AU2001271923A1 - Apparatus and method for processing a microelectronic workpiece using metrology - Google Patents
Apparatus and method for processing a microelectronic workpiece using metrologyInfo
- Publication number
- AU2001271923A1 AU2001271923A1 AU2001271923A AU7192301A AU2001271923A1 AU 2001271923 A1 AU2001271923 A1 AU 2001271923A1 AU 2001271923 A AU2001271923 A AU 2001271923A AU 7192301 A AU7192301 A AU 7192301A AU 2001271923 A1 AU2001271923 A1 AU 2001271923A1
- Authority
- AU
- Australia
- Prior art keywords
- metrology
- processing
- microelectronic workpiece
- microelectronic
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10P72/0456—
-
- H10P72/0432—
-
- H10P72/0468—
-
- H10P72/0472—
-
- H10P72/0604—
-
- H10P72/0612—
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/612,176 US6747734B1 (en) | 2000-07-08 | 2000-07-08 | Apparatus and method for processing a microelectronic workpiece using metrology |
| US09612176 | 2000-07-08 | ||
| PCT/US2001/021579 WO2002004886A1 (en) | 2000-07-08 | 2001-07-09 | Apparatus and method for processing a microelectronic workpiece using metrology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001271923A1 true AU2001271923A1 (en) | 2002-01-21 |
Family
ID=24452047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001271923A Abandoned AU2001271923A1 (en) | 2000-07-08 | 2001-07-09 | Apparatus and method for processing a microelectronic workpiece using metrology |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6747734B1 (en) |
| AU (1) | AU2001271923A1 (en) |
| TW (1) | TWI225547B (en) |
| WO (1) | WO2002004886A1 (en) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| JP4219562B2 (en) | 1999-04-13 | 2009-02-04 | セミトゥール・インコーポレイテッド | System for electrochemical processing of workpieces |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6428673B1 (en) * | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
| WO2002004887A1 (en) | 2000-07-08 | 2002-01-17 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| US6747734B1 (en) * | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
| JP4644926B2 (en) * | 2000-10-13 | 2011-03-09 | ソニー株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| US7123978B2 (en) * | 2000-12-27 | 2006-10-17 | Insyst Ltd. | Method for dynamically targeting a batch process |
| DE10141051A1 (en) * | 2001-08-22 | 2003-03-06 | Leica Microsystems | Arrangement and method for inspection of unstructured wafers |
| US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US20030074098A1 (en) * | 2001-09-18 | 2003-04-17 | Cheung Robin W. | Integrated equipment set for forming an interconnect on a substrate |
| US6991710B2 (en) | 2002-02-22 | 2006-01-31 | Semitool, Inc. | Apparatus for manually and automatically processing microelectronic workpieces |
| US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
| US6842661B2 (en) * | 2002-09-30 | 2005-01-11 | Advanced Micro Devices, Inc. | Process control at an interconnect level |
| US7050879B1 (en) * | 2003-04-03 | 2006-05-23 | Advanced Micro Devices, Inc. | Adjusting a sampling protocol in an adaptive control process |
| DE10346026B4 (en) * | 2003-10-02 | 2011-01-05 | Advanced Micro Devices, Inc., Sunnyvale | A method of controlling the formation of conductive structures in a dielectric layer of a microstructure component |
| US7451011B2 (en) * | 2004-08-27 | 2008-11-11 | Tokyo Electron Limited | Process control using physical modules and virtual modules |
| US7212878B2 (en) * | 2004-08-27 | 2007-05-01 | Tokyo Electron Limited | Wafer-to-wafer control using virtual modules |
| WO2006055363A2 (en) * | 2004-11-12 | 2006-05-26 | Semitool, Inc. | Modular tool unit for processing microelectronic workpieces |
| US20060154385A1 (en) * | 2005-01-07 | 2006-07-13 | Ravinder Aggarwal | Fabrication pathway integrated metrology device |
| US20060194400A1 (en) * | 2005-01-21 | 2006-08-31 | Cooper James A | Method for fabricating a semiconductor device |
| US7305320B2 (en) * | 2006-02-15 | 2007-12-04 | International Business Machines Corporation | Metrology tool recipe validator using best known methods |
| CN101454486B (en) * | 2006-04-04 | 2013-03-13 | 索罗能源公司 | Composition control for roll-to-roll processing photovoltaic films |
| US20070227633A1 (en) * | 2006-04-04 | 2007-10-04 | Basol Bulent M | Composition control for roll-to-roll processed photovoltaic films |
| US8204721B2 (en) * | 2009-06-29 | 2012-06-19 | Sentinel Ic Technologies, Inc. | Apparatus and method for emulation of process variation induced in split process semiconductor wafers |
| JP2012073155A (en) * | 2010-09-29 | 2012-04-12 | Hitachi High-Technologies Corp | Magnetic disk inspection device and inspection method |
| US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
