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MX2013008146A - Improvements in coating technology. - Google Patents

Improvements in coating technology.

Info

Publication number
MX2013008146A
MX2013008146A MX2013008146A MX2013008146A MX2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A MX 2013008146 A MX2013008146 A MX 2013008146A
Authority
MX
Mexico
Prior art keywords
platinum
bath
coating technology
electroplating bath
source
Prior art date
Application number
MX2013008146A
Other languages
Spanish (es)
Inventor
Laura Ashfield
Rein Berzins Allan
Alan Boardman
Geoffrey Warren Stephen
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Publication of MX2013008146A publication Critical patent/MX2013008146A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention provides an aqueous platinum electroplating bath comprising: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally comprise one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath.
MX2013008146A 2011-01-12 2012-01-12 Improvements in coating technology. MX2013008146A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1100447.0A GB201100447D0 (en) 2011-01-12 2011-01-12 Improvements in coating technology
US201161437281P 2011-01-28 2011-01-28
PCT/GB2012/050057 WO2012095667A2 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Publications (1)

Publication Number Publication Date
MX2013008146A true MX2013008146A (en) 2013-12-16

Family

ID=43664099

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013008146A MX2013008146A (en) 2011-01-12 2012-01-12 Improvements in coating technology.

Country Status (8)

Country Link
US (1) US20130334056A1 (en)
EP (1) EP2663670A2 (en)
CN (1) CN103492618A (en)
BR (1) BR112013017516A2 (en)
GB (1) GB201100447D0 (en)
MX (1) MX2013008146A (en)
SG (2) SG191820A1 (en)
WO (1) WO2012095667A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152953A (en) * 2014-08-29 2014-11-19 昆明贵金属研究所 Main salt for phosphoric acid tank electroplating platinum and synthetic method thereof
CN106661735B (en) * 2014-09-04 2019-12-10 日本高纯度化学株式会社 Palladium plating solution and palladium coating film obtained using the same
CN105132964A (en) * 2015-09-21 2015-12-09 无锡清杨机械制造有限公司 Platinum electroplating solution for phosphate system and electroplating method adopting platinum electroplating solution
CN105386096A (en) * 2015-09-21 2016-03-09 无锡清杨机械制造有限公司 Alkaline plating Pt electroplating bath and electroplating method thereof
CN105154931A (en) * 2015-09-21 2015-12-16 无锡清杨机械制造有限公司 Platinum electroplating solution comprising dihydrogen dinitrosulfatoplatinate and electroplating method adopting platinum electroplating solution
CN106435666B (en) * 2016-11-22 2018-12-18 中国科学院金属研究所 A method of high-temperature alloy surface deposition layer is prepared using neutral platinum plating solution
CN107235479B (en) * 2017-05-19 2019-08-09 王晓波 The synthetic method of four ammino platinum of hydrogen phosphate
US10612149B1 (en) * 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
CN113423194B (en) * 2021-04-27 2023-05-23 厦门理工学院 Blind hole filling method for roll-to-roll copper foil
CN114182315B (en) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 Corrosion-resistant combined electroplated layer and electroplating method
CN114411215B (en) * 2022-03-15 2023-12-05 深圳市顺信精细化工有限公司 Platinum electroplating solution and electroplating method
GB202217304D0 (en) 2022-11-18 2023-01-04 Johnson Matthey Plc High efficiency platinum electroplating solutions
CN117263151B (en) * 2023-09-12 2025-07-22 云南贵金属实验室有限公司 Q salt intermediate, preparation method, method for preparing Q salt and P salt and application of Q salt intermediate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1217170B (en) * 1962-09-05 1966-05-18 Dehydag Gmbh Galvanic nickel baths
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
US4234500A (en) * 1979-03-07 1980-11-18 Engelhard Minerals & Chemicals Corporation Ethylenediamine platinum(II) and 1,2-diamino-cyclohexane platinum(II) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8821005D0 (en) 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
NL9002866A (en) * 1990-12-24 1992-07-16 Stork Screens Bv METHOD FOR FORMING A LOW INTERNAL STRESS Sieve MATERIAL AND SO THEREFORE OBTAINED Sieve MATERIAL.
JP2001073182A (en) * 1999-07-15 2001-03-21 Boc Group Inc:The Improved acidic copper electroplating solution
JP4392640B2 (en) * 2000-10-11 2010-01-06 石原薬品株式会社 Non-cyanide gold-tin alloy plating bath
KR100363011B1 (en) * 2002-03-28 2002-11-30 Hanwha Chemical Corp Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same
DE102008050135B4 (en) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness

Also Published As

Publication number Publication date
SG191820A1 (en) 2013-08-30
EP2663670A2 (en) 2013-11-20
WO2012095667A3 (en) 2013-10-03
US20130334056A1 (en) 2013-12-19
WO2012095667A2 (en) 2012-07-19
GB201100447D0 (en) 2011-02-23
BR112013017516A2 (en) 2024-01-23
SG10201510015PA (en) 2016-01-28
CN103492618A (en) 2014-01-01

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