JPH11162889A - Wafer breaking and stretching apparatus and method - Google Patents

Abstract

(57) [Summary] [Problem] A wafer brake that can be braked / extended by a single device regardless of the state of the wafer, and consequently requires only one type of ring to maintain the stretched state. A stretching / stretching device and a braking / stretching method are provided. SOLUTION: A wafer 9 subjected to full-cut dicing or half-cut dicing is broken and extended on an extension stage 2. A recess 13 is provided on the upper surface of the extension stage 2 and separately prepared in the recess 13. The hard adapter 21 and the elastic adapter 22 can be selectively mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor manufacturing process,
In particular, the present invention relates to a wafer breaking / stretching apparatus and a breaking / stretching method used in the breaking step.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, a wafer is a dicing sheet (also referred to as a "wafer sheet").
Full-cut dicing, which is applied to the dicing process and cuts a part of the dicing sheet with a dicing saw to completely cut the wafer, and half-cut or semi-full cut, which cuts leaving a part of the wafer Dicing is performed by any of dicing methods.
After the dicing step, the wafer is transferred to a breaking / stretching step. In the breaking / stretching step, the wafer is divided into individual dies (hereinafter, referred to as “chips”) and further sent to a die bonding step. .

[0003] The conventional wafer breaking
In the stretching step, the apparatus used differs between a wafer subjected to full-cut dicing and a wafer subjected to half-cut or semi-full-cut dicing.

FIGS. 5 to 8 show an example of an apparatus used in a conventional braking / stretching process.
Is an overall configuration diagram of the device, FIGS. 6 and 7 are explanatory diagrams of the operation of the device, and FIG. 8 is a conceptual diagram of the device. 5 to 8, the braking / stretching device 51 includes an extension stage 52 having a built-in heater, a lower clamp 53, and an upper clamp 54. Of these, the extension stage 52 is movable in the vertical direction, and the lower clamp 53 and the upper clamp 54 surround the outside of the extension stage 52 and are arranged at positions that do not hinder the vertical movement of the extension stage 52. I have.

The extension stage shown in FIGS. 6 to 8 is an extension stage when a full-cut dicing wafer is used. The extension stage 52 is made of an aluminum material and is formed in a disk shape having a smooth upper surface. The extension stage 52 is fixedly mounted on a shaft 62 (see FIGS. 6 and 7) of a lifting means (not shown). It is structured to move up and down as a unit. In addition, a small-diameter portion 55 to which the inner ring 57 of the double ring is fitted is provided at the upper part of the extension stage 52, and a step 56 is formed on the outer peripheral surface by the formation of the small-diameter portion 55. ing.

The double ring comprises the inner ring 57,
Outer ring 5 that can be fitted and mounted on the outside of this ring 57
8.

Lower clamp 53 and upper clamp 5
Reference numerals 4 are ring-shaped with each other, and are arranged at positions where they can abut each other. The upper clamp 53 is vertically movable with respect to the lower clamp 54, and when pressed against the lower clamp 54, clamps an outer peripheral portion of a dicing sheet 58 disposed between the lower clamp 53 and the upper clamp 54. It has a structure that can be used.

Next, the operation of the brake / extension device 51 will be described. In the case of using the wafer subjected to the full cut dicing, the processing is performed in the following order. First, with the inner ring 57 attached to the small-diameter portion 55 of the extension stage 52 and positioned at the step 56, the extension stage 52 is arranged at a position where the upper surface has been raised to substantially the same position as the positioning surface of the lower clamp 53. . After that, the wafer 59 is placed on the extension stage 52 and the dicing sheet 60 is set. Subsequently, the periphery of the dicing sheet 60 is clamped by lowering the upper clamp 54. FIG. 6 shows this clamped state. Next, the dicing sheet 60 is extended by raising the extension stage 52 by the elevating means.
9 is broken into chips one by one. FIG. 7 shows this state. With the extension stage 52 raised, the outer ring 58 of the double ring is fitted and mounted from above the dicing sheet 60 to the outside of the inner ring 57 as shown by the dashed line in FIG. Thus, the stretching of the dicing sheet 60 on the extension stage 52 is maintained, and thereafter, the lower clamp 53 and the upper clamp 54
This stretching is maintained even if the clamping by the above is released.
When the outer ring 58 is attached, the dicing sheet 60 protruding outward from the outer ring 58 is cut, and the braking process is completed.

