-in testing methodology in flash memory |
| JP4108519B2 (en) * | 2003-03-31 | 2008-06-25 | エルピーダメモリ株式会社 | Control circuit, semiconductor memory device, and control method |
| JP4314085B2 (en) * | 2003-09-08 | 2009-08-12 | パナソニック株式会社 | Nonvolatile semiconductor memory device |
| KR100586841B1 (en) * | 2003-12-15 | 2006-06-07 | 삼성전자주식회사 | Variable delay control method and circuit |
| JP4130634B2 (en) | 2004-01-20 | 2008-08-06 | 松下電器産業株式会社 | Semiconductor device |
| JP4124743B2 (en) | 2004-01-21 | 2008-07-23 | 株式会社ルネサステクノロジ | Phase change memory |
| JP2005327337A (en) * | 2004-05-12 | 2005-11-24 | Matsushita Electric Ind Co Ltd | Semiconductor memory device |
| KR100591764B1 (en) * | 2004-05-18 | 2006-06-22 | 삼성전자주식회사 | Semiconductor memory device with signal lines wired across cell array |
| US7102371B1 (en) * | 2004-05-19 | 2006-09-05 | National Semiconductor Corporation | Bilevel probe |
| KR100634439B1 (en) * | 2004-10-26 | 2006-10-16 | 삼성전자주식회사 | Fuse-Free Circuits, Fuse-Free Semiconductor Integrated Circuits and Fuse-Free Nonvolatile Memory Devices, and Fuse-Free Methods |
| US7373573B2 (en) | 2005-06-06 | 2008-05-13 | International Business Machines Corporation | Apparatus and method for using a single bank of eFuses to successively store testing data from multiple stages of testing |
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US8110469B2 (en) | 2005-08-30 | 2012-02-07 | Micron Technology, Inc. | Graded dielectric layers |
| JP2007172690A (en) * | 2005-12-19 | 2007-07-05 | Fujitsu Ltd | Memory redundancy selection device, storage device, information processing device, and memory cell redundancy selection method |
| JP4764723B2 (en) * | 2006-01-10 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| JP4675813B2 (en) | 2006-03-31 | 2011-04-27 | Okiセミコンダクタ株式会社 | Semiconductor memory device and manufacturing method thereof |
| JP2008181634A (en) * | 2006-12-26 | 2008-08-07 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| US8055982B2 (en) * | 2007-02-21 | 2011-11-08 | Sigmatel, Inc. | Error correction system and method |
| KR100843243B1 (en) * | 2007-04-18 | 2008-07-02 | 삼성전자주식회사 | Semiconductor memory device with optimized signal transmission power and its power initialization method |
| KR100888885B1 (en) * | 2007-04-19 | 2009-03-17 | 삼성전자주식회사 | Lead frame and semiconductor device having same |
| JP2008300575A (en) | 2007-05-30 | 2008-12-11 | Oki Electric Ind Co Ltd | Semiconductor memory device and manufacturing method thereof |
| JP2009070943A (en) | 2007-09-12 | 2009-04-02 | Oki Semiconductor Co Ltd | Semiconductor memory device and manufacturing method thereof |
| KR100933839B1 (en) * | 2008-03-10 | 2009-12-24 | 주식회사 하이닉스반도체 | Nonvolatile Memory Device and Operation Method |
| JP2009239161A (en) * | 2008-03-28 | 2009-10-15 | Genusion Inc | Nonvolatile semiconductor memory device and usage method thereof |
| KR100998945B1 (en) * | 2008-09-05 | 2010-12-09 | 주식회사 하이닉스반도체 | Nonvolatile Memory Device Manufacturing Method |
| DE102008063429B4 (en) * | 2008-12-31 | 2015-03-26 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Setting the configuration of a multi-gate transistor by controlling individual lands |
| JP6174011B2 (en) | 2011-05-12 | 2017-08-02 | デピュー シンセス プロダクツ, インコーポレーテッドDePuy Synthes Products, Inc. | Region optimization of pixel array using stacking scheme for hybrid image sensor with minimum vertical interconnection |
