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AU2001286227A1 - Laser beam machining method and laser beam machining device - Google Patents

Laser beam machining method and laser beam machining device

Info

Publication number
AU2001286227A1
AU2001286227A1 AU2001286227A AU8622701A AU2001286227A1 AU 2001286227 A1 AU2001286227 A1 AU 2001286227A1 AU 2001286227 A AU2001286227 A AU 2001286227A AU 8622701 A AU8622701 A AU 8622701A AU 2001286227 A1 AU2001286227 A1 AU 2001286227A1
Authority
AU
Australia
Prior art keywords
work
laser beam
beam machining
predetermined
cut line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286227A
Inventor
Kenshi Fukumitsu
Fumitsugu Fukuyo
Naoki Uchiyama
Toshimitsu Wakuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18763489&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2001286227(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of AU2001286227A1 publication Critical patent/AU2001286227A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • H10P54/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023Thermo-compression bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/034Observing the temperature of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/102Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • H10P72/7402
    • H10P72/7416
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/02Other than completely through work thickness
    • Y10T83/0333Scoring
    • Y10T83/0341Processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A laser beam processing method capable of cutting a work (1) without producing a fusing and a cracking out of a predetermined cutting line (5) on the surface (3) of the work (1), wherein a pulse laser beam (L) is radiated on the predetermined cut line (5) on the surface (3) of the work (1) with a condensed point (P) aligned to the inside of the work (1), and a modified area is formed inside the work (1) along the predetermined determined cut line (5) by moving the condensed point (P) along the predetermined cut line (5), whereby the work (1) can be cut with a rather small force by cracking the work (1) along the predetermined cut line (5) starting from the modified area.
AU2001286227A 2000-09-13 2001-09-13 Laser beam machining method and laser beam machining device Abandoned AU2001286227A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2000-278306 2000-09-13
PCT/JP2001/007954 WO2002022301A1 (en) 2000-09-13 2001-09-13 Laser beam machining method and laser beam machining device

Publications (1)

Publication Number Publication Date
AU2001286227A1 true AU2001286227A1 (en) 2002-03-26

Family

ID=18763489

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Families Citing this family (616)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297869B1 (en) * 1998-12-04 2001-10-02 Samsung Electronics Co., Ltd. Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
US6548370B1 (en) * 1999-08-18 2003-04-15 Semiconductor Energy Laboratory Co., Ltd. Method of crystallizing a semiconductor layer by applying laser irradiation that vary in energy to its top and bottom surfaces
JP4659300B2 (en) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
US8204618B2 (en) * 2008-03-24 2012-06-19 Hypertherm, Inc. Method and apparatus for operating an automated high temperature thermal cutting system
EP1441385A4 (en) * 2001-10-31 2009-11-18 Mitsuboshi Diamond Ind Co Ltd METHOD FOR FORMING CUTTING PATH ON SEMICONDUCTOR WAFER, AND DEVICE FOR FORMING CUTTING PATH
WO2003076119A1 (en) 2002-03-12 2003-09-18 Hamamatsu Photonics K.K. Method of cutting processed object
EP3252806B1 (en) 2002-03-12 2019-10-09 Hamamatsu Photonics K.K. Substrate dividing method
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
JP2004022936A (en) * 2002-06-19 2004-01-22 Disco Abrasive Syst Ltd Semiconductor wafer dividing method and apparatus
JP2004066293A (en) * 2002-08-06 2004-03-04 Namiki Precision Jewel Co Ltd Laser processing method
JP4459514B2 (en) 2002-09-05 2010-04-28 株式会社半導体エネルギー研究所 Laser marking device
US7294454B1 (en) * 2002-09-30 2007-11-13 Translume, Inc. Waveguide fabrication methods and devices
TWI520269B (en) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
WO2004050291A1 (en) * 2002-12-05 2004-06-17 Hamamatsu Photonics K.K. Laser processing device
JP2004188422A (en) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk Device and method for machining laser beam
US6756562B1 (en) * 2003-01-10 2004-06-29 Kabushiki Kaisha Toshiba Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
JP3825753B2 (en) 2003-01-14 2006-09-27 株式会社東芝 Manufacturing method of semiconductor device
WO2004080642A1 (en) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. Laser beam machining method
FR2852250B1 (en) 2003-03-11 2009-07-24 Jean Luc Jouvin PROTECTIVE SHEATH FOR CANNULA, AN INJECTION KIT COMPRISING SUCH ANKLE AND NEEDLE EQUIPPED WITH SUCH ANKLE
CN1758985A (en) 2003-03-12 2006-04-12 浜松光子学株式会社 Laser beam machining method
WO2004096483A1 (en) * 2003-04-25 2004-11-11 Nitto Denko Corporation Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
US7410831B2 (en) 2003-05-12 2008-08-12 Tokyo Seimitsu Co., Ltd. Method and device for dividing plate-like member
JP2004343008A (en) * 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd Workpiece division method using laser beam
KR101058800B1 (en) 2003-05-22 2011-08-23 가부시키가이샤 토쿄 세이미쯔 Laser dicing equipment
DE112004000766T5 (en) * 2003-05-22 2007-01-25 Tokyo Seimitsu Co., Ltd. Chip cutter
JP4494728B2 (en) * 2003-05-26 2010-06-30 株式会社ディスコ Non-metallic substrate division method
TWI401302B (en) * 2003-06-06 2013-07-11 日立化成股份有限公司 Cutting adhesive integrated adhesive sheet
JP2005019667A (en) * 2003-06-26 2005-01-20 Disco Abrasive Syst Ltd Semiconductor wafer division method using laser beam
JP4256214B2 (en) 2003-06-27 2009-04-22 株式会社ディスコ Plate-shaped material dividing device
JP2005028423A (en) * 2003-07-09 2005-02-03 Disco Abrasive Syst Ltd Laser processing method and laser processing apparatus
JP2005032903A (en) * 2003-07-10 2005-02-03 Oki Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
JP4703983B2 (en) * 2003-07-18 2011-06-15 浜松ホトニクス株式会社 Cutting method
US7605344B2 (en) * 2003-07-18 2009-10-20 Hamamatsu Photonics K.K. Laser beam machining method, laser beam machining apparatus, and laser beam machining product
JP4554901B2 (en) * 2003-08-12 2010-09-29 株式会社ディスコ Wafer processing method
JP4563097B2 (en) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP4590174B2 (en) 2003-09-11 2010-12-01 株式会社ディスコ Wafer processing method
JP2005086175A (en) * 2003-09-11 2005-03-31 Hamamatsu Photonics Kk Semiconductor thin film manufacturing method, semiconductor thin film, semiconductor thin film chip, electron tube, and photodetecting element
JP4398686B2 (en) * 2003-09-11 2010-01-13 株式会社ディスコ Wafer processing method
EP1518634A1 (en) * 2003-09-23 2005-03-30 Advanced Laser Separation International (ALSI) B.V. A method of and a device for separating semiconductor elements formed in a wafer of semiconductor material
JP4408361B2 (en) 2003-09-26 2010-02-03 株式会社ディスコ Wafer division method
JP4251054B2 (en) * 2003-10-01 2009-04-08 株式会社デンソー Manufacturing method of semiconductor device
JP2005129607A (en) * 2003-10-22 2005-05-19 Disco Abrasive Syst Ltd Wafer division method
JP2005142303A (en) 2003-11-05 2005-06-02 Disco Abrasive Syst Ltd Silicon wafer dividing method and apparatus
JP2005138143A (en) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd Machining apparatus using laser beam
JP2005144487A (en) * 2003-11-13 2005-06-09 Seiko Epson Corp Laser processing apparatus and laser processing method
JP4601965B2 (en) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4509578B2 (en) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4598407B2 (en) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP2005203541A (en) 2004-01-15 2005-07-28 Disco Abrasive Syst Ltd Wafer laser processing method
US7179722B2 (en) * 2004-02-03 2007-02-20 Disco Corporation Wafer dividing method
JP2005222989A (en) * 2004-02-03 2005-08-18 Disco Abrasive Syst Ltd Wafer division method
CN100428418C (en) * 2004-02-09 2008-10-22 株式会社迪斯科 Wafer Separation Method
JP2005268752A (en) * 2004-02-19 2005-09-29 Canon Inc Laser cleaving method, member to be cleaved, and semiconductor element chip
JP2005236082A (en) 2004-02-20 2005-09-02 Nitto Denko Corp Laser dicing adhesive sheet and method for producing the same
JPWO2005084874A1 (en) 2004-03-05 2008-01-17 オリンパス株式会社 Laser processing equipment
JP2005252196A (en) * 2004-03-08 2005-09-15 Toshiba Corp Semiconductor device and manufacturing method thereof
JP2005252126A (en) * 2004-03-08 2005-09-15 Disco Abrasive Syst Ltd Wafer processing method
JP4453407B2 (en) * 2004-03-15 2010-04-21 三菱電機株式会社 Laser processing equipment
FI120082B (en) * 2004-03-18 2009-06-30 Antti Salminen Process for processing materials with high power frequency electromagnetic radiation
US7511247B2 (en) 2004-03-22 2009-03-31 Panasonic Corporation Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization
JP4514490B2 (en) * 2004-03-29 2010-07-28 日東電工株式会社 Semiconductor wafer fragmentation method
WO2005098916A1 (en) * 2004-03-30 2005-10-20 Hamamatsu Photonics K.K. Laser processing method and semiconductor chip
JP4536407B2 (en) * 2004-03-30 2010-09-01 浜松ホトニクス株式会社 Laser processing method and object to be processed
KR101336402B1 (en) 2004-03-30 2013-12-04 하마마츠 포토닉스 가부시키가이샤 Laser processing method and semiconductor chip
WO2011123205A1 (en) 2010-03-30 2011-10-06 Imra America, Inc. Laser-based material processing apparatus and methods
DE102004024475A1 (en) * 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Method and device for separating semiconductor materials
JP4694795B2 (en) * 2004-05-18 2011-06-08 株式会社ディスコ Wafer division method
JP4631044B2 (en) * 2004-05-26 2011-02-16 国立大学法人北海道大学 Laser processing method and apparatus
US7491288B2 (en) * 2004-06-07 2009-02-17 Fujitsu Limited Method of cutting laminate with laser and laminate
JP4938998B2 (en) * 2004-06-07 2012-05-23 富士通株式会社 Substrate and laminate cutting method, and laminate production method
US7935941B2 (en) * 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US7425471B2 (en) * 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US8148211B2 (en) * 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
EP1614499A1 (en) * 2004-07-09 2006-01-11 Advanced Laser Separation International (ALSI) B.V. Laser cutting method and arrangement for performing said method
JP4634089B2 (en) * 2004-07-30 2011-02-16 浜松ホトニクス株式会社 Laser processing method
JP4200177B2 (en) * 2004-08-06 2008-12-24 浜松ホトニクス株式会社 Laser processing method and semiconductor device
US7550367B2 (en) * 2004-08-17 2009-06-23 Denso Corporation Method for separating semiconductor substrate
JP2006108459A (en) * 2004-10-07 2006-04-20 Disco Abrasive Syst Ltd Laser processing method and laser processing apparatus for silicon wafer
JP4754801B2 (en) * 2004-10-13 2011-08-24 浜松ホトニクス株式会社 Laser processing method
JP2006114691A (en) * 2004-10-14 2006-04-27 Disco Abrasive Syst Ltd Wafer division method
KR20070069187A (en) 2004-10-20 2007-07-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Laser irradiation method, laser irradiation device, and semiconductor device manufacturing method
JP2006123228A (en) * 2004-10-27 2006-05-18 Disco Abrasive Syst Ltd Laser processing method and laser processing apparatus
KR20060040277A (en) * 2004-11-05 2006-05-10 엘지.필립스 엘시디 주식회사 Cutting Method of Substrate Using Femtosecond Laser
KR101074408B1 (en) * 2004-11-05 2011-10-17 엘지디스플레이 주식회사 apparatus for generating femtosecond laser and method for cutting of substrate using the same
JP4917257B2 (en) 2004-11-12 2012-04-18 浜松ホトニクス株式会社 Laser processing method
JP4781661B2 (en) 2004-11-12 2011-09-28 浜松ホトニクス株式会社 Laser processing method
JP4776911B2 (en) * 2004-11-19 2011-09-21 キヤノン株式会社 Laser processing apparatus and laser processing method
JP2006145810A (en) * 2004-11-19 2006-06-08 Canon Inc Automatic focusing device, laser processing device and laser cleaving device
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2006150385A (en) 2004-11-26 2006-06-15 Canon Inc Laser cleaving method
CN100481337C (en) * 2004-12-08 2009-04-22 雷射先进科技株式会社 Division starting point forming method in body to be divided, and dividing method for body to be divided
TWI237322B (en) * 2004-12-14 2005-08-01 Cleavage Entpr Co Ltd Method and device by using a laser beam to cut Gallium arsenide (GaAs) epitaxy wafer
JP2006173428A (en) 2004-12-17 2006-06-29 Seiko Epson Corp Substrate processing method and element manufacturing method
JP4873863B2 (en) * 2005-01-14 2012-02-08 日東電工株式会社 Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing
JP4854061B2 (en) * 2005-01-14 2012-01-11 日東電工株式会社 Manufacturing method of laser processed product and protective sheet for laser processing
JP4471852B2 (en) * 2005-01-21 2010-06-02 パナソニック株式会社 Semiconductor wafer, manufacturing method using the same, and semiconductor device
JP4198123B2 (en) 2005-03-22 2008-12-17 浜松ホトニクス株式会社 Laser processing method
JP2006286727A (en) * 2005-03-31 2006-10-19 Denso Corp Semiconductor wafer provided with a plurality of semiconductor devices and dicing method thereof
JP2006315017A (en) * 2005-05-11 2006-11-24 Canon Inc Laser cutting method and member to be cut
JP4809632B2 (en) * 2005-06-01 2011-11-09 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP4776994B2 (en) * 2005-07-04 2011-09-21 浜松ホトニクス株式会社 Processing object cutting method
JP4749799B2 (en) * 2005-08-12 2011-08-17 浜松ホトニクス株式会社 Laser processing method
KR100813351B1 (en) * 2005-08-19 2008-03-12 하마마츠 포토닉스 가부시키가이샤 Laser processing method
KR100766727B1 (en) * 2005-08-19 2007-10-15 하마마츠 포토닉스 가부시키가이샤 Laser processing method
US8221400B2 (en) 2005-08-22 2012-07-17 Sie Surgical Instruments Engineering Ag Apparatus for and method of refractive surgery with laser pulses
DE102005039833A1 (en) * 2005-08-22 2007-03-01 Rowiak Gmbh Device and method for material separation with laser pulses
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP4762653B2 (en) 2005-09-16 2011-08-31 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP2007087973A (en) * 2005-09-16 2007-04-05 Rohm Co Ltd Nitride semiconductor device manufacturing method and nitride semiconductor light emitting device obtained by the method
DE102005046479B4 (en) * 2005-09-28 2008-12-18 Infineon Technologies Austria Ag Process for splitting brittle materials using trenching technology
JP2007095952A (en) * 2005-09-28 2007-04-12 Tokyo Seimitsu Co Ltd Laser dicing apparatus and laser dicing method
JP2007118207A (en) * 2005-10-25 2007-05-17 Seiko Epson Corp Laminate processing method