Next, a case where a half-cut or semi-full-cut diced wafer is used will be described. In the case where the half-cut or semi-full-cut diced wafer is used, a braking stage as shown in FIG. Stage 72
Is used. The braking stage 7 shown in FIG.
2 has a smooth disk-shaped upper surface covered with a rubber sheet having elasticity, and a peripheral surface formed of a small body. When using the half-cut or semi-full-cut diced wafer, the surface of the braking stage 72 shown in FIG. 9 is covered with a protective sheet, and then the dicing sheet 60 is braked with the surface of the wafer 59 facing downward. It is placed on a stage 72 and clamped by a clamper. In this case, the braking shown in FIG.
Since the stretching device cannot be used, it will be clamped by another method not shown. Then, pressure is applied from above the dicing sheet 60 with a roller or the like to break the wafer 59 into chips one by one. Further, the breaking stage 72 is raised to extend the dicing sheet 60, and the dicing sheet 60 is fitted from above the dicing sheet 60 of the braking stage 72 with the side of the Duracon ring 73 to which the double-sided tape (not shown) is attached down. The protruding dicing sheet is cut while leaving about 1 cm, the remaining dicing sheet 60 is adhered to the double-sided tape on the outer periphery of the Dura-con ring 73, and then, the stopper 74 is hung on the Dura-con ring 73 and stopped with a screwdriver. finish.

[0010]

As described above, in the conventional wafer breaking / stretching method, there are two types of stages, one for stretching a full-cut wafer and the other for breaking and stretching a half-cut or semi-full-cut wafer. And a stretching device or a breaking device was required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object the purpose of breaking and extending with a single apparatus regardless of the state of a wafer. The present invention provides a wafer breaking / stretching apparatus and a breaking / stretching method that can use only one kind of ring. Further, other objects will be clarified sequentially in the contents described below.

[0012]

In order to achieve the above object, according to the present invention, there is provided a wafer for breaking / extending a full-cut or half-cut dicing wafer on an extension stage. In the braking / stretching apparatus of the above, a configuration is provided which comprises a concave portion provided on the upper surface of the extension stage, and an adapter detachably provided in the concave portion.

[0013] In the invention according to claim 2, a rigid adapter and an elastic adapter are prepared as the adapter.

According to a third aspect of the present invention, in the method of breaking and extending a wafer which has been subjected to full-cut dicing or half-cut dicing, the method comprises the steps of: Used a hard adapter, and used an elastic adapter when breaking and stretching a half-cut diced wafer.

According to a fourth aspect of the present invention, a concave portion is formed on an upper surface of an extension stage for setting the wafer, and the hard adapter or the elastic member is formed in the concave portion in accordance with full-cut dicing and half-cut dicing. Adapters are now used.

Therefore, according to the device of the first aspect of the present invention, a plurality of types of adapters to be arranged in the recess of the extension stage are prepared, and a plurality of types of braking can be performed by one device by selectively using them. -Stretching becomes possible. Further, since the outer peripheral portion of the extension stage can be left as it is, only one type of double ring or the like for maintaining the extended state is required, and the number of jigs can be reduced and the management can be simplified.

According to the apparatus of the second aspect of the present invention, in addition to the function of the first aspect of the present invention, a hard adapter suitable for breaking and stretching a wafer which has been subjected to full cut dicing as an adapter is provided. Soft adapters suitable for breaking and stretching half-cut or semi-full-cut dicing wafers are available, so a single machine can break full-cut dicing and half-cut or semi-full-cut dicing wafers. It can be stretched.

According to the method of the present invention, it is possible to break / stretch a full-cut diced wafer and a half-cut diced wafer by using one adapter. . In addition, since the outer peripheral portion of the extension stage can be left as it is, only one type of double ring or the like for maintaining the stretched state is required, so that the number of jigs can be reduced and management can be simplified, thereby reducing costs. be able to.