| CN104486987A (en) | 2012-07-26 | 2015-04-01 | 橄榄医疗公司 | Camera system with smallest area monolithic CMOS image sensor |
| EP3690028A1 (en) * | 2012-09-04 | 2020-08-05 | Anthrogenesis Corporation | Methods of tissue generation |
| KR102044827B1 (en) * | 2012-10-17 | 2019-11-15 | 삼성전자주식회사 | Data loading circuit and semiconductor memory device including the same |
| BR112015023206A2 (en) | 2013-03-15 | 2017-08-22 | Olive Medical Corp | IMAGE SENSOR SYNCHRONIZATION WITHOUT INPUT TIMER AND DATA TRANSMISSION TIMER |
| JP6419774B2 (en) | 2013-03-15 | 2018-11-07 | デピュイ・シンセス・プロダクツ・インコーポレイテッド | Minimizing image sensor I/O and conductor count in endoscopic applications |
| US9270174B2 (en) * | 2013-05-12 | 2016-02-23 | Freescale Semiconductor, Inc. | Integrated circuit power management module |
| CN104409104B (en) * | 2014-10-30 | 2018-02-06 | 上海华虹宏力半导体制造有限公司 | The verification method of chip-stored unit scrambler address |
| CN104616698A (en) * | 2015-01-28 | 2015-05-13 | 山东华翼微电子技术股份有限公司 | Method for sufficiently utilizing memory redundancy unit |
| JP6097775B2 (en) * | 2015-02-16 | 2017-03-15 | 力晶科技股▲ふん▼有限公司 | Semiconductor memory device and semiconductor integrated circuit device |
| US9343156B1 (en) * | 2015-06-25 | 2016-05-17 | Sandisk Technologies Inc. | Balancing programming speeds of memory cells in a 3D stacked memory |
| JP7282749B2 (en) * | 2018-04-19 | 2023-05-29 | ソニーセミコンダクタソリューションズ株式会社 | Non-volatile memory circuit |
| KR102832402B1 (en) * | 2020-05-25 | 2025-07-10 | 에스케이하이닉스 주식회사 | Memory device |
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-
2000
- 2000-02-10 JP JP2000038167A patent/JP4191355B2/en not_active Expired - Lifetime
-
2001
- 2001-01-30 TW TW090101806A patent/TW506135B/en not_active IP Right Cessation
- 2001-02-08 EP EP01904349A patent/EP1262996B1/en not_active Expired - Lifetime
- 2001-02-08 CN CN201010003815.7A patent/CN101916591B/en not_active Expired - Lifetime
- 2001-02-08 DE DE60143643T patent/DE60143643D1/en not_active Expired - Lifetime
- 2001-02-08 KR KR1020027006867A patent/KR100816924B1/en not_active Expired - Lifetime
- 2001-02-08 WO PCT/JP2001/000887 patent/WO2001059789A1/en not_active Ceased
- 2001-02-08 AU AU2001232248A patent/AU2001232248A1/en not_active Abandoned
- 2001-02-08 CN CN01804803A patent/CN100590739C/en not_active Expired - Lifetime
- 2001-02-08 KR KR1020077023259A patent/KR100817343B1/en not_active Expired - Lifetime
- 2001-02-12 US US09/780,393 patent/US6611458B2/en not_active Expired - Lifetime
-
2003
- 2003-06-25 US US10/602,684 patent/US6894944B2/en not_active Expired - Lifetime
-
2005
- 2005-03-07 US US11/072,309 patent/US7149113B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP4191355B2 (en) | 2008-12-03 |
| KR20020080340A (en) | 2002-10-23 |
| WO2001059789A1 (en) | 2001-08-16 |
| US20050152186A1 (en) | 2005-07-14 |
| CN100590739C (en) | 2010-02-17 |
| US20040004879A1 (en) | 2004-01-08 |
| EP1262996B1 (en) | 2010-12-15 |
| TW506135B (en) | 2002-10-11 |
| US7149113B2 (en) | 2006-12-12 |
| US20010019499A1 (en) | 2001-09-06 |
| EP1262996A4 (en) | 2007-06-27 |
| EP1262996A1 (en) | 2002-12-04 |
| CN101916591A (en) | 2010-12-15 |
| KR100816924B1 (en) | 2008-03-26 |
| CN1398407A (en) | 2003-02-19 |
| JP2001229690A (en) | 2001-08-24 |
| DE60143643D1 (en) | 2011-01-27 |
| US6894944B2 (en) | 2005-05-17 |
| US6611458B2 (en) | 2003-08-26 |
| KR20070108570A (en) | 2007-11-12 |
| CN101916591B (en) | 2014-05-07 |
| KR100817343B1 (en) | 2008-03-27 |
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