NO20011219D0 - Ikke-sirkulære miniatyrgjennomføringer for elektronikk- kretskort - Google Patents

Ikke-sirkulære miniatyrgjennomføringer for elektronikk- kretskort

Info

Publication number: NO20011219D0
Authority: NO; Norway
Prior art keywords: transmissions; electronic circuit; circuit boards; circular miniature; miniature
Prior art date: 1998-09-10

Application number

NO20011219A

Other languages

English (en)

Other versions

NO20011219L (no

Inventor

Martin A Cotton

Original Assignee

Viasystems Group Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-09-10

Filing date

2001-03-09

Publication date

2001-03-09

2001-03-09 Application filed by Viasystems Group Inc filed Critical Viasystems Group Inc

2001-03-09 Publication of NO20011219D0 publication Critical patent/NO20011219D0/no

2001-05-04 Publication of NO20011219L publication Critical patent/NO20011219L/no

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H10W42/20—

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Structure Of Printed Boards (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Manufacturing Of Printed Wiring (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Laminated Bodies (AREA)
Multi-Conductor Connections (AREA)

NO20011219A 1998-09-10 2001-03-09 Ikke-sirkul¶re miniatyrgjennomföringer for elektronikk- kretskort NO20011219L (no)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US9973098P	1998-09-10	1998-09-10
PCT/US1999/020418 WO2000016443A1 (en)	1998-09-10	1999-09-07	Non-circular micro-via

Publications (2)

Publication Number	Publication Date
NO20011219D0 true NO20011219D0 (no)	2001-03-09
NO20011219L NO20011219L (no)	2001-05-04

Family

ID=22276347

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO20011219A NO20011219L (no)	1998-09-10	2001-03-09	Ikke-sirkul¶re miniatyrgjennomföringer for elektronikk- kretskort

Country Status (15)

Country	Link
EP (1)	EP1127387B1 (no)
JP (1)	JP2002525854A (no)
KR (3)	KR20010086372A (no)
CN (1)	CN1133240C (no)
AU (2)	AU5812099A (no)
BR (1)	BR9913588A (no)
CA (1)	CA2343445A1 (no)
DE (1)	DE69934814T2 (no)
EA (1)	EA003157B1 (no)
ES (1)	ES2281188T3 (no)
IL (1)	IL141826A0 (no)
NO (1)	NO20011219L (no)
PL (1)	PL346561A1 (no)
TR (1)	TR200100713T2 (no)
WO (2)	WO2000016443A1 (no)