WO2007055010A1 (en) 2005-11-10 2007-05-18 Renesas Technology Corp. Semiconductor device manufacturing method and semiconductor device
JP2013080972A (en) * 2005-11-10 2013-05-02 Renesas Electronics Corp Method of manufacturing semiconductor device
JP4830740B2 (en) * 2005-11-16 2011-12-07 株式会社デンソー Manufacturing method of semiconductor chip
US20070111480A1 (en) * 2005-11-16 2007-05-17 Denso Corporation Wafer product and processing method therefor
KR100858983B1 (en) * 2005-11-16 2008-09-17 가부시키가이샤 덴소 Semiconductor device and dicing method for semiconductor substrate
JP2007165850A (en) 2005-11-16 2007-06-28 Denso Corp Wafer and wafer cutting method
US7662668B2 (en) * 2005-11-16 2010-02-16 Denso Corporation Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
JP4678281B2 (en) * 2005-11-16 2011-04-27 株式会社デンソー Semiconductor substrate cutting device
US7838331B2 (en) * 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
JP2007142000A (en) * 2005-11-16 2007-06-07 Denso Corp Laser beam machine and laser beam machining method
JP2007165851A (en) * 2005-11-16 2007-06-28 Denso Corp Dicing seat frame
JP4736738B2 (en) * 2005-11-17 2011-07-27 株式会社デンソー Laser dicing method and laser dicing apparatus
JP4237745B2 (en) * 2005-11-18 2009-03-11 浜松ホトニクス株式会社 Laser processing method
JP4907965B2 (en) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 Laser processing method
US20070155131A1 (en) * 2005-12-21 2007-07-05 Intel Corporation Method of singulating a microelectronic wafer
JP4804911B2 (en) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 Laser processing equipment
JP4907984B2 (en) 2005-12-27 2012-04-04 浜松ホトニクス株式会社 Laser processing method and semiconductor chip
JP4711185B2 (en) 2006-02-27 2011-06-29 株式会社デンソー Foreign matter removing apparatus and foreign matter removing method for semiconductor device
JP2007235008A (en) * 2006-03-03 2007-09-13 Denso Corp Wafer cutting method and chip
JP2007235069A (en) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd Wafer processing method
JP2007235068A (en) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd Wafer processing method
JP4322881B2 (en) * 2006-03-14 2009-09-02 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP2007275962A (en) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd Laser processing equipment
JP2007305687A (en) * 2006-05-09 2007-11-22 Disco Abrasive Syst Ltd Wafer dividing method and dividing apparatus
JP2007317747A (en) * 2006-05-23 2007-12-06 Seiko Epson Corp Substrate dividing method and liquid jet head manufacturing method
US20070298529A1 (en) * 2006-05-31 2007-12-27 Toyoda Gosei, Co., Ltd. Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
JP4480728B2 (en) * 2006-06-09 2010-06-16 パナソニック株式会社 Method for manufacturing MEMS microphone
US7897487B2 (en) * 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
JP5183892B2 (en) 2006-07-03 2013-04-17 浜松ホトニクス株式会社 Laser processing method
JP5048978B2 (en) 2006-07-14 2012-10-17 株式会社ディスコ Laser processing equipment
JP2008028347A (en) * 2006-07-25 2008-02-07 Disco Abrasive Syst Ltd Embrittlement zone formation method
JP5145673B2 (en) * 2006-08-30 2013-02-20 住友電気工業株式会社 Laser processing method and laser processing apparatus
JP4954653B2 (en) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 Laser processing method
WO2008035679A1 (en) * 2006-09-19 2008-03-27 Hamamatsu Photonics K. K. Laser processing method and laser processing apparatus
JP5037082B2 (en) * 2006-10-02 2012-09-26 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP5101073B2 (en) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 Laser processing equipment
JP5132911B2 (en) * 2006-10-03 2013-01-30 浜松ホトニクス株式会社 Laser processing method
JP4964554B2 (en) * 2006-10-03 2012-07-04 浜松ホトニクス株式会社 Laser processing method
EP2070636B1 (en) * 2006-10-04 2015-08-05 Hamamatsu Photonics K.K. Laser processing method
JP5029804B2 (en) * 2006-11-02 2012-09-19 澁谷工業株式会社 Cleaving method for brittle materials
DE102006051556A1 (en) * 2006-11-02 2008-05-08 Manz Automation Ag Process for structuring solar modules and structuring device
CA2669045A1 (en) * 2006-11-08 2008-05-15 T2 Biosystems, Inc. Nmr systems for in vivo detection of analytes
JP4306717B2 (en) * 2006-11-09 2009-08-05 セイコーエプソン株式会社 Method for manufacturing silicon device and method for manufacturing liquid jet head
US20080142475A1 (en) * 2006-12-15 2008-06-19 Knowles Electronics, Llc Method of creating solid object from a material and apparatus thereof
WO2008081828A1 (en) * 2007-01-05 2008-07-10 Nippon Electric Glass Co., Ltd. Cover glass for solid state imaging device and method for manufacturing the cover glass
US8530784B2 (en) * 2007-02-01 2013-09-10 Orbotech Ltd. Method and system of machining using a beam of photons
JP2008277414A (en) * 2007-04-26 2008-11-13 Disco Abrasive Syst Ltd Wafer division method
JP5162163B2 (en) * 2007-06-27 2013-03-13 株式会社ディスコ Wafer laser processing method
JP5336054B2 (en) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 Processing information supply system provided with processing information supply device
JP2009032970A (en) * 2007-07-27 2009-02-12 Rohm Co Ltd Method of manufacturing nitride semiconductor device
JP4402708B2 (en) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 Laser processing method, laser processing apparatus and manufacturing method thereof
US20090040640A1 (en) * 2007-08-07 2009-02-12 Jinnam Kim Glass cutting method, glass for flat panel display thereof and flat panel display device using it
JP2009044600A (en) * 2007-08-10 2009-02-26 Panasonic Corp Microphone device and manufacturing method thereof
JP5225639B2 (en) * 2007-09-06 2013-07-03 浜松ホトニクス株式会社 Manufacturing method of semiconductor laser device
JP5342772B2 (en) * 2007-10-12 2013-11-13 浜松ホトニクス株式会社 Processing object cutting method
JP5449665B2 (en) 2007-10-30 2014-03-19 浜松ホトニクス株式会社 Laser processing method
JP5054496B2 (en) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 Processing object cutting method
JP5134928B2 (en) * 2007-11-30 2013-01-30 浜松ホトニクス株式会社 Workpiece grinding method
EP2225776A4 (en) 2007-12-14 2013-01-16 Du Pont REAR PANEL STRUCTURES FOR ELECTRONIC DEVICES
WO2009081746A1 (en) 2007-12-21 2009-07-02 Tokyo Seimitsu Co., Ltd. Dicing apparatus and dicing method
JP5826027B2 (en) 2008-03-21 2015-12-02 イムラ アメリカ インコーポレイテッド Laser-based material processing method and system
US20090242526A1 (en) * 2008-03-26 2009-10-01 Electro Scientific Industries, Inc. Laser micromachining through a protective member
JP5345334B2 (en) * 2008-04-08 2013-11-20 株式会社レミ Thermal stress cleaving method for brittle materials
US8900715B2 (en) * 2008-06-11 2014-12-02 Infineon Technologies Ag Semiconductor device
JP5108661B2 (en) 2008-07-03 2012-12-26 浜松ホトニクス株式会社 Laser processing apparatus and laser processing method
JP5117954B2 (en) * 2008-07-31 2013-01-16 株式会社ディスコ Laser processing apparatus and laser processing method
JP5243139B2 (en) * 2008-07-31 2013-07-24 株式会社ディスコ Laser processing apparatus and laser processing method
JP2010029930A (en) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method
JP2010029927A (en) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method
JP5692969B2 (en) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 Aberration correction method, laser processing method using this aberration correction method, laser irradiation method using this aberration correction method, aberration correction apparatus, and aberration correction program
WO2010031379A1 (en) * 2008-09-17 2010-03-25 Trumpf Laser Gmbh + Co. Kg Method for laser fusion cutting without cutting gas
DE102008052006B4 (en) 2008-10-10 2018-12-20 3D-Micromac Ag Method and device for the production of samples for transmission electron microscopy
KR100918432B1 (en) * 2008-10-23 2009-09-24 홍동희 Ampoule bottle and cutting groove formation method for easy cutting
US8895892B2 (en) * 2008-10-23 2014-11-25 Corning Incorporated Non-contact glass shearing device and method for scribing or cutting a moving glass sheet
US20110300692A1 (en) * 2008-10-29 2011-12-08 Oerlikon Solar Ag, Trubbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
JP5127669B2 (en) * 2008-10-31 2013-01-23 パナソニック株式会社 Semiconductor wafer
KR101539246B1 (en) * 2008-11-10 2015-07-24 삼성전자 주식회사 Fabricating method of the light emitting device for improving light extraction efficiency and light emitting device fabricated by the method
JP5254761B2 (en) 2008-11-28 2013-08-07 浜松ホトニクス株式会社 Laser processing equipment
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
JP5241525B2 (en) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 Laser processing equipment
JP5241527B2 (en) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 Laser processing equipment
DE102009005303A1 (en) * 2009-01-16 2010-07-22 BIAS - Bremer Institut für angewandte Strahltechnik GmbH A method for separating a semiconductor wafer from a semiconductor crystal
JP2010177277A (en) * 2009-01-27 2010-08-12 Tokyo Seimitsu Co Ltd Laser dicing method and laser dicing device
US8728914B2 (en) 2009-02-09 2014-05-20 Hamamatsu Photonics K.K. Workpiece cutting method
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8245540B2 (en) * 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
KR101697383B1 (en) 2009-02-25 2017-01-17 니치아 카가쿠 고교 가부시키가이샤 Semiconductor element manufacturing method
US8609512B2 (en) * 2009-03-27 2013-12-17 Electro Scientific Industries, Inc. Method for laser singulation of chip scale packages on glass substrates
US20100252959A1 (en) * 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
KR101769158B1 (en) * 2009-04-07 2017-08-17 하마마츠 포토닉스 가부시키가이샤 Laser machining device and laser machining method
JP5491761B2 (en) * 2009-04-20 2014-05-14 浜松ホトニクス株式会社 Laser processing equipment
US8455332B2 (en) * 2009-05-01 2013-06-04 Bridgelux, Inc. Method and apparatus for manufacturing LED devices using laser scribing
US8706288B2 (en) * 2009-05-21 2014-04-22 Electro Scientific Industries, Inc. Apparatus and method for non-contact sensing of transparent articles
JP5340808B2 (en) * 2009-05-21 2013-11-13 株式会社ディスコ Laser processing method of semiconductor wafer
US8269138B2 (en) * 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
US8133763B2 (en) * 2009-05-22 2012-03-13 Texas Instruments Incorporated Method for semiconductor leadframes in low volume and rapid turnaround
JP5525601B2 (en) 2009-06-04 2014-06-18 コアレイズ オーワイ Substrate processing method using laser
US8216867B2 (en) * 2009-06-10 2012-07-10 Cree, Inc. Front end scribing of light emitting diode (LED) wafers and resulting devices
TW201103681A (en) * 2009-06-12 2011-02-01 Applied Materials Inc Methods and systems for laser-scribed line alignment
CN102470549A (en) * 2009-07-03 2012-05-23 旭硝子株式会社 Cutting method and cutting device for brittle material substrate, and vehicle window glass obtained by the cutting method
JP5537081B2 (en) 2009-07-28 2014-07-02 浜松ホトニクス株式会社 Processing object cutting method
JP5476063B2 (en) * 2009-07-28 2014-04-23 浜松ホトニクス株式会社 Processing object cutting method
JP4915440B2 (en) * 2009-08-07 2012-04-11 株式会社デンソー Manufacturing method of semiconductor device
KR101770836B1 (en) * 2009-08-11 2017-08-23 하마마츠 포토닉스 가부시키가이샤 Laser machining device and laser machining method
JP5379604B2 (en) 2009-08-21 2013-12-25 浜松ホトニクス株式会社 Laser processing method and chip
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8943855B2 (en) 2009-08-28 2015-02-03 Corning Incorporated Methods for laser cutting articles from ion exchanged glass substrates
JP2011060848A (en) * 2009-09-07 2011-03-24 Nitto Denko Corp Thermosetting type die bond film, dicing-die bond film and semiconductor device
US20110058770A1 (en) * 2009-09-10 2011-03-10 E. I. Du Pont De Nemours And Company Sub-surface engraving of oled substrates for improved optical outcoupling
JP5446631B2 (en) * 2009-09-10 2014-03-19 アイシン精機株式会社 Laser processing method and laser processing apparatus
JP2011077429A (en) * 2009-10-01 2011-04-14 Disco Abrasive Syst Ltd Workpiece dividing method
KR101124509B1 (en) 2009-10-13 2012-03-16 주식회사 엘티에스 Laser processing apparatus
JP5620669B2 (en) * 2009-10-26 2014-11-05 東芝機械株式会社 Laser dicing method and laser dicing apparatus
JP5414467B2 (en) * 2009-11-09 2014-02-12 キヤノン株式会社 Laser processing method
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
CN102639280A (en) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 Laser processing and cutting system and method
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
US8759951B2 (en) 2009-12-11 2014-06-24 Sharp Kabushiki Kaisha Method for manufacturing semiconductor device, and semiconductor device
JP5056839B2 (en) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 Workpiece processing method and workpiece division method
JP5452247B2 (en) * 2010-01-21 2014-03-26 東芝機械株式会社 Laser dicing equipment
JP5479924B2 (en) * 2010-01-27 2014-04-23 浜松ホトニクス株式会社 Laser processing method
JP2011165766A (en) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd Method of processing optical device wafer
DE102010009015A1 (en) * 2010-02-24 2011-08-25 OSRAM Opto Semiconductors GmbH, 93055 Method for producing a plurality of optoelectronic semiconductor chips
JP2011201759A (en) * 2010-03-05 2011-10-13 Namiki Precision Jewel Co Ltd Single crystal substrate with multilayer film, production method for single crystal substrate with multilayer film, and device production method
CN102834216B (en) * 2010-03-16 2015-01-21 爱信精机株式会社 Pulse laser device, transparent member welding method, and transparent member welding device
US8519298B2 (en) * 2010-03-25 2013-08-27 Veeco Instruments, Inc. Split laser scribe
JP2011200926A (en) * 2010-03-26 2011-10-13 Mitsuboshi Diamond Industrial Co Ltd Laser beam machining method and brittle material substrate
KR101230616B1 (en) * 2010-03-26 2013-02-06 디앤에이 주식회사 Laser processing apparatus and laser processing method
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US20110240644A1 (en) * 2010-04-05 2011-10-06 Steven Donald Kimmell Thermoplastic containers with easy access defined by laser-induced rupturable areas
KR100984727B1 (en) * 2010-04-30 2010-10-01 유병소 Method and apparatus for processing workpiece
JP5670647B2 (en) 2010-05-14 2015-02-18 浜松ホトニクス株式会社 Processing object cutting method
US8950217B2 (en) 2010-05-14 2015-02-10 Hamamatsu Photonics K.K. Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass member
DE102010029791A1 (en) 2010-06-08 2011-12-08 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for laser material processing of a workpiece
KR101247571B1 (en) * 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for scribing brittle material substrate
US20120160818A1 (en) * 2010-06-14 2012-06-28 Mitsubishi Electric Corporation Laser machining apparatus and laser machining method
WO2011158672A1 (en) 2010-06-16 2011-12-22 昭和電工株式会社 Laser processing method