| GB2493340A (en) | 2011-07-28 | 2013-02-06 | St Microelectronics Res & Dev | Address mapping of boot transactions between dies in a system in package |
| US9478408B2 (en) | 2014-06-06 | 2016-10-25 | Lam Research Corporation | Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging |
| US10081869B2 (en) | 2014-06-10 | 2018-09-25 | Lam Research Corporation | Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates |
| US10047438B2 (en) | 2014-06-10 | 2018-08-14 | Lam Research Corporation | Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas |
| CN109916301B (en) * | 2019-03-27 | 2021-03-16 | 青岛小鸟看看科技有限公司 | A volume measurement method and depth camera module |
| CN110067012B (en) * | 2019-06-04 | 2023-05-12 | 大连达利凯普科技有限公司 | Cyanide-free gold plating equipment for single-layer capacitors |
| US12449386B2 (en) | 2023-09-12 | 2025-10-21 | Kla Corporation | Forward library based seeding for efficient X-ray scatterometry measurements |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU8459282A (en) | 1982-04-16 | 1983-11-04 | Baardson A.B. | Power plant |
| EP0108175B1 (en) | 1982-11-02 | 1988-01-13 | Sumitomo Metal Industries, Ltd. | Process for producing alloy steel powder |
| US5393624A (en) * | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
| US5096550A (en) * | 1990-10-15 | 1992-03-17 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for spatially uniform electropolishing and electrolytic etching |
| US5270222A (en) * | 1990-12-31 | 1993-12-14 | Texas Instruments Incorporated | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
| US5363171A (en) * | 1993-07-29 | 1994-11-08 | The United States Of America As Represented By The Director, National Security Agency | Photolithography exposure tool and method for in situ photoresist measurments and exposure control |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US6194628B1 (en) | 1995-09-25 | 2001-02-27 | Applied Materials, Inc. | Method and apparatus for cleaning a vacuum line in a CVD system |
| US6187072B1 (en) | 1995-09-25 | 2001-02-13 | Applied Materials, Inc. | Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions |
| US6045618A (en) | 1995-09-25 | 2000-04-04 | Applied Materials, Inc. | Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment |
| US6193802B1 (en) | 1995-09-25 | 2001-02-27 | Applied Materials, Inc. | Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment |
| US6051284A (en) | 1996-05-08 | 2000-04-18 | Applied Materials, Inc. | Chamber monitoring and adjustment by plasma RF metrology |
| US6004828A (en) * | 1997-09-30 | 1999-12-21 | Semitool, Inc, | Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| US5948203A (en) * | 1996-07-29 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring |
| US5924058A (en) | 1997-02-14 | 1999-07-13 | Applied Materials, Inc. | Permanently mounted reference sample for a substrate measurement tool |
| TW383414B (en) * | 1997-03-05 | 2000-03-01 | Tokyo Electron Ltd | Photoresist agent processing method and photoresist agent processing system and evaluation method and processing apparatus for photoresist agent film |
| US6017437A (en) | 1997-08-22 | 2000-01-25 | Cutek Research, Inc. | Process chamber and method for depositing and/or removing material on a substrate |
| US6110011A (en) | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
| US5900633A (en) * | 1997-12-15 | 1999-05-04 | On-Line Technologies, Inc | Spectrometric method for analysis of film thickness and composition on a patterned sample |
| TW444275B (en) * | 1998-01-13 | 2001-07-01 | Toshiba Corp | Processing device, laser annealing device, laser annealing method, manufacturing device and substrate manufacturing device for panel display |
| US6168693B1 (en) * | 1998-01-22 | 2001-01-02 | International Business Machines Corporation | Apparatus for controlling the uniformity of an electroplated workpiece |
| AU2233399A (en) * | 1998-02-12 | 1999-08-30 | Acm Research, Inc. | Plating apparatus and method |
| US6331490B1 (en) * | 1998-03-13 | 2001-12-18 | Semitool, Inc. | Process for etching thin-film layers of a workpiece used to form microelectric circuits or components |
| US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
| US6208751B1 (en) | 1998-03-24 | 2001-03-27 | Applied Materials, Inc. | Cluster tool |
| US6132289A (en) * | 1998-03-31 | 2000-10-17 | Lam Research Corporation | Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
| US6025600A (en) | 1998-05-29 | 2000-02-15 | International Business Machines Corporation | Method for astigmatism correction in charged particle beam systems |
| US6447668B1 (en) * | 1998-07-09 | 2002-09-10 | Acm Research, Inc. | Methods and apparatus for end-point detection |