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DE10052532C2 (de) *	2000-10-23	2002-11-14	Conducta Endress & Hauser	Leiterplatte mit einer Eingangsschaltung zur Aufnahme und Verarbeitung eines elektrischen Signals sowie Verwendung der Leiterplatte
EP1356531A1 (en) *	2001-01-24	2003-10-29	Koninklijke Philips Electronics N.V.	Method of producing a track on a substrate
DE10219388A1 (de)	2002-04-30	2003-11-20	Siemens Ag	Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat
US8129628B2 (en)	2005-10-31	2012-03-06	Sharp Kabushiki Kaisha	Multilayer wiring board and method for manufacturing multilayer wiring board
JP2009033114A (ja) *	2007-06-29	2009-02-12	Tdk Corp	電子モジュール、及び電子モジュールの製造方法
DE102009019782A1 (de)	2009-05-02	2010-11-04	Valeo Schalter Und Sensoren Gmbh	Verfahren zur Herstellung von durchkontaktierbaren Leiterplatten
JP2011061021A (ja) *	2009-09-10	2011-03-24	Kyokutoku Kagi Kofun Yugenkoshi	非円柱ビア構造及びこのビア構造を有する伝熱促進基板
US8488329B2 (en)	2010-05-10	2013-07-16	International Business Machines Corporation	Power and ground vias for power distribution systems
US8748750B2 (en)	2011-07-08	2014-06-10	Honeywell International Inc.	Printed board assembly interface structures
WO2014108744A1 (en) *	2013-01-09	2014-07-17	Freescale Semiconductor, Inc.	Electronic high frequency device and manufacturing method
KR102128508B1 (ko) *	2013-10-08	2020-06-30	엘지이노텍 주식회사	인쇄회로기판
KR101507268B1 (ko) *	2014-01-10	2015-03-30	(주)인터플렉스	연성회로기판의 그라운드 확장 구조
US20170064821A1 (en) *	2015-08-31	2017-03-02	Kristof Darmawikarta	Electronic package and method forming an electrical package
US10516207B2 (en)	2017-05-17	2019-12-24	Nxp B.V.	High frequency system, communication link
FR3077158B1 (fr) *	2018-01-25	2021-02-26	Commissariat Energie Atomique	Puce electronique a face arriere protegee par une structure de fragilisation amelioree
EP3582233B1 (en) *	2018-06-13	2021-07-28	Airbus Operations, S.L.U.	Method for printed cable installation in harness systems for aircrafts and a composite element with an integrated harness system
WO2020180149A1 (ko)	2019-03-07	2020-09-10	에스케이씨 주식회사	패키징 기판 및 이를 포함하는 반도체 장치
EP3905315A4 (en)	2019-03-07	2022-10-19	Absolics Inc.	PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE WITH IT
KR102653023B1 (ko)	2019-03-12	2024-03-28	앱솔릭스 인코포레이티드	패키징 기판 및 이를 포함하는 반도체 장치
CN113261093B (zh)	2019-03-12	2024-04-16	爱玻索立克公司	半导体封装用基板及其制备方法以及半导体装置
KR102537005B1 (ko)	2019-03-12	2023-05-26	앱솔릭스 인코포레이티드	유리를 포함하는 기판의 적재 카세트 및 이를 적용한 기판의 적재방법
US11967542B2 (en)	2019-03-12	2024-04-23	Absolics Inc.	Packaging substrate, and semiconductor device comprising same
PL3910667T3 (pl)	2019-03-29	2025-11-12	Absolics Inc.	Opakowaniowe podłoże szklane dla półprzewodnika, podłoże opakowaniowe dla półprzewodnika i urządzenie półprzewodnikowe
CN112312648B (zh) *	2019-07-31	2025-08-01	深南电路股份有限公司	线路板及其制作方法
WO2021040178A1 (ko)	2019-08-23	2021-03-04	에스케이씨 주식회사	패키징 기판 및 이를 포함하는 반도체 장치
KR20220003342A (ko)	2020-07-01	2022-01-10	삼성전기주식회사	전자 소자 패키지 및 이의 제조방법
US11756897B2 (en) *	2021-05-05	2023-09-12	STATS ChipPAC Pte. Ltd.	Semiconductor device and method of forming a slot in EMI shielding with improved removal depth
US12328811B2 (en)	2021-07-27	2025-06-10	Samsung Electronics Co., Ltd	Insulating member arrangement structure and electronic device including the same

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CA939831A (en) *	1969-03-27	1974-01-08	Frederick W. Schneble (Jr.)	Plated through hole printed circuit boards
US5347086A (en) *	1992-03-24	1994-09-13	Microelectronics And Computer Technology Corporation	Coaxial die and substrate bumps
US5304743A (en) *	1992-05-12	1994-04-19	Lsi Logic Corporation	Multilayer IC semiconductor package
JP3241139B2 (ja) *	1993-02-04	2001-12-25	三菱電機株式会社	フィルムキャリア信号伝送線路
US5401912A (en) *	1993-06-07	1995-03-28	St Microwave Corp., Arizona Operations	Microwave surface mount package
US5359767A (en) *	1993-08-26	1994-11-01	International Business Machines Corporation	Method of making multilayered circuit board
JPH07235775A (ja) *	1994-02-21	1995-09-05	Mitsubishi Electric Corp	多層プリント配線基板
US5773195A (en) *	1994-12-01	1998-06-30	International Business Machines Corporation	Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
EP0916237B1 (de) *	1996-07-31	2001-01-17	Dyconex Patente	Verfahren zur herstellung von verbindungsleitern
US5724727A (en) *	1996-08-12	1998-03-10	Motorola, Inc.	Method of forming electronic component