JP5981094B2 (en) * 2010-06-24 2016-08-31 東芝機械株式会社 Dicing method
JP5104912B2 (en) * 2010-06-28 2012-12-19 三星ダイヤモンド工業株式会社 Laser processing equipment
JP5104911B2 (en) * 2010-06-28 2012-12-19 三星ダイヤモンド工業株式会社 Workpiece processing method, workpiece dividing method, and laser processing apparatus
JP5104910B2 (en) * 2010-06-28 2012-12-19 三星ダイヤモンド工業株式会社 Workpiece processing method and workpiece division method
TWI446984B (en) * 2010-06-28 2014-08-01 Mitsuboshi Diamond Ind Co Ltd Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus
JP5391158B2 (en) * 2010-06-30 2014-01-15 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
RU2013102422A (en) 2010-07-12 2014-08-20 ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи METHOD OF PROCESSING MATERIALS USING FILAMENTATION
JP5597051B2 (en) * 2010-07-21 2014-10-01 浜松ホトニクス株式会社 Laser processing method
DE102010032029B4 (en) * 2010-07-21 2012-09-13 Jenoptik Automatisierungstechnik Gmbh Method for separating a round flat plate made of brittle material into several rectangular individual plates by means of laser
JP5104920B2 (en) * 2010-07-23 2012-12-19 三星ダイヤモンド工業株式会社 Laser processing apparatus, workpiece processing method, and workpiece dividing method
JP5104919B2 (en) * 2010-07-23 2012-12-19 三星ダイヤモンド工業株式会社 Laser processing apparatus, workpiece processing method, and workpiece dividing method
KR102035619B1 (en) 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 Laser processing method
JP5574866B2 (en) 2010-07-26 2014-08-20 浜松ホトニクス株式会社 Laser processing method
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
CN103026486B (en) 2010-07-26 2016-08-03 浜松光子学株式会社 Intermediate manufacturing method
WO2012014724A1 (en) * 2010-07-26 2012-02-02 浜松ホトニクス株式会社 Substrate processing method
JP5389265B2 (en) * 2010-07-26 2014-01-15 浜松ホトニクス株式会社 Substrate processing method
JP5476476B2 (en) 2010-07-26 2014-04-23 浜松ホトニクス株式会社 Laser processing method
JP5693074B2 (en) 2010-07-26 2015-04-01 浜松ホトニクス株式会社 Laser processing method
JP5702556B2 (en) 2010-07-26 2015-04-15 浜松ホトニクス株式会社 Laser processing method
JP5653110B2 (en) 2010-07-26 2015-01-14 浜松ホトニクス株式会社 Chip manufacturing method
WO2012014720A1 (en) 2010-07-26 2012-02-02 浜松ホトニクス株式会社 Laser processing method
CN103025477B (en) 2010-07-26 2015-05-06 浜松光子学株式会社 Method for manufacturing semiconductor device
KR101146642B1 (en) 2010-08-04 2012-05-16 (주)큐엠씨 Apparatus for Breaking Processed Object Using Curved Surface Close-adhesion
KR101217698B1 (en) * 2010-08-16 2013-01-02 주식회사 이오테크닉스 Laser processing method and laser processing apparatus using sequential multi-focusing
KR101211104B1 (en) * 2010-08-18 2012-12-18 유병소 Laser processing method and laser processing device
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
CN101976796B (en) * 2010-09-06 2011-11-16 中国科学院上海光学精密机械研究所 Method for inhibiting amplified spontaneous radiation of large-size sheet laser neodymium glass
GB201016046D0 (en) * 2010-09-24 2010-11-10 Renishaw Plc A method of forming an optical device
US8722516B2 (en) 2010-09-28 2014-05-13 Hamamatsu Photonics K.K. Laser processing method and method for manufacturing light-emitting device
JP2012079936A (en) 2010-10-01 2012-04-19 Nitto Denko Corp Dicing, die-bonding film and method for manufacturing semiconductor device
JP4911239B2 (en) * 2010-10-15 2012-04-04 セイコーエプソン株式会社 Multilayer structure substrate, droplet discharge head substrate, and method for manufacturing multilayer structure
JP5240272B2 (en) * 2010-10-15 2013-07-17 三星ダイヤモンド工業株式会社 Laser processing apparatus, workpiece processing method, and workpiece dividing method
JP2012089709A (en) * 2010-10-20 2012-05-10 Disco Abrasive Syst Ltd Method for dividing workpiece
US8399808B2 (en) * 2010-10-22 2013-03-19 Ultratech, Inc. Systems and methods for forming a time-averaged line image
CN102456625A (en) * 2010-10-26 2012-05-16 苏州天弘激光股份有限公司 Laser cutting manufacturing method of special-shaped wafer
US8703517B2 (en) 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
JP4976576B2 (en) * 2010-11-01 2012-07-18 住友電気工業株式会社 Cutting tool, manufacturing method thereof and manufacturing apparatus
JP2012096274A (en) * 2010-11-04 2012-05-24 Disco Corp Laser processing apparatus
EP2657958B1 (en) * 2010-11-10 2016-02-10 Toyota Jidosha Kabushiki Kaisha Method of manufacturing semiconductor device
WO2012063348A1 (en) * 2010-11-11 2012-05-18 パイオニア株式会社 Laser processing method and device
RU2459691C2 (en) * 2010-11-29 2012-08-27 Юрий Георгиевич Шретер Method of separating surface layer of semiconductor chip (versions)
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
JP5480169B2 (en) 2011-01-13 2014-04-23 浜松ホトニクス株式会社 Laser processing method
JP5548143B2 (en) * 2011-01-25 2014-07-16 三星ダイヤモンド工業株式会社 LED chip manufacturing method
TWI457191B (en) * 2011-02-04 2014-10-21 Mitsuboshi Diamond Ind Co Ltd Laser scribing method and laser processing apparatus
JP5906198B2 (en) * 2011-02-08 2016-04-20 株式会社フジクラ Manufacturing method of substrate having micropores, and substrate
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
US8735772B2 (en) 2011-02-20 2014-05-27 Electro Scientific Industries, Inc. Method and apparatus for improved laser scribing of opto-electric devices
JP5860217B2 (en) * 2011-03-04 2016-02-16 株式会社ディスコ Laser processing equipment
JP5860219B2 (en) * 2011-03-10 2016-02-16 株式会社ディスコ Laser processing equipment
JP5860221B2 (en) * 2011-03-17 2016-02-16 株式会社ディスコ Laser processing method for nonlinear crystal substrate
US8538576B2 (en) * 2011-04-05 2013-09-17 Asm Technology Singapore Pte. Ltd. Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece
JP5589942B2 (en) 2011-04-15 2014-09-17 豊田合成株式会社 Manufacturing method of semiconductor light emitting chip
CN102765876A (en) * 2011-05-05 2012-11-07 上海镭立激光科技有限公司 Glass cutting method by laser self-focusing and wire feeding
JP2012238746A (en) * 2011-05-12 2012-12-06 Disco Abrasive Syst Ltd Division method of optical device wafer
JP5912287B2 (en) * 2011-05-19 2016-04-27 株式会社ディスコ Laser processing method and laser processing apparatus
US9034458B2 (en) 2011-05-27 2015-05-19 Corning Incorporated Edge-protected product and finishing method
JP5840875B2 (en) * 2011-06-21 2016-01-06 株式会社ディスコ Processing method of optical device wafer
US9095414B2 (en) 2011-06-24 2015-08-04 The Regents Of The University Of California Nonlinear optical photodynamic therapy (NLO-PDT) of the cornea
RU2469433C1 (en) * 2011-07-13 2012-12-10 Юрий Георгиевич Шретер Method for laser separation of epitaxial film or layer of epitaxial film from growth substrate of epitaxial semiconductor structure (versions)
JP5140198B1 (en) 2011-07-27 2013-02-06 東芝機械株式会社 Laser dicing method
JP2013046924A (en) 2011-07-27 2013-03-07 Toshiba Mach Co Ltd Laser dicing method
JP2013027887A (en) 2011-07-27 2013-02-07 Toshiba Mach Co Ltd Laser dicing method
JP2013055160A (en) * 2011-09-01 2013-03-21 Canon Inc Light transmissive member, optical device, and manufacturing method of them
JP5939752B2 (en) * 2011-09-01 2016-06-22 株式会社ディスコ Wafer dividing method
JP2013063454A (en) * 2011-09-16 2013-04-11 Hamamatsu Photonics Kk Laser machining method and laser machining device
JP5894754B2 (en) * 2011-09-16 2016-03-30 浜松ホトニクス株式会社 Laser processing method
US10239160B2 (en) * 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
JP5923765B2 (en) * 2011-10-07 2016-05-25 株式会社ブイ・テクノロジー Laser processing equipment for glass substrates
WO2013051245A1 (en) * 2011-10-07 2013-04-11 Canon Kabushiki Kaisha Method and apparatus for laser-beam processing and method for manufacturing ink jet head
US20130095581A1 (en) * 2011-10-18 2013-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Thick window layer led manufacture
WO2013065450A1 (en) * 2011-11-04 2013-05-10 株式会社フジクラ Method of manufacturing substrate provided with micropores
WO2013067647A1 (en) * 2011-11-10 2013-05-16 Colibri Technologies Inc. Internal optical elements produced by irradiation-induced refractive index changes
US8697463B2 (en) * 2012-01-26 2014-04-15 Epistar Corporation Manufacturing method of a light-emitting device
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
KR20140129055A (en) * 2012-02-28 2014-11-06 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Method and apparatus for separation of strengthened glass and articles produced thereby
WO2013130549A1 (en) 2012-02-28 2013-09-06 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
KR20140131520A (en) 2012-02-29 2014-11-13 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Methods and apparatus for machining strengthened glass and articles produced thereby
JP6011002B2 (en) * 2012-04-23 2016-10-19 セイコーエプソン株式会社 Manufacturing method of liquid ejecting head and manufacturing method of liquid ejecting apparatus
JP5982172B2 (en) * 2012-05-15 2016-08-31 株式会社ディスコ Wafer laser processing method
JP6009225B2 (en) * 2012-05-29 2016-10-19 浜松ホトニクス株式会社 Cutting method of tempered glass sheet
KR20130134703A (en) * 2012-05-31 2013-12-10 참엔지니어링(주) Laser processing system and method
US9938180B2 (en) * 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP5360267B2 (en) * 2012-06-15 2013-12-04 三星ダイヤモンド工業株式会社 Workpiece processing method and workpiece division method
JP5646549B2 (en) * 2012-06-15 2014-12-24 三星ダイヤモンド工業株式会社 Laser processing equipment
JP5646550B2 (en) * 2012-06-15 2014-12-24 三星ダイヤモンド工業株式会社 Workpiece processing method, workpiece dividing method, and laser processing apparatus
JP5360266B2 (en) * 2012-06-15 2013-12-04 三星ダイヤモンド工業株式会社 Laser processing apparatus, workpiece processing method, and workpiece dividing method
US20130344684A1 (en) * 2012-06-20 2013-12-26 Stuart Bowden Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material
CN102749746B (en) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 Liquid crystal substrate cutting device and liquid crystal substrate cutting method
JP5918044B2 (en) * 2012-06-25 2016-05-18 株式会社ディスコ Processing method and processing apparatus
JP2014011358A (en) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd Laser dicing method
JP5421475B2 (en) 2012-07-04 2014-02-19 誠 雫石 Imaging device, semiconductor integrated circuit, and imaging apparatus
US8709916B2 (en) * 2012-07-05 2014-04-29 Asm Technology Singapore Pte Ltd Laser processing method and apparatus
TW201417928A (en) * 2012-07-30 2014-05-16 Raydiance Inc Cutting of brittle materials with tailored edge shape and roughness
WO2014022681A1 (en) 2012-08-01 2014-02-06 Gentex Corporation Assembly with laser induced channel edge and method thereof
KR101358672B1 (en) * 2012-08-13 2014-02-11 한국과학기술원 Transparent material cutting method using ultrafast pulse laser and dicing apparatus for thereof
JP6068882B2 (en) * 2012-09-05 2017-01-25 株式会社ディスコ Laser processing equipment
JP2014053510A (en) * 2012-09-07 2014-03-20 Toshiba Corp End face processing method and end face processing device
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6013858B2 (en) * 2012-10-01 2016-10-25 株式会社ディスコ Wafer processing method
JP6003496B2 (en) * 2012-10-02 2016-10-05 三星ダイヤモンド工業株式会社 Patterned substrate processing method
JP6124547B2 (en) * 2012-10-16 2017-05-10 株式会社ディスコ Processing method
JP6127526B2 (en) * 2012-10-29 2017-05-17 三星ダイヤモンド工業株式会社 Laser processing apparatus and processing condition setting method for patterned substrate
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
TWI598174B (en) * 2013-01-25 2017-09-11 鴻海精密工業股份有限公司 Sapphire dicing device
JP6208430B2 (en) * 2013-01-25 2017-10-04 株式会社ディスコ Laser processing method
WO2014121261A1 (en) * 2013-02-04 2014-08-07 Newport Corporation Method and apparatus for laser cutting transparent and semitransparent substrates
CN104968621A (en) * 2013-02-04 2015-10-07 旭硝子株式会社 Cutting method of glass substrate, glass substrate, near infrared cut filter glass, manufacturing method of glass substrate
JP6062287B2 (en) * 2013-03-01 2017-01-18 株式会社ディスコ Wafer processing method
JP6113529B2 (en) 2013-03-05 2017-04-12 株式会社ディスコ Wafer processing method
US9878399B2 (en) * 2013-03-15 2018-01-30 Jian Liu Method and apparatus for welding dissimilar material with a high energy high power ultrafast laser
EP2781296B1 (en) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
JP6189066B2 (en) * 2013-03-27 2017-08-30 株式会社ディスコ Wafer processing method
KR101857336B1 (en) 2013-04-04 2018-05-11 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 Method and device for separating a substrate
JP6054234B2 (en) * 2013-04-22 2016-12-27 株式会社ディスコ Wafer processing method
DE102013207480A1 (en) 2013-04-24 2014-10-30 Smartrac Technology Gmbh Method of separating a wafer into chips
JP6062315B2 (en) * 2013-04-24 2017-01-18 株式会社ディスコ Wafer processing method
KR102065370B1 (en) * 2013-05-03 2020-02-12 삼성디스플레이 주식회사 Method of peeling substrate and substrate peeling device
FR3006068B1 (en) * 2013-05-24 2015-04-24 Saint Gobain PROCESS FOR OBTAINING A SUBSTRATE
JP6101569B2 (en) * 2013-05-31 2017-03-22 株式会社ディスコ Laser processing equipment
KR101996244B1 (en) 2013-06-27 2019-07-05 삼성전자 주식회사 Method for fabricating semiconductor device
DE102013212577A1 (en) * 2013-06-28 2014-12-31 Trumpf Laser- Und Systemtechnik Gmbh Method for cutting off a workpiece by means of a pulsed laser beam
EP3024616B1 (en) * 2013-07-23 2019-04-10 3D-Micromac AG Method and device for separating a flat workpiece into multiple parts
CN103466930A (en) * 2013-07-25 2013-12-25 武汉帝尔激光科技有限公司 Cutting system and cutting method for glass panel
JP6121281B2 (en) * 2013-08-06 2017-04-26 株式会社ディスコ Wafer processing method
JP6406263B2 (en) 2013-09-25 2018-10-17 Agc株式会社 Optical glass
DE102013016693A1 (en) * 2013-10-08 2015-04-09 Siltectra Gmbh Production method for solid state elements by means of laser treatment and temperature-induced stresses
DE102014013107A1 (en) 2013-10-08 2015-04-09 Siltectra Gmbh Novel wafer manufacturing process
JP6246561B2 (en) * 2013-11-01 2017-12-13 株式会社ディスコ Laser processing method and laser processing apparatus
CN103739192B (en) * 2013-11-14 2016-02-17 上海和辉光电有限公司 Cutting unit and cutting method
JP6032182B2 (en) * 2013-11-18 2016-11-24 トヨタ自動車株式会社 Laser processing method and laser processing apparatus
DE102013223637B4 (en) * 2013-11-20 2018-02-01 Trumpf Laser- Und Systemtechnik Gmbh A method of treating a laser transparent substrate for subsequently separating the substrate
JP5607847B1 (en) 2013-11-29 2014-10-15 古河電気工業株式会社 Adhesive tape for semiconductor processing
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
ITAN20130232A1 (en) * 2013-12-05 2015-06-06 Munoz David Callejo METHOD TO OBTAIN A PLURALITY OF LAMINS FROM A MATERIAL LINE WITH A MONOCHRISTALLINE STRUCTURE
JP6223801B2 (en) * 2013-12-05 2017-11-01 株式会社ディスコ Optical device wafer processing method
JP6223804B2 (en) * 2013-12-09 2017-11-01 株式会社ディスコ Wafer processing equipment