| US6122046A (en) | 1998-10-02 | 2000-09-19 | Applied Materials, Inc. | Dual resolution combined laser spot scanning and area imaging inspection |
| US6280289B1 (en) | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| US6159073A (en) | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| JP4484370B2 (en) | 1998-11-02 | 2010-06-16 | アプライド マテリアルズ インコーポレイテッド | Method for determining an end point for chemical mechanical polishing of a metal layer on a substrate and apparatus for polishing a metal layer of a substrate |
| US6201240B1 (en) | 1998-11-04 | 2001-03-13 | Applied Materials, Inc. | SEM image enhancement using narrow band detection and color assignment |
| US6303931B1 (en) | 1998-11-17 | 2001-10-16 | Applied Materials, Inc. | Method for determining a profile quality grade of an inspected feature |
| US6283692B1 (en) | 1998-12-01 | 2001-09-04 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
| US6247998B1 (en) | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
| US6190234B1 (en) | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
| US6690473B1 (en) * | 1999-02-01 | 2004-02-10 | Sensys Instruments Corporation | Integrated surface metrology |
| US6244931B1 (en) | 1999-04-02 | 2001-06-12 | Applied Materials, Inc. | Buffer station on CMP system |
| US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6117780A (en) * | 1999-04-22 | 2000-09-12 | Mosel Vitelic Inc. | Chemical mechanical polishing method with in-line thickness detection |
| US6556949B1 (en) | 1999-05-18 | 2003-04-29 | Applied Materials, Inc. | Semiconductor processing techniques |
| US6303395B1 (en) | 1999-06-01 | 2001-10-16 | Applied Materials, Inc. | Semiconductor processing techniques |
| US6456894B1 (en) | 1999-06-01 | 2002-09-24 | Applied Materials, Inc. | Semiconductor processing techniques |
| EP1058173A3 (en) | 1999-06-01 | 2004-06-30 | Applied Materials, Inc. | Semiconductor processing techniques |
| US6238539B1 (en) | 1999-06-25 | 2001-05-29 | Hughes Electronics Corporation | Method of in-situ displacement/stress control in electroplating |
| US6255222B1 (en) | 1999-08-24 | 2001-07-03 | Applied Materials, Inc. | Method for removing residue from substrate processing chamber exhaust line for silicon-oxygen-carbon deposition process |
| US6318384B1 (en) | 1999-09-24 | 2001-11-20 | Applied Materials, Inc. | Self cleaning method of forming deep trenches in silicon substrates |
| US6277194B1 (en) | 1999-10-21 | 2001-08-21 | Applied Materials, Inc. | Method for in-situ cleaning of surfaces in a substrate processing chamber |
| US6284622B1 (en) | 1999-10-25 | 2001-09-04 | Advanced Micro Devices, Inc. | Method for filling trenches |
| US6270634B1 (en) * | 1999-10-29 | 2001-08-07 | Applied Materials, Inc. | Method for plasma etching at a high etch rate |
| US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| US6309276B1 (en) | 2000-02-01 | 2001-10-30 | Applied Materials, Inc. | Endpoint monitoring with polishing rate change |
| US6511898B1 (en) | 2000-05-24 | 2003-01-28 | Advanced Micro Devices Inc. | Method for controlling deposition parameters based on polysilicon grain size feedback |
| US6486036B1 (en) * | 2000-06-28 | 2002-11-26 | Advanced Micro Devices, Inc. | Method and apparatus for process control of alignment in dual damascene processes |
| WO2002004887A1 (en) | 2000-07-08 | 2002-01-17 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| US6747734B1 (en) | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
| US6428673B1 (en) * | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
| US6444481B1 (en) | 2001-07-02 | 2002-09-03 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a plating process |
| US6534328B1 (en) | 2001-07-19 | 2003-03-18 | Advanced Micro Devices, Inc. | Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same |
| KR20060024792A (en) | 2003-06-06 | 2006-03-17 | 세미툴,인크 | Methods and Systems for Processing Microfeature Workpieces with Flow Agitators and / or Multiple Electrodes |
| US7393439B2 (en) * | 2003-06-06 | 2008-07-01 | Semitool, Inc. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
-
2000
- 2000-07-08 US US09/612,176 patent/US6747734B1/en not_active Expired - Lifetime
-
2001
- 2001-07-09 WO PCT/US2001/021579 patent/WO2002004886A1/en not_active Ceased
- 2001-07-09 AU AU2001271923A patent/AU2001271923A1/en not_active Abandoned
- 2001-10-02 TW TW090116708A patent/TWI225547B/en not_active IP Right Cessation
-
2003
- 2003-10-14 US US10/685,306 patent/US7161689B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050107971A1 (en) | 2005-05-19 |
| WO2002004886A1 (en) | 2002-01-17 |
| TWI225547B (en) | 2004-12-21 |
| US7161689B2 (en) | 2007-01-09 |
| US6747734B1 (en) | 2004-06-08 |
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