1999
- 1999-09-07 KR KR1020017002973A patent/KR20010086372A/ko not_active Ceased
- 1999-09-07 WO PCT/US1999/020418 patent/WO2000016443A1/en not_active Ceased
- 1999-09-07 DE DE69934814T patent/DE69934814T2/de not_active Expired - Fee Related
- 1999-09-07 AU AU58120/99A patent/AU5812099A/en not_active Abandoned
- 1999-09-07 CN CN998107409A patent/CN1133240C/zh not_active Expired - Fee Related
- 1999-09-07 IL IL14182699A patent/IL141826A0/xx unknown
- 1999-09-07 ES ES99945538T patent/ES2281188T3/es not_active Expired - Lifetime
- 1999-09-07 PL PL99346561A patent/PL346561A1/xx unknown
- 1999-09-07 EA EA200100329A patent/EA003157B1/ru active IP Right Revival
- 1999-09-07 BR BR9913588-4A patent/BR9913588A/pt not_active IP Right Cessation
- 1999-09-07 TR TR2001/00713T patent/TR200100713T2/xx unknown
- 1999-09-07 CA CA002343445A patent/CA2343445A1/en not_active Abandoned
- 1999-09-07 EP EP99945538A patent/EP1127387B1/en not_active Expired - Lifetime
- 1999-09-07 JP JP2000570871A patent/JP2002525854A/ja active Pending
- 1999-09-09 AU AU58209/99A patent/AU5820999A/en not_active Withdrawn
- 1999-09-09 WO PCT/US1999/020830 patent/WO2000014771A2/en not_active Ceased
2001
- 2001-03-09 NO NO20011219A patent/NO20011219L/no not_active Application Discontinuation
2003
- 2003-08-25 KR KR10-2003-0058610A patent/KR100455021B1/ko not_active Expired - Fee Related
- 2003-08-25 KR KR10-2003-0058608A patent/KR20030074544A/ko not_active Ceased

Also Published As

Publication number	Publication date
KR20010086372A (ko)	2001-09-10
AU5820999A (en)	2000-03-27
BR9913588A (pt)	2001-06-05
EA003157B1 (ru)	2003-02-27
KR20030074545A (ko)	2003-09-19
CN1317163A (zh)	2001-10-10
DE69934814T2 (de)	2007-10-11
HK1042780A1 (en)	2002-08-23
EP1127387A1 (en)	2001-08-29
EP1127387B1 (en)	2007-01-10
AU5812099A (en)	2000-04-03
WO2000016443A1 (en)	2000-03-23
CA2343445A1 (en)	2000-03-23
NO20011219L (no)	2001-05-04
WO2000014771A2 (en)	2000-03-16
TR200100713T2 (tr)	2001-10-22
CN1133240C (zh)	2003-12-31
KR20030074544A (ko)	2003-09-19
PL346561A1 (en)	2002-02-11
ES2281188T3 (es)	2007-09-16
EP1127387A4 (en)	2004-05-26
IL141826A0 (en)	2002-03-10
JP2002525854A (ja)	2002-08-13
EA200100329A1 (ru)	2001-10-22
KR100455021B1 (ko)	2004-11-06
DE69934814D1 (de)	2007-02-22

Publication	Publication Date	Title
NO20011219D0 (no)	2001-03-09	Ikke-sirkulære miniatyrgjennomføringer for elektronikk- kretskort
DE69943290D1 (de)	2011-04-28	Gedruckte Leiterplatte
AU6483199A (en)	2000-06-05	Electronic circuit board
DE69911078D1 (de)	2003-10-16	Elektronische Komponenten
DE69942711D1 (de)	2010-10-07	Mehrschichtige gedruckte Leiterplatte
DE60045566D1 (de)	2011-03-03	Mehrschicht-Leiterplatte
GB9930051D0 (en)	2000-02-09	Electronic circuit
DE60043603D1 (de)	2010-02-11	Verbinder für gedruckte Leiterplatten
DE69925880D1 (de)	2005-07-28	Verbindungsverfahren für Leiterplatte
GB2360404B (en)	2004-03-10	Electronic circuit
DE60039569D1 (de)	2008-09-04	Gedruckte Leiterplatte
GB2363257B (en)	2002-05-22	Printed circuit board
IL151278A0 (en)	2003-04-10	Printed circuit board assembly
AU2003275432A8 (en)	2004-05-04	Circuit board standoff
SG91855A1 (en)	2002-10-15	Circuit board assembly
GB0111267D0 (en)	2001-06-27	Electronic circuit
DE69939157D1 (de)	2008-09-04	Gedruckte Leiterplatte
FI19992062L (fi)	1999-09-27	Painettu piirilevy
GB9930675D0 (en)	2000-02-16	Electronic circuit
GB0115221D0 (en)	2001-08-15	Electronic circuit
DE59903853D1 (de)	2003-01-30	Elektronische schaltungsanordnung
GB0010730D0 (en)	2000-06-28	Printed circuit boards
DE69922271D1 (de)	2004-12-30	Leiterplattenherstellungsmethode
FI981351L (fi)	1999-12-12	Elektroninen ohjauspiiri
EP1042092A4 (en)	2002-01-02	COMPONENT OF A BOARD

Legal Events

Date	Code	Title	Description
2005-12-19	FC2A	Withdrawal, rejection or dismissal of laid open patent application