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10471546B1 (en) * 2013-12-20 2019-11-12 Gentex Corporation Distribution of damage volumes in laser-induced channels
US10189117B2 (en) 2013-12-31 2019-01-29 The United States Of America, As Represented By The Secretary Of The Navy Adhesion improvement via material nanostructuring or texturizing
US10106880B2 (en) 2013-12-31 2018-10-23 The United States Of America, As Represented By The Secretary Of The Navy Modifying the surface chemistry of a material
US10388098B2 (en) 2014-02-07 2019-08-20 Korea Institute Of Machinery & Materials Apparatus and method of processing anti-counterfeiting pattern, and apparatus and method of detecting anti-counterfeiting pattern
SG11201607716PA (en) 2014-03-24 2016-11-29 Lintec Corp Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
US9719776B2 (en) 2014-04-01 2017-08-01 TeraDiode, Inc. Feature and depth measurement using multiple beam sources and interferometry
WO2015150552A1 (en) * 2014-04-04 2015-10-08 Rolex Sa Method for producing a timepiece component provided with an insert made of a composite material, and associated timepiece component and timepiece
KR101718677B1 (en) * 2014-04-14 2017-03-21 미쓰비시덴키 가부시키가이샤 Control device and laser processing device
US9636783B2 (en) 2014-04-30 2017-05-02 International Business Machines Corporation Method and apparatus for laser dicing of wafers
US10369663B1 (en) * 2014-05-30 2019-08-06 Gentex Corporation Laser process with controlled polarization
JP6301203B2 (en) * 2014-06-02 2018-03-28 株式会社ディスコ Chip manufacturing method
US9165832B1 (en) 2014-06-30 2015-10-20 Applied Materials, Inc. Method of die singulation using laser ablation and induction of internal defects with a laser
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP2965853B2 (en) 2014-07-09 2020-03-25 High Q Laser GmbH Processing of material using elongated laser beams
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
LT3169477T (en) 2014-07-14 2020-05-25 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
DE102014213775B4 (en) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Method and device for laser-based processing of flat, crystalline substrates, in particular of semiconductor substrates
US9859162B2 (en) 2014-09-11 2018-01-02 Alta Devices, Inc. Perforation of films for separation
CN104367481A (en) * 2014-09-21 2015-02-25 四川制药制剂有限公司 Processing technology for cefcapene pivoxil hydrochloride
JP6347714B2 (en) * 2014-10-02 2018-06-27 株式会社ディスコ Wafer processing method
JP6360411B2 (en) * 2014-10-09 2018-07-18 株式会社ディスコ Wafer processing method
LT3206829T (en) * 2014-10-13 2019-03-12 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures
KR102512044B1 (en) 2014-10-31 2023-03-20 코닝 인코포레이티드 Laser welded glass packages and methods of making
US10017411B2 (en) 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10083843B2 (en) 2014-12-17 2018-09-25 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times
CN104625433A (en) * 2014-12-31 2015-05-20 武汉华工激光工程有限责任公司 Method for cutting LED lamp filament transparent material support
KR20170105562A (en) 2015-01-12 2017-09-19 코닝 인코포레이티드 Laser cutting of thermally tempered substrates using multiple photon absorption methods
CN104630899B (en) * 2015-01-17 2017-09-22 王宏兴 The separation method of diamond layer
US20170362697A1 (en) * 2015-01-28 2017-12-21 Siltectra Gmbh Transparent and highly stable screen protector
JP6395632B2 (en) 2015-02-09 2018-09-26 株式会社ディスコ Wafer generation method
JP6395633B2 (en) 2015-02-09 2018-09-26 株式会社ディスコ Wafer generation method
GB201502149D0 (en) * 2015-02-09 2015-03-25 Spi Lasers Uk Ltd Apparatus and method for laser welding
JP6495056B2 (en) * 2015-03-06 2019-04-03 株式会社ディスコ Single crystal substrate processing method
JP2016171214A (en) 2015-03-12 2016-09-23 株式会社ディスコ Processing method of single crystal substrate
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
JP6429715B2 (en) * 2015-04-06 2018-11-28 株式会社ディスコ Wafer generation method
JP6494382B2 (en) 2015-04-06 2019-04-03 株式会社ディスコ Wafer generation method
JP6425606B2 (en) 2015-04-06 2018-11-21 株式会社ディスコ Wafer production method
DE102015004603A1 (en) 2015-04-09 2016-10-13 Siltectra Gmbh Combined wafer fabrication process with laser treatment and temperature-induced stresses
JP6456766B2 (en) * 2015-05-08 2019-01-23 株式会社ディスコ Wafer processing method
CN104827191A (en) * 2015-05-12 2015-08-12 大族激光科技产业集团股份有限公司 Laser cutting method for sapphire
CN106197262B (en) * 2015-05-29 2019-02-05 宝山钢铁股份有限公司 A kind of rectangular piece position and angle measurement method
JP6472333B2 (en) * 2015-06-02 2019-02-20 株式会社ディスコ Wafer generation method
JP6478821B2 (en) * 2015-06-05 2019-03-06 株式会社ディスコ Wafer generation method
CN105098098B (en) * 2015-06-11 2017-06-09 京东方科技集团股份有限公司 A kind of sealed in unit and its application method
WO2016208522A1 (en) 2015-06-23 2016-12-29 三菱電機株式会社 Method and device for manufacturing semiconductor element
JP6700581B2 (en) * 2015-06-25 2020-05-27 日本電気硝子株式会社 Method and apparatus for cutting tube glass, and method for manufacturing tube glass product
TWI533024B (en) 2015-06-26 2016-05-11 閤康生物科技股份有限公司 Sample collection device and sample collection device array
DE102015110422A1 (en) 2015-06-29 2016-12-29 Schott Ag Laser processing of a multiphase transparent material, as well as multiphase composite material
KR102499697B1 (en) 2015-07-10 2023-02-14 코닝 인코포레이티드 Method for continuously manufacturing holes in a flexible substrate sheet and articles related thereto
JP6482423B2 (en) 2015-07-16 2019-03-13 株式会社ディスコ Wafer generation method
JP6482425B2 (en) 2015-07-21 2019-03-13 株式会社ディスコ Thinning method of wafer
JP6472347B2 (en) 2015-07-21 2019-02-20 株式会社ディスコ Thinning method of wafer
JP6260601B2 (en) 2015-10-02 2018-01-17 日亜化学工業株式会社 Manufacturing method of semiconductor device
DE102015116848A1 (en) 2015-10-05 2017-04-06 Schott Ag Dielectric workpiece with a zone of defined strength and method for its production and its use
DE102015116846A1 (en) * 2015-10-05 2017-04-06 Schott Ag Process for filamentizing a workpiece with a shape deviating from the nominal contour and workpiece produced by filamentation
JP6625854B2 (en) * 2015-10-06 2019-12-25 株式会社ディスコ Optical device wafer processing method
KR101716369B1 (en) * 2015-10-19 2017-03-27 주식회사 이오테크닉스 Auto inspection apparatus and method of laser processing apparatus
JP6757491B2 (en) * 2015-10-20 2020-09-23 日本電気硝子株式会社 Tube glass cutting method and cutting device, and tube glass product manufacturing method
JP6576211B2 (en) * 2015-11-05 2019-09-18 株式会社ディスコ Wafer processing method
JP6521837B2 (en) * 2015-11-05 2019-05-29 株式会社ディスコ Wafer processing method
JP6562819B2 (en) * 2015-11-12 2019-08-21 株式会社ディスコ Method for separating SiC substrate
CN105365061A (en) * 2015-11-18 2016-03-02 无锡科诺达电子有限公司 Precise cutting instrument for sapphires
JP2017107903A (en) * 2015-12-07 2017-06-15 株式会社ディスコ Wafer processing method
CN106881531A (en) * 2015-12-10 2017-06-23 彭翔 Method and system for cutting crisp and hard material
CN105397236A (en) * 2015-12-26 2016-03-16 浙江一比邻焊割机械股份有限公司 Efficient and energy-saving welding torch
CN105436710B (en) * 2015-12-30 2019-03-05 大族激光科技产业集团股份有限公司 A kind of laser lift-off method of silicon wafer
DE102016000051A1 (en) * 2016-01-05 2017-07-06 Siltectra Gmbh Method and apparatus for planar generation of modifications in solids
JP6608713B2 (en) * 2016-01-19 2019-11-20 株式会社ディスコ Wafer processing method
US10518358B1 (en) 2016-01-28 2019-12-31 AdlOptica Optical Systems GmbH Multi-focus optics
US10466288B2 (en) * 2016-02-10 2019-11-05 Roger Smith Fiber optic pulsed polarimetry
US10283501B2 (en) 2016-03-03 2019-05-07 Gan Systems Inc. GaN-on-Si semiconductor device structures for high current/ high voltage lateral GaN transistors and methods of fabrication thereof
US10249506B2 (en) 2016-03-03 2019-04-02 Gan Systems Inc. GaN-on-si semiconductor device structures for high current/ high voltage lateral GaN transistors and methods of fabrication thereof
JP6666173B2 (en) * 2016-03-09 2020-03-13 株式会社ディスコ Laser processing equipment
JP6690983B2 (en) 2016-04-11 2020-04-28 株式会社ディスコ Wafer generation method and actual second orientation flat detection method
JP6633447B2 (en) * 2016-04-27 2020-01-22 株式会社ディスコ Wafer processing method
EP3957611A1 (en) 2016-05-06 2022-02-23 Corning Incorporated Transparent substrates with improved edge surfaces
JP6755705B2 (en) * 2016-05-09 2020-09-16 株式会社ディスコ Laser processing equipment
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
CN105945422B (en) * 2016-06-12 2018-01-05 西安中科微精光子制造科技有限公司 A kind of ultrafast laser microfabrication system
WO2017216603A1 (en) 2016-06-14 2017-12-21 Evana Technologies, Uab Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018011618A1 (en) 2016-07-13 2018-01-18 Evana Technologies, Uab Method and system for cleaving a substrate with a focused converging ring-shaped laser beam
JP7090594B2 (en) 2016-07-29 2022-06-24 コーニング インコーポレイテッド Equipment and methods for laser machining
JP6698468B2 (en) * 2016-08-10 2020-05-27 株式会社ディスコ Wafer generation method
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN113399816B (en) 2016-09-30 2023-05-16 康宁股份有限公司 Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots
JP6821245B2 (en) * 2016-10-11 2021-01-27 株式会社ディスコ Wafer processing method
EP3525978A1 (en) * 2016-10-13 2019-08-21 Corning Incorporated Creation of holes and slots in glass substrates
WO2018072659A1 (en) * 2016-10-20 2018-04-26 胡绍勤 Method for manufacturing speed regulation groove part
JP7066701B2 (en) 2016-10-24 2022-05-13 コーニング インコーポレイテッド Substrate processing station for laser-based processing of sheet glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
TW201831414A (en) * 2016-12-13 2018-09-01 美商康寧公司 Methods for laser processing transparent workpieces by forming score lines
US10505072B2 (en) 2016-12-16 2019-12-10 Nichia Corporation Method for manufacturing light emitting element
JP6669144B2 (en) 2016-12-16 2020-03-18 日亜化学工業株式会社 Light emitting device manufacturing method
US10502550B2 (en) * 2016-12-21 2019-12-10 Kennametal Inc. Method of non-destructive testing a cutting insert to determine coating thickness
CN110023027B (en) * 2017-01-17 2021-05-11 极光先进雷射株式会社 Laser processing system and laser processing method
TWI612621B (en) * 2017-01-25 2018-01-21 Siliconware Precision Industries Co., Ltd. Electronic components and their methods
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
CN106981457A (en) * 2017-02-13 2017-07-25 武汉澳谱激光科技有限公司 For shielding integrated circuit high-density packages electromagnetic interference method and laser process equipment
JP6858587B2 (en) 2017-02-16 2021-04-14 株式会社ディスコ Wafer generation method
JP6620825B2 (en) 2017-02-27 2019-12-18 日亜化学工業株式会社 Manufacturing method of semiconductor device
US11512016B2 (en) 2017-03-22 2022-11-29 Corning Incorporated Methods of separating a glass web
TWI722172B (en) * 2017-04-20 2021-03-21 矽品精密工業股份有限公司 Cutting method
US10710200B2 (en) * 2017-05-23 2020-07-14 Sakai Display Products Corporation Method for producing device support base and laser cleaning apparatus
JP6991475B2 (en) * 2017-05-24 2022-01-12 協立化学産業株式会社 How to cut the object to be processed
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP2019024038A (en) * 2017-07-24 2019-02-14 株式会社ディスコ Wafer processing method
JP2019029560A (en) * 2017-08-01 2019-02-21 株式会社ディスコ Laser processing device
WO2019040854A1 (en) * 2017-08-25 2019-02-28 Corning Incorporated Apparatus and method for laser processing transparent workpieces using an afocal beam adjustment assembly
DE102017121140A1 (en) * 2017-09-01 2019-03-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laser processing of a transparent workpiece
US10347534B2 (en) * 2017-09-12 2019-07-09 Nxp B.V. Variable stealth laser dicing process
JP6903532B2 (en) * 2017-09-20 2021-07-14 キオクシア株式会社 Semiconductor devices and their manufacturing methods
JP6896344B2 (en) * 2017-09-22 2021-06-30 株式会社ディスコ Chip manufacturing method
CN107745188A (en) * 2017-09-30 2018-03-02 深圳信息职业技术学院 A kind of picosecond laser process equipment
JP6943388B2 (en) * 2017-10-06 2021-09-29 国立大学法人埼玉大学 Substrate manufacturing method
CA3086755A1 (en) * 2017-10-25 2019-05-02 Nikon Corporation Processing apparatus, and manufacturing method of movable body
US20200353563A1 (en) * 2017-11-27 2020-11-12 Nitto Denko Corporation Laser processing method for plastic film, and plastic film
CN109904296A (en) * 2017-12-08 2019-06-18 昱鑫制造股份有限公司 The cutting method and semiconductor packages unit that die-filling group of semiconductor package
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP6677706B2 (en) * 2017-12-27 2020-04-08 ファナック株式会社 Link information generation device, link information generation method, and link information generation program
JP2019125688A (en) * 2018-01-16 2019-07-25 株式会社ディスコ Laser processing method of workpiece
JP7188886B2 (en) * 2018-01-29 2022-12-13 浜松ホトニクス株式会社 processing equipment
WO2019151185A1 (en) * 2018-01-31 2019-08-08 Hoya株式会社 Method for producing glass substrate for magnetic disk
CN110102882A (en) * 2018-02-01 2019-08-09 松下电器产业株式会社 Slicing method and slicing device
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108526711B (en) * 2018-03-29 2020-01-10 歌尔股份有限公司 Method for improving nanosecond pulse width ultraviolet laser cutting
CN110418513B (en) * 2018-04-28 2020-12-04 深圳市大族数控科技有限公司 Laser cap opening method, device, storage medium and laser cap opening device
EP3569388B1 (en) 2018-05-15 2023-05-03 Howmedica Osteonics Corp. Fabrication of components using shaped energy beam profiles
WO2019226530A1 (en) * 2018-05-22 2019-11-28 Corning Incorporated Methods and apparatus for forming and polishing glass, glass-ceramic and ceramic preforms to form shaped plates for liquid lenses
CN108789886B (en) * 2018-05-31 2019-11-15 中国科学院西安光学精密机械研究所 A kind of cutting and splitting method of transparent hard and brittle material
CN108581189B (en) * 2018-06-01 2020-04-17 业成科技(成都)有限公司 Laser cutting method
US11059131B2 (en) 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
KR102617346B1 (en) * 2018-06-28 2023-12-26 삼성전자주식회사 Laser dicing device for suppressing scattering
US11075496B2 (en) 2018-06-28 2021-07-27 Samsung Electronics Co., Ltd. Laser dicing device, method of laser beam modulation, and method of dicing a substrate
JP7140576B2 (en) 2018-07-12 2022-09-21 株式会社ディスコ Wafer division method
US10940611B2 (en) * 2018-07-26 2021-03-09 Halo Industries, Inc. Incident radiation induced subsurface damage for controlled crack propagation in material cleavage
JP6904927B2 (en) * 2018-07-30 2021-07-21 ファナック株式会社 Robot system and calibration method
JP7118804B2 (en) * 2018-08-17 2022-08-16 キオクシア株式会社 Semiconductor device manufacturing method
CN109014677A (en) * 2018-08-23 2018-12-18 苏州新代数控设备有限公司 Welding robot bond pad locations teaching method based on laser ranging
US10589445B1 (en) * 2018-10-29 2020-03-17 Semivation, LLC Method of cleaving a single crystal substrate parallel to its active planar surface and method of using the cleaved daughter substrate
TWI825208B (en) * 2018-10-30 2023-12-11 日商濱松赫德尼古斯股份有限公司 Laser processing method
KR102697974B1 (en) * 2018-11-21 2024-08-22 서울바이오시스 주식회사 Light emitting device and light emitting module including the same
GB201819193D0 (en) * 2018-11-26 2019-01-09 Univ Southampton Method for fabricating nanostructured optical elements using polarised light
US11664276B2 (en) * 2018-11-30 2023-05-30 Texas Instruments Incorporated Front side laser-based wafer dicing
KR102806085B1 (en) * 2018-12-03 2025-05-12 삼성전자주식회사 LiDAR device and method of driving the same
CN113260492B (en) 2018-12-21 2024-02-20 国立大学法人东海国立大学机构 Laser processing method, semiconductor component manufacturing method, and laser processing device
JP7200670B2 (en) 2018-12-27 2023-01-10 富士通オプティカルコンポーネンツ株式会社 Optical module and its manufacturing method
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
DE102019201438B4 (en) 2019-02-05 2024-05-02 Disco Corporation Method for producing a substrate and system for producing a substrate
JP7286238B2 (en) 2019-02-20 2023-06-05 株式会社ディスコ How to make multiple chips
DE102019205847B4 (en) * 2019-04-24 2025-06-18 Infineon Technologies Ag Method and device for producing at least one modification in a solid
US11054574B2 (en) 2019-05-16 2021-07-06 Corning Research & Development Corporation Methods of singulating optical waveguide sheets to form optical waveguide substrates
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JP2020194918A (en) * 2019-05-29 2020-12-03 パナソニックIpマネジメント株式会社 Method for manufacturing element chip
DE102019207990B4 (en) * 2019-05-31 2024-03-21 Disco Corporation Method for machining a workpiece and system for machining a workpiece
TWI857095B (en) * 2019-07-18 2024-10-01 日商東京威力科創股份有限公司 Processing device and processing method
TWI857094B (en) * 2019-07-18 2024-10-01 日商東京威力科創股份有限公司 Processing device and processing method
KR102772310B1 (en) * 2019-09-09 2025-02-26 삼성디스플레이 주식회사 Laser annealing device and system for monitorting laser beam
JP7303080B2 (en) * 2019-09-11 2023-07-04 浜松ホトニクス株式会社 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
CN110653488A (en) * 2019-10-16 2020-01-07 东南大学 A cross-scale high-resolution three-dimensional laser direct writing processing method
CN110732790A (en) * 2019-10-28 2020-01-31 东莞记忆存储科技有限公司 processing method for cutting package substrate
WO2021100201A1 (en) * 2019-11-22 2021-05-27 三菱重工業株式会社 Laser processing method, and laser processing device
US11081393B2 (en) 2019-12-09 2021-08-03 Infineon Technologies Ag Method for splitting semiconductor wafers
EP3839676A1 (en) * 2019-12-16 2021-06-23 Bystronic Laser AG Thickness compensation in a cutting and bending process
JP7493967B2 (en) * 2020-03-06 2024-06-03 浜松ホトニクス株式会社 Inspection device and inspection method
JP7385504B2 (en) * 2020-03-06 2023-11-22 浜松ホトニクス株式会社 Inspection equipment and processing system
JP7512053B2 (en) * 2020-03-10 2024-07-08 浜松ホトニクス株式会社 Laser processing device and laser processing method
JP7467208B2 (en) * 2020-04-06 2024-04-15 浜松ホトニクス株式会社 Laser processing device and laser processing method
JP7598200B2 (en) * 2020-04-06 2024-12-11 浜松ホトニクス株式会社 Inspection device and inspection method
TWI733604B (en) * 2020-06-10 2021-07-11 財團法人工業技術研究院 Laser processing system and method for glass workpiece
CN111785814B (en) * 2020-07-13 2021-10-26 福建晶安光电有限公司 Substrate and processing method thereof, light-emitting diode and manufacturing method thereof
JP7519846B2 (en) * 2020-08-31 2024-07-22 株式会社ディスコ Laser processing device and method for correcting focal point position
DE102020123790A1 (en) * 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Process for cutting a workpiece
WO2022066435A1 (en) 2020-09-28 2022-03-31 Corning Incorporated Methods for adjusting beam properties for laser processing coated substrates
DE102020213776A1 (en) 2020-11-03 2022-05-05 Q.ant GmbH Method of cleaving a crystal
CN112539698B (en) * 2020-11-09 2021-12-31 北京工业大学 Method for on-line tracking and real-time feedback of laser beam acting material interior
CN112536535A (en) * 2020-12-09 2021-03-23 苏州工业园区纳米产业技术研究院有限公司 Cutting method of silicon wafer of insulator and chip
JP7782953B2 (en) * 2021-01-29 2025-12-09 株式会社ディスコ Chip manufacturing method and tape application device
CN114502316B (en) * 2021-02-26 2022-12-27 国立大学法人名古屋工业大学 Laser processing device, thickness detection method and thickness detection device
DE102021110742B4 (en) 2021-04-27 2025-01-16 Infineon Technologies Ag METHOD FOR DIVIDING SEMICONDUCTOR WORKPIECES, SEMICONDUCTOR WORKPIECE AND DEVICE FOR DEFINING A SEPARATION AREA IN SEMICONDUCTOR WORKPIECES
EP4084054A1 (en) * 2021-04-27 2022-11-02 Infineon Technologies AG Methods of splitting a semiconductor work piece
GB2607713B (en) * 2021-05-26 2023-09-20 Thermo Fisher Scient Bremen Gmbh Systems and methods for imaging and ablating a sample
CN113371989A (en) * 2021-05-26 2021-09-10 苏州镭明激光科技有限公司 Splitting method and splitting device for semiconductor chip
JP7641519B2 (en) * 2021-05-31 2025-03-07 パナソニックIpマネジメント株式会社 Manufacturing method of element chip and substrate processing method
DE102021117530A1 (en) 2021-07-07 2023-01-12 Trumpf Laser- Und Systemtechnik Gmbh Process for joining at least two joining partners
IL311370A (en) * 2021-09-13 2024-05-01 Gemological Inst Of America Inc Gia Laser inscription for gems
JP2023047440A (en) * 2021-09-27 2023-04-06 株式会社ディスコ Plate-like material processing method
KR20230060340A (en) 2021-10-27 2023-05-04 삼성전자주식회사 Method of processing substrate
JP7474231B2 (en) * 2021-10-29 2024-04-24 日亜化学工業株式会社 Method for manufacturing light-emitting element
US20230381492A1 (en) * 2021-11-16 2023-11-30 Theodosios Alexander Collapsing mechanical circulatory support device for temporary use
US20230207390A1 (en) * 2021-12-23 2023-06-29 Texas Instruments Incorporated Method of controlled propagation of laser induced silicon cracks through a balanced compressive and retractive cyclical force for laser dicing
US11999013B2 (en) 2021-12-29 2024-06-04 PlasmaTex, LLC Pulsed laser processing of medical devices
US20230253251A1 (en) * 2022-02-10 2023-08-10 Texas Instruments Incorporated Singulating semiconductor wafers
KR102650505B1 (en) * 2022-04-11 2024-03-22 주식회사 시스템알앤디 Apparatus and method for picking ultra-thin glass products that preserve cutting edge strength
CN115598090B (en) * 2022-09-27 2025-09-19 深圳泰德激光技术股份有限公司 Laser spherical aberration observation method, device, equipment and storage medium
US20240120284A1 (en) * 2022-10-06 2024-04-11 Thinsic Inc Carbon Assisted Semiconductor Dicing And Method
CN119328910B (en) * 2023-08-14 2025-07-01 西湖仪器(杭州)技术有限公司 A method for producing a semiconductor wafer
KR102734681B1 (en) * 2024-05-17 2024-11-27 케이투레이저시스템(주) Laser scoring system based on light quantity feedback
CN119785947B (en) * 2025-03-11 2025-06-13 合肥沛顿存储科技有限公司 Wafer cutting parameter optimization method and system
CN119839426B (en) * 2025-03-17 2025-10-28 吉林大学 A device and method for continuously cutting light-transmitting hard and brittle material wafers with time-delayed synchronization
CN119910781B (en) * 2025-04-02 2025-07-29 浙江晶盛机电股份有限公司 Wafer cutting line tension adjusting method and slicing machine

Family Cites Families (493)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US411800A (en) * 1889-10-01 Watch-case spring
GB125120A (en) 1900-01-01
US2005A (en) * 1841-03-16 Improvement in the manner of constructing molds for casting butt-hinges
US2002A (en) * 1841-03-12 Tor and planter for plowing
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
JPS4624989Y1 (en) 1967-08-31 1971-08-28
US3629545A (en) * 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
GB1246481A (en) * 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3613974A (en) 1969-03-10 1971-10-19 Saint Gobain Apparatus for cutting glass
JPS4812599Y1 (en) 1969-03-24 1973-04-05
JPS4812599B1 (en) 1969-07-09 1973-04-21
US3610871A (en) * 1970-02-19 1971-10-05 Western Electric Co Initiation of a controlled fracture
US3626141A (en) * 1970-04-30 1971-12-07 Quantronix Corp Laser scribing apparatus
US3824678A (en) * 1970-08-31 1974-07-23 North American Rockwell Process for laser scribing beam lead semiconductor wafers
JPS5133952Y2 (en) 1971-06-22 1976-08-23
US3909582A (en) 1971-07-19 1975-09-30 American Can Co Method of forming a line of weakness in a multilayer laminate
US3790744A (en) * 1971-07-19 1974-02-05 American Can Co Method of forming a line of weakness in a multilayer laminate
US3790051A (en) 1971-09-07 1974-02-05 Radiant Energy Systems Semiconductor wafer fracturing technique employing a pressure controlled roller
US3800991A (en) 1972-04-10 1974-04-02 Ppg Industries Inc Method of and an apparatus for cutting glass
NO134614C (en) 1972-10-12 1976-11-17 Glaverbel
JPS5628630B2 (en) 1973-05-30 1981-07-03
JPS5628630Y2 (en) 1974-10-30 1981-07-07
JPS5157283A (en) 1974-11-15 1976-05-19 Nippon Electric Co Handotaikibanno bunkatsuhoho
US4046985A (en) 1974-11-25 1977-09-06 International Business Machines Corporation Semiconductor wafer alignment apparatus
US3970819A (en) * 1974-11-25 1976-07-20 International Business Machines Corporation Backside laser dicing system
JPS5333050Y2 (en) 1975-01-17 1978-08-15
US4190759A (en) 1975-08-27 1980-02-26 Hitachi, Ltd. Processing of photomask
US4027137A (en) 1975-09-17 1977-05-31 International Business Machines Corporation Laser drilling nozzle
JPS5836939Y2 (en) 1975-11-11 1983-08-19 トヨオキコウギヨウ カブシキガイシヤ Yuatsu Houkou Kirikaeben
NL7609815A (en) 1976-09-03 1978-03-07 Philips Nv PROCESS FOR MANUFACTURING A SEMI-CONDUCTOR DEVICE AND SEMI-CONDUCTOR DEVICE MANUFACTURED BY THE PROCESS.
JPS5333050A (en) 1976-09-08 1978-03-28 Hitachi Ltd Production of semiconductor element
US4092518A (en) * 1976-12-07 1978-05-30 Laser Technique S.A. Method of decorating a transparent plastics material article by means of a laser beam
JPS53141573U (en) 1977-04-15 1978-11-08
JPS53141573A (en) 1977-05-16 1978-12-09 Toshiba Corp Pellet dividing method of semiconductor wafer
JPS54161349A (en) 1978-06-10 1979-12-20 Nippon Telegr & Teleph Corp <Ntt> Three-dimensional cross type waveguide passage
JPS5857767B2 (en) 1979-03-08 1983-12-21 東京大学総長 Automatic pressure control device
US4242152A (en) * 1979-05-14 1980-12-30 National Semiconductor Corporation Method for adjusting the focus and power of a trimming laser
JPS5628630A (en) 1979-08-16 1981-03-20 Kawasaki Steel Corp Temperature controlling method of high temperature high pressure reacting cylinder
JPS6041478B2 (en) * 1979-09-10 1985-09-17 富士通株式会社 Manufacturing method of semiconductor laser device
JPS5676522U (en) 1979-11-17 1981-06-22
JPS5676522A (en) 1979-11-29 1981-06-24 Toshiba Corp Formation of semiconductor thin film
JPH0219839Y2 (en) 1980-02-29 1990-05-31
JPS6043236B2 (en) * 1980-03-12 1985-09-27 松下電器産業株式会社 Laser processing method
US4336439A (en) * 1980-10-02 1982-06-22 Coherent, Inc. Method and apparatus for laser scribing and cutting
US4392476A (en) * 1980-12-23 1983-07-12 Lazare Kaplan & Sons, Inc. Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds
JPS57106618A (en) * 1980-12-24 1982-07-02 Eisai Co Ltd Anticancer agent consisting of polyprenyl compound
JPS6055640B2 (en) 1980-12-29 1985-12-05 松下電工株式会社 Leakage slurry recovery device from paper making machine
DE3110235A1 (en) 1981-03-17 1982-10-21 Trumpf GmbH & Co, 7257 Ditzingen "METHOD AND DEVICE FOR FLAME-CUTTING BY MEANS OF A LASER BEAM"
JPS5836939A (en) 1981-08-26 1983-03-04 Toshiba Corp Cutting method for glass wafer
JPS5844784A (en) * 1981-09-11 1983-03-15 Nippon Sekigaisen Kogyo Kk Laser device
JPS5854648A (en) 1981-09-28 1983-03-31 Nippon Kogaku Kk <Nikon> Positioning device
JPS5857767A (en) 1981-10-01 1983-04-06 Matsushita Electric Ind Co Ltd Laser device
JPS5857767U (en) 1981-10-06 1983-04-19 三菱電機株式会社 Potentiometer disconnection detection device
US4475027A (en) * 1981-11-17 1984-10-02 Allied Corporation Optical beam homogenizer
JPS58171783A (en) 1982-04-02 1983-10-08 Hitachi Ltd magnetic bubble memory chip
JPS58181492A (en) * 1982-04-02 1983-10-24 グレタ−ク・アクチエンゲゼルシヤフト Method and device for focussing optical beam having coherence
JPS58171783U (en) 1982-05-14 1983-11-16 有限会社河島農具製作所 Crawler tensioning device
JPS58181492U (en) 1982-05-25 1983-12-03 新明和工業株式会社 Warning device for industrial robots
JPS5916344A (en) 1982-07-19 1984-01-27 Toshiba Corp Device of wafer scribing with laser
JPS6054151B2 (en) * 1982-10-22 1985-11-28 株式会社東芝 Laser cutting method
JPS5976687U (en) 1982-11-17 1984-05-24 プレスコンクリ−ト工業株式会社 precast gutter
US4689467A (en) 1982-12-17 1987-08-25 Inoue-Japax Research Incorporated Laser machining apparatus
JPS59141233A (en) 1983-02-02 1984-08-13 Nec Corp Manufacture of semiconductor device
JPS59150691A (en) 1983-02-15 1984-08-28 Matsushita Electric Ind Co Ltd Laser working machine
DE8304141U1 (en) * 1983-02-15 1983-07-07 Rofin-Sinar Laser GmbH, 2000 Hamburg LASER DEVICE FOR MATERIAL MACHINING
JPS59130438U (en) 1983-02-22 1984-09-01 株式会社クボタ Structure of combine harvester with grain tank
JPS59141233U (en) 1983-03-11 1984-09-20 東京部品工業株式会社 Caliper in disc brake
JPS59150691U (en) 1983-03-29 1984-10-08 日立造船株式会社 Anti-freezing device for tanks on ships in ice seas
JPS5985627U (en) 1983-07-08 1984-06-09 相生精機株式会社 die lifter for press machine
JPH0611071B2 (en) 1983-09-07 1994-02-09 三洋電機株式会社 Method for dividing compound semiconductor substrate
JPS6055640U (en) 1983-09-26 1985-04-18 株式会社パイロット wall panels
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS59130438A (en) 1983-11-28 1984-07-27 Hitachi Ltd Method for separating plates
US4650619A (en) * 1983-12-29 1987-03-17 Toshiba Ceramics Co., Ltd. Method of machining a ceramic member
JPS60144985A (en) 1983-12-30 1985-07-31 Fujitsu Ltd Manufacture of semiconductor light-emitting element
JPS60167351A (en) * 1984-02-09 1985-08-30 Mitsubishi Electric Corp Manufacture of hybrid integrated circuit device
JPS60144985U (en) 1984-03-07 1985-09-26 十文字 邦治 Bathtub water surface floating object removal device
JPS60167351U (en) 1984-04-17 1985-11-06 ソニー株式会社 Display element holder
JPS6188878A (en) 1984-06-16 1986-05-07 Agency Of Ind Science & Technol Construction of expression plasmid pamc1 for expression of rat hepatic cytochrome p-450mc gene in yeast
US4562333A (en) * 1984-09-04 1985-12-31 General Electric Company Stress assisted cutting of high temperature embrittled materials
DE3575805D1 (en) * 1984-10-11 1990-03-08 Hitachi Ltd BRACKET FOR OPTICAL LENS.
