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MX2013008146A - Mejoras en tecnologia de revestimiento. - Google Patents

Mejoras en tecnologia de revestimiento.

Info

Publication number
MX2013008146A
MX2013008146A MX2013008146A MX2013008146A MX2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A
Authority
MX
Mexico
Prior art keywords
platinum
bath
coating technology
electroplating bath
source
Prior art date
Application number
MX2013008146A
Other languages
English (en)
Inventor
Laura Ashfield
Rein Berzins Allan
Alan Boardman
Geoffrey Warren Stephen
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Publication of MX2013008146A publication Critical patent/MX2013008146A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La presente invención proporciona un baño de galvanoplastia de platino acuoso que comprende: a) una fuente de iones de platino; y b) una fuente de aniones polifosfato, y en donde el baño tiene un pH en la variación de aproximadamente 2 a aproximadamente 9 cuando está en uso o listo para utilizarse. El baño de galvanoplastia de platino acuoso puede comprender opcionalmente uno o más niveladores. La invención también proporciona el uso del baño de galvanoplastia de platino y sales de platino adecuadas para ser utilizados en el baño.
MX2013008146A 2011-01-12 2012-01-12 Mejoras en tecnologia de revestimiento. MX2013008146A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1100447.0A GB201100447D0 (en) 2011-01-12 2011-01-12 Improvements in coating technology
US201161437281P 2011-01-28 2011-01-28
PCT/GB2012/050057 WO2012095667A2 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Publications (1)

Publication Number Publication Date
MX2013008146A true MX2013008146A (es) 2013-12-16

Family

ID=43664099

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013008146A MX2013008146A (es) 2011-01-12 2012-01-12 Mejoras en tecnologia de revestimiento.

Country Status (8)

Country Link
US (1) US20130334056A1 (es)
EP (1) EP2663670A2 (es)
CN (1) CN103492618A (es)
BR (1) BR112013017516A2 (es)
GB (1) GB201100447D0 (es)
MX (1) MX2013008146A (es)
SG (2) SG191820A1 (es)
WO (1) WO2012095667A2 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152953A (zh) * 2014-08-29 2014-11-19 昆明贵金属研究所 磷酸槽电镀铂用的主盐及其合成方法
CN106661735B (zh) * 2014-09-04 2019-12-10 日本高纯度化学株式会社 钯镀液和使用该钯镀液得到的钯覆膜
CN105132964A (zh) * 2015-09-21 2015-12-09 无锡清杨机械制造有限公司 一种磷酸盐体系的铂电镀液及其电镀方法
CN105386096A (zh) * 2015-09-21 2016-03-09 无锡清杨机械制造有限公司 一种碱性镀Pt的电镀液及其电镀方法
CN105154931A (zh) * 2015-09-21 2015-12-16 无锡清杨机械制造有限公司 一种二硝基硫酸二氢化铂的铂电镀液及其电镀方法
CN106435666B (zh) * 2016-11-22 2018-12-18 中国科学院金属研究所 一种利用中性镀铂液制备高温合金表面电沉积层的方法
CN107235479B (zh) * 2017-05-19 2019-08-09 王晓波 磷酸氢根四氨合铂的合成方法
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
CN113423194B (zh) * 2021-04-27 2023-05-23 厦门理工学院 一种卷对卷铜箔盲孔填孔方法
CN114182315B (zh) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 一种耐腐蚀组合电镀层及电镀方法
CN114411215B (zh) * 2022-03-15 2023-12-05 深圳市顺信精细化工有限公司 一种铂电镀液及电镀方法
GB202217304D0 (en) 2022-11-18 2023-01-04 Johnson Matthey Plc High efficiency platinum electroplating solutions
CN117263151B (zh) * 2023-09-12 2025-07-22 云南贵金属实验室有限公司 一种q盐中间体、制备方法、制备q盐和p盐的方法及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1217170B (de) * 1962-09-05 1966-05-18 Dehydag Gmbh Galvanische Nickelbaeder
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
US4234500A (en) * 1979-03-07 1980-11-18 Engelhard Minerals & Chemicals Corporation Ethylenediamine platinum(II) and 1,2-diamino-cyclohexane platinum(II) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8821005D0 (en) 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
NL9002866A (nl) * 1990-12-24 1992-07-16 Stork Screens Bv Werkwijze voor het vormen van een zeefmateriaal met lage inwendige spanning en aldus verkregen zeefmateriaal.
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP4392640B2 (ja) * 2000-10-11 2010-01-06 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
KR100363011B1 (en) * 2002-03-28 2002-11-30 Hanwha Chemical Corp Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same
DE102008050135B4 (de) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit

Also Published As

Publication number Publication date
SG191820A1 (en) 2013-08-30
EP2663670A2 (en) 2013-11-20
WO2012095667A3 (en) 2013-10-03
US20130334056A1 (en) 2013-12-19
WO2012095667A2 (en) 2012-07-19
GB201100447D0 (en) 2011-02-23
BR112013017516A2 (pt) 2024-01-23
SG10201510015PA (en) 2016-01-28
CN103492618A (zh) 2014-01-01

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