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MX2019014822A - Sustrato de adhesión/unión y método para proteger superficies destinadas a la unión de alambre. - Google Patents

Sustrato de adhesión/unión y método para proteger superficies destinadas a la unión de alambre.

Info

Publication number
MX2019014822A
MX2019014822A MX2019014822A MX2019014822A MX2019014822A MX 2019014822 A MX2019014822 A MX 2019014822A MX 2019014822 A MX2019014822 A MX 2019014822A MX 2019014822 A MX2019014822 A MX 2019014822A MX 2019014822 A MX2019014822 A MX 2019014822A
Authority
MX
Mexico
Prior art keywords
copper surfaces
copper
corrosion inhibitor
bonding
same
Prior art date
Application number
MX2019014822A
Other languages
English (en)
Inventor
Joachim Ganz
Uwe Dreissigacker
Isabell Buresch
Boris Mizaikoff
Dervis Türkmen
Original Assignee
Doduco Solutions Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco Solutions Gmbh filed Critical Doduco Solutions Gmbh
Publication of MX2019014822A publication Critical patent/MX2019014822A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/141—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • H10W70/458—
    • H10W70/69—
    • H10W90/701—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W70/421—
    • H10W70/465—
    • H10W72/01515—
    • H10W72/01571—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/5475—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Se describe un sustrato de soldadura que tiene una almohadilla de contacto (4a) hecha de cobre o una aleación a base de cobre para unir el alambre (5), estando cubierta la almohadilla de contacto (4a) con una capa de inhibidor de corrosión que contiene alifatos que contienen nitrógeno como sustancia activa y un heterocíclico aromático que contiene nitrógeno como una sustancia activa adicional. De acuerdo con la invención, se proporciona que la capa inhibidora de la corrosión, sin ningún contenido de agua, contiene 5% en peso o más de derivado de urea o 3% en peso o más de trifenilguanidina o 2% en peso o más de derivado de tetrazol o 5 % en peso o más de 1-H-benzotriazol o 5% en peso o más de benzimidazol. Además, se describe un módulo electrónico que tiene dicho sustrato de soldadura y un método de protección contra la corrosión de superficies hechas de cobre o una aleación a base de cobre prevista para la soldadura de cables. (Fig. 1).
MX2019014822A 2017-06-22 2018-06-05 Sustrato de adhesión/unión y método para proteger superficies destinadas a la unión de alambre. MX2019014822A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017113871.4A DE102017113871A1 (de) 2017-06-22 2017-06-22 Bondsubstrat sowie Verfahren zum Schützen von zum Drahtbonden vorgesehenen Oberflächen
PCT/EP2018/064775 WO2018234032A1 (de) 2017-06-22 2018-06-05 Korrosionsinihibitorschicht für kupferoberflächen auf bondsubstraten sowie verfahren zum schützen von zum drahtbonden vorgesehenen kupferoberflächen mit derselben

Publications (1)

Publication Number Publication Date
MX2019014822A true MX2019014822A (es) 2020-07-14

Family

ID=62563139

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019014822A MX2019014822A (es) 2017-06-22 2018-06-05 Sustrato de adhesión/unión y método para proteger superficies destinadas a la unión de alambre.

Country Status (8)

Country Link
US (1) US20200123665A1 (es)
EP (1) EP3642387A1 (es)
JP (1) JP2020524906A (es)
KR (1) KR20200012910A (es)
CN (1) CN110914472A (es)
DE (1) DE102017113871A1 (es)
MX (1) MX2019014822A (es)
WO (1) WO2018234032A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112164685B (zh) * 2020-08-31 2023-03-31 浙江大学 一种有机包覆抗腐的键合银丝及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
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JPS63261735A (ja) * 1987-04-17 1988-10-28 Hitachi Cable Ltd リ−ドフレ−ム
GB2204864A (en) * 1987-04-29 1988-11-23 Ciba Geigy Ag Corrosion inhibition
US5141675A (en) * 1990-10-15 1992-08-25 Calgon Corporation Novel polyphosphate/azole compositions and the use thereof as copper and copper alloy corrosion inhibitors
JPH07142627A (ja) * 1993-11-18 1995-06-02 Fujitsu Ltd 半導体装置及びその製造方法
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
JP4740754B2 (ja) * 2006-01-27 2011-08-03 株式会社大和化成研究所 変色防止剤組成物
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
DE102007040065A1 (de) * 2007-08-24 2009-02-26 Ormecon Gmbh Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung
EP2190014A1 (en) * 2007-09-13 2010-05-26 Mitsui Mining & Smelting Co., Ltd Lead frame and lead frame manufacturing method
US8253233B2 (en) * 2008-02-14 2012-08-28 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
US7658617B1 (en) * 2009-02-02 2010-02-09 International Business Machines Corporation Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer
JP2014037585A (ja) * 2012-08-17 2014-02-27 Fujifilm Corp 酸化防止処理方法、これを用いた半導体製品の製造方法
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
DE102015101527A1 (de) 2015-02-03 2016-08-04 Doduco Gmbh Aluminium-Kupferverbundhalbzeug für die Elektrotechnik und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
US20200123665A1 (en) 2020-04-23
DE102017113871A1 (de) 2018-12-27
KR20200012910A (ko) 2020-02-05
WO2018234032A1 (de) 2018-12-27
JP2020524906A (ja) 2020-08-20
EP3642387A1 (de) 2020-04-29
CN110914472A (zh) 2020-03-24

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