JPS6196439A (en) 1984-10-17 1986-05-15 Toray Ind Inc Lens defect inspecting instrument
JPS61112345A (en) 1984-11-07 1986-05-30 Toshiba Corp Manufacture of semiconductor device
JPS61121453A (en) 1984-11-19 1986-06-09 Matsushita Electric Ind Co Ltd Braking and expanding process of fragile thin sheet
JPS6196439U (en) 1984-11-30 1986-06-20
JPS61112345U (en) 1984-12-25 1986-07-16
JPS61121453U (en) 1985-01-18 1986-07-31
JPS61220339A (en) 1985-03-26 1986-09-30 Nippon Telegr & Teleph Corp <Ntt> Control of characteristics of semiconductor material
JPS61229487A (en) * 1985-04-03 1986-10-13 Sasaki Glass Kk Method for cutting glass by laser beam
ZA862386B (en) 1985-04-16 1987-11-25 Colgate Palmolive Co Compositions to counter breath odor
US4689491A (en) * 1985-04-19 1987-08-25 Datasonics Corp. Semiconductor wafer scanning system
JPS624341A (en) 1985-06-29 1987-01-10 Toshiba Corp Manufacture of semiconductor device
JPS6240986A (en) 1985-08-20 1987-02-21 Fuji Electric Corp Res & Dev Ltd Laser processing method
JPH0732281B2 (en) 1985-10-25 1995-04-10 株式会社日立製作所 Cleaving device and cleaving method
JPS6298684U (en) 1985-12-11 1987-06-23
AU584563B2 (en) * 1986-01-31 1989-05-25 Ciba-Geigy Ag Laser marking of ceramic materials, glazes, glass ceramics and glasses
JPH0429352Y2 (en) 1986-02-17 1992-07-16
US4691093A (en) 1986-04-22 1987-09-01 United Technologies Corporation Twin spot laser welding
JPH0750811B2 (en) * 1986-06-17 1995-05-31 松下電器産業株式会社 Cleaving method of semiconductor laser
JPS6384789A (en) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd Light working method
FR2605310B1 (en) * 1986-10-16 1992-04-30 Comp Generale Electricite METHOD FOR REINFORCING CERAMIC WORKPIECES BY LASER TREATMENT
US4815854A (en) 1987-01-19 1989-03-28 Nec Corporation Method of alignment between mask and semiconductor wafer
JPH0639572Y2 (en) 1987-02-27 1994-10-19 株式会社クボタ Multi-membrane perforator for transplanter
JPH0688149B2 (en) 1987-03-04 1994-11-09 株式会社半導体エネルギ−研究所 Light processing method
JPS63278692A (en) 1987-05-07 1988-11-16 D S Sukiyanaa:Kk Automatic focusing mechanism in laser beam machine
JPS63293939A (en) 1987-05-27 1988-11-30 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JPS6438209A (en) 1987-08-04 1989-02-08 Nec Corp Preparation of semiconductor device
JPS6438209U (en) 1987-08-29 1989-03-07
JPH0617637Y2 (en) 1987-09-24 1994-05-11 小島プレス工業株式会社 Vehicle storage device
JPH01112130A (en) 1987-10-26 1989-04-28 Matsushita Electric Ind Co Ltd Evaluation method of infrared optical fiber
US5300942A (en) 1987-12-31 1994-04-05 Projectavision Incorporated High efficiency light valve projection system with decreased perception of spaces between pixels and/or hines
US4981525A (en) 1988-02-19 1991-01-01 Sanyo Electric Co., Ltd. Photovoltaic device
JPH0256987A (en) * 1988-02-23 1990-02-26 Mitsubishi Electric Corp Mounting method of hybrid integrated circuit
FR2627409A1 (en) 1988-02-24 1989-08-25 Lectra Systemes Sa LASER CUTTING APPARATUS WITH A FUME EXHAUST DEVICE
JPH01225510A (en) 1988-03-04 1989-09-08 Sumitomo Electric Ind Ltd How to cut and divide semiconductor substrates
JPH01225509A (en) 1988-03-04 1989-09-08 Sumitomo Electric Ind Ltd Dividing method for semiconductor base
JPH01133701U (en) * 1988-03-07 1989-09-12
US4908493A (en) * 1988-05-31 1990-03-13 Midwest Research Institute Method and apparatus for optimizing the efficiency and quality of laser material processing
JP2680039B2 (en) 1988-06-08 1997-11-19 株式会社日立製作所 Optical information recording / reproducing method and recording / reproducing apparatus
US5017755A (en) * 1988-10-26 1991-05-21 Kabushiki Kaisha Toshiba Method of repairing liquid crystal display and apparatus using the method
US4982166A (en) * 1989-03-01 1991-01-01 Morrow Clifford E Method and apparatus for combining two lower power laser beams to produce a combined higher power beam
US5014207A (en) * 1989-04-21 1991-05-07 E. I. Du Pont De Nemours And Company Solid imaging system
DE69013047T2 (en) * 1989-05-08 1995-04-13 Philips Nv Process for splitting a plate made of brittle material.
JP2507665B2 (en) 1989-05-09 1996-06-12 株式会社東芝 Method for manufacturing metal cylindrical member for electron tube
JPH0737840Y2 (en) 1989-07-05 1995-08-30 東洋刃物株式会社 Perforated paper cutter
US5151135A (en) 1989-09-15 1992-09-29 Amoco Corporation Method for cleaning surfaces using UV lasers
JPH03124489A (en) * 1989-10-06 1991-05-28 Teijin Ltd Optical recording medium
JP2810151B2 (en) * 1989-10-07 1998-10-15 ホーヤ株式会社 Laser marking method
JPH0729855Y2 (en) 1989-10-25 1995-07-12 旭光学工業株式会社 Camera case
JPH03177051A (en) * 1989-12-05 1991-08-01 Kawasaki Steel Corp Method and device for cutting semiconductor wafer
JP2765746B2 (en) 1990-03-27 1998-06-18 科学技術振興事業団 Fine modification and processing method
JPH0757427B2 (en) * 1989-12-08 1995-06-21 三菱電機株式会社 Laser cutting machine
JP2891264B2 (en) 1990-02-09 1999-05-17 ローム 株式会社 Method for manufacturing semiconductor device
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
US5132505A (en) 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
JPH03276662A (en) 1990-03-26 1991-12-06 Nippon Steel Corp Wafer cutting method
JPH03124486U (en) 1990-03-29 1991-12-17
JP2620723B2 (en) 1990-05-24 1997-06-18 サンケン電気株式会社 Method for manufacturing semiconductor device
US5023877A (en) 1990-06-29 1991-06-11 The United States Of America As Represented By The Secretary Of The Air Force Miniature, optically pumped narrow line solid state laser
JPH04110944A (en) * 1990-08-31 1992-04-13 Nippon Sekiei Glass Kk Marking method for transparent material
JP3024990B2 (en) * 1990-08-31 2000-03-27 日本石英硝子株式会社 Cutting method of quartz glass material
TW207588B (en) 1990-09-19 1993-06-11 Hitachi Seisakusyo Kk
JPH04143645A (en) 1990-10-05 1992-05-18 Nuclear Fuel Ind Ltd Melting point measuring method
JPH04167985A (en) 1990-10-31 1992-06-16 Nagasaki Pref Gov Method for cutting off wafer
JPH0740336Y2 (en) 1990-11-07 1995-09-20 株式会社クボタ Rice storage device for commercial rice cooker
FR2669427B1 (en) * 1990-11-16 1993-01-22 Thomson Csf DEVICE FOR CONTROLLING ALIGNMENT OF TWO OPTICAL CHANNELS AND LASER DESIGNATION SYSTEM PROVIDED WITH SUCH A CONTROL DEVICE.
JPH04188847A (en) 1990-11-22 1992-07-07 Mitsubishi Electric Corp Adhesive tape
US5211805A (en) 1990-12-19 1993-05-18 Rangaswamy Srinivasan Cutting of organic solids by continuous wave ultraviolet irradiation
JPH0639572A (en) 1991-01-11 1994-02-15 Souei Tsusho Kk Wafer cutting device
IL97479A (en) * 1991-03-08 1994-01-25 Shafir Aaron Laser beam heating method and apparatus
JPH04111800U (en) 1991-03-16 1992-09-29 テイーデイーケイ株式会社 Lead wire insertion detection mechanism in lead wire cutting and bending equipment
JP3165192B2 (en) 1991-03-28 2001-05-14 株式会社東芝 Method for manufacturing semiconductor integrated circuit device
JPH04300084A (en) 1991-03-28 1992-10-23 Toshiba Corp Laser beam machine
US5171249A (en) 1991-04-04 1992-12-15 Ethicon, Inc. Endoscopic multiple ligating clip applier
DE4113714A1 (en) * 1991-04-26 1992-10-29 Hoechst Ag DRAWN PACKAGING WITH INTEGRATED TARGET BREAKAGE POINTS AND METHOD FOR THEIR PRODUCTION
JPH04339586A (en) 1991-05-13 1992-11-26 Mitsubishi Electric Corp Laser beam machine
JP3213338B2 (en) * 1991-05-15 2001-10-02 株式会社リコー Manufacturing method of thin film semiconductor device
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5635976A (en) * 1991-07-17 1997-06-03 Micronic Laser Systems Ab Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate
US5762744A (en) * 1991-12-27 1998-06-09 Rohm Co., Ltd. Method of producing a semiconductor device using an expand tape
GB2263195B (en) 1992-01-08 1996-03-20 Murata Manufacturing Co Component supply method
JP2627696B2 (en) 1992-01-17 1997-07-09 コマツ電子金属株式会社 Melt level control device and control method in CZ method
RU2024441C1 (en) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Process of cutting of nonmetal materials
US5254149A (en) * 1992-04-06 1993-10-19 Ford Motor Company Process for determining the quality of temper of a glass sheet using a laser beam
JP3101421B2 (en) 1992-05-29 2000-10-23 富士通株式会社 Manufacturing method of shaped metal pattern
JP3088193B2 (en) 1992-06-05 2000-09-18 三菱電機株式会社 Method for manufacturing semiconductor device having LOC structure and lead frame used therein
US5812261A (en) * 1992-07-08 1998-09-22 Active Impulse Systems, Inc. Method and device for measuring the thickness of opaque and transparent films
GB9216643D0 (en) 1992-08-05 1992-09-16 Univ Loughborough Automatic operations on materials
US5265114C1 (en) * 1992-09-10 2001-08-21 Electro Scient Ind Inc System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device
AU5872994A (en) * 1992-12-18 1994-07-19 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
JP3255741B2 (en) 1992-12-22 2002-02-12 リンテック株式会社 Wafer dicing method, radiation irradiation apparatus used for this method, and pressure-sensitive adhesive sheet for attaching a wafer
JP2720744B2 (en) 1992-12-28 1998-03-04 三菱電機株式会社 Laser processing machine
US5382770A (en) * 1993-01-14 1995-01-17 Reliant Laser Corporation Mirror-based laser-processing system with visual tracking and position control of a moving laser spot
US5359176A (en) 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
US5321717A (en) 1993-04-05 1994-06-14 Yoshifumi Adachi Diode laser having minimal beam diameter and optics
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
EP0656241B1 (en) * 1993-06-04 1998-12-23 Seiko Epson Corporation Apparatus and method for laser machining
JPH0775955A (en) 1993-06-17 1995-03-20 Disco Abrasive Syst Ltd Precision cutting equipment
US5580473A (en) * 1993-06-21 1996-12-03 Sanyo Electric Co. Ltd. Methods of removing semiconductor film with energy beams
JPH0729855A (en) * 1993-07-12 1995-01-31 Sumitomo Electric Ind Ltd Method for expanding semiconductor wafer
US5699145A (en) * 1993-07-14 1997-12-16 Nikon Corporation Scanning type exposure apparatus
JPH0732281A (en) 1993-07-19 1995-02-03 Toyoda Mach Works Ltd Robot controller
JP2616247B2 (en) 1993-07-24 1997-06-04 日本電気株式会社 Method for manufacturing semiconductor device
JPH0740336A (en) 1993-07-30 1995-02-10 Sumitomo Electric Ind Ltd Diamond processing method
GB2281129B (en) * 1993-08-19 1997-04-09 United Distillers Plc Method of marking a body of glass
JPH0776167A (en) * 1993-09-08 1995-03-20 Miyachi Technos Kk Laser marking method
DE4331262C2 (en) * 1993-09-15 1996-05-15 Wissner Rolf Laser machine for machining a workpiece and method for controlling a laser machine
US5376793A (en) 1993-09-15 1994-12-27 Stress Photonics, Inc. Forced-diffusion thermal imaging apparatus and method
US5424548A (en) * 1993-09-21 1995-06-13 International Business Machines Corp. Pattern specific calibration for E-beam lithography
US5393482A (en) 1993-10-20 1995-02-28 United Technologies Corporation Method for performing multiple beam laser sintering employing focussed and defocussed laser beams
JP2760288B2 (en) 1993-12-28 1998-05-28 日本電気株式会社 Via hole forming method and film cutting method
DE4404141A1 (en) * 1994-02-09 1995-08-10 Fraunhofer Ges Forschung Device and method for laser beam shaping, especially in laser beam surface processing
US5631734A (en) 1994-02-10 1997-05-20 Affymetrix, Inc. Method and apparatus for detection of fluorescently labeled materials
JP3162255B2 (en) * 1994-02-24 2001-04-25 三菱電機株式会社 Laser processing method and apparatus
US5521999A (en) 1994-03-17 1996-05-28 Eastman Kodak Company Optical system for a laser printer
JPH07263382A (en) 1994-03-24 1995-10-13 Kawasaki Steel Corp Wafer fixing tape
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5504772A (en) 1994-09-09 1996-04-02 Deacon Research Laser with electrically-controlled grating reflector
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5774222A (en) * 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
JP3374880B2 (en) 1994-10-26 2003-02-10 三菱電機株式会社 Semiconductor device manufacturing method and semiconductor device
JP3535241B2 (en) * 1994-11-18 2004-06-07 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
JPH08148692A (en) 1994-11-24 1996-06-07 Sony Corp Method of manufacturing thin film semiconductor device
US5543365A (en) * 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
CN1161475A (en) * 1995-01-26 1997-10-08 浜松光子学株式会社 Image-forming apparatus
JPH08197271A (en) * 1995-01-27 1996-08-06 Ricoh Co Ltd Brittle material cleaving method and brittle material cleaving apparatus
US5841543A (en) * 1995-03-09 1998-11-24 Texas Instruments Incorporated Method and apparatus for verifying the presence of a material applied to a substrate
JPH08264488A (en) 1995-03-22 1996-10-11 Nec Corp Wafer scribing apparatus and method
JP3509985B2 (en) * 1995-03-24 2004-03-22 三菱電機株式会社 Chip separation method for semiconductor device
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses
KR0174773B1 (en) * 1995-03-31 1999-04-01 모리시다 요이치 Inspection method of semiconductor device
JP2737744B2 (en) 1995-04-26 1998-04-08 日本電気株式会社 Wafer probing equipment
US5870133A (en) * 1995-04-28 1999-02-09 Minolta Co., Ltd. Laser scanning device and light source thereof having temperature correction capability
US5663980A (en) 1995-05-22 1997-09-02 Adachi; Yoshi Semiconductor laser device having changeable wavelength, polarization mode, and beam shape image
JP3138613B2 (en) * 1995-05-24 2001-02-26 三菱電機株式会社 Laser processing equipment
DE59602730D1 (en) 1995-06-23 1999-09-16 Andreas Peiker TELEPHONE DEVICE WITH A HANDSET HAVING A TALK AND / OR EARSHELL
JPH09150286A (en) * 1995-06-26 1997-06-10 Corning Inc Method and apparatus for cutting brittle material
JPH0917756A (en) 1995-06-28 1997-01-17 Toshiba Corp Protective tape for semiconductor and method of using the same
KR970008386A (en) * 1995-07-07 1997-02-24 하라 세이지 A method of dividing a substrate and a dividing device
JPH0929472A (en) * 1995-07-14 1997-02-04 Hitachi Ltd Cleaving method, cleaving device and chip material
JP2809303B2 (en) 1995-07-28 1998-10-08 関西日本電気株式会社 Wafer cutting method
