[go: up one dir, main page]

SG191820A1 - Improvements in coating technology - Google Patents

Improvements in coating technology Download PDF

Info

Publication number
SG191820A1
SG191820A1 SG2013051248A SG2013051248A SG191820A1 SG 191820 A1 SG191820 A1 SG 191820A1 SG 2013051248 A SG2013051248 A SG 2013051248A SG 2013051248 A SG2013051248 A SG 2013051248A SG 191820 A1 SG191820 A1 SG 191820A1
Authority
SG
Singapore
Prior art keywords
unsubstituted
group
alkyl
substituted
platinum
Prior art date
Application number
SG2013051248A
Other languages
English (en)
Inventor
Laura Ashfield
Allan Rein Berzins
Alan Boardman
Stephen Geoffrey Warren
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Publication of SG191820A1 publication Critical patent/SG191820A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG2013051248A 2011-01-12 2012-01-12 Improvements in coating technology SG191820A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1100447.0A GB201100447D0 (en) 2011-01-12 2011-01-12 Improvements in coating technology
US201161437281P 2011-01-28 2011-01-28
PCT/GB2012/050057 WO2012095667A2 (en) 2011-01-12 2012-01-12 Improvements in coating technology

Publications (1)

Publication Number Publication Date
SG191820A1 true SG191820A1 (en) 2013-08-30

Family

ID=43664099

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013051248A SG191820A1 (en) 2011-01-12 2012-01-12 Improvements in coating technology
SG10201510015PA SG10201510015PA (en) 2011-01-12 2012-01-12 Improvements in coating technology

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201510015PA SG10201510015PA (en) 2011-01-12 2012-01-12 Improvements in coating technology

Country Status (8)

Country Link
US (1) US20130334056A1 (es)
EP (1) EP2663670A2 (es)
CN (1) CN103492618A (es)
BR (1) BR112013017516A2 (es)
GB (1) GB201100447D0 (es)
MX (1) MX2013008146A (es)
SG (2) SG191820A1 (es)
WO (1) WO2012095667A2 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152953A (zh) * 2014-08-29 2014-11-19 昆明贵金属研究所 磷酸槽电镀铂用的主盐及其合成方法
JP6620103B2 (ja) * 2014-09-04 2019-12-11 日本高純度化学株式会社 パラジウムめっき液及びそれを用いて得られたパラジウム皮膜
CN105386096A (zh) * 2015-09-21 2016-03-09 无锡清杨机械制造有限公司 一种碱性镀Pt的电镀液及其电镀方法
CN105132964A (zh) * 2015-09-21 2015-12-09 无锡清杨机械制造有限公司 一种磷酸盐体系的铂电镀液及其电镀方法
CN105154931A (zh) * 2015-09-21 2015-12-16 无锡清杨机械制造有限公司 一种二硝基硫酸二氢化铂的铂电镀液及其电镀方法
CN106435666B (zh) * 2016-11-22 2018-12-18 中国科学院金属研究所 一种利用中性镀铂液制备高温合金表面电沉积层的方法
CN107235479B (zh) * 2017-05-19 2019-08-09 王晓波 磷酸氢根四氨合铂的合成方法
US10612149B1 (en) 2019-09-05 2020-04-07 Chow Sang Sang Jewellery Company Limited Platinum electrodeposition bath and uses thereof
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions
CN113423194B (zh) * 2021-04-27 2023-05-23 厦门理工学院 一种卷对卷铜箔盲孔填孔方法
CN114182315B (zh) * 2022-02-14 2022-05-17 深圳市顺信精细化工有限公司 一种耐腐蚀组合电镀层及电镀方法
CN114411215B (zh) * 2022-03-15 2023-12-05 深圳市顺信精细化工有限公司 一种铂电镀液及电镀方法
GB202217304D0 (en) 2022-11-18 2023-01-04 Johnson Matthey Plc High efficiency platinum electroplating solutions
CN117263151B (zh) * 2023-09-12 2025-07-22 云南贵金属实验室有限公司 一种q盐中间体、制备方法、制备q盐和p盐的方法及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1217170B (de) * 1962-09-05 1966-05-18 Dehydag Gmbh Galvanische Nickelbaeder
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method
US4234500A (en) * 1979-03-07 1980-11-18 Engelhard Minerals & Chemicals Corporation Ethylenediamine platinum(II) and 1,2-diamino-cyclohexane platinum(II) pyrophosphate complexes
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8821005D0 (en) * 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
NL9002866A (nl) * 1990-12-24 1992-07-16 Stork Screens Bv Werkwijze voor het vormen van een zeefmateriaal met lage inwendige spanning en aldus verkregen zeefmateriaal.
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP4392640B2 (ja) * 2000-10-11 2010-01-06 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
KR100363011B1 (en) * 2002-03-28 2002-11-30 Hanwha Chemical Corp Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same
DE102008050135B4 (de) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit

Also Published As

Publication number Publication date
EP2663670A2 (en) 2013-11-20
BR112013017516A2 (pt) 2024-01-23
WO2012095667A3 (en) 2013-10-03
SG10201510015PA (en) 2016-01-28
MX2013008146A (es) 2013-12-16
GB201100447D0 (en) 2011-02-23
WO2012095667A2 (en) 2012-07-19
US20130334056A1 (en) 2013-12-19
CN103492618A (zh) 2014-01-01

Similar Documents

Publication Publication Date Title
SG191820A1 (en) Improvements in coating technology
EP2802687A1 (en) Improvements in coating technology
CN113818053B (zh) 含三价铬的电镀槽液和沉积铬的方法
CN110139948B (zh) 锡镀覆浴液和在衬底的表面上沉积锡或锡合金的方法
KR101779410B1 (ko) 무시아나이드 은 전기도금액
KR101624759B1 (ko) 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물
CN105829583B (zh) 从电解质中沉积铜-锡合金和铜-锡-锌合金
RS60681B1 (sr) Elektrolit za elektrohemijske prevlake
KR102127642B1 (ko) 아민과 폴리아크릴아미드와 비스에폭시드의 반응 생성물을 함유하는 구리 전기도금욕
JP6214355B2 (ja) 電解金めっき液及びそれを用いて得られた金皮膜
JP5583896B2 (ja) パラジウムおよびパラジウム合金の高速めっき方法
TWI234591B (en) An acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same
GB2119402A (en) Improvements in bright palladium electrodesposition
EP0037634A1 (en) Zinc plating baths and additives therefor
US4170526A (en) Electroplating bath and process
RU2334831C2 (ru) Электролит меднения
US6238542B1 (en) Water soluble brighteners for zinc and zinc alloy electrolytes
Radovici et al. Some aspects of copper electrodeposition from pyrophosphate electrolytes
US3170854A (en) Bright nickel plating bath containing a pyridinium or quinolinium phosphate brightener and method of electroplating therewith
TW201343979A (zh) 用於改進滾筒鍍電解質中層厚度分佈之添加物
US3376206A (en) Electrolyte for the electrodeposition of palladium
US4401527A (en) Process for the electrodeposition of palladium
RU2622106C1 (ru) Способ получения дигидрата оксалата железа(+2) из отходов промышленного производства
EP3842572A1 (en) Tin alloy electroplating bath and plating method using same
US2813065A (en) Heterocyclic nitrogen compound containing antimony plating solutions and process