GB201100447D0 - Improvements in coating technology - Google Patents
Improvements in coating technologyInfo
- Publication number
- GB201100447D0 GB201100447D0 GBGB1100447.0A GB201100447A GB201100447D0 GB 201100447 D0 GB201100447 D0 GB 201100447D0 GB 201100447 A GB201100447 A GB 201100447A GB 201100447 D0 GB201100447 D0 GB 201100447D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- platinum
- bath
- coating technology
- electroplating bath
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 7
- 229910052697 platinum Inorganic materials 0.000 abstract 4
- 238000009713 electroplating Methods 0.000 abstract 3
- 229920000388 Polyphosphate Polymers 0.000 abstract 1
- 150000001450 anions Chemical class 0.000 abstract 1
- 150000003057 platinum Chemical class 0.000 abstract 1
- -1 platinum ions Chemical class 0.000 abstract 1
- 239000001205 polyphosphate Substances 0.000 abstract 1
- 235000011176 polyphosphates Nutrition 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1100447.0A GB201100447D0 (en) | 2011-01-12 | 2011-01-12 | Improvements in coating technology |
| US13/979,448 US20130334056A1 (en) | 2011-01-12 | 2012-01-12 | Coating technology |
| EP12700726.8A EP2663670A2 (en) | 2011-01-12 | 2012-01-12 | Improvements in coating technology |
| SG2013051248A SG191820A1 (en) | 2011-01-12 | 2012-01-12 | Improvements in coating technology |
| PCT/GB2012/050057 WO2012095667A2 (en) | 2011-01-12 | 2012-01-12 | Improvements in coating technology |
| MX2013008146A MX2013008146A (es) | 2011-01-12 | 2012-01-12 | Mejoras en tecnologia de revestimiento. |
| SG10201510015PA SG10201510015PA (en) | 2011-01-12 | 2012-01-12 | Improvements in coating technology |
| BR112013017516A BR112013017516A2 (pt) | 2011-01-12 | 2012-01-12 | Banho de galvanização de platina aquoso, sal de platina, e, uso de um banho de galvanização de platina aquoso |
| CN201280005391.5A CN103492618A (zh) | 2011-01-12 | 2012-01-12 | 涂覆技术改进 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1100447.0A GB201100447D0 (en) | 2011-01-12 | 2011-01-12 | Improvements in coating technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB201100447D0 true GB201100447D0 (en) | 2011-02-23 |
Family
ID=43664099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GBGB1100447.0A Ceased GB201100447D0 (en) | 2011-01-12 | 2011-01-12 | Improvements in coating technology |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20130334056A1 (es) |
| EP (1) | EP2663670A2 (es) |
| CN (1) | CN103492618A (es) |
| BR (1) | BR112013017516A2 (es) |
| GB (1) | GB201100447D0 (es) |
| MX (1) | MX2013008146A (es) |
| SG (2) | SG191820A1 (es) |
| WO (1) | WO2012095667A2 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114182315A (zh) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | 一种耐腐蚀组合电镀层及电镀方法 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152953A (zh) * | 2014-08-29 | 2014-11-19 | 昆明贵金属研究所 | 磷酸槽电镀铂用的主盐及其合成方法 |
| CN106661735B (zh) * | 2014-09-04 | 2019-12-10 | 日本高纯度化学株式会社 | 钯镀液和使用该钯镀液得到的钯覆膜 |
| CN105132964A (zh) * | 2015-09-21 | 2015-12-09 | 无锡清杨机械制造有限公司 | 一种磷酸盐体系的铂电镀液及其电镀方法 |
| CN105386096A (zh) * | 2015-09-21 | 2016-03-09 | 无锡清杨机械制造有限公司 | 一种碱性镀Pt的电镀液及其电镀方法 |
| CN105154931A (zh) * | 2015-09-21 | 2015-12-16 | 无锡清杨机械制造有限公司 | 一种二硝基硫酸二氢化铂的铂电镀液及其电镀方法 |
| CN106435666B (zh) * | 2016-11-22 | 2018-12-18 | 中国科学院金属研究所 | 一种利用中性镀铂液制备高温合金表面电沉积层的方法 |
| CN107235479B (zh) * | 2017-05-19 | 2019-08-09 | 王晓波 | 磷酸氢根四氨合铂的合成方法 |
| US10612149B1 (en) * | 2019-09-05 | 2020-04-07 | Chow Sang Sang Jewellery Company Limited | Platinum electrodeposition bath and uses thereof |
| GB202020071D0 (en) | 2020-12-18 | 2021-02-03 | Johnson Matthey Plc | Electroplating solutions |
| CN113423194B (zh) * | 2021-04-27 | 2023-05-23 | 厦门理工学院 | 一种卷对卷铜箔盲孔填孔方法 |
| CN114411215B (zh) * | 2022-03-15 | 2023-12-05 | 深圳市顺信精细化工有限公司 | 一种铂电镀液及电镀方法 |
| GB202217304D0 (en) | 2022-11-18 | 2023-01-04 | Johnson Matthey Plc | High efficiency platinum electroplating solutions |
| CN117263151B (zh) * | 2023-09-12 | 2025-07-22 | 云南贵金属实验室有限公司 | 一种q盐中间体、制备方法、制备q盐和p盐的方法及其应用 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1217170B (de) * | 1962-09-05 | 1966-05-18 | Dehydag Gmbh | Galvanische Nickelbaeder |
| GB1431548A (en) * | 1972-09-21 | 1976-04-07 | Engelhard Ind Ltd | Electrodeposition of plantinum |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| US4121982A (en) * | 1978-02-03 | 1978-10-24 | American Chemical & Refining Company Incorporated | Gold alloy plating bath and method |
| US4234500A (en) * | 1979-03-07 | 1980-11-18 | Engelhard Minerals & Chemicals Corporation | Ethylenediamine platinum(II) and 1,2-diamino-cyclohexane platinum(II) pyrophosphate complexes |
| US4673472A (en) * | 1986-02-28 | 1987-06-16 | Technic Inc. | Method and electroplating solution for deposition of palladium or alloys thereof |
| GB8821005D0 (en) | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
| NL9002866A (nl) * | 1990-12-24 | 1992-07-16 | Stork Screens Bv | Werkwijze voor het vormen van een zeefmateriaal met lage inwendige spanning en aldus verkregen zeefmateriaal. |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| JP4392640B2 (ja) * | 2000-10-11 | 2010-01-06 | 石原薬品株式会社 | 非シアン系の金−スズ合金メッキ浴 |
| KR100363011B1 (en) * | 2002-03-28 | 2002-11-30 | Hanwha Chemical Corp | Electrolyte composition for electrolysis of brine and electrolysis method of brine using the same |
| DE102008050135B4 (de) * | 2008-10-04 | 2010-08-05 | Umicore Galvanotechnik Gmbh | Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit |
-
2011
- 2011-01-12 GB GBGB1100447.0A patent/GB201100447D0/en not_active Ceased
-
2012
- 2012-01-12 US US13/979,448 patent/US20130334056A1/en not_active Abandoned
- 2012-01-12 MX MX2013008146A patent/MX2013008146A/es unknown
- 2012-01-12 CN CN201280005391.5A patent/CN103492618A/zh active Pending
- 2012-01-12 EP EP12700726.8A patent/EP2663670A2/en not_active Withdrawn
- 2012-01-12 BR BR112013017516A patent/BR112013017516A2/pt not_active IP Right Cessation
- 2012-01-12 SG SG2013051248A patent/SG191820A1/en unknown
- 2012-01-12 SG SG10201510015PA patent/SG10201510015PA/en unknown
- 2012-01-12 WO PCT/GB2012/050057 patent/WO2012095667A2/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114182315A (zh) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | 一种耐腐蚀组合电镀层及电镀方法 |
| CN114182315B (zh) * | 2022-02-14 | 2022-05-17 | 深圳市顺信精细化工有限公司 | 一种耐腐蚀组合电镀层及电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG191820A1 (en) | 2013-08-30 |
| EP2663670A2 (en) | 2013-11-20 |
| MX2013008146A (es) | 2013-12-16 |
| WO2012095667A3 (en) | 2013-10-03 |
| US20130334056A1 (en) | 2013-12-19 |
| WO2012095667A2 (en) | 2012-07-19 |
| BR112013017516A2 (pt) | 2024-01-23 |
| SG10201510015PA (en) | 2016-01-28 |
| CN103492618A (zh) | 2014-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AT | Applications terminated before publication under section 16(1) |