JPH09107168A (en) * 1995-08-07 1997-04-22 Mitsubishi Electric Corp Laser processing method for wiring board, laser processing apparatus for wiring board, and carbon dioxide laser oscillator for processing wiring board
EP0847317B1 (en) 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
US6057525A (en) * 1995-09-05 2000-05-02 United States Enrichment Corporation Method and apparatus for precision laser micromachining
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies
EP0857098A1 (en) 1995-10-27 1998-08-12 E.I. Du Pont De Nemours And Company Method and apparatus for laser cutting materials
US5886318A (en) * 1995-11-03 1999-03-23 Vasiliev; Anatoly Valentinovich Method for laser-assisted image formation in transparent objects
US5747769A (en) 1995-11-13 1998-05-05 General Electric Company Method of laser forming a slot
KR0171947B1 (en) * 1995-12-08 1999-03-20 김주용 Exposure method for manufacturing semiconductor device and exposure device using same
US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
MY118036A (en) * 1996-01-22 2004-08-30 Lintec Corp Wafer dicing/bonding sheet and process for producing semiconductor device
JP3592018B2 (en) 1996-01-22 2004-11-24 日本テキサス・インスツルメンツ株式会社 Polyimide adhesive sheet and process film for polyimide
JP3292021B2 (en) * 1996-01-30 2002-06-17 三菱電機株式会社 Laser processing method and laser processing apparatus
JPH09213662A (en) 1996-01-31 1997-08-15 Toshiba Corp Wafer dividing method and semiconductor device manufacturing method
JPH09216085A (en) * 1996-02-07 1997-08-19 Canon Inc Substrate cutting method and cutting device
JP3027768U (en) 1996-02-08 1996-08-13 株式会社アールイシダ Health slippers
EP0820640B1 (en) 1996-02-09 2011-07-13 Advanced Laser Separation International (ALSI) B.V. Laser separation of semiconductor elements formed in a wafer of semiconductor material
US5925024A (en) 1996-02-16 1999-07-20 Joffe; Michael A Suction device with jet boost
US6133986A (en) * 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
JPH09306839A (en) 1996-03-12 1997-11-28 Sharp Corp Method for melt crystallization of semiconductor and method for activating impurities
JP3660741B2 (en) 1996-03-22 2005-06-15 株式会社日立製作所 Method for manufacturing electronic circuit device
AU1941397A (en) 1996-03-25 1997-10-17 Nippon Sheet Glass Co. Ltd. A laser processing method for a glass substrate, and a diffraction grating and a microlens array obtained therefrom
JPH09253877A (en) * 1996-03-25 1997-09-30 Sumitomo Electric Ind Ltd Excimer laser processing method and processed substrate
US5880777A (en) 1996-04-15 1999-03-09 Massachusetts Institute Of Technology Low-light-level imaging and image processing
US5807380A (en) 1996-04-26 1998-09-15 Dishler; Jon G. Optical guide and method for use in corrective laser eye surgery
JPH09298339A (en) * 1996-04-30 1997-11-18 Rohm Co Ltd Manufacture of semiconductor laser
US6087617A (en) * 1996-05-07 2000-07-11 Troitski; Igor Nikolaevich Computer graphics system for generating an image reproducible inside optically transparent material
JP3259014B2 (en) 1996-07-24 2002-02-18 ミヤチテクノス株式会社 Scanning laser marking method and apparatus
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
JPH1071483A (en) 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd How to cut brittle materials
US6172757B1 (en) * 1996-09-25 2001-01-09 Vanguard International Semiconductor Corporation Lever sensor for stepper field-by-field focus and leveling system
DK109197A (en) * 1996-09-30 1998-03-31 Force Instituttet Process for processing a material by means of a laser beam
US5829448A (en) * 1996-10-30 1998-11-03 Photogen, Inc. Method for improved selectivity in photo-activation of molecular agents
JPH10128567A (en) 1996-10-30 1998-05-19 Nec Kansai Ltd Laser beam splitting method
DE19646332C2 (en) * 1996-11-09 2000-08-10 Fraunhofer Ges Forschung Method for changing the optical behavior on the surface and / or within a workpiece by means of a laser
JPH10163780A (en) 1996-12-04 1998-06-19 Ngk Insulators Ltd Manufacturing method of vibrator made of piezoelectric single crystal
JP3468676B2 (en) 1996-12-19 2003-11-17 リンテック株式会社 Manufacturing method of chip body
US5867324A (en) 1997-01-28 1999-02-02 Lightwave Electronics Corp. Side-pumped laser with shaped laser beam
JP3421523B2 (en) 1997-01-30 2003-06-30 三洋電機株式会社 Wafer splitting method
US6312800B1 (en) 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
JPH10305420A (en) 1997-03-04 1998-11-17 Ngk Insulators Ltd Processing method of base material composed of oxide single crystal and method of manufacturing functional device
US6529362B2 (en) * 1997-03-06 2003-03-04 Applied Materials Inc. Monocrystalline ceramic electrostatic chuck
CA2199355A1 (en) * 1997-03-06 1998-09-06 Bob Bishop Multiple beam laser welding apparatus
US5976392A (en) * 1997-03-07 1999-11-02 Yageo Corporation Method for fabrication of thin film resistor
US6228114B1 (en) 1997-04-01 2001-05-08 Joseph Y. Lee Adjustable corneal ring
US6320641B1 (en) 1997-04-01 2001-11-20 Agris-Schoen Vision Systems, Inc. High-precision-resolution image acquisition apparatus and method
US6277067B1 (en) 1997-04-04 2001-08-21 Kerry L. Blair Method and portable colposcope useful in cervical cancer detection
WO1998052257A1 (en) 1997-05-12 1998-11-19 Dahm Jonathan S Improved laser cutting apparatus
JP3230572B2 (en) 1997-05-19 2001-11-19 日亜化学工業株式会社 Method for manufacturing nitride compound semiconductor device and semiconductor light emitting device
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
BE1011208A4 (en) * 1997-06-11 1999-06-01 Cuvelier Georges Capping METHOD FOR GLASS PIECES.
JPH115185A (en) * 1997-06-11 1999-01-12 Nikon Corp Laser processing equipment
US20030054987A1 (en) * 1997-06-16 2003-03-20 Genentech, Inc. Secreted and transmembrane polypeptides and nucleic acids encoding the same
JPH1110376A (en) 1997-06-25 1999-01-19 Souei Tsusho Kk Cutting method
US6327090B1 (en) 1997-07-03 2001-12-04 Levelite Technology, Inc. Multiple laser beam generation
DE19728766C1 (en) * 1997-07-07 1998-12-17 Schott Rohrglas Gmbh Use of a method for producing a predetermined breaking point in a vitreous body
JPH1128586A (en) 1997-07-08 1999-02-02 Keyence Corp Laser beam marking device
US6294439B1 (en) 1997-07-23 2001-09-25 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
US5863813A (en) * 1997-08-20 1999-01-26 Micron Communications, Inc. Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips
JP3498895B2 (en) 1997-09-25 2004-02-23 シャープ株式会社 Substrate cutting method and display panel manufacturing method
JP3231708B2 (en) 1997-09-26 2001-11-26 住友重機械工業株式会社 Marking method of transparent material
JP3292294B2 (en) 1997-11-07 2002-06-17 住友重機械工業株式会社 Marking method and marking device using laser
US6392683B1 (en) * 1997-09-26 2002-05-21 Sumitomo Heavy Industries, Ltd. Method for making marks in a transparent material by using a laser
JP3208730B2 (en) * 1998-01-16 2001-09-17 住友重機械工業株式会社 Marking method of light transmissive material
JPH11121517A (en) 1997-10-09 1999-04-30 Hitachi Ltd Semiconductor element mounting apparatus and mounting method
JPH11162889A (en) 1997-11-25 1999-06-18 Sony Corp Wafer breaking and stretching apparatus and method
JP3076290B2 (en) 1997-11-28 2000-08-14 山形日本電気株式会社 Semiconductor chip pickup apparatus and method
JP3449201B2 (en) * 1997-11-28 2003-09-22 日亜化学工業株式会社 Method for manufacturing nitride semiconductor device
JPH11156564A (en) * 1997-11-28 1999-06-15 Toshiba Ceramics Co Ltd Heat resistant transparent member and manufacture
JP3532100B2 (en) 1997-12-03 2004-05-31 日本碍子株式会社 Laser cleaving method
JPH11177176A (en) 1997-12-10 1999-07-02 Hitachi Cable Ltd Semiconductor laser
JP3604550B2 (en) 1997-12-16 2004-12-22 日亜化学工業株式会社 Method for manufacturing nitride semiconductor device
US6005219A (en) * 1997-12-18 1999-12-21 General Electric Company Ripstop laser shock peening
JPH11204551A (en) 1998-01-19 1999-07-30 Sony Corp Method for manufacturing semiconductor device
JP3009658B2 (en) 1998-01-20 2000-02-14 三菱重工業株式会社 Welding material for high Cr steel
JP3352934B2 (en) * 1998-01-21 2002-12-03 理化学研究所 High intensity ultrashort pulse laser processing method and apparatus
JP4132172B2 (en) 1998-02-06 2008-08-13 浜松ホトニクス株式会社 Pulse laser processing equipment
JP3455102B2 (en) * 1998-02-06 2003-10-14 三菱電機株式会社 Semiconductor wafer chip separation method
US6641662B2 (en) * 1998-02-17 2003-11-04 The Trustees Of Columbia University In The City Of New York Method for fabricating ultra thin single-crystal metal oxide wave retarder plates and waveguide polarization mode converter using the same
JPH11240730A (en) * 1998-02-27 1999-09-07 Nec Kansai Ltd Break cutting of brittle material
US6183092B1 (en) * 1998-05-01 2001-02-06 Diane Troyer Laser projection apparatus with liquid-crystal light valves and scanning reading beam
US6057180A (en) 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
JP3152206B2 (en) * 1998-06-19 2001-04-03 日本電気株式会社 Autofocus device and autofocus method
JP2000015467A (en) 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd Method and apparatus for processing workpiece by light
US6181728B1 (en) * 1998-07-02 2001-01-30 General Scanning, Inc. Controlling laser polarization
US6257244B1 (en) * 1998-07-13 2001-07-10 Raymond F. Williams Uniformly size adjustable hair-enhancing cap and methods of manufacture and of custom fitting
JP2000183358A (en) 1998-07-17 2000-06-30 Sony Corp Method for manufacturing thin film semiconductor device
JP3784543B2 (en) 1998-07-29 2006-06-14 Ntn株式会社 Pattern correction apparatus and correction method
JP3156776B2 (en) * 1998-08-03 2001-04-16 日本電気株式会社 Laser irradiation method
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
KR20000015467A (en) 1998-08-29 2000-03-15 윤종용 Solid-state imaging device structure
US6402004B1 (en) 1998-09-16 2002-06-11 Hoya Corporation Cutting method for plate glass mother material
JP3605651B2 (en) 1998-09-30 2004-12-22 日立化成工業株式会社 Method for manufacturing semiconductor device
JP2000124537A (en) 1998-10-21 2000-04-28 Sharp Corp Semiconductor laser chip manufacturing method and manufacturing apparatus used in the method
US6413839B1 (en) 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
JP2000133859A (en) 1998-10-27 2000-05-12 Sumitomo Heavy Ind Ltd Laser marking method and device using laser
US6172329B1 (en) * 1998-11-23 2001-01-09 Minnesota Mining And Manufacturing Company Ablated laser feature shape reproduction control
JP3178524B2 (en) * 1998-11-26 2001-06-18 住友重機械工業株式会社 Laser marking method and apparatus and marked member
KR100338983B1 (en) * 1998-11-30 2002-07-18 윤종용 Wafer separating device and wafer separating method using the same
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6252197B1 (en) * 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
IL127388A0 (en) * 1998-12-03 1999-10-28 Universal Crystal Ltd Material processing applications of lasers using optical breakdown
JP2000195828A (en) 1998-12-25 2000-07-14 Denso Corp Method and device for cutting/separating wafer
US6127005A (en) * 1999-01-08 2000-10-03 Rutgers University Method of thermally glazing an article
JP2000219528A (en) 1999-01-18 2000-08-08 Samsung Sdi Co Ltd Glass substrate cutting method and apparatus
EP1022778A1 (en) 1999-01-22 2000-07-26 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
JP3569147B2 (en) * 1999-01-26 2004-09-22 松下電器産業株式会社 Substrate cutting method
JP2000210785A (en) 1999-01-26 2000-08-02 Mitsubishi Heavy Ind Ltd Laser beam machine with plural beams
JP4040819B2 (en) 1999-02-03 2008-01-30 株式会社東芝 Wafer dividing method and semiconductor device manufacturing method
EP1026735A3 (en) 1999-02-03 2004-01-02 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
JP4119028B2 (en) 1999-02-19 2008-07-16 小池酸素工業株式会社 Laser piercing method
JP2000237885A (en) 1999-02-19 2000-09-05 Koike Sanso Kogyo Co Ltd Laser cutting method
US6208020B1 (en) 1999-02-24 2001-03-27 Matsushita Electronics Corporation Leadframe for use in manufacturing a resin-molded semiconductor device
JP3426154B2 (en) 1999-02-26 2003-07-14 科学技術振興事業団 Manufacturing method of optical waveguide with grating
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass
TW445545B (en) 1999-03-10 2001-07-11 Mitsubishi Electric Corp Laser heat treatment method, laser heat treatment apparatus and semiconductor device
JP3648399B2 (en) 1999-03-18 2005-05-18 株式会社東芝 Semiconductor device
JP2000278306A (en) * 1999-03-26 2000-10-06 Mitsubishi Electric Corp ATM ring network
US6555781B2 (en) 1999-05-10 2003-04-29 Nanyang Technological University Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
JP2000323441A (en) 1999-05-10 2000-11-24 Hitachi Cable Ltd Cutting method of optical waveguide circuit chip formed on ceramic substrate
US6285002B1 (en) * 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
US6562698B2 (en) * 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
US6420245B1 (en) 1999-06-08 2002-07-16 Kulicke & Soffa Investments, Inc. Method for singulating semiconductor wafers
JP2000349107A (en) 1999-06-09 2000-12-15 Nitto Denko Corp Method for manufacturing semiconductor encapsulated chip module and fixing sheet thereof
KR100626983B1 (en) * 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribing method by use of laser
US6229113B1 (en) * 1999-07-19 2001-05-08 United Technologies Corporation Method and apparatus for producing a laser drilled hole in a structure
US6344402B1 (en) * 1999-07-28 2002-02-05 Disco Corporation Method of dicing workpiece
TW404871B (en) 1999-08-02 2000-09-11 Lg Electronics Inc Device and method for machining transparent medium by laser
JP2001047264A (en) 1999-08-04 2001-02-20 Seiko Epson Corp Electro-optical device, method of manufacturing the same, and electronic apparatus
KR100578309B1 (en) * 1999-08-13 2006-05-11 삼성전자주식회사 Laser cutting device and glass substrate cutting method using the same
JP2001064029A (en) 1999-08-27 2001-03-13 Toyo Commun Equip Co Ltd Multilayered glass substrate and its cutting method
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
JP4493127B2 (en) 1999-09-10 2010-06-30 シャープ株式会社 Manufacturing method of nitride semiconductor chip
US6229114B1 (en) 1999-09-30 2001-05-08 Xerox Corporation Precision laser cutting of adhesive members
US6359254B1 (en) * 1999-09-30 2002-03-19 United Technologies Corporation Method for producing shaped hole in a structure
JP3932743B2 (en) 1999-11-08 2007-06-20 株式会社デンソー Manufacturing method of pressure contact type semiconductor device
JP4180206B2 (en) 1999-11-12 2008-11-12 リンテック株式会社 Manufacturing method of semiconductor device
KR100721391B1 (en) * 1999-11-24 2007-05-23 어플라이드 포토닉스 아이엔씨. Method and apparatus for separating non-metallic materials
JP5408829B2 (en) 1999-12-28 2014-02-05 ゲットナー・ファンデーション・エルエルシー Method for manufacturing active matrix substrate
US6612035B2 (en) * 2000-01-05 2003-09-02 Patrick H. Brown Drywall cutting tool
JP2001196282A (en) 2000-01-13 2001-07-19 Hitachi Ltd Semiconductor device and manufacturing method thereof
JP2001250798A (en) 2000-03-06 2001-09-14 Sony Corp Method and apparatus for dividing material with scribe line
DE10015702A1 (en) * 2000-03-29 2001-10-18 Vitro Laser Gmbh Method for introducing at least one internal engraving into a flat body and device for carrying out the method
AU2001251172A1 (en) * 2000-03-30 2001-10-15 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP2001284292A (en) 2000-03-31 2001-10-12 Toyoda Gosei Co Ltd Chip division method for semiconductor wafer
CN100337319C (en) * 2000-04-14 2007-09-12 S.O.I.Tec绝缘体上硅技术公司 Method for cutting out at least a thin layer in substrate or ingot, in particular made of semiconductor materials
US6367175B2 (en) * 2000-04-22 2002-04-09 S&S Trust Low turbulence air blast system
US6333486B1 (en) 2000-04-25 2001-12-25 Igor Troitski Method and laser system for creation of laser-induced damages to produce high quality images
WO2001085387A1 (en) * 2000-05-11 2001-11-15 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
JP3746412B2 (en) 2000-05-15 2006-02-15 日立造船株式会社 Plastic sorting equipment
JP4697823B2 (en) 2000-05-16 2011-06-08 株式会社ディスコ Method for dividing brittle substrate
TW443581U (en) 2000-05-20 2001-06-23 Chipmos Technologies Inc Wafer-sized semiconductor package structure
JP2001339638A (en) 2000-05-26 2001-12-07 Hamamatsu Photonics Kk Streak camera device
JP2001345252A (en) 2000-05-30 2001-12-14 Hyper Photon Systens Inc Laser cutter
JP2001354439A (en) 2000-06-12 2001-12-25 Matsushita Electric Ind Co Ltd Glass substrate processing method and high frequency circuit manufacturing method
JP2002019268A (en) 2000-07-03 2002-01-23 Nippon Aerosil Co Ltd Ultrafine ceramic powder aggregate dispersion water for forming ink absorbing layer of ink jet recording medium
JP3650000B2 (en) 2000-07-04 2005-05-18 三洋電機株式会社 Nitride-based semiconductor laser device and method for manufacturing nitride semiconductor laser device
US6399914B1 (en) * 2000-07-10 2002-06-04 Igor Troitski Method and laser system for production of high quality laser-induced damage images by using material processing made before and during image creation
JP3906653B2 (en) * 2000-07-18 2007-04-18 ソニー株式会社 Image display device and manufacturing method thereof
US6376797B1 (en) * 2000-07-26 2002-04-23 Ase Americas, Inc. Laser cutting of semiconductor materials
JP2002047025A (en) 2000-07-31 2002-02-12 Seiko Epson Corp Substrate cutting method, electro-optical device manufacturing method using the same, laser cutting device, electro-optical device, and electronic equipment used in the method
JP2002050589A (en) 2000-08-03 2002-02-15 Sony Corp Method and apparatus for stretching and separating semiconductor wafer
US6726631B2 (en) * 2000-08-08 2004-04-27 Ge Parallel Designs, Inc. Frequency and amplitude apodization of transducers
US6325855B1 (en) 2000-08-09 2001-12-04 Itt Manufacturing Enterprises, Inc. Gas collector for epitaxial reactors
JP3479833B2 (en) 2000-08-22 2003-12-15 日本電気株式会社 Laser correction method and apparatus
JP4762458B2 (en) 2000-09-13 2011-08-31 浜松ホトニクス株式会社 Laser processing equipment
JP4659300B2 (en) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
JP2003001458A (en) 2000-09-13 2003-01-08 Hamamatsu Photonics Kk Laser beam machining method
JP4837320B2 (en) 2000-09-13 2011-12-14 浜松ホトニクス株式会社 Processing object cutting method
JP2003039184A (en) 2000-09-13 2003-02-12 Hamamatsu Photonics Kk Laser beam machining method
JP3626442B2 (en) 2000-09-13 2005-03-09 浜松ホトニクス株式会社 Laser processing method
JP3722731B2 (en) 2000-09-13 2005-11-30 浜松ホトニクス株式会社 Laser processing method
JP3751970B2 (en) 2000-09-13 2006-03-08 浜松ホトニクス株式会社 Laser processing equipment
JP3761567B2 (en) 2000-09-13 2006-03-29 浜松ホトニクス株式会社 Laser processing method
JP4964376B2 (en) 2000-09-13 2012-06-27 浜松ホトニクス株式会社 Laser processing apparatus and laser processing method
JP3761565B2 (en) 2000-09-13 2006-03-29 浜松ホトニクス株式会社 Laser processing method
JP3408805B2 (en) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 Cutting origin region forming method and workpiece cutting method
JP2002192371A (en) * 2000-09-13 2002-07-10 Hamamatsu Photonics Kk Laser beam machining method and laser beam machining device
US6847003B2 (en) 2000-10-13 2005-01-25 Tokyo Electron Limited Plasma processing apparatus
US6720522B2 (en) 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
JP3660294B2 (en) 2000-10-26 2005-06-15 株式会社東芝 Manufacturing method of semiconductor device
JP3332910B2 (en) 2000-11-15 2002-10-07 エヌイーシーマシナリー株式会社 Wafer sheet expander
JP2002158276A (en) 2000-11-20 2002-05-31 Hitachi Chem Co Ltd Adhesive sheet for attaching wafer and semiconductor device
US6875379B2 (en) 2000-12-29 2005-04-05 Amkor Technology, Inc. Tool and method for forming an integrated optical circuit
US6545339B2 (en) 2001-01-12 2003-04-08 International Business Machines Corporation Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication
JP2002219528A (en) 2001-01-23 2002-08-06 Toyota Industries Corp Press die
JP2002226796A (en) 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Adhesive sheet for attaching wafer and semiconductor device
TW521310B (en) 2001-02-08 2003-02-21 Toshiba Corp Laser processing method and apparatus
US6527965B1 (en) 2001-02-09 2003-03-04 Nayna Networks, Inc. Method for fabricating improved mirror arrays for physical separation
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
SG118117A1 (en) * 2001-02-28 2006-01-27 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
TW473896B (en) 2001-03-20 2002-01-21 Chipmos Technologies Inc A manufacturing process of semiconductor devices
US6777645B2 (en) 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
WO2002082540A1 (en) 2001-03-30 2002-10-17 Fujitsu Limited Semiconductor device, method of manufacture thereof, and semiconductor substrate
US6932933B2 (en) * 2001-03-30 2005-08-23 The Aerospace Corporation Ultraviolet method of embedding structures in photocerams
KR100701013B1 (en) * 2001-05-21 2007-03-29 삼성전자주식회사 Method and apparatus for cutting non-metallic substrate using laser beam
US20020198567A1 (en) * 2001-06-07 2002-12-26 Yona Keisari Electro-endocytotic therapy as a treatment modality of cancer
JP2003017790A (en) 2001-07-03 2003-01-17 Matsushita Electric Ind Co Ltd Nitride-based semiconductor device and manufacturing method
JP2003046177A (en) 2001-07-31 2003-02-14 Matsushita Electric Ind Co Ltd Manufacturing method of semiconductor laser
JP2003154517A (en) 2001-11-21 2003-05-27 Seiko Epson Corp Method and apparatus for cleaving brittle material, and method for manufacturing electronic component
EP1329946A3 (en) * 2001-12-11 2005-04-06 Sel Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device including a laser crystallization step
US6608370B1 (en) * 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
US6908784B1 (en) 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
JP3935186B2 (en) 2002-03-12 2007-06-20 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP4509573B2 (en) 2002-03-12 2010-07-21 浜松ホトニクス株式会社 Semiconductor substrate, semiconductor chip, and semiconductor device manufacturing method
JP3670267B2 (en) 2002-03-12 2005-07-13 浜松ホトニクス株式会社 Laser processing method
EP3252806B1 (en) 2002-03-12 2019-10-09 Hamamatsu Photonics K.K. Substrate dividing method
JP4509720B2 (en) 2002-03-12 2010-07-21 浜松ホトニクス株式会社 Laser processing method
JP2003338636A (en) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk Light emitting element manufacturing method, light emitting diode, and semiconductor laser element
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
JP2006135355A (en) 2002-03-12 2006-05-25 Hamamatsu Photonics Kk Semiconductor substrate cutting method
JP2003338468A (en) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk Light emitting element manufacturing method, light emitting diode, and semiconductor laser element
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
WO2003076119A1 (en) 2002-03-12 2003-09-18 Hamamatsu Photonics K.K. Method of cutting processed object
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
US6787732B1 (en) 2002-04-02 2004-09-07 Seagate Technology Llc Method for laser-scribing brittle substrates and apparatus therefor
NL1021421C2 (en) * 2002-09-10 2004-03-11 Fountain Patents B V Device and method for manufacturing products from a warm plastic mass.
TWI520269B (en) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
WO2004050291A1 (en) 2002-12-05 2004-06-17 Hamamatsu Photonics K.K. Laser processing device
JP2004188422A (en) 2002-12-06 2004-07-08 Hamamatsu Photonics Kk Device and method for machining laser beam
JP4334864B2 (en) 2002-12-27 2009-09-30 日本電波工業株式会社 Thin plate crystal wafer and method for manufacturing crystal resonator
US7341007B2 (en) 2003-03-05 2008-03-11 Joel Vatsky Balancing damper
FR2852250B1 (en) * 2003-03-11 2009-07-24 Jean Luc Jouvin PROTECTIVE SHEATH FOR CANNULA, AN INJECTION KIT COMPRISING SUCH ANKLE AND NEEDLE EQUIPPED WITH SUCH ANKLE
CN1758985A (en) * 2003-03-12 2006-04-12 浜松光子学株式会社 Laser beam machining method
GB2404280B (en) 2003-07-03 2006-09-27 Xsil Technology Ltd Die bonding
US7605344B2 (en) 2003-07-18 2009-10-20 Hamamatsu Photonics K.K. Laser beam machining method, laser beam machining apparatus, and laser beam machining product
US20050018037A1 (en) * 2003-07-22 2005-01-27 Lee Tae-Kyoung Multi-beam laser scanning unit and laser-beam deflection compensating method
JP4563097B2 (en) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2005086175A (en) 2003-09-11 2005-03-31 Hamamatsu Photonics Kk Semiconductor thin film manufacturing method, semiconductor thin film, semiconductor thin film chip, electron tube, and photodetecting element
JP4300084B2 (en) 2003-09-19 2009-07-22 株式会社リコー Image forming apparatus
JP4160597B2 (en) 2004-01-07 2008-10-01 浜松ホトニクス株式会社 Semiconductor light emitting device and manufacturing method thereof
JP4598407B2 (en) 2004-01-09 2010-12-15 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4601965B2 (en) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4509578B2 (en) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
US20050177288A1 (en) * 2004-02-06 2005-08-11 Sullivan James D. Interdependent control of aftermarket vehicle accessories without invasive control connections
KR101336402B1 (en) 2004-03-30 2013-12-04 하마마츠 포토닉스 가부시키가이샤 Laser processing method and semiconductor chip
WO2005098916A1 (en) 2004-03-30 2005-10-20 Hamamatsu Photonics K.K. Laser processing method and semiconductor chip
JP4536407B2 (en) 2004-03-30 2010-09-01 浜松ホトニクス株式会社 Laser processing method and object to be processed
JP4733934B2 (en) 2004-06-22 2011-07-27 株式会社ディスコ Wafer processing method
JP4634089B2 (en) 2004-07-30 2011-02-16 浜松ホトニクス株式会社 Laser processing method
JP4200177B2 (en) 2004-08-06 2008-12-24 浜松ホトニクス株式会社 Laser processing method and semiconductor device
JP4754801B2 (en) 2004-10-13 2011-08-24 浜松ホトニクス株式会社 Laser processing method
JP4917257B2 (en) 2004-11-12 2012-04-18 浜松ホトニクス株式会社 Laser processing method
JP4781661B2 (en) 2004-11-12 2011-09-28 浜松ホトニクス株式会社 Laser processing method
KR101067042B1 (en) 2004-12-13 2011-09-22 엘지디스플레이 주식회사 Display device driving device
JP4198123B2 (en) 2005-03-22 2008-12-17 浜松ホトニクス株式会社 Laser processing method
JP4776994B2 (en) 2005-07-04 2011-09-21 浜松ホトニクス株式会社 Processing object cutting method
JP4749799B2 (en) 2005-08-12 2011-08-17 浜松ホトニクス株式会社 Laser processing method
JP4762653B2 (en) 2005-09-16 2011-08-31 浜松ホトニクス株式会社 Laser processing method and laser processing apparatus
JP4237745B2 (en) 2005-11-18 2009-03-11 浜松ホトニクス株式会社 Laser processing method
JP4907965B2 (en) 2005-11-25 2012-04-04 浜松ホトニクス株式会社 Laser processing method
JP4804911B2 (en) 2005-12-22 2011-11-02 浜松ホトニクス株式会社 Laser processing equipment
JP4907984B2 (en) 2005-12-27 2012-04-04 浜松ホトニクス株式会社 Laser processing method and semiconductor chip
JP5183892B2 (en) 2006-07-03 2013-04-17 浜松ホトニクス株式会社 Laser processing method
US7897487B2 (en) 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
WO2008035679A1 (en) 2006-09-19 2008-03-27 Hamamatsu Photonics K. K. Laser processing method and laser processing apparatus
JP4954653B2 (en) 2006-09-19 2012-06-20 浜松ホトニクス株式会社 Laser processing method
JP5101073B2 (en) 2006-10-02 2012-12-19 浜松ホトニクス株式会社 Laser processing equipment
JP5132911B2 (en) 2006-10-03 2013-01-30 浜松ホトニクス株式会社 Laser processing method
JP4964554B2 (en) 2006-10-03 2012-07-04 浜松ホトニクス株式会社 Laser processing method
EP2070636B1 (en) 2006-10-04 2015-08-05 Hamamatsu Photonics K.K. Laser processing method
JP5336054B2 (en) 2007-07-18 2013-11-06 浜松ホトニクス株式会社 Processing information supply system provided with processing information supply device
JP4402708B2 (en) 2007-08-03 2010-01-20 浜松ホトニクス株式会社 Laser processing method, laser processing apparatus and manufacturing method thereof
JP5225639B2 (en) 2007-09-06 2013-07-03 浜松ホトニクス株式会社 Manufacturing method of semiconductor laser device
JP5342772B2 (en) 2007-10-12 2013-11-13 浜松ホトニクス株式会社 Processing object cutting method
JP5449665B2 (en) 2007-10-30 2014-03-19 浜松ホトニクス株式会社 Laser processing method
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