According to the method of the present invention described in claim 4,
Since the outer peripheral portion of the extension stage can be left as it is, only one type of double ring or the like for maintaining the extended state is required, so that the number of jigs can be reduced and management can be simplified, thereby reducing costs. it can.

[0020]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Although the embodiments described below are preferred specific examples of the present invention, various technically preferable limitations are given thereto. However, the scope of the present invention is particularly limited in the following description. Is not limited to these embodiments unless otherwise described.

FIGS. 1 to 4 show an embodiment of the apparatus of the present invention used in the breaking / stretching step.
1 is an overall configuration diagram of the device, FIGS. 1 and 2 are explanatory diagrams of the operation of the device, and FIG. 4 is a conceptual diagram of the device. 1 to 4, a breaking / stretching apparatus 1 includes an extension stage 2 having a built-in heater, a lower clamp 3 and an upper clamp 4, and a hard adapter as shown in FIG. 21 and an elastic adapter 22 are provided. The extension stage 2 is movable in the vertical direction, and the lower clamp 3 and the upper clamp 4 surround the outside of the extension stage 2 and are arranged at positions where they do not hinder the vertical movement of the extension stage 2.

More specifically, the extension stage 2 is made of aluminum and is formed in a disk shape having a smooth upper surface, and is fixed to an upper portion of a shaft 12 (see FIGS. 1 and 2) of a lifting means (not shown). And is configured to move up and down integrally with the shaft 12. A small-diameter portion 5 on which an inner ring 7 of the double ring is fitted is mounted on the upper part of the extension stage 2.
The step 6 is formed in the outer peripheral surface by the formation of the small diameter portion 5. Further, a circular recess 13 is formed at the center of the upper surface of the extension stage 2.

The double ring includes the inner ring 7 and an outer ring 8 which can be fitted and mounted on the outer side of the ring 7.

The lower clamp 3 and the upper clamp 4 have a ring shape with each other and are arranged at positions where they can abut each other. The upper clamp 4 is movable in the vertical direction with respect to the lower clamp 3, and when pressed against the lower clamp 3, the dicing sheet 10 disposed between the lower clamp 3 and the upper clamp 4.
Has a structure capable of clamping the outer peripheral portion of the rim.

Hard adapter 21 and elastic adapter 2
2 are both formed in a disk shape, and can be mounted in the recess 13 of the extension stage 2 so as to fill the recess 13. Also, some of them are adapter 21
Notches 23 are provided for facilitating removal of (22) from recess 13. Note that, of the hard adapter 21 and the elastic adapter 22, the hard adapter 2
Reference numeral 1 denotes a wafer which is used for breaking and extending a wafer which has been subjected to full cut dicing, and is formed of, for example, the same aluminum material as the extension stage 2. On the other hand, the elastic adapter 22 is used when breaking and extending the half-cut diced wafer, and is made of, for example, a rubber material.

Next, the operation of the brake and extension device 1 of this embodiment will be described. First, a case where a wafer subjected to full cut dicing is used will be described. In this case, processing is performed in the following order. First, the inner ring 7 is connected to the small-diameter portion 5 of the extension stage 2.
And the hard adapter 2 in the recess 13.
1 is mounted, the extension stage 2 is moved to a position where the upper surface has been raised to substantially the same position as the positioning surface of the lower clamp 3.
Place. Thereafter, the wafer 9 is placed on the upper surface of the extension stage 2.
Is placed and the dicing sheet 10 is set. Subsequently, the upper clamp 4 is lowered to clamp the periphery of the dicing sheet 10. FIG. 1 shows this clamped state. Next, the dicing sheet 10 is extended by raising the extension stage 2 by the elevating means, and the wafer 9 is broken into individual chips by this extension. FIG. 2 shows this state. Subsequently, in a state where the extension stage 2 is raised, the outer ring 8 of the double ring is fitted from the upper side of the dicing sheet 10 to the outer side of the inner ring 7 as shown by a chain line in FIG. Attach. Thereby, the stretching of the dicing sheet 10 on the extension stage 2 is maintained, and thereafter, even if the clamps by the lower clamp 3 and the upper clamp 4 are released, the stretching is maintained. Further, when the outer ring 8 is mounted, the dicing sheet 10 protruding outside from the outer ring 8 is cut, and the braking process is completed.

Next, a case where a half-cut or semi-full-cut dicing wafer is used will be described. In this case, the processing is performed in the following order. First, the inner ring 7 is connected to the small-diameter portion 5 of the extension stage 2.
And the elastic adapter 2 in the recess 13.
With the stage 2 mounted, the extension stage 2 is moved to a position where the upper surface has been raised to almost the same position as the positioning surface of the lower clamp 3.
Place. Then, after covering the surface of the extension stage 2 with a protective sheet (not shown), the dicing sheet 10 is placed on the extension stage 2 with the surface of the wafer 9 facing downward. Subsequently, the upper clamp 4 is lowered to clamp the periphery of the dicing sheet 10. Next, after applying pressure with a roller or the like from above the dicing sheet 10 to break the wafer into chips one by one,
The dicing sheet 10 is stretched by raising the extension stage 2 by the lifting means. With the extension stage 2 raised, the outer ring 8 of the double ring is fitted from the upper side of the dicing sheet 10 to the outer side of the inner ring 7. Thereby, the stretching of the dicing sheet 10 on the extension stage 2 is maintained, and thereafter, even if the clamps by the lower clamp 3 and the upper clamp 4 are released, the stretching is maintained. When the outer ring 8 is attached in this way, the dicing sheet 10 protruding outside the ring 8 is cut, and the braking process is completed.

Therefore, according to the breaking / stretching apparatus of the embodiment, two types of adapters, a hard adapter 21 and an elastic adapter 22, are provided in the recess 13 of the extension stage 2, and the wafer which is fully cut diced is prepared. The hard adapter 21 is used to break and stretch the wafer 9, and the elastic adapter 22 is used to break and stretch the half-cut or semi-full-cut diced wafer 9.
Multiple types of braking / stretching are possible with one device. Further, since the outer peripheral portion of the extension stage 2 may be left as it is, only one type of double ring or the like for maintaining the stretched state is required. For this reason, it is possible to simplify the management by reducing the number of jigs.

[0029]

As described above, according to the present invention, 1
Multiple types of braking and stretching are possible with one device,
In addition, since the outer peripheral portion of the extension stage may be left as it is, only one type of double ring or the like for maintaining the extended state is required. As a result, it is possible to simplify the management by reducing the number of jigs, and it is possible to expect effects such as a reduction in cost.

[Brief description of the drawings]

FIG. 1 is an operation explanatory diagram of an apparatus shown as one embodiment of the present invention.

FIG. 2 is a diagram illustrating the operation of the device of the present invention.

FIG. 3 is an overall configuration diagram of the device of the present invention.

FIG. 4 is a conceptual diagram of the device of the present invention.

FIG. 5 is an overall configuration diagram of a conventional device.

FIG. 6 is a diagram illustrating the operation of the conventional device.

FIG. 7 is an operation explanatory diagram of the conventional device.

FIG. 8 is a conceptual diagram of a conventional device.

FIG. 9 is a conceptual diagram of another conventional device.

[Explanation of symbols]

1: Breaking / stretching device, 2: Extension stage, 3:
Lower clamp, 4… Upper clamp, 9… Wafer,
10 dicing sheet, 13 recess, 21 hard adapter, 22 elastic adapter

Claims (4)

[Claims] 1. A wafer breaking / stretching apparatus for breaking / stretching a full-cut dicing or half-cut dicing wafer on an extension stage, comprising: a recess provided on an upper surface of the extension stage; A wafer breaking / stretching device, comprising: 2. The wafer breaking / stretching apparatus according to claim 1, wherein a hard adapter and an elastic adapter are prepared as the adapter. 3. A method of breaking / stretching a wafer which breaks / stretches a full-cut dicing or half-cut dicing wafer, wherein a hard adapter is used to break / stretch the full-cut dicing wafer. A wafer breaking / stretching method, comprising using an elastic adapter when breaking / stretching a cut dicing wafer. 4. A concave portion is formed on an upper surface of an extension stage on which the wafer is set, and the hard adapter or the elastic adapter is accommodated in the concave portion in accordance with full-cut dicing and half-cut dicing. 4. The method for breaking and stretching a wafer according to claim 3